Abstract: A suction head is introduced into a ball reservoir holding conductive balls, such as solder balls, and a plurality of suction holes formed in a suction surface of the suction head, hold the conductive balls by suction, respectively. Then, the suction head is moved into a position above a workpiece placed in position, and the suction is released from the conductive balls held on the suction head, thereby placing these conductive balls onto the workpiece. The suction head is vibrated or moved within the ball reservoir so that each of the suction holes can positively hold one conductive ball, thus preventing extra conductive balls from sticking to the suction head.

Abstract: An electronic assembly (100) includes multiple solder connections (101) coupling faying surfaces (202, 204) of two substrates (106, 108). A solder connection (201) is fabricated by reflow heating of a first, less compliant solder paste (312, 314) and a compliant preform (210) so as to cause compliant material of the preform (210) to dissolve into the solder paste (312, 314). Upon solidification of the solder paste (312, 314), blended regions (520, 522), having a gradual, changing concentration of compliant material form between resulting fillets (212, 214) and the preform (210). The blended regions (520, 522) transfer temperature induced shear stresses, caused by thermal cycling of the electronic assembly (100), from the fillets (212, 214) into the compliant preform (210).

Abstract: In bonding the connecting electrodes of adjacent semiconductor chips to each other, a solder layer shaped like a bump is formed on that portion of the connecting electrode which is positioned on the upper surface of the semiconductor chip. The semiconductor chips are positioned close to each other such that the connecting electrodes of these chips are aligned with each other. Then, the solder layer is melted to cause the molten solder to flow along the entire region of the connecting electrode and, thus, to achieve mutual bonding of the connecting electrodes in the entire regions including the upper surface region and the side surface region. The method permits stably bonding semiconductor chips to each other with a high bonding strength, leading to an improved reliability of electric connection in the bonded portion.

Abstract: A method of joining two bodies together, at least one of the bodies being predominantly composed of metal, the two bodies each having a respective joint surface for joining with the joint surface of the other body, the two bodies having a respective melting point, includes the following steps: a) providing aluminum metal and iron metal on at least one of the joint surfaces of the two bodies; b) after providing the aluminum metal and iron metal on the one joint surface, positioning the joint surfaces of the two bodies in juxtaposition against one another with the aluminum and iron positioned therebetween; c) heating the aluminum and iron on the juxtaposed bodies to a temperature from greater than or equal to 600.degree. C.

Abstract: A novel method for sealing the end of tubing connected to and extending from a container housing workpieces to be thermally processed using mechanical as well as thermal means. The invention also contemplates a novel tubing member for connection to such a container, where the sealing material is disposed within the tubing member prior to insertion of the tubing into the container. After fixing the tubing in the container, a plurality of locations along the length of the tubing are identified where mechanical closure of the tubing is effected. Then, the tubing is heated to a temperature sufficiently high to melt the contained sealing material at the crushed locations, such that a metallurgical seal is formed inside the tubing at the crushed locations.

Abstract: Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.

Abstract: A process for fabricating a plurality of solder joints from a low melting point solder paste and high melting point solder balls is described. An abbreviated process flow is as follows: First, the solder balls are placed into cavities in an alignment boat, a vacuum is initiated to hold the boat and solder balls in place. Second, an amount of solder paste is applied directly onto the solder balls in the boat. Third, an alignment plate is placed over the alignment boat to provide a means of roughly aligning the solder ball/solder paste combination to the substrate. Fourth, the substrate is placed through the alignment plate on top of the solder balls in the boat. Pressure is applied to wet the solder paste to the conductive pads on the substrate. Finally, the substrate and alignment boat assembly is processed through a furnace for solder paste reflow.

Abstract: The process of manufacturing an oil cooler which comprises the steps of:(A) making cooling fins by forming a plurality of insertion holes of which inner brim is projected along the axial direction for inserting a plurality of tubes in each sheet to be transformed into cooling fins, and to drill a plurality of pores for inserting linear brazing materials at positions closed to the insertion holes, respectively,(B) inserting a plurality of tubes arranged in parallel into each of insertion holes of a number of the cooling fins respectively, and inserting linear brazing materials into the pores of each of the cooling fins, and(C) joining the brims of the cooling fins and the tubes by heating to melt said brazing materials.

Abstract: A method and apparatus for feeding preform wire into a preform dispenser, cutting a piece of preform, transferring the preform to a location over an integrated circuit ceramic package, and placing the preform in the package prior to placing and attaching a die in the ceramic package.

Abstract: The strengthening and stiffening of long, curved or tapered tubes is achieved by using internal strengtheners. The strengthening element conforms to the internal shape of the tube as it is inserted into the tube. The parts of the strengthening element which are then in contact with the inside of the tube have pre-formed welding material attached to them; a solid connection between the strengthener and the tube is achieved by selective heating, welding or by blowing adhesive material through the tube.If a tube has the non-welded strengthener in place, the forming or bending of the tube may proceed, since the strengthener takes the form of the tube at any stage of forming. The process is especially suitable for tubes with different cross-sections along their length.

Abstract: The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.

Abstract: Disclosed is a method of manufacturing a high-yield solder bumped semiconductor wafer. The method comprises providing a non-solderable transfer substrate having a transfer surface for receipt of solder material; depositing solder material onto the transfer surface to form solder bumps in a predetermined pattern; aligning solderable conductive elements of a semiconductor wafer with the predetermined solder bumps on the transfer surface; and reflowing the patterned solder bumps into wetted contact with the wafer conductive elements.

Abstract: A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint. The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.

Abstract: Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.

Abstract: Disclosed is a method of forming solder terminals for a pinless module, preferably for a pinless metallized ceramic module. The method is comprised of the following steps: forming a substrate having a pattern of conductors formed onto its top surface and preformed via-holes extending from the top to bottom surface; applying a droplet of flux at at least one of said preformed via-hole openings of the bottom surface of said substrate to fill said via-holes with flux by capillarity and form a glob of flux at the bottom openings; applying a solder preform, i.e.

Abstract: Metal parts are brazed by means of an amorphous filler metal foil. The brazing foil, useful for brazing stainless steels, has a composition consisting essentially of about 0-10 atom percent iron, about 0-20 atom percent chromium, about 3-5 atom percent molybdenum, about 5-35 atom percent cobalt, about 14-19 atom percent boron and the balance nickel and incidental impurities. The ductile foil permits fabrication of preforms of complex shapes which do not require binders and/or fluxes necessary for brazing powders presently used to braze stainless steels and nickel base alloys, and exhibits excellent braze-metal and high-temperature strengths.

Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

Abstract: A fluid handling body and a method of attaching extension tubes to the fluid handling body which effectively seals the tubes to the body in a simple manufacturing operation, reducing the number of manufacturing operations required while minimizing the possibilities of damage to the tubes or undesirably restricting the fluid flow path in the body or tubes. The method hereof is particularly advantageous where several tubes are to be attached to the body to produce a precise, leak-free component. The body includes a fluid flow passageway extending into one end and a saucer-like cavity in the other end. A plurality of bores extend through the body between the cavity and passageway. With the tubes received in the bores, a paste is applied in the cavity. The outer periphery of the body is heated, melting the paste in a single heating operation and effecting flow of the paste in the cavity into circumscribing relation about the tubes.

Abstract: After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570.degree. C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.

Abstract: The invention comprises a method of mounting a cutter, having a stud portion defining one end thereof and a cutting formation generally adjacent the other end, in a pocket in a drill bit body member. The method includes the steps of forming a channel extending into the pocket, inserting brazing material into the channel, inserting the stud portion of the cutter assembly into the pocket, then heating the bit body member to cause the brazing material to flow through the channel into the pocket, and finally re-cooling the bit body member. During the assembly of the various pieces required in the steps mentioned immediately above, a spring is used, cooperative between the cutter and the bit body member, to retain the stud portion in the pocket and also to displace the stud portion toward the trailing side of the pocket.

Abstract: A vane compressor is provided which has a rotor formed therein with a plurality of axial slits opening in its outer peripheral surface in a circumferentially spaced arrangement, and in each of which a vane is received, and a plurality of cavities located between adjacent ones of the axial slits. The rotor is formed of at least two rotor elements integrally joined in an axial alignment, each rotor element being formed of a sintered alloy compact. The rotor elements are brazed along their end faces abutting against each other.

Abstract: A process for manufacturing a piston ring is disclosed wherein web-like first metal member which will form a base of a piston ring and web-like second metal member which will form a wear resistant layer of the piston ring are separately fed and joined together. The joined web is subject to curving to gradually decrease a radius of curvature.

Abstract: This invention relates to an improved method of installing an elongated heater such as a cartridge heater in a molding member such as an injection molding manifold member. First, a bore is drilled into an elongated portion of the manifold member to extend generally parallel to the hot runner passage extending through it and a filler duct is drilled from the top to intersect the bore along its length. The cartridge heater is then inserted into the bore and a filler tube with a base is set on the top in alignment with the filler duct. A brazing paste is then applied around the base of the filler tube and around the terminal portions of the cartridge heater extending from the bore. The manifold member is then heated in a vacuum furnace which brazes the filler tube in position and seals the outer end of the duct against leakage.

Abstract: The invention provides a novel method for firmly bonding a porous body, e a sintered body prepared by the powder metallurgical techniques with a metal powder, and a fusion-made body, e.g. an iron casting body, hitherto undertaken by the method of pressure welding or diffusion bonding. The inventive method utilizes the principle of infiltration and an infiltrater material is placed at the contacting portion between the porous body and the fusion-made body and heated at a temperature to exceed the melting point of the infiltrater material in vacuum so that the molten infiltrater material is infiltrated into the porous body leading to strong bonding upon solidification to have the porous body and the fusion-made body integrally bonded together.

Abstract: A carrier matrix for use in the manufacture of a catalytic reactor for the purification of exhaust gases in an internal combustion engine of a motor vehicle is prepared by joining in wound form a corrugated steel sheet and a generally flat steel sheet, the sheets being joined in locations where they contact one another by the use of solder or brazing material. In one embodiment solder is applied in spots along the tops of the arches of the corrugated sheet, and after coiling the solder is activated by heating. In another embodiment, coiling is first carried out and then soldering is accomplished by the application of solder into one or both end faces of the coil.

Abstract: A method of manufacturing brazed parts by brazing a metal part with a base material made from a metal plate on which a pressing operation is accomplished at a work station. The base and filler materials are stamped with the filler material initially on top of the base material. A portion of the filler material is formed through and held in position in a through hole in the base material. The metal part and the base material are then brazed through the filler material.

Abstract: A method of making and the resulting heat exchanger in which there is provided a header plate having a tube receiving opening closely embracing the tube in the opening with a sheet of solder on at least one of the tube and plate adjacent to the opening together with a retainer wettable by the molten solder attached to the tube and plate and bearing against the solder to retain it in position. The assembly of tube, plate, retainer and solder is heated to a melting temperature for the solder with the result that the molten solder flows over the wettable retainer and into the space between the plate and tube by capillary attraction after which the solder is cooled to a solidifying temperature to form a solder joint uniting the tube and header.

Abstract: A heat-recoverable article comprises a memory metal member to which has been imparted both thermally-recoverable and resiliently-recoverable strain. The resilient strain is retained by means of a disburdenable keeper, preferably one made from fusible or chemically degradable material, which can be removed, for example, by heating or chemical treatment, to allow resilient recovery. The article is preferably so constructed that it can be heated to obtain both thermal and resilient recovery simultaneously. One preferred form of article is a radially expanded longitudinally split tube, the keeper being positioned in the split. Such an article can be used as a connector to secure an earth lead to the sheath of a mineral-insulated cable.

Abstract: A dimensionally-recoverable article comprising a hollow resilient member which has been expanded to a dimensionally unstable configuration in which it is retained by a keeper positioned between and separating two parts of the hollow member away from the path of recovery thereof. The keeper is preferably made from a fusible or chemically degradable material so that it can be removed, for example, by heating or chemical treatment to allow the hollow member to recover towards its original configuration. One preferred form of article is a radially-expanded longitudinally split tube having the keeper positioned within the split. Such an article may be used as a connector to secure an earth lead to the sheath of a mineral-insulated cable.

Abstract: Described herein is an improved connector sleeve and a method of forming wire wrap post terminations with this connector sleeve. The sleeve comprises a solder ring and a fixturing member positioned in an axially displaced relationship within a heat recoverable sleeve such that the fixturing member and the solder ring are held in place by the heat recoverable sleeve.

Abstract: A feedthrough connector for use on an implantable electronic cardiac pacer. A single structure provides a means for connecting a heart lead to the pacer and feedthrough into the body of the pacer. The feedthrough may include filtering means to protect against external interferences. The entire structure has provisions for physical compliance to absorb stresses due to different heat coefficients and as may be caused during assembly and use. Also disclosed is a method for making the feedthrough connector.

Abstract: Gold alloy bumps are built up upon conductive pads formed upon electronic chips. The bumps are thereafter aligned with conductive portions of a generally larger substrate to which the chips are to be electrically connected. The bumps are produced by either vacuum evaporating or plating metallic layers over the conductive chip pad areas wherein certain layers within the bumps are formed of magnetic metals such as cobalt or nickel cobalt alloys. Metallic layers of gold and alloying metal are evaporated or plated over the deposited magnetic metals to complete the formation of the bumps. The chips are thereafter subjected to a sufficient amount of heat to cause the bumps to flow, thereby to form a reliable electrical connection between the chips and the substrate. The magnetic materials formed within the bumps result in ease of transporting and manipulating the chips for further processing by means of magnetic plates or other pickup devices.

Abstract: An apparatus consisting of a pair of rollers with tangentially meeting perimeters for crimping successive portions of a continuous strip of solder into rings around a strip of terminal posts carried in parallel manner upon a common carrier strip. The roller perimeters each contain a circumferential track of crimping ridges which are both axially and angularly positioned to coincide with corresponding ridges on the other roller to crimp said solder strip around each post on the strip of terminal posts, both strips being simultaneously passed between the crimping tracks on said rollers. Each roller also comprises a circumferential track of spur-type gear teeth, the two tracks being axially offset on opposite sides of said crimping tracks and having bottom lands (the troughs of the teeth) which coincide when the teeth pass through the common tangential or pitch plane of the rollers.

Abstract: A process for producing hollow gold jewelry. A temporary substrate of soft iron is plated with precious metal leaf. A strip cut form a bimetallic plate thus plated is drawn, with incorporation of a temporary soft-iron core, to a precious metal covered wire, which can be fabricated into hollow pieces of jewelry, the soft iron being eliminated by an aqueous solution of H.sub.2 SO.sub.4.

Abstract: In a fabricating process of a metallic honeycomb structure, a plurality of bar soldering materials are laid on a plurality of metallic structure members previously assembled as a honeycomb structure and melted in a heating kiln to complete the soldering joint.

Abstract: Copper alloy carrier objects are brazed to silver or copper alloy contact objects by assembling or positioning the carrier object into direct contact with said contact object such that there is defined or presented an exposed position or junction where said carrier object and said contact object come into direct contact, then placing at said position or junction a quantity, such as a pellet or piece, of a brazing alloy and subjecting the resulting assembly to furnace brazing at an elevated temperature for a sufficient period of time in a non-reactive gaseous atmosphere to cause said brazing alloy to melt and to join and braze together said carrier object and said contact object.