Abstract: The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract: A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.

Abstract: A method for repairing a component of a gas turbine and a solder alloy are disclosed. In an embodiment, the method includes applying the solder alloy to the component in an area of the component having a punctiform damage or a linear imperfection, where the solder alloy is a mixture of a NiCoCrAlY alloy and a Ni-based solder. A molded repair part made of the solder alloy is applied to the component in an area of the component having a planar defect. The component is heat treated to solder the molded repair part on the component and to solder the solder alloy applied to the component in the area of the component having the punctiform damage or the linear imperfection. The component is cooled after the heat treating and, following the cooling, the component is further heat treated.

Abstract: A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask.

Abstract: A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes nickel, germanium, and an active metal element. The braze alloy includes germanium in an amount greater than about 5 weight percent, and the active metal element in an amount less than about 10 weight percent. A method for sealing a ceramic component to a metal component in an electrochemical cell and, an electrochemical cell sealed thereby, are also provided.

Abstract: A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO2, Al2O3, YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.

Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: An assembly includes a first plate member with a first generally planar abutting surface and a second plate member with a second generally planar abutting surface. The first abutting surface being generally planar and having a plurality of micro reservoirs for storing brazing material. The first abutting surface and the second abutting surface being positioned adjacent each other and being joined by brazing material from the plurality of micro reservoirs.

Abstract: A solder spattering suppressed reflow method includes the following steps: (A) preparing a carrier; (B) placing at least one solderable object on the carrier by means of printing, dispensing, mounting or plating; and (C) moving the carrier into an enclosed chamber and carrying out a high-temperature and high-pressure reflow process to have the solderable object heated and melted to bond to the carrier.

Abstract: A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (200) may have the following parts: backing plate (220) supporting substrate (100) such that plural terminal regions (108) formed on one surface of substrate (100) are free, transfer mask (210), which contains a metal mask and has plural through-holes (216) formed corresponding to plural terminal regions (108) of the substrate, fixing block (230) onto which end portions (210a) of the transfer mask are fixed such that transfer mask (210) faces one surface of the substrate, and magnet part (240), which attaches transfer mask (210) by magnetic force to the side of backing plate (220); for magnet part (240), the attachment force to the center portion of the substrate is less than that of the peripheral edge portion.

Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.

Abstract: A method for auxiliary assembling micro-components though liquid medium. This method includes following steps: providing a substrate, an adhesive layer, at least one micro-component and a liquid medium, wherein the adhesive layer is on the substrate and the micro-component and the liquid medium are on the adhesive layer. The adhesive is used for adhering one side of the micro-component and another side of the micro-components is disposed with is disposed with the liquid medium. Then, the another side of the micro-component which is disposed with the liquid medium touches a target area, and the substrate moves toward the target zone at a speed that is smaller than 90 ?m/s for placing the micro-component on the target zone or moves away from the target zone at a speed greater than 4370 ?m/s for picking up the micro-component from the target zone.

Abstract: Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

Abstract: The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.

Abstract: Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic material chosen from the group consisting of oxides, carbides, and nitrides of at least one metal. The nonmetallic material is more susceptible to heating by microwave radiation than the metallic material of the first particles, and the nonmetallic material is present in the braze material in an amount sufficient to enable the first particles to completely melt when the first and second particles are subjected to heating by microwave radiation.

Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Abstract: In one embodiment, a method for soldering photovoltaic solar cells includes providing a first and second PV cell, a holder, soldering ribbon and a mass reflow oven. The method further includes placing the soldering ribbon in a fixture groove in the holder. The method further includes placing the first and second PV cell in the holder such that the soldering ribbon is position in a desired position on the first and second PV cell. The method further includes placing the holder and the first and second PV cell with the soldering ribbon into the mass reflow oven. The method further includes heating the holder and the first and second PV cell with the soldering ribbon in the mass reflow oven to solder the first and second PV cell. The method further includes cooling the holder and the first and second PV cell with the soldering ribbon.

Abstract: A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface of the core layer, a solder resist layer including opening portions and formed on an outermost surface of the at least one laminated layer such that respective portions of an outermost conductor layer are exposed from the opening portions; forming a Sn-containing underlying layer on the respective portions of the outermost conductor layer by a plating process; and fusing the Sn-containing underlying layer to the respective portions of the outermost conductor layer by a heating process, then mounting solder balls directly on respective portions of the Sn-containing underlying layer, and then connecting the solder balls to the respective portions of the Sn-containing underlying layers.

Abstract: Disclosed herein is a jig for solder ball attachment capable of sensing whether missing balls occur by electrical sensing using an electrical sensor structure in which a conductive thin film is embedded in the jig and electrically sensing whether abnormal solder balls, for example, large ball/small ball/ball size are attached, without confirming whether abnormal solder balls, for example, large ball/small ball/ball size are attached by vision one by one, thereby shortening operating time and improving workability.

Abstract: An amorphous braze foil (1) produced by a melt-spin process has an upper side and a lower side. The upper side and the lower side are thinly coated with a film of metallic Ni-based, Co-based, or Ni—Co-based braze powder (2) with a particle size in the nanometer range, wherein both the braze foil (1) and also the braze powder (2) additionally include grain boundary stabilizing elements as alloying elements. In addition, melting point depressants can be present in the braze foil or in the nano braze powder (2) in a commercially common quantity or with a considerably increased proportion. With the braze foil (1) coated in this manner, both the melting temperature of the braze material and also the probability of recrystallization are advantageously reduced when brazing in the adjacent base material (10).

Abstract: A flip chip package and a method of manufacturing the same are provided. The flip chip package include: a package substrate, a semiconductor chip and conductive hollow bumps. The semiconductor chip may be arranged over an upper surface of the package substrate. The conductive hollow bumps may be interposed between the semiconductor chip and the package substrate to electrically connect the semiconductor chip with the package substrate. Thus, a wide gap may be formed between the semiconductor chip and the package substrate by the thick conductive hollow bumps. As a result, a sufficient amount of the molding member may be supplied to each of the conductive hollow bumps to surround each of the conductive hollow bumps.

Abstract: Disclosed is a method for manufacturing a wiring board including a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post to be electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, the method including a through-hole boring process of boring the through-hole in the solder resist layer containing a thermosetting resin to expose the conductor layer within the through-hole; a first conductor part forming process of forming a first conductor part composed mainly of copper within the through-hole; and a second conductor part forming process of forming a second conductor part composed mainly of tin, copper, or a solder on the first conductor part, in this order.

Abstract: A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

Abstract: A metallic solder rod is provided. The solder rod includes a stop-off at the end so that the solder cannot drip from an opening. The solder rod includes an inner region and an outer region which at least partially surrounds the inner region wherein the inner region includes a different alloy than the outer region. A process for applying solder to a hole in a substrate is also provided.

Abstract: The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.

Abstract: A method of brazing a top loading cutter into a cutter pocket is disclosed, wherein the method includes placing at least one braze disc between an inner wall of the cutter pocket and a portion of the top loading cutter and heating the at least one braze disc to a temperature above the melting temperature of the braze disc.

Abstract: A surplus ball removing apparatus including a substrate stage, a substrate including a connection pad, a mask with opening to supply conductive ball onto the substrate, a surplus ball adhering head for removing surplus ball mounted on the substrate, adhering head moving system, an image processing portion, an adhesive material stage, and a ball recovering stage.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.

Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part, comprising steps of: providing a stainless steel part, a SiC ceramic part, and a Al foil; bringing surfaces of the stainless steel part, SiC ceramic part, and Al foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a pulsed electric current to the stainless steel part, SiC ceramic part, and Al foil, heating the stainless steel part, SiC ceramic part, and Al foil to a joining temperature of about 500-650° C., and simultaneously applying a joining pressure of about 50-100 MPa to the stainless steel part, SiC ceramic part, and Al foil while the current is applied, and maintaining the joining temperature and the joining pressure for about 10-30 minutes.

Abstract: A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and gasses to escape the interface between the solder and the substrate. Particularly, flux accumulates in the spaces formed by the gaps and is forced to the edge of the solder preform as the gap closes. In further embodiments, channels are formed on one or both surfaces of the solder preform. In addition to further assisting in the escape of gas and flux during reflow, the channels and gaps increase the effectiveness of oxygen purging using inert or reducing gasses in the reflow chamber. Additionally, the channels and gaps increase the effectiveness of vacuum solder.

Abstract: Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Abstract: The invention provides a process for brazing two or three parts. A braze with a composition consisting of NiresCraBbPcSid with 20 atomic percent<a<22 atomic percent; 1.2 atomic percent?b?3.6 atomic percent; 12.5 atomic percent?c?14.5 atomic percent; 0 atomic percent?d<1.5 atomic percent; incidental impurities?0.5 atomic percent; and residual Ni is inserted between two or more parts to be joined to form a joint, the parts to be joined having a higher melting temperature than the braze. The joint is heated to a temperature of between 1020° C. and 1070° C. and cooled to form a brazed joint between the parts.

Abstract: An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.

Abstract: A method for connecting a tube and a cast component includes widening an end section of the tube to form a widened section, positioning the cast component adjacent to the widened section, and welding the cast component to enclose at least a portion of the widened section with a weld deposit in at least one step, thereby locking the tube and the cast component together. A connection between a tube and a cast component is also provided.

Abstract: A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and gasses to escape the interface between the solder and the substrate. Particularly, flux accumulates in the spaces formed by the gaps and is forced to the edge of the solder preform as the gap closes. In further embodiments, channels are formed on one or both surfaces of the solder preform. In addition to further assisting in the escape of gas and flux during reflow, the channels and gaps increase the effectiveness of oxygen purging using inert or reducing gasses in the reflow chamber. Additionally, the channels and gaps increase the effectiveness of vacuum solder.

Abstract: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

Abstract: A method of brazing a pipe member to a counterpart member includes steps of mounting in a circumferential direction an engaging portion in a ring shape to an outer periphery of the pipe end portion proximate an endmost portion of the pipe member, engaging a brazing-filler-metal-made ring in a ring shape with the engaging portion, inserting the pipe end portion of the pipe member provided with the brazing-filler-metal-made ring into the counterpart member, heating and melting the brazing-filler-metal-made rug with the outer peripheral surface of the pipe end portion being in abutment with the inner peripheral surface of the counterpart member, pouring a brazing filler metal into an abutment portion between the outer peripheral surface of the pipe end portion and the inner peripheral surface of the counterpart member, and securing by brazing the pipe end portion to the counterpart member.

Abstract: A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body.

Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is disposed on the additional circuit structure. A conductive bump pattern is disposed in the solder mask insulating layer, wherein the conductive bump pattern extends into the opening horizontally, wherein a side, a portion of an upper surface and a portion of a lower surface of the conductive bump pattern are exposed from the opening from the opening. A solder ball is formed in the opening, wherein the solder ball is electrically connected to the additional circuit structure.

Abstract: In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part.

Abstract: A method for joining metal parts of a turbine engine component, the method comprising positioning a nanoparticle foil between faying surfaces of the metal parts, and diffusion bonding the metal with the nanoparticle foil, where the nanoparticle foil has a film thickness of about 100 micrometers or less, and comprises an alloy having an average particle size of about 500 nanometers or less.