Abstract: In accordance with disclosed embodiments, there is a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. One example is a microelectronic die package that includes a die, a package substrate attached to the die on one side of the die and configured to be connected to a system board, a plurality of passive devices over a second side of the die, and a plurality of passive device contacts over a respective passive die, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die.

Abstract: A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members. The circuit members are spaced apart from one another in a current packaging process to increase a layer area. The assemble substrate thus fabricated meets the requirements for a packaging substrate of a large size, and has a high yield and low fabrication cost.

Abstract: A method for diagnosing a bias power supply for an acquisition system including a matrix-array interface device having conductive rows and columns, each row being connected to an input port and to a bias power supply, each column being selectively connected to ground by controlling an output port, and at each intersection either a circuit or a shunt, connected between the intersected row and the intersected column, including the following steps: controlling an output port so as to ground a shunt, reading the input port corresponding to the shunt, a low state indicating a normal presence of the power supply, a high state indicating an abnormal absence.

Abstract: An image capturing apparatus includes an image sensor, a determination unit configured to determine whether or not a predetermined condition is satisfied, and a control unit configured to acquire foreign substance information from an image obtained by causing the image sensor to perform image capture, wherein if the determination unit determines that the predetermined condition is not satisfied, the control unit acquires the foreign substance information from the image, and if the determination unit determines that the predetermined condition is satisfied, the control unit does not acquire the foreign substance information from the image, and the predetermined condition includes at least one of the following: that a mounted lens unit is a lens unit with a narrow image circle, and that a mode in which only a partial region of the image sensor is recorded has been set.

Abstract: A semiconductor package includes a first semiconductor chip. A second semiconductor chip is below the first semiconductor chip. A third semiconductor chip is below the second semiconductor chip. The second semiconductor chip includes a first surface in direct contact with the first semiconductor chip, and a second surface facing the third semiconductor chip. A first redistribution pattern is on the second surface of the second semiconductor chip and is electrically connected to the third semiconductor chip. The third semiconductor chip includes a third surface facing the second semiconductor chip. A conductive pad is on the third surface.

Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

Abstract: A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed at a surface of the semiconductor substrate, wherein the photo-sensitive device is configured to receive a light signal from the backside of the semiconductor substrate, and convert the light signal to an electrical signal. An amorphous-like adhesion layer is disposed on the backside of the semiconductor substrate. The amorphous-like adhesion layer includes a compound of nitrogen and a metal. A metal shielding layer is disposed on the backside of the semiconductor substrate and contacting the amorphous-like adhesion layer.

Abstract: Disclosed embodiments perform readout at a high rate without being affected by transition of pixel transistors. A solid state imaging device of an embodiment has a pixel having a photoelectric conversion unit that generates charges, an amplification transistor including an input node that receives a signal based on the charges generated in the photoelectric conversion unit, and a reset transistor that resets the potential of the input node of the amplification transistor; a signal processing circuit that reads out a signal from the pixel via a signal line; and a switch provided between the signal line and an input node of the signal processing circuit, and a signal value of a control signal applied to the gate of the reset transistor changes while the switch is in the off-state.

Abstract: A solid-state image pickup device according to an embodiment is a solid-state image pickup device including a first pixel row, a second pixel row, and a third pixel row that are arranged in a horizontal direction. In the solid-state image pickup device, a first control pulse for transferring charges of first accumulation portions of the fourth and sixth CCD registers in a vertical direction perpendicular to the horizontal direction and a second control pulse for transferring charges of second accumulation portions of the fourth and sixth CCD registers in the horizontal direction are input to the fourth and sixth CCD registers such that an Hi period of the first control pulse and an Hi period of the second control pulse do not overlap each other in a timing period in which charges accumulated in the first, second, and third pixel rows are transferred.

Abstract: Described examples include a system in package (SIP) device, including: a first leadframe having a first surface and a second surface opposite the first surface; an integrated circuit die including solder bumps on a first surface and having a second opposite surface, the solder bumps mounted to the second surface of the first leadframe; a second leadframe having a first surface including a die pad portion, and a second opposite surface, the die pad portion attached to the second surface of the integrated circuit die; and an inductor mounted to the first surface of the first leadframe, the inductor having terminals with exterior portions electrically connected and mechanically connected to the first surface of the first leadframe, the inductor terminals spaced from one another by a portion of an inductor body, the portion of the inductor body between the inductor terminals spaced from the first surface of the first leadframe by a gap of at least 100 ?ms.

Abstract: An image sensor and a method of manufacturing the image sensor are provided. The image sensor includes a block layer including an absorption layer and a transparent layer that are alternately stacked, a lens element is located below the block layer, and a sensing element is located to face the lens element.

Abstract: A sensor and a portable terminal comprising the same, according to an embodiment, comprise: a substrate; a light-emitting unit and a light-receiving unit, which are arranged on the substrate at a distance from each other; a cover unit arranged on the light-emitting unit and the light-receiving unit so as to face the substrate; a first optical guide lens unit arranged between the cover unit and the light-emitting unit so as to refract light, which has been emitted from the light-emitting unit and to transfer the same to the outside of the cover unit; and a second optical guide lens unit arranged between the cover unit and the light-receiving unit so as to transfer light from the outside of the cover unit to the light-receiving unit. In connection with a proximity/illuminance sensor, the sensing range related to a spaced object is expanded, thereby improving the sensing performance.

Abstract: An image capturing apparatus includes an image sensor, a determination unit configured to determine whether or not a predetermined condition is satisfied, and a control unit configured to acquire foreign substance information from an image obtained by causing the image sensor to perform image capture, wherein if the determination unit determines that the predetermined condition is not satisfied, the control unit acquires the foreign substance information from the image, and if the determination unit determines that the predetermined condition is satisfied, the control unit does not acquire the foreign substance information from the image, and the predetermined condition includes at least one of the following: that a mounted lens unit is a lens unit with a narrow image circle, and that a mode in which only a partial region of the image sensor is recorded has been set.

Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.

Abstract: A pixel sensor element (200) including a photodetector (201) and a storage assembly having N storage arrays (205), each having an input shift register (207) and an output shift register (215) each with a number M of storage cells arranged in a column, and a storage shift register (211) with a number M of rows of storage cells, each row comprising a number P of storage cells, for signal transfer from the input shift register (207) to the output shift register (215). A number N of independently driveable signal transfer regions (203) transfer the signal from the photodetector (201) to a first cell (210) of one of a respective one of the input shift registers (207). A number N of signal read-out regions (219) read the signal from a last cell (217) of a respective one of the output shift registers (215). N is 2 or more. M is 1 or more. P is 1 or more. Image sensors, imaging devices, storage assemblies, and methods are also provided.

Abstract: A semiconductor package includes a leadframe comprising input/output pins accessible external to the semiconductor package and a semiconductor die electrically connected to the leadframe. The semiconductor package also includes a passive electrical component mounted on a side of the semiconductor die opposite the leadframe. Mold compound encapsulates the passive electrical component, semiconductor die, and leadframe to form the semiconductor package. Associated methods are disclosed as well.

Abstract: An apparatus and a method for producing the apparatus are described, wherein the apparatus includes a substrate with a photodetector and a dielectric arranged on the substrate. Further, the apparatus includes a microlens arranged on a first side of the dielectric. The microlens is configured to steer incident radiation onto the photodetector. Moreover, the apparatus includes a carrier-free optical interference filter. The microlens is arranged between the photodetector and the interference filter, and the interference filter has a plane surface on a side facing away from the photodetector.

Abstract: The present technology relates to a solid-state imaging device that can further reduce the influence the film stress generated in an upper electrode has on a photoelectric conversion film, a method of manufacturing the solid-state imaging device, and an electronic apparatus. A solid-state imaging device includes: a photoelectric conversion film formed on the upper side of a semiconductor substrate; and two or more light shielding films formed at positions higher than the photoelectric conversion film with respect to the semiconductor substrate. The present technology can be applied to solid-state imaging devices, electronic apparatuses, and the like, for example.

Abstract: A method for manufacturing a semiconductor structure includes the following steps. A first carrier is adhered to a first surface of a wafer by a first temporary bonding layer. A second surface of the wafer facing away from the first carrier is etched to form at least one through hole and at least one trench, in which a conductive pad of the wafer is exposed through the through hole. An isolation layer is formed on the second surface of the wafer, a sidewall of the through hole, and a sidewall of the trench. A second carrier is adhered to the second surface of the wafer by a second temporary bonding layer, and thus the through hole and the trench are covered by the second carrier. The first carrier and the first temporary bonding layer are removed.

Abstract: The exemplary embodiment of the present disclosure relates to a photo detecting sensor including a photo detector configured to detect an optical signal incident on an active detecting area for optical detection, an optical part arranged at a front side of the photo detector to pass the optical signal, and a micro lens array interposed between the optical part and the photo detector to concentrate the optical signal having passed the optical part to within the active detecting area of the photo detector.

Abstract: In a distance measuring device, a drive controller generates an emission timing signal and an exposure timing signal in accordance with a measurement condition. A light source irradiates light in response to the emission timing signal. A solid-state image sensor has a group of pixels arranged in a matrix pattern and divided into a plurality of regions on a line-by-line basis, and performs an exposure process on a selected one of the regions in response to the exposure timing signal. An imaging signal processor obtains distance information by performing an arithmetic operation on a signal output from the solid-state image sensor. The drive controller generates mutually different measurement conditions to the plurality of the regions of the solid-state image sensor.

Abstract: According to an aspect of the present invention, there is provided an imaging device including: a plurality of pixels, each pixel including a photoelectric conversion unit that photoelectrically converts received light, a read node in which a signal charge generated in the photoelectric conversion unit is accumulated, and a first readout circuit that performs analog-to-digital conversion to convert a signal based on the signal charge accumulated in the read node into a digital signal; and a second readout circuit that reads a signal based on the signal charge, the signal having a smaller amplitude than a resolution of the analog-to-digital conversion of the first readout circuit.

Abstract: First and second semiconductor light receiving elements each include: a first P-type semiconductor region which is formed in an N-type semiconductor substrate; a first N-type semiconductor layer region which is formed in the first P-type semiconductor region; a P-type semiconductor region having a high concentration which is formed in the first P-type semiconductor region; and an N-type semiconductor region having a high concentration which is formed in the first N-type semiconductor layer region. On the semiconductor substrate, insulating oxide films are formed. On the first and the second semiconductor light receiving elements, insulating oxide films that have different thicknesses are formed.

Abstract: A stacked III-V semiconductor diode that has an n+ layer having a dopant concentration of at least 1019 N/cm3, an n? layer having a dopant concentration of 1012 N/cm3 to 1016 N/cm3, a layer thickness of 10 ?m to 300 ?m, a p+ layer having a dopant concentration of 5·1018 N/cm3 to 5·1020 cm3 and a layer thickness greater than 2 ?m, the layers following each other in the specified order, each including a GaAs compound or being made from a GaAs compound and having a monolithic design, the n+ layer or the p+ layer being a substrate, and a lower side of the n? layer being integrally connected to an upper side of the n+ layer. The stacked III-V semiconductor diode including a first defect layer having a layer thickness greater than 0.5 ?m, the defect layer being situated within the n? layer.

Abstract: Embodiments of the disclosure provide an image sensor device. The image sensor device includes a semiconductor substrate including a front surface, a back surface opposite to the front surface, a light-sensing region close to the front surface, and a trench adjacent to the light-sensing region. The image sensor device includes a light-blocking structure positioned in the trench to absorb or reflect incident light.

Abstract: A method for forming an image sensor device is provided. The method includes forming a photodetector in a semiconductor substrate and forming a shielding layer over the semiconductor substrate. The method also includes forming a dielectric layer over the shielding layer and partially removing the dielectric layer to form a recess. The method further includes partially removing the shielding layer through the recess. In addition, the method includes forming a filter in the recess after the shielding layer is partially removed.

Abstract: A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

Abstract: A solid-state imaging device includes: multiple micro lenses, which are disposed in each of a first direction and a second direction orthogonal to the first direction, focus the incident light into the light-receiving surface; with the multiple micro lenses of which the planar shape is a shape including a portion divided by a side extending in the first direction and a side extending in the second direction being disposed arrayed mutually adjacent to each of the first direction and the second direction; and with the multiple micro lenses being formed so that the depth of a groove between micro lenses arrayed in a third direction is deeper than the depth of a groove between micro lenses arrayed in the first direction, and also the curvature of the lens surface in the third direction is higher than the curvature of the lens surface in the first direction.

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device capable of realizing impedance control of the semiconductor device. An input/output wiring line 23 and a ground wiring line 22 are such that through glass vias are provided so as to form a strip line structure by blasting or electric discharge machining and thereafter metal films are formed on a surface and a rear surface. It is possible to configure the semiconductor device with the impedance control by adjusting a conductor diameter of the input/output wiring line 23 and an insulating layer thickness between the input/output wiring line 23 and the ground wiring line 22. The present technology may be applied to the semiconductor device.

Abstract: Various technologies described herein pertain to combining high dynamic range techniques to enable rendering higher dynamic range scenes with an image sensor. The image sensor can implement a combination of spatial exposure multiplexing and temporal exposure multiplexing, for example. By way of another example, the image sensor can implement a combination of spatial exposure multiplexing and dual gain operation. Pursuant to another example, the image sensor can implement a combination of temporal exposure multiplexing and dual gain operation. In accordance with yet another example, the image sensor can implement a combination of spatial exposure multiplexing, temporal exposure multiplexing, and dual gain operation. The image sensor can be formed on a single wafer or the image sensor can be a 3D-IC image sensor that includes at least two vertically integrated layers.

Abstract: First RGB image signals are subjected to an input process. First color information is obtained from the first RGB image signals. Second color information is obtained by a selective expansion processing in which color ranges except a first color range are moved in a feature space formed by the first color information, the first color information that represents each object in a body cavity being distributed in the each color range. The second color information is converted to second RGB signals. A red display signal, a green display signal and a blue display signal are obtained by applying a pseudo-color display process to the second RGB signals.

Abstract: A method for controlling an electronic apparatus includes determining representative colors of pixels of a received image frame; calculating input dynamic ranges for respective representative colors based on brightness information of the received image frame; expanding a dynamic range for the representative colors based on at least one of the brightness information of the received image frame and display characteristics of the electronic apparatus; and outputting an image frame having adjusted brightness based on the expanded dynamic range.

Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves.

Abstract: BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer.

Abstract: A semiconductor device includes a first conductive portion, a second conductive portion, a first layer, and a second layer. The first conductive portion includes a first end portion and a first extending portion. The first extending portion extends in a first direction. The length of the first extending portion in a second direction is shorter than a length of at least a part of the first end portion in the second direction. The first layer includes multiple semiconductor chips, multiple passive chip components, and a resin. The first extending portion includes a first portion and a second portion. The first layer is provided around the first portion. The first layer expands along a first plane. The first plane intersects the first direction. The second layer includes a first multilayer wiring. The second layer expands along a second plane intersecting the first direction.

Abstract: A first signal ratio (?log(B/G)) between a B image signal and a G image signal is calculated. A second signal ratio (?log(G/R)) between the G image signal and an R image signal is calculated. A difference between first and second signal ratios in a first area and first and second signal ratios in a specific area is increased to enhance a color difference between normal mucosa and an abnormal region (an atrophic mucosal region and a deep blood vessel region). The color difference between the normal mucosa and the abnormal region in a case where at least one of the RGB image signals is a narrowband image signal is greater than the color difference in a case where all of the RGB image signals are broadband image signals.

Abstract: A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.

Abstract: In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Abstract: The present disclosure is directed to a system and method for amplifying Radio Frequency (RF) signals. In some implementations, a system includes a first interface, a second interface, secure memory, a user-interface module, a processing module, and am amplification module. The first interface connects to a microSD slot of a mobile host device. The second interface includes an internal antenna for wirelessly communicating with retail terminals. The secure memory stores user credentials and a payment application used to execute financial transactions with the retail terminals. The processing module executes the payment application using the user credentials in response to at least a transaction request received by the RF module and transmits at least one transaction response to the retail terminal based, at least in part, on the executed payment application. The amplification module connected to a lead of the antenna and is configured to amplify at least received RF signals.

Abstract: A semiconductor device package includes a land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interposer substrate as the at least one semiconductor die. Terminal pads of the interposer substrate may be electrically connected to either or both of a peripheral array pattern of lands and to a central, two-dimensional array pattern of pads, both array patterns located on the opposing side of the interposer substrate from the at least one semiconductor die. Additional components, active, passive or both, may be connected to pads of the two-dimensional array to provide a system-in-a-package. Lead fingers of a lead frame may be superimposed on the opposing side of the interposer substrate, bonded directly to the land grid array land and wire bonded to pads as desired for repair or to ease routing problems on the interposer.

Abstract: A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.

Abstract: An embedded package includes a first semiconductor chip embedded in a package substrate, a second semiconductor chip disposed over a first surface of the package substrate, and a group of external connection joints disposed on the first surface of the package substrate and between a sidewall of the second semiconductor chip and an edge of the embedded package. Related memory cards and related electronic systems are also provided.

Abstract: An apparatus for grounding a chip may be provided. The apparatus may comprise a ground lid, a ground trace, a first substance, and a second substance. The first substance may be configured adhere the ground lid to the ground trace. The second substance may be configured to provide electrical conduction between the ground lid and the ground trace.

Abstract: A solid-state image sensor includes a plurality of pixels for focus detection by a phase difference detection scheme. The pixel includes a semiconductor region provided therein with a plurality of photoelectric converters configured so that signals therefrom are independently read out, a microlens, and a lens surface arranged between the microlens and the semiconductor region, wherein the lens surface exerts a negative power on light which passes through the microlens toward the semiconductor region.

Abstract: A semiconductor package includes a first substrate, a plurality of memory chips horizontally disposed on the first substrate, and having one surfaces which face the first substrate, other surfaces which face away from the one surfaces, and first bumps formed on the other surfaces, a second substrate disposed on the plurality of memory chips and electrically connected, a sub-substrate horizontally disposed on the first substrate together with the plurality of memory chips and electrically connecting the first substrate and the second substrate, and a driving chip having second bumps on one surface thereof and mounted to the second substrate such that the second bumps are electrically connected with the second substrate.

Abstract: A range image sensor capable of improving its aperture ratio and yielding a range image with a favorable S/N ratio is provided. A range image sensor RS has an imaging region constituted by a plurality of one-dimensionally arranged units on a semiconductor substrate 1 and yields a range image according to a charge amount issued from the units.

Abstract: A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.

Abstract: Methods and apparatus for a sensor are disclosed. An oxide layer is formed on a substrate, followed by a spacer layer and a buffer layer. A photoresist layer is formed on the buffer layer over a pixel region, with an opening exposing a first part of the buffer layer. A first etching is performed to remove the first part of the buffer layer to expose a first part of the spacer layer. A second etching is performed to remove the first part of the spacer layer, the remaining buffer layer, and partially remove a second part of the spacer layer so that the result spacer layer will have an end with a shape substantially similar to a triangle, a height of the end is in a substantially same range as a length of the end.

Abstract: In various embodiments, image sensors incorporate multiple output structures by including multiple sub-arrays, at least one of which includes a region of active pixels, a dark pixel region that is fanned and/or slanted, a dark pixel region that is unfanned and unslanted, a horizontal CCD, and an output structure for conversion of charge to voltage.

Abstract: In various embodiments, image sensors incorporate multiple output structures by including multiple sub-arrays, at least one of which includes a region of active pixels, a dark pixel region that is fanned and/or slanted, a dark pixel region that is unfanned and unslanted, a horizontal CCD, and an output structure for conversion of charge to voltage.