Abstract: Method for manufacturing an solar cell device, characterized in that the method comprises among others the following steps: arranging solar cell units (1) and electrically insulating units (2) alternatingly next to each other; applying rear soldering ribbons (3) to the rear side of the solar cell units (1) and the electrically insulating units (2); applying front soldering ribbons (4) to the front side of the solar cell units (1) and the electrically insulating units (2); soldering the rear soldering ribbons (3) and the front soldering ribbons (4) to the solar cell units (1), thereby providing an assembled solar cell. The invention also comprises a solar cell manufactured by means of the method.

Abstract: In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member.

Abstract: A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and heating the preform to remove the remainder of the binder and to sinter the metallic powder together. The preform may include a wear-resistant material therein. Such preforms may be used to form a braze joint between two metallic components, or to produce a metallic component with a wearcoated surface.

Abstract: A method for manufacturing a printed wiring board having a bump. The method includes forming a solder-resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective conductive pad of the printed wiring board, and printing a solder paste in the large-diameter aperture in the solder-resist layer, but not printing the solder paste in the small-diameter aperture in the solder resist layer. The method also includes loading a solder ball in each of the large-diameter aperture and the small-diameter aperture using a mask having aperture areas that correspond to the small-diameter aperture and large-diameter aperture of the solder-resist layer, and forming a small-diameter bump from the solder ball in the small-diameter aperture and a large-diameter bump from both the solder paste and the solder ball in the large-diameter aperture.

Abstract: A method of forming a brazed joint between an armature bar and a hydraulic header clip including the steps of: locating ends of a plurality of hollow strands and a plurality of solid strands within a cavity in an end fitting such that free ends of said hollow strands extend axially beyond free ends of said solid strands; and pre-placing an essentially phosphorous-free silver braze alloy around and between said ends of said hollow strands and said solid strands such that said braze alloy extends axially beyond the free ends of said solid strands.

Abstract: Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.

Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

Abstract: A method for forming a solder joint to form an electrical interconnection. In accordance with various embodiments, a solid block of solder is placed onto a previously applied layer of solder paste on an underlying electrically conductive pad. The solid block of solder and the layer of solder paste are concurrently reflowed to form a solder joint. In some embodiments, a pick and place machine is used to respectively place the block of solder and a component onto the layer of solder paste, and the hardened solder joint interconnects a terminal of the component to the pad.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: Provided is a semiconductor device and method of fabricating the semiconductor memory device. The semiconductor device may be formed by forming a first welding groove along outside edges of one case of a pair of upper and lower cases, forming a first welding protrusion along outside edges of the other case, the first welding protrusion being formed to correspond to the first welding groove and having a volume larger than a volume of the first welding groove. The method may further include inserting the first welding protrusion into the first welding groove to enclose a memory module in an inner accommodating space of the upper and lower cases, melting the first welding protrusion so that a first portion of the first welding protrusion fills the first welding groove and a second portion of the first welding protrusion fills a space between welding portions of the upper case and the lower case, and solidifying the first and second portions of the first welding protrusion.

Abstract: A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end.

Abstract: The present invention discloses abrasion resistant claddings for cast iron substrates comprising hard particles and nickel-based braze alloys. The cladding material can be brazed on cast iron substrates at lower temperatures than conventional cladding materials, providing highly increased abrasion resistance to the cast iron substrate materials without adversely affecting the physical properties and structural integrity of such substrates.

Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center region (16) of the insert than in the surface region (18) of the insert, thereby facilitating complete melting of the insert during a transient liquid phase bonding process. Alternatively, the particles may be a low-ductility material, such as a superalloy or an MCrAlY alloy, contained within a high ductility sheath material formed into a ribbon shape, thereby allowing the low-ductility material to be delivered in ribbon form during a coating process.

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im

Abstract: A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped.

Abstract: The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

Abstract: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.

Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.

Abstract: In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.

Abstract: Provided is a method of joining members having different thermal expansion coefficients, capable of joining them at a temperature lower than the melting point of Ag to obtain a joining layer having excellent durability to a thermal cycle. First Ag particles 3 having an average particle diameter of 50 nm or less and an Ag foil 4 or metal foil 4 having a smaller modulus of longitudinal elasticity than that of Ag are placed between two types of members 1 and 2 at least one of which has a lower thermal expansion coefficient than that of Ag, heated to join the members 1 and 2.

Abstract: A heating apparatus comprising an energetic nanolaminate film that produces heat when initiated, a power source that provides an electric current, and a control that initiates the energetic nanolaminate film by directing the electric current to the energetic nanolaminate film and joule heating the energetic nanolaminate film to an initiation temperature. Also a method of heating comprising providing an energetic nanolaminate film that produces heat when initiated, and initiating the energetic nanolaminate film by directing an electric current to the energetic nanolaminate film and joule heating the energetic nanolaminate film to an initiation temperature.

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract: A method for electrically connecting disk drive suspension assembly elements including positioning a first component having a first terminal with an edge adjacent to a second component having a second terminal and applying solder to form a solder joint over the edge of the first terminal and onto the second terminal. Heat to melt the solder is provided from a source that is physically remote from the components.

Abstract: A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises a braze tape alloy containing the base metal of the superalloys and a melting point suppressant, and is applied so as to substantially cover the faying surface. The braze tape is then bonded to the faying surface by heating the first component to a temperature not exceeding the brazing temperature required to join the components. Thereafter, the components are assembled so that the bonded braze tape are between the respective faying surfaces of the components. The components are then brazed together by applying and heating a braze alloy to the braze temperature.

Abstract: The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper and incidental impurities. The total amount of copper, nickel, tin and zinc is between 80 and 95 atom %. The addition of more than 0.5 atom % of zinc produces excellent resistance to surface oxidation in air and/or atmospheric humidity. These brazing alloys can be used to produce excellent brazed joints.

Abstract: A bonding means for electrically coupling a first component and a second component at an interface. The bonding means including at least one electrically conductive bonding puck positioned between the first component and the second component. The bonding puck being disposed within a recess formed in at least one of the first component and the second component. The at least one electrically conductive bonding puck providing electrical bonding between the first component and the second component and establishing electrical continuity therebetween.

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.

Abstract: A nickel-based braze composition is described, containing nickel, palladium, and restricted amounts of boron and silicon. The composition can also contain tantalum, titanium, and zirconium, as well as aluminum, chromium, and cobalt. A method for joining two metal components, using the braze composition, is also described. The braze composition can also be used to fill cracks or other cavities in a component, e.g., a gas turbine part formed from a nickel-based superalloy. Articles of manufacture which contain the braze composition are also described.

Abstract: In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a ?? phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

Abstract: A solder ball mounting method includes a step of providing a flux on electrodes of a substrate, a step of arranging a plurality of solder ball mounting masks in which ball feeding openings are formed in positions opposing to the electrodes and opening areas of the ball feeding openings are set to increase toward an upper layer on the substrate, a step of mounting solder balls on the electrodes by feeding the solder balls into the ball feeding openings while moving the solder ball mounting mask as an upper layer in a surface direction of the substrate, a step of removing the solder ball mounting masks from the substrate, and a step of joining the solder balls to the electrodes.

Abstract: A method of making porous shapes from unit structures such as beads involves coating the beads with two or more layers of material deposited such that it forms an energetic material. These bi-layer energetic materials are formed from a variety of materials including, but not limited to: Ti & B, Zr & B, Hf & B, Ti & C, Zr & C, Hf & C, Ti & Si, Zr & Si, Nb & Si, Ni & Al, Zr & Al, or Pd & Al, all of which can be deposited from vapor. Pressure is applied to prevent the components from moving and the solid-state reaction between the alternating layers produces exothermic heat. Heat from the reaction alone or in conjunction of an applied brazing compound joins the beads forming a porous shape that is desired. The reaction in the materials may be activated with a small pulse of local energy that can be applied using optical, electrical, or thermal sources. Common examples include an electrical pulse, spark, hot filament, a laser beam, etc.

Abstract: System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A brazing assembly includes a tungsten/carbide/cobalt substrate (e.g., wear pad), a second substrate including titanium or titanium alloy (e.g., a midspan shroud of a fan or compressor blade) and a brazing material including gold, nickel, and copper present in respective amounts to improve the ductility of the braze joint. A brazed article includes a first substrate, a second substrate, and a braze joint having a post-braze hardness of between 450 and 600 KHN. A method to improve the impact resistance of a braze joint between a tungsten/carbide/cobalt substrate and a substrate including titanium or alloy thereof includes utilizing a brazing material including gold, nickel, and copper and brazing at temperatures less than about 1900° F. (1038° C.).

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls ale dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold ale configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.

Abstract: A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig, floating means that floats the ball cup from the arraying jig, and vibrating means that vibrates the ball cup. The moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup.

Abstract: The present invention is a low heat energy input repair system. The system utilizes a V-shaped feedstock that conforms to the shape of grooves in damaged parts. The V-shape of the feedstock conforms closely to the damaged region of various components and reduces the heat input needed to bond the surfaces. The repair system is deployable onsite, at a military depot, industrial manufacturing facility or other location where a mobile repair system would be beneficial. The present system provides onsite, in-situ, low heat input repair of wear, fatigue and corrosion cracks, or impact surface damage of large components. The present invention is particularly useful for components with thin walls and results in low distortion.

Abstract: A method of making a carbon nanotube reinforced solder cap. Carbon nanotube-solder (CNT-S) particles are transferred from a transfer substrate, having an adhesive layer, to a solder bump by using thermo compression bonding. The CNT-S particles are then reflowed to form a cap on the solder bump. The solder bump with the reflowed cap can then be joined to a bonding pad or another solder bump with a cap by placing the solder bump on the pad or other bump and reflowing at a temperature sufficient to reflow the cap(s).

Abstract: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.

Abstract: A braze ring includes a generally annular body and an outer annular channel formed on an outer surface of the body. A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end. Another braze ring includes a body having a substantially symmetric cross-sectional shape forming an inner channel and an outer channel and flux carried within each of the inner channel and the outer channel.

Abstract: Systems and methods for transient liquid phase bonding are described herein. Embodiments of these systems and methods utilize sandwich interlayers to produce stronger, more homogeneous bonds than currently possible. These sandwich interlayers have a middle bonding layer sandwiched between two outer bonding layers. The middle bonding layer is a different composition, and may even be a different form, than the outer bonding layers. In embodiments, these sandwich interlayers may be used to join a single crystal material to a polycrystalline material to make a gas turbine engine component, such as an integrally bladed rotor.