Abstract: The method for producing a solder bump transfer sheet of the invention includes the steps of: providing a sheet having a chromium oxide layer containing substantially no iron oxide as the outermost surface; and forming a plurality of solder bumps placed in a predetermined pattern on the chromium oxide layer.

Abstract: A solder ball dispenser (100) has feeder unit and head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are put into motion in the chambers by moving air. The pneumatic singulator and a channel for solder balls are formed, machined or molded in a head plate (142) of a dispenser and enclosed by a front plate (141) and a back plate (143) secured adjacent to the head plate. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The pneumatic singulator ejects the balls one at a time to a target device such as a Ball Grid Array (BGA). The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum.

Abstract: A method and a device for placing a multitude of shaped parts of solder material (20) on a bond pad arrangement (29) of a substrate (23), said bond pad arrangement comprising a multitude of bond pads (28), and for subsequent re-melting of the shaped parts of solder material on the bond pads (28), with arrangement of a template device (21) comprising a multitude of template apertures (27) for accommodating shaped parts of solder material (20) opposite a substrate (23) comprising a bond pad arrangement (29), such that the shaped parts of solder material are associated with the individual bond pads (28); and application of laser energy to the shaped parts of solder material (20) accommodated in the template apertures (27) using a laser device (39) arranged at the rear of the template device (21) such that said laser energy is applied to the shaped parts of solder material through the template device.

Abstract: A solder bump structure includes a contact pad, an intermediate layer located over the contact pad, a solder bump located over the intermediate layer, and at least one metal projection extending upwardly from a surface of the intermediate layer and embedded within the solder bump. Any crack in the solder bump will tend to propagate horizontally through the bump material, and in this case, the metal projections act as obstacles to crack propagation. These obstacles have the effect of increasing the crack resistance, and further lengthen the propagation path of any crack as it travels through the solder bump material, thus decreasing the likelihood device failure.

Abstract: A wafer transfer apparatus adapted to a wafer ball placement apparatus including at least one wafer cassette, a flux dispenser unit, a ball placement unit, a reflow oven unit, and an unloader. The apparatus is also adapted to a wafer bump printing apparatus including at least one wafer cassette, a bump printing unit, a reflow oven unit, and an unloader. The apparatus includes a robot arm for picking up a wafer from the at least one wafer cassette and transferring the wafer to/from one of the wafer cassette, the flux dispenser unit, the ball placement unit or bump printing unit, and the reflow oven unit. The apparatus may also include a stage for carrying and moving the robot arm. With the apparatus, it is possible to reduce process time, simplify steps of transferring the wafer and lower risks of breaking wafer. The invention can achieve the effects of improving the production efficiency, saving the space and simplifying the apparatus.

Abstract: A tin-based solder material and method comprising same are disclosed herein. In one embodiment, the solder material comprises 0.00001 to 10 weight percent of at least one of the following elements: selenium, tellurium, arsenic, polonium, or thallium. After heating to one or more temperatures in a non-oxidizing atmosphere sufficient to melt the solder, the at least one element substantially segregates to the surface of the molten solder composition. The at least one element improves the solder joint formed between at least two substrates by reducing the surface tension of the molten solder.

Abstract: A method for coating a substrate is presented. The method comprises providing a substrate; attaching a preform to the substrate, the preform comprising braze alloy and wear-resistant particles; and bonding the preform to the substrate to form a wear-resistant coating.

Abstract: The present invention is directed to a coating composition and its employment in a metallization process that facilitates bonding of brazing filler metals to treated refractory surfaces, such as ceramics. The coating can be applied in preselected areas of the refractory surface to define the target area for brazing. It is believed that when compositions of the present invention are employed with brazing or soldering filler metals, strong bonds between two non-metallic refractory bodies, or between a non-metallic refractory body to ferrous and non-ferrous metal can be attained. In one embodiment, the present invention is a coating composition applied to a refractory material prior to brazing, the composition being comprised of a group IVB transition metal component selected from the group consisting of a group UVB transition metal, a hydride thereof, mixtures of group IVB metals and/or hydrides thereof, a binder material, and a fluid carrier.

Abstract: A method for securing a metallic substrate (24) to a metallic housing (26). The method may include: firing a first solderable coating (64) to an edge (60) of the metallic substrate (24); firing a second solderable coating (64) to a groove (62) of the metallic housing (26); joining the edge (60) of the metallic substrate (24) to the groove (62) of the metallic housing (26) to form a joint (66) at the first solderable coating and the second solderable coating; applying a solder (68) to the joint (66); and solder bonding the metallic substrate (24) to the metallic housing (26) to provide a hermetic seal at the joint (66). There is also an electronic control module that incorporates the method.

Abstract: An electronic package having a solder interconnect liquidus temperature hierarchy to limit the extent of the melting of the C4 solder interconnect during subsequent second level join/assembly and rework operations. The solder hierarchy employs the use of off-eutectic solder alloys of Sn/Ag and Sn/Cu with a higher liquidus temperature for the C4 first level solder interconnections, and a lower liquidus temperature alloy for the second level interconnections. When the second level chip carrier to PCB join/assembly operations occur, the chip to chip carrier C4 interconnections do not melt completely. They continue to have a certain fraction of solids, and a lower fraction of liquids, than a fully molten alloy. This provides reduced expansion of the solder join and consequently lower stresses on the C4 interconnect.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: At first, a brazing filler metal sheet is prepared (step S1). The brazing filler metal sheet comprises a brazing filler metal layer, a sticking material layer, and a released paper. The brazing filler metal layer comprises a brazing filler metal. A coating material layer is laminated on the brazing filler metal layer (step S2). The coating material layer comprises a mixture of coating material particles and a binder. As the coating material particles, MCrAlY particles and abrasive particles (cubic boron nitride particles or the like) are used. The coating material layer is then dried (step S3), and the brazing filler metal sheet is cut (step S4), and adhered to a rotor blade (step S5). The rotor blade is heated (step S6), to melt the brazing filler metal. The brazing filler metal gets wet as a liquid phase around the MCrAlY particles, and diffuses due to the heat treatment holding process. A solidified layer is then formed by cooling (step S7).

Abstract: A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members.

Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Abstract: A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a cooling element, there is arranged a plug mainly made of copper. Between the side surface of the plug and the inner surface of the hole, there is arranged brazing agent with a melting temperature lower than that of the pieces to be joined together, and the junction area between the plug and the piece, such as the housing element of the cooling element, is heated at least up to the melting temperature of the brazing agent or to the vicinity thereof, whereafter the junction area is cooled. The invention also relates to a cooling element manufactured according to said method.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: In a method of manufacturing a plate type titanium heat exchanger in which a plurality of titanium herringbone plates are laminated and flow paths are formed between the respective herringbone plates, after brazing materials are charged or coated to the joints between the herringbone plates, respectively, the herringbone plates are placed in a vacuum heating furnace, subjected to vacuum degas processing while being gradually heated, and joined to each other by brazing by being more heated after a prescribed vacuum pressure has been obtained.

Abstract: A method for joining a highly electroconductive core element (2) to a jacket element (1) made of refined steel. In said method, the electroconductive core element (2), such as a copper bar, and the joining agent element (3) are inserted in the jacket element (1), and at least the juncture area of the elements to be joined is thermally treated, so that there is created a metallurgical joint between the electroconductive core element (2) and the refined-steel jacket element (1).

Abstract: A method of joining metal and metal, or metal and ceramic parts, wherein a first metal part is selected and then processed to form a bond coat that will effectively bond to a sealing material which in turn bonds to a second metal or ceramic part without degrading under the operating conditions of electrochemical devices. Preferred first metal parts include alumina forming alloys from the group consisting of ferritic stainless steels (such as Fecralloys), austinetic stainless steels, and superalloys, and chromia forming alloys formed of ferritic stainless steels. In the case of chromia forming ferritic stainless steels, this bond coat consists of a thin layer of alumina formed on the surface, with a diffusion layer between the first metal part and this thin layer. The bond coat provides a good bonding surface for a sealing layer of glass, braze or combinations thereof, while at the same time the diffusion layer provides a durable bond between the thin alumina layer and the first metal part.

Abstract: A method of joining surfaces comprising: providing a first surface comprising a layer of silver; interposing between the first surface and a second surface a eutectic composite which melts below 140° C.; raising the temperature of the eutectic composite to a first temperature above the eutectic temperature to at least partially melt the eutectic composite and form molten eutectic alloy; and contacting the molten eutectic alloy with silver layer of the first surface so as to cause inter-diffusion and reaction between the eutectic alloy and the silver, wherein the relative proportions of silver and eutectic composite are selected such that a non-eutectic composition forms between silver and the metals contained in the eutectic composite, the non-eutectic composition having a melting temperature higher than said first temperature.

Abstract: A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: Braze filler in the form of coiled melt spun foil is adhesively bonded to coiled parent sheet metal forming a coiled laminate which can be cut to desired shapes, and brazed as an assembly comprised of laminate and non-laminate parts. Because the parent metal and melt spun foil are cut at the same time, only one piece of material must be handled. The laminate may comprise melt spun foil on one or both sides of the parent metal, may be bonded to the parent metal by means of spraying, rolling, dripping, or brushing, and may be applied to either parent metal or melt spun foil, or both. Application of the adhesive may also be in a pattern rather than covering the entire surface of parent metal.

Abstract: A diffusion bond mixture paint and method for repairing a single-crystal superalloy article that minimizes the amount of braze alloy applied to the article. The amount of boron and eutectic brittle borides of the wide gap brazing processes is minimized, resulting in a more robust repair. The braze paint includes an alloy powder mixture, a binder, and a carrier to thin the paint.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are bonded to their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are further bonded. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface. The ball is retained within the hole in an ambient processing environment which is generally uniform over the entirety of the ball's outer surface. While the ball is within the hole, the ball is bonded.

Abstract: A method of producing fiber-reinforced metallic building components having a complicated three-dimensional geometric shape includes the following steps. First, metal-coated SiC fibers are applied to a metallic sectional piece having a simple geometric shape, and are then held thereon without restraint by a metallic counterpart piece. Then, the unit consisting of the sectional piece, fibers and counterpart piece undergoes plastic deformation in vacuo between mold halves by applying pressure at an elevated temperature, without bonding of the fibers to one another or to the building component metal. By further increasing the pressure and/or temperature, the molded unit is compressed further between the mold halves and is consolidated to a monolithic part by metallic bonding (diffusion welding), whereby the part, either alone or bonded to other parts, forms the building component, after cooling and removing it from the mold halves.

Abstract: A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower shell. Thus, after the stamping process, the lower shell is subjected to a heat-treating process to reduce the brittleness. After the heat-treating process a center shell is welded to the lower shell.

Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Abstract: A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.

Abstract: A ribbon of colour A metal is combined with a thin layer of soldering alloy, bent and soldered to form a tube, it is then filled with a core of colour B metal. The compound is then drawn and/or laminated until it is transformed into a long ribbon or into a wire, externally of colour A and internally of colour B. The filled ribbon or wire is wrapped like a solenoid around a deformable support, like a metal mesh and stamped into the desired shape. The resulting two faced element is then ground in order to remove, all along a strip and following a line or in dots, the superficial part of colour A until the core of colour B is revealed. The bi-coloured long element is then treated like a single body and allows the realisation of precious bi-coloured ornamental items.

Abstract: The present invention relates to a method for repairing components such as blades used in turbine engines. The method comprises the steps of placing a piece of refractory metal material over an area of the component to be repaired and depositing a repair filler metal material over the piece of refractory material in an amount sufficient to repair the component and welding the repair filler metal material in place. The refractory metal material may be selected from the group consisting of niobium, tantalum, molybdenum, tungsten, a metal having a melting point higher than the melting point of nickel, and alloys thereof and may be uncoated or coated.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: An apparatus and method for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen mutually removably connected and configured and arranged to substantially secure an electronic component assembly in position therebetween. At least one of the platens is configured such that a portion of electronic components of a carrier substrate secured by the double platen assembly is viewable for exposure to an energy beam such as a laser beam used to cure a liquid into an associated dielectric stereolithographic packaging structure. Another embodiment includes the use of an adhesive-coated film for holding, locating and securing a plurality of individual electronic components for processing. A method of forming solder balls is also disclosed.

Abstract: An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position.

Abstract: A method for applying at least one bond coating on a surface of a metal-based substrate is described. A foil of the bond coating material is first attached to the substrate surface and then fused thereto, e.g., by brazing. The foil is often initially prepared by thermally spraying the bond coating material onto a removable support sheet, and then detaching the support sheet. Optionally, the foil may also include a thermal barrier coating applied over the bond coating. The substrate can be a turbine engine component.

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract: A soldering method is designed to seal an on-line transfer device of cable such that a housing of the device is sealed off to prevent the electromagnetic interference. The method includes a first step in which a fusing portion between a receiving seat and a cover of the housing is furnished with a soft solder. The cover is heated to cause the soft solder to melt to flow into the fusion portion, so as to fuse the receiving seat and the cover together. The housing of the device is free of the soldering marks or lumps.

Abstract: Start with a semiconductor substrate with contacts exposed through an insulating layer. Form a base over the contacts, with the base composed of at least one metal layer. Then form a conductive metal layer over the base. Form a mask over the top surface of the conductive metal layer with C4 solder bump openings therethrough with the shape of C4 solder bump images down to the surface of the conductive metal layer above the contacts. Etch away the exposed portions of the conductive metal layer below the C4 solder bump openings to form through holes in the conductive metal layer exposing C4 solder bump plating sites on the top surface of the base below the C4 solder bump openings with the conductive metal layer remaining intact on the periphery of the through holes at the C4 solder bump plating sites. As an option, form a barrier layer over the plating sites next.

Abstract: A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.

Abstract: An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.

Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.

Abstract: Preforms for use in base metal repair are formed by thermally spraying preferably a blend of a braze alloy and a high temperature alloy onto a separation sheet thereby forming a preform sheet. The separation sheet is removed from the preform sheet and the preform sheet is cut to form individual preforms which can be brazed directly onto a worn area of a high temperature alloy part such as a jet engine part.

Abstract: A two-part solder preform for use in attaching a leaded circuit component to a circuit board. The preform is formed by two different solid components, a first of which is formed of a lower-temperature solder alloy and the second of a higher-temperature solder alloy, in which the first solid component is present in a sufficient amount to dissolve the second solid component when the preform is heated above the melting temperature of the lower-temperature solder alloy but below the melting temperature of the higher-temperature solder alloy. Upon cooling, the preform yields a solder joint having a substantially homogenous composition, which bonds the lead to the circuit board. Preferred solder alloys for the first and second solid components are lead-free.

Abstract: A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of nickel, cobalt and iron, onto a bonding layer which comprises one or more metals selected from the group consisting of zinc, tin, lead, bismuth, nickel, antimony and thallium and which is disposed on a substrate including aluminum.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: The present invention is directed to an apparatus and method of solder-sealing an active matrix OLED display using a monochromatic solid-state laser beam (1). The solder-sealing apparatus comprises a cover assembly (13) adapted to be positioned over at least one OLED (11) on a substrate (10), a sealing band (12) surrounding each OLED, a chuck assembly (20) with an array of heat sinks (21) that align with the OLEDs, a pick-up assembly (30) with at least one aperture (33), and a flange assembly (132) to which a solder pre-form (133) is secured. The chuck assembly (20) receives, aligns and orients the substrate (10). A vacuum is then applied through each aperture (33) to align and hold the cover assembly (13) in place. The sealing band (12) and solder pre-form (133) are aligned and pressed together by the pick-up assembly (30), and the focused laser beam (1) is projected through the chuck assembly to seal the OLEDs (11) within the cover assembly (13).

Abstract: A process for reconditioning worn or out-of-spec components, in particular titanium components and components which in partial areas are designed to receive further components in a positively locking and dimensionally accurate manner, e.g., as grooves, for which purpose the relevant partial areas are machined until a predetermined dimension is reached, spare parts which correspond to the machined partial areas and have the same geometry minus a predetermined soldering gap are produced from a material which is of the same type as the material of the component, and a soldering medium is introduced between machined walls of the partial area and spare part, which are fixedly joined to the component by a soldering process, after which, if necessary, the partial area(s) in question is/are dimensionally accurately machined.