With Protecting Of Work Or Filler Or Applying Flux Patents (Class 228/214)
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Patent number: 5417362Abstract: An electrical connecting method connects a first contact of a first object to a second contact of a second object. The electrical connecting method includes the steps of coating a Ga system liquid metal on at least one of the first and second contacts, where the Ga system liquid metal includes a predetermined weight percent of Bi, and contacting the first contact to the second contact via the Ga system liquid metal. The predetermined weight percent of Bi is selected such that the liquid state of the Ga system liquid metal is maintained when the first and second contacts make contact via the Ga system liquid metal.Type: GrantFiled: March 4, 1994Date of Patent: May 23, 1995Assignee: Fujitsu LimitedInventors: Tatsuo Chiyonobu, Kaoru Hashimoto
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Patent number: 5414928Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.Type: GrantFiled: April 2, 1993Date of Patent: May 16, 1995Assignee: International Business Machines CorporationInventors: Barry A. Bonitz, James V. Ellerson, Kishen N. Kapur, Jack M. McCreary, Irving Memis, Gerald M. Vettel
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Patent number: 5388756Abstract: A method and apparatus allow for continuous removal of contaminants from solder. The solder is pumped from a main solder pot to an auxiliary solder pot through a skimmer valve which is heated to keep the solder molten. In the auxiliary pot, the solder is cooled so that dissolved contaminants such as copper precipitate out and are removed from the pot. The purified solder is then returned to the main pot, for example, by a gravity feed.Type: GrantFiled: December 27, 1993Date of Patent: February 14, 1995Assignee: AT&T Corp.Inventor: Ronald E. Howlett
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Patent number: 5388863Abstract: This invention is a method for joining sections of in-situ cement-mortar lined pipes adapted for high pressure water injection service. The method utilizes a backing ring with one beveled end inserted into a beveled end of the first pipe section and the other beveled end of the backing ring projecting from the first section and adapted to mate with a beveled end of the second pipe section. The pipe sections are then cement-mortar lined. The ends of the linings are then cut back and beveled to facilitate alignment and fit-up, and to provide a cavity and anchor for the retention of a heat expanding grout that is applied to both ends of the lined mating pipe sections to seal the joint. A root opening is left between the mated ends to permit weld penetration and fusion of the butted ends of the steel pipe and a space for the excess and expanding grout to protrude internally.Type: GrantFiled: July 20, 1993Date of Patent: February 14, 1995Assignee: Saudi Arabian Oil CompanyInventor: Ahmed A. Omar
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Patent number: 5383593Abstract: Method is for assembling a disk fitted with small wings. The small wings are composed of a foot made of an element with the disk and welded blades. The disk and the blades are installed on a rotating template with fixing means in the desired position and elements are merged at the joining surface by an electron gun or similar device. The small wings are successively welded during one or two operations. Screens for halting heating radiation are situated behind the wings to be welded. Rotors of turbines and compressors may be assembled in this manner.Type: GrantFiled: November 3, 1993Date of Patent: January 24, 1995Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "SNECMA"Inventors: Pierre M. S. Lechervy, Bernard P. C. Sohier
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Patent number: 5368223Abstract: Avoidance of the corrosion initiation sites consisting of Mn particles deposited on the TiG welded inner tube surface is achieved through suppression of emission of manganese fumes by addition of a protective non corrosive metallic layer. The latter melts during the welding and arises in a non-corrosive internal metallic coating of the welded zone.Type: GrantFiled: May 6, 1993Date of Patent: November 29, 1994Assignee: L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges ClaudeInventors: Henri Chevrel, Alain Boireau
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Patent number: 5344062Abstract: The method of forming a seamed metal tube having a metal coating of this invention includes galvanizing the strip prior to welding. The strip is then formed into an open seam tube and welded in an inert atmosphere with the seam located in the lower portion of the tube. Finally, the metal coating is caused to flow downwardly over the seam, coating the seam by several means. In one embodiment, the strip is preformed into an arcuate shape and galvanized, wherein the zinc coating increases in thickness toward the lateral strip edges, such that the coating will flow over the seam following welding. The tube may also be reheated following welding, preferably in an enclosure containing an inert atmosphere which includes the weld apparatus. In another embodiment, an inert gas is directed over the inner and outer surfaces of the tube, adjacent the seam, driving the molten metal downwardly over the seam to coat the seam.Type: GrantFiled: June 24, 1993Date of Patent: September 6, 1994Assignee: The IDOD TrustInventors: Theodore H. Krengel, John J. Borzym, Charles A. Willetts
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Patent number: 5335841Abstract: Disclosed are a welded pipe with an excellent corrosion resistance, having two plate layers on the inner surface thereof, and a method of manufacturing it. The inner surface is coated with the plate layers even on the bead part and other steel foundation-exposed parts. A first plate layer of at least one of Ni, Co and Ni- or Co-base alloys is formed on at least one surface of a steel strip, then a second plate layer made of a metal or alloy having a lower melting point than the metal or alloy of forming the first plate layer is formed over the first plate layer. The thus plated steel strip is formed into a pipe and then heat-treated to give a welded pipe having no exposed steel foundation. The welded pipe has excellent corrosion resistance and workability.Type: GrantFiled: February 24, 1993Date of Patent: August 9, 1994Assignee: USUI Kokusai Sangyo Kaisha Ltd.Inventor: Hiroshi Yamanashi
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Patent number: 5330098Abstract: An alloy for brazing ceramics has the following composition, in weight percent: 0.5 to 3% titanium; 0.25 to 2% aluminum, silicon or tin; 2 to 6% copper; balance silver.Type: GrantFiled: November 13, 1992Date of Patent: July 19, 1994Assignee: The Morgan Crucible Co., PLCInventor: Howard Mizuhara
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Patent number: 5322208Abstract: A method for assembling a motor vehicle frame including a rail having a generally planar outer surface and upper and lower ends, and a bracket including a wall portion having a lower end, the method comprising the steps of positioning the bracket against the side rail outer surface so that the wall portion extends transversely to the rail outer surface, and welding the bracket to the rail by providing a weld bead along the junction between the wall portion and the rail outer surface and extending the weld bead along the rail outer surface substantially beyond the lower end of the wall portion to the lower end of the rail.Type: GrantFiled: July 9, 1992Date of Patent: June 21, 1994Assignee: A. O. Smith CorporationInventors: John F. Hinrichs, Michael S. Lasky, Jeffrey S. Noruk, Stephen D. Hall
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Patent number: 5285951Abstract: A method of connecting pipes to a gate valve assembly includes the steps of turning a wedge-shaped valve member having a heat sensitive sealing disc to a fully open position so that the disc is further away from a weld seam than when the disc is in a closed position. A pipe is then sealed to the gate valve assembly while the heat sensitive sealing disc is in the open position. Heat from the sealing operation is thus prevented from damaging the heat sensitive sealing disc.Type: GrantFiled: February 3, 1992Date of Patent: February 15, 1994Assignee: R.M.I. Holland B.V.Inventors: Andreas P. A. Dierikx, deceased, by Johannes Kranenburg, legal representative, Arthur A. J. M. Van Hooijdonk
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Patent number: 5273193Abstract: A welding fuel tank has a magnet 3 disposed on the inside or outside thereof in the vicinity of a fuel pump 12 which is housed inside the fuel tank. The magnet collects magnetic spatter which remains inside the fuel tank after welding and prevents the spatter from entering the fuel pump. The magnet may be a permanent magnet or an electromagnet, and it may be disposed outside the pump or in the fuel filter of the fuel pump. A cleaning method for a welded fuel tank comprises introducing a magnet into a fuel tank after welding, vibrating the fuel tank so that the magnet will move about the inside of the fuel tank and collect magnetic spatter, and then removing the magnet and spatter from the fuel tank.Type: GrantFiled: March 3, 1989Date of Patent: December 28, 1993Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Sadatoshi Murakami, Satoru Yamasaki, Tatsumi Harada
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Patent number: 5249814Abstract: A multi-ply sealing ring and method of manufacturing same. Two annular members are nested one within the other and then welded together at equi-distant intervals to form a plurality of annular weld zones. The two annular members are then cut along the weld zones to form a plurality of multi-ply cylindrical bands having weld-sealed opposite axial ends. Each cylindrical band is then formed to include a sealing profile.Type: GrantFiled: January 14, 1993Date of Patent: October 5, 1993Assignee: EG&G Pressure Science, Inc.Inventor: Horace P. Halling
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Patent number: 5249101Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.Type: GrantFiled: July 6, 1992Date of Patent: September 28, 1993Assignee: International Business Machines CorporationInventors: Brenda D. Frey, Charles A. Joseph, Francis J. Olshefski, James W. Wilson
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Patent number: 5245746Abstract: A transformer bobbin (2) having pins (24) extending therefrom is fabricated by winding connecting wire around the pins and pulling the wire until it breaks, then soldering the wire to the pins. The stresses imparted to the pins cause the pins to become mis-aligned when the bobbin material becomes softened during soldering. In order to correct this misalignment the pins are inserted, while the bobbin material is still soft, into holes (36) in a plate (34). The holes are aligned in the desired alignments of the pins and have at their upper ends (38) tapering profiles which contain the mis-aligned pins and guide them into their desired alignments. The pins are retained in the plate until the bobbin material has resolidified and the pins have become fixed in their desired alignments. During this time electrical continuity testing is performed on the soldered transformer.Type: GrantFiled: January 7, 1992Date of Patent: September 21, 1993Assignee: Motorola Lighting, Inc.Inventor: Rembert R. Stokes
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Patent number: 5242096Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.Type: GrantFiled: July 30, 1992Date of Patent: September 7, 1993Assignees: NEC Corporation, EIGHTECH TECTRON Co., Ltd.Inventors: Masashi Tsunabuchi, Taihei Takeshita, Tadanori Ishikura, Akifumi Takashima
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Patent number: 5234156Abstract: A process and an apparatus serve for the continuous coating of workpieces, with a coating medium being applied to a zone to be coated on the workpiece that is passing the zone, and with heat being applied in this coating procedure, to produce a film from the coating medium at the zone. To reduce the size of the installation, a synthetic resin is sprayed toward the zone that is passing through, and heat is applied, at least predominantly, before the sprayed synthetic resin impinges on the zone, in order to reduce the size of the route up to where the film is formed.Type: GrantFiled: July 9, 1990Date of Patent: August 10, 1993Inventor: Peter Ribnitz
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Patent number: 5178318Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.Type: GrantFiled: June 6, 1991Date of Patent: January 12, 1993Assignee: Compaq Computer Corp.Inventors: Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney
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Patent number: 5172850Abstract: An electrowinning anode is formed by tightly joining a sheet of lead anode material to a copper busbar using solder to fill the joint. The busbar is optimally coated with a tin alloy by dipping the busbar into the alloy prior to being joined with the sheet. A lead coating is electrodeposited onto the busbar and the soldered joint to provide a complete metallurgical seal and good resistance to acid corrosion.Type: GrantFiled: August 29, 1991Date of Patent: December 22, 1992Assignee: RSR CorporationInventors: Raymond D. Prengaman, Clifford E. Morgan
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Patent number: 5158228Abstract: There is disclosed a method for arranging a plurality of line filaments above the grid electrode supported on the base plate of a conventional fluorescent displaying tube. The inventive method employs a temporary mounting plate for temporarily supporting the filaments with tension until they are completely arranged above the grid electrode. The mounting plate comprises a plurality of cutting-off lines and a pair of weld portions at opposite ends thereof. The arrangement of the filaments accomplished, the temporary mounting plate is cut along the cutting-off lines so as to remove all the other portions except the weld portions.Type: GrantFiled: January 16, 1990Date of Patent: October 27, 1992Assignee: Samsung Electron Devices Co., Ltd.Inventor: Namshin Park
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Patent number: 5152311Abstract: The present invention is a method for preventing fluid from reaching a portion of a pipe to permit soldering of a threaded adaptor or valve onto the pipe. The method includes the first step of inserting a hollow member through the adaptor or valve. Next, there is the step of inserting the hollow member with an expansion sleeve into the pipe. Then, there is the step of expanding the expansion sleeve such that the expansion sleeve forms a seal in the pipe and fluid from a fluid source upstream of the sleeve is diverted through the hollow member past the portion of the pipe and soldering the threaded adaptor or valve onto the portion of the pipe. The present invention is also a method for preventing water from reaching a portion of a pipe to permit soldering of a threaded adaptor or valve onto the pipe. The method includes the first step of inserting a hollow member through the threaded adaptor or valve. Next, there is the step of inserting the hollow member with an expansion sleeve into the pipe.Type: GrantFiled: August 3, 1989Date of Patent: October 6, 1992Assignee: Timothy McCrearyInventor: Robert L. McCreary
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Patent number: 5098233Abstract: A carbide shank boring bar having a coolant/lubricant bore running axially therethrough fitted with a steel head, said head being machinable to produce a pocket to receive a metal cutter insert wherein said boring bar shank and said steel head have a diameter less than one-half inch and said head is brazed without flux to said boring bar and no flux residue remains in said coolant/lubricant bore upon completion of said brazing. The method of achieving the fusion includes using an atmospheric vacuum chamber to conduct the fusion.Type: GrantFiled: October 29, 1990Date of Patent: March 24, 1992Assignee: Circle Machine CompanyInventors: Harvey L. Patterson, Reginald Quintana
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Patent number: 5098010Abstract: A volatile flux coating solution which, when dry, provides durable protective film coating containing residual flux, and a fluxing-soldering process utilizing such a solution. The coating solution is applied to a cleaned metal surface to be later joined and soldered to another metal surface, thereby obviating the need for recleaning and refluxing at the time of joining and soldering. Where two objects prepared according to this invention are joined, no additional cleaning or fluxing is required, thus saving significant time and labor at the work site. However, an object prepared according to the present invention may nevertheless be joined to an unprepared object at the work site if the unprepared object is prepared by conventional techniques, thereby allowing the prepared object to be joined with either prepared or unprepared objects. The soldering process is completed by soldering the two objects together according to conventional techniques.Type: GrantFiled: September 28, 1987Date of Patent: March 24, 1992Inventors: Arthur O. Carmichael, Seymour A. Genden
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Patent number: 5081764Abstract: A multiple-terminal unit comprises a first and a second group of teeth extending from one edge of a band-shaped. The teeth in the first group and the second group are bent at different positions so that their stem parts are staggered. In another aspect of the invention, the part at which a terminal and wiring pattern on a substrate a fixed by resin, preferably thixotropic resin.Type: GrantFiled: July 26, 1990Date of Patent: January 21, 1992Assignee: Oki Electric Industry Co., Ltd.Inventors: Jiro Utunomiya, Saburo Iida, Hitosi Sibuya, Kazunori Kusaba, Isao Narumi
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Patent number: 5065932Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.Type: GrantFiled: September 24, 1990Date of Patent: November 19, 1991Assignee: International Business Machines CorporationInventors: Terry F. Hayden, Christopher A. Hicks, Peter G. Ledermann, Alvin D. Nguyne, Stephen C. Steinbach, Stanley K. Yu
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Patent number: 5024368Abstract: A method is described of diffusion bonding and superplastic forming components made of aluminium or an aluminium alloy to form a composite formed article. The method involves applying stopping-off material to selected areas of the components to prevent diffusion bonding in those areas, the stopping-off material being applied by plasma spraying.Type: GrantFiled: July 17, 1990Date of Patent: June 18, 1991Assignee: British AerospaceInventors: Ian E. Bottomley, Graham A. Cooper
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Patent number: 4995550Abstract: A composite electrode based on a valve metal with a layer of a platinum foil securely adhering thereto is produced by hot isostatic pressing of the valve metal base and platinum foil between separating sheets; the separating sheet which comes in contact with the platinum foil during hot isostatic pressing is a metal with a melting point of at least 100.degree. C. above the hot isostatic pressing temperature.Type: GrantFiled: July 13, 1989Date of Patent: February 26, 1991Assignee: Peroxid-Chemie GmbHInventors: Herbert Appl, Michael Gnann, Wolfgang Jahr, Erwin Rossberger
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Patent number: 4993620Abstract: The face plates of a drift tube have their joints with a central cylindrical body sealed by utilizating two metallurgical techniques. The first technique involves the soldering of interface surfaces at the joints between the face plates and the body. The soldered joint prevents the entry of electroplating solution into the interior of the drift tube during a second metallurgical procedure involving the electroformation of a copper strap around the joint which provides a permanent seal against leakage of coolant from the drift tube while offering excellent electrical and thermal conductivity across the surface of the drift tube.Type: GrantFiled: May 3, 1990Date of Patent: February 19, 1991Assignee: Grumman Aerospace CorporationInventors: Michael G. Kornely, Jr., Robert G. Micich, Douglas S. Holmes
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Patent number: 4992067Abstract: The invention describes a method of manufacturing a color cathode-ray tube having a color selection electrode attached to a plurality of support studs distributed about and affixed to an interior surface portion of a faceplate panel. The manufacturing steps include: attaching a plurality of support means, each of which includes stud-engaging means, and at least one of the stud-engaging means comprising a washer having a stud-receiving aperture therethrough, to the color selection electrode; positioning the color selection electrode within the faceplate panel with the stud-engaging means positioned on the support studs; and, then, welding the washer to the support means.Type: GrantFiled: October 25, 1989Date of Patent: February 12, 1991Assignee: RCA Licensing Corp.Inventor: Ted J. Fiock
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Patent number: 4965925Abstract: An improved electrical fuse having axial leads (5) and comprising a fuse wire in a cylindrical sleeve (2) supported at its ends by lead carrying end caps (3) is coated over the length of the fuse body by an adherent insulating layer of plastic (7). Improved humidity resistance and mechanical strength are achieved and control of coating thickness is improved. Use of hot plastic for the adherent insulating layer (7) reflows solder joint (4) reducing instances of open or high resistance fuses which must be rejected. Also, the i.sup.2 t performance is significantly improved over other adherent coatings.Type: GrantFiled: April 17, 1989Date of Patent: October 30, 1990Inventor: John M. Monter
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Patent number: 4944444Abstract: The invention provides a portable welding or cutting shield to assist in preventing welding or burning by-products from contaminating or damaging the inside surfaces of a pipe. The portable welding shield comprises a shield assembly for capturing the by-products released within and traveling along the length of the pipe, a leg assembly for supporting the shield assembly within the pipe and a splatter target that extends upwardly from the shield assembly. The leg assembly includes fixed first and second legs, and an adjustable third leg. The adjustable leg includes a screw actuator that allows the length of the leg to be radially adjusted so as to allow the leg assembly to be brought in and out of engagement with the inside diameter of the pipe. The shield assembly includes multiple flexible pieces of flame resistant fabric sandwiched between a top and a bottom pair of semi-circular plates.Type: GrantFiled: January 18, 1990Date of Patent: July 31, 1990Assignee: MK-Ferguson CompanyInventor: James S. Renner
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Patent number: 4941249Abstract: An integral sprue gated injection molding nozzle and method having a melt bore extending centrally therethrough wherein a circular forward end portion of the electrical heating element encircles the melt bore in the nose portion to provide additional heat adjacent the gate. The method includes locating the circular portion of the heating element in a circumferential space between a hub member and a funnel member and integrally brazing them together in a vacuum furnace to form the nose portion of the nozzle. The nose portion is drilled and machined to provide the desired gate and configuration depending upon the particular application.Type: GrantFiled: December 5, 1989Date of Patent: July 17, 1990Inventor: Jobst U. Gellert
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Patent number: 4933305Abstract: For preventing a semiconductor device from separation of a passivation film, there is disclosed a process of wire bonding comprising the steps of: (a) preparing an intermediate structure of a semiconductor device; (b) forming an inter-level insulating layer of an organic material on the intermediate structure; (c) forming at least one bonding pad on the inter-level insulating layer; (d) growing a passivation film of an inorganic material on the inter-level insulating film in a high temperature ambient, the passivation film exposing the bonding pad; and (e) connecting a bonding wire to the bonding pad at a temperature lower than that of the high temperature ambient.Type: GrantFiled: July 27, 1988Date of Patent: June 12, 1990Assignee: NEC CorporationInventor: Takamaro Kikkawa
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Patent number: 4923110Abstract: A flux coating for treating a clean metallic component having a fluid channel defined through at least a portion thereof to provide a durable, tack-free, protective flux film on a surface of the portion so that the component can be fluid-tightly soldered or low temperature brazed to a mating metallic component at a later time without cleaning and fluxing the portion of the component at the later time. The solution consisting essentially of rosin and a highly volatile organic solvent, the solution being adapted to rapidly air dry when coated on the surface of the portion to leave a very thin, protective flux film on the surface of the component, the component being capable of being stored for long periods of time, handled, assembled, shaped, formed and otherwise worked without removal of the film from the surface of the component and without reduction of the fluxing properties of the film.Type: GrantFiled: December 29, 1988Date of Patent: May 8, 1990Inventors: Arthur O. Carmichael, Seymour A. Genden
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Patent number: 4887761Abstract: A method of explosively bonding metal plates into a multi-laminar composite plate wherein the metal plates are assembled over a restraining means, e.g. an anvil, in overlapping spaced-apart relationship, a driver plate having a mass of at least the total mass of the plates to be bonded is disposed over the top plate of the assembly at a stand-off distance of at least half its thickness, a buffer layer of granular inert material is disposed between the driver plate and the top plate, and an explosive layer is placed on the driver plate and detonated in the direction parallel to the driver plate. The number of plates which can be bonded in a single operation can be increased by placing an explosive layer driver plate and a layer of granular inert material symmetrically on each side of an assembly of metal plates and detonating each explosive charge simultaneously. The method produces multi-laminar composite plates having improved uniformity of bond quality at the interfaces.Type: GrantFiled: November 25, 1988Date of Patent: December 19, 1989Assignee: Imperial Chemical Industries PLCInventor: Roy Hardwick
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Patent number: 4881430Abstract: The method of making a heterogeneous, Damascus-type cutting blade, comprising forming an open metal enclosure, placing a stack of metal foils in the enclosure, placing a metal plate in the enclosure on top of the stack of foils, folding in portions of the enclosure on said plate to compress the latter and stack of foils, heating and hammering the enclosure and foils to bond the same together, removing the enclosure from the bonded foils, and finish-griding the bonded foils.Type: GrantFiled: September 6, 1988Date of Patent: November 21, 1989Inventor: Arthur J. Hubbard
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Patent number: 4869422Abstract: A method of cladding a base plate of carbon steel, including the steps of plating by electroless deposition the faying surface of the plate slab, positioning a cladding plate, on the the plated faying surface, welding both plates together at three edges to form a seal, attaching a gas reservoir at the fourth side thus forming a sealed subassembly, evacuating the space formed in the subassembly between the two plates of water vapor and oxygen, heating the subassembly to about 1650.degree. to 2100.degree. F. thereby melting the bonding metal alloy, and hot rolling the heated assembly to metallically bond the cladding plate to the steel plate by means of the mechanism of liquid interface diffusion bonding.Type: GrantFiled: April 11, 1988Date of Patent: September 26, 1989Assignee: Head & JohnsonInventor: William C. Turner
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Patent number: 4858816Abstract: The wave barrier device of the invention comprises a flap which is rigidly joined to the soldering machine. This flap plunges lightly into the molten tin bath and pushes it before the board which is precedes.Type: GrantFiled: February 29, 1988Date of Patent: August 22, 1989Assignee: Societe Electronique de la Region Pays de LoireInventor: Bruno Gontier
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Patent number: 4840304Abstract: A process for manufacturing the butt-welded cans comprises the steps of applying a 0.5 to 3.5 .mu.m thick organic resin film for preventing the adhesion of melted metal particles to at least a 1-mm-wide region from the butt-weld portion edge of at least the inner surface of a steel plate can blank, and butt-welding the edges of the can blank by the use of a laser, or alternatively applying a 0.5 to 7.0.mu.m thick organic resin film, butting the edges of the can blank, and laser-welding the butted edges while a cooling device is brought into contact with the butted edges from the inner side of each can. In this case, it is preferred that the coating material having high thermal decomposition resistance is applied to the whole outer surface of each can, and the weld portion is then butt-welded by means of a CO.sub.2 laser.Type: GrantFiled: September 2, 1988Date of Patent: June 20, 1989Assignee: Toyo Seikan Kaisha Ltd.Inventors: Nobuyuki Sato, Hiroshi Matsubayashi, Seishichi Kobayashi, Minoru Mitsuhashi, Kenji Matsuno, Kazuhisa Ishibashi
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Patent number: 4817856Abstract: A pump impeller is coated essentially without use of core structures. The pump impeller coating is performed in several stages. Partial units of the impeller are coated, whereafter the coated partial units are assembled together. Exposed areas of the impeller are then coated to provide a continuous coating over the entire impeller.Type: GrantFiled: July 31, 1987Date of Patent: April 4, 1989Assignee: A. Ahlstrom CorporationInventors: Pauli A. T. Koistinen, Seppo T. Tolonen
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Patent number: 4813806Abstract: A welding beveling of a T-joint of a member welded to a rib on a lower plate, the rib varying in thickness along its length, comprises a beveling on an upper plate partially overlapping the rib at the thicker portion of the rib and having a clearance between the upper plate and the rib at the thinner portion, and a part of the beveling at the thicker rib portion being provided with a detecting hole for detecting the overlap.Type: GrantFiled: March 4, 1986Date of Patent: March 21, 1989Assignee: Mitsubishi Jukogyo Kabushiki KaishaInventors: Nagio Minami, Tamotu Oka
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Patent number: 4811889Abstract: In a method for the continuous manufacture of powder-filled steel tube from steel strip, wherein the strip is moved along a path in which successively the moving strip is formed into an open channel, powder is introduced into the open channel, and the channel is shaped into a tube by further deformation and closure of the strip edges together. To avoid the disturbance of the powder by air currents caused by the strip movement and by the closure of the strip, such air currents arising in the vicinity of the moving strip are removed by suction extraction at the location where the powder is introduced into the open channel.Type: GrantFiled: January 6, 1988Date of Patent: March 14, 1989Assignee: Rijnstaal B.V.Inventors: Arnold J. G. Dackus, Cornelis G. J. Brasser
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Patent number: 4805795Abstract: There is here provided butt-welded cans made of steel plates having a carbon concentration of 0.02 to 0.09% by weight, the aforesaid butt-welded cans being characterized in that a coating film for preventing the adhesion of melted metal particles is applied to at least the inner surface of the weld portion and its vicinity of each can, and a carbon concentration index I of the weld portion satisfies the formula (1)I=(Iw/Ic).times.10.sup.3 .ltoreq.15 (1)wherein Iw is a K.alpha. X ray intensity, of carbon in the weld portion, measured by the EPMA method, andIc is a K.alpha. X ray intensity, of carbon in graphite, measured by the EPMA method.Type: GrantFiled: December 28, 1987Date of Patent: February 21, 1989Assignee: Toyo Seikan Kaisha Ltd.Inventors: Nobuyuki Sato, Hiroshi Matsubayashi, Seishichi Kobayashi, Minoru Mitsuhashi, Kenji Matsuno, Kazuhisa Ishibashi
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Patent number: 4768283Abstract: This invention relates to an improved injection molding nozzle and method of making it. The components are assembled and dipped in lacquer and powdered nickel prior to brazing in a vacuum furnace. This integrally brazes the components together, embeds an electrical heating element in a spiral channel, and provides the surfaces with a protective nickel coating. In one embodiment, the forward end has an integral high speed steel insert and the remote end of the heating element extends into the forward end of the nozzle. In addition to providing the protective coating, carrying out the method with a single vacuum brazing step considerably reduces manufacturing costs.Type: GrantFiled: August 18, 1987Date of Patent: September 6, 1988Inventor: Jobst U. Gellert
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Patent number: 4744506Abstract: The ends of a plurality of copper conductors bearing superconductive strands, for example of niobiumtitanium, are treated with a liquid metal solvent to selectively remove the copper from the superconductive strands. The liberated strands of superconductor are then soldered with a superconducting solder. The joint is included in a coil which at superconducting temperatures induces a high magnetic field of 0.5 Tesla and above.Type: GrantFiled: April 18, 1986Date of Patent: May 17, 1988Assignee: General Electric CompanyInventor: Roy F. Thornton
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Patent number: 4708885Abstract: A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board.An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.Type: GrantFiled: November 20, 1986Date of Patent: November 24, 1987Assignee: Murata Manufacturing Co., Ltd.Inventors: Shigeki Saito, Takao Hosokawa, Masataka Mae
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Patent number: 4681349Abstract: The metal housings of multi-branched plastic lined components are welded in situ with the liner in place. A series of grooves in the outer surface of the preformed plastic liner underlie the weld joints and, in cooperation with a vent passage, prevent blow-out of the weld metal and damage to the plastic, all at higher welding temperatures sufficient to obtain deeper weld penetration.Type: GrantFiled: June 3, 1986Date of Patent: July 21, 1987Assignee: Unidynamics CorporationInventors: Irving D. Press, John Krieg
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Patent number: 4615479Abstract: A method for soldering an electrical product with a soldering flux, wherein an aqueous dispersion or an organic solvent solution of a compound containing a polyfluoroalkyl or polyfluoroether group having from 4 to 21 carbon atoms is applied to a peripheral portion around the soldering portion and dried to form a coating of said compound so as to prevent the soldering flux from penetrating to or depositing on said peripheral portion.Type: GrantFiled: February 21, 1985Date of Patent: October 7, 1986Assignees: Asahi Glass Company Ltd., Seimi Chemical Company Ltd.Inventors: Sachio Ohotoshi, Fumio Hase
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Patent number: 4598858Abstract: For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced by spreading over the top phase (4), which consists of a liquid synthetic polyalphaolefin, a powder of a chemically active component of sebacic acid and/or suberic acid which is solid at room temperature and liquid at the soldering temperature.Type: GrantFiled: March 12, 1985Date of Patent: July 8, 1986Assignee: LGZ Landis & Gyr Zug AGInventors: Tomas Stratil, Milos Pisinger, Peter Fehr
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Patent number: 4588652Abstract: A member is secured to a supporting surface by a peripheral seam weld that partially closes off an area between the member and the surface. In the region of the or each interruption in the continuity of the seam weld, there is provided between the member and the supporting surface an insert of a material that is stable in shape at normal temperatures but that has expanded and flowed at elevated temperature, e.g. due to heating by the welding process, to complete the sealing of said area between the member and the surface, in cooperation with the seam weld.Type: GrantFiled: July 6, 1984Date of Patent: May 13, 1986Assignee: George Blair PLCInventor: Kenneth Reynard