Abstract: In a photoelectric conversion element which is formed by alternately stacking a region of a first conductivity type and a region of a second conductivity type as a conductivity type opposite to the first conductivity type to form a multi-layered structure, in which junction surfaces between the neighboring regions of the first and second conductivity types are formed to have depths suited to photoelectrically convert light in a plurality of different wavelength ranges, and which outputs signals for respective wavelength ranges, a region of a conductivity type opposite to the conductivity type of a surface-side region of the junction surface closest to a surface is formed in the surface of the surface-side region. Thus, highly color-separable signals which suffer less color mixture upon reading out signals from a plurality of photodiode layers is read out.

Abstract: The photoconductive switch comprises a laser that generates light having a first wavelength and a photoconductive switch element arranged to receive the light generated by the laser as incident light. The photoconductive switch element includes a photoconductive layer and a wavelength conversion element. The photoconductive layer has a low absorptivity at the first wavelength. The wavelength conversion element converts the incident light into activating light having a second wavelength at which the photoconductive layer has a greater absorptivity than at the first wavelength. The wavelength conversion element is integral with the photoconductive layer, or is in contact with the photoconductive layer, or is both integral with and in contact with the photoconductive layer.

Abstract: A structure and method for producing color filters with a protective silation layer is described. In one embodiment, each filter is coated with a silation layer to prevent bleeding of material between closely spaced filters during the fabrication process. In a second embodiment, the silation layer is used to protect an array of filters from physical damage during detaping operations. In a third embodiment, the silation layer is used before fabrication later filters in a color filter array to prevent damage to previous filter layers.

Abstract: A monolithic optical detector for determining spectral content of an incident light includes at least a first and second well in a substrate, the second well formed proximate the first well. The first well is configured to be exposed to incident light and for generating a first photocurrent as a function of the incident light. The second well is configured to be shielded from the incident light and for generating a second photocurrent as a function of the incident light. Lastly, a processing and control unit, responsive to the first and second photocurrents, determines an indication of spectral content of the incident light. A method and device parameter controller are also disclosed.

Abstract: A semiconductor photoelectric conversion device includes: a number of photoelectric conversion elements formed in a principal surface of the semiconductor substrate; functional devices formed in the semiconductor substrate adjacent to photoelectric conversion elements; a light shielding film formed above the semiconductor substrate for shielding light above the functional devices and having a window above each photoelectric conversion element; and an effective wavelength shortening member disposed in the windows, and being made of transmissive material having a high refractive index, thereby shortening an effective wavelength of light passing through the windows.

Abstract: Device designs and techniques for forming multiple-band quantum-well detectors.

Abstract: A digital color image sensor is disclosed having an elevated two-color photo-detector in combination with a single-color photo-detector. At least part of the circuitry associated with the two-color photo-detector may be integrated under the single-color photo-detector, which results in a smaller and less expensive photo-detector for a color image sensor. In addition, the two-color photo-detector photo-detectors are electrically isolated from each other, thereby improving the dynamic range of each photo-detector. The isolation is achieved by implementing one of the photo-detectors of the two-color photo-detector within the bulk silicon and elevating the other photo-detector of the two-color photo-detector above the bulk silicon.

Abstract: A device for stabilizing the operating wavelength (&lgr;) of an electro-optical component having a nominal operating wavelength (&lgr;0) by means of a wavelength influencing circuit (4, 5) adapted to be driven by a control signal. The device comprises a semiconductor photodiode (3) adapted to be impinged upon by the radiation generated and/or processed by the component and to generate an output signal which is indicative of a difference of the wavelength of the radiation ((&lgr;) with respect to the nominal operating wavelength (&lgr;0, &lgr;i). The semiconductor photodiode (3) includes a plurality of layers jointly defining two opposite diodes generating opposite photocurrents as a result of radiation impinging onto the photodiode (3). The opposite photocurrents are adapted to generate the control signal to effect the stabilization action.

Abstract: The present invention is a solid state detector that has internal gain and incorporates a special readout technique to determine the input position at which a detected signal originated without introducing any dead space to the active area of the device. In a preferred embodiment of the invention, the detector is a silicon avalanche photodiode that provides a two dimensional position sensitive readout for each event that is detected.

Abstract: An image sensor structure. A first PN photodiode is located in a photo-sensing region of a substrate. A second PN photodiode is located in the substrate above the first PN photodiode. An N-type terminal of the first PN photodiode connects to a source/drain region of a first transistor. A contact is coupled with the second PN photodiode. The contact connects to a gate of a second transistor.

Abstract: A color optimized CMOS photodiode pixel array is provided. The pixel array employs different dimensions to take advantage of different characteristics of the photodiode physics to produce an enhanced image while minimizing the need for post processing. The design includes a relatively shallow blue pixel photodiode, a deeper green pixel photodiode, and a relatively deep red pixel photodiode. The red pixel photodiode is larger and deeper than the green pixel photodiode, which is larger and deeper than the blue pixel photodiode. Each color pixel photodiode comprises a junction diode and a depletion region. The CMOS construction of the three color pixel photodiodes may vary, but one possible construct of the red pixel photodiode would be an N Well/P Sub diode construct, the green pixel photodiode a N+/P Sub diode construct, and the blue being a N+/P Well or N+/P Sub diode construct.

Abstract: A vertical photodetector for detecting different wavelengths of light. The structure provides doped regions, which are separated by barrier regions. The doped regions detect photons corresponding to different wavelengths of light. Specifically, by detecting the amount of electrical charge collected by diodes positioned in the different doped regions, different wavelengths of light can be detected. The barrier regions inhibit the flow of electrical charges from one doped region into another doped region. The area of the doped regions can be increased, without increasing the capacitance of the diodes which are used to detect the electrical charges generated by light incident of the vertical photodetector.

Abstract: A radiation detector, particularly suited for the detection of long wavelength infrared radiation, employs a plurality of multiple quantum well (MQW) superlattices in a unitary stack. The superlattices are electrically connected in parallel, and current outputs are obtained from the parallel connection as an indication of the incident radiation. Electrical contact layers are provided on the opposite sides of each superlattice, with adjacent superlattices sharing a common contact layer. The number of quantum well/barrier layer periods per superlattice is preferably reduced to about 20-30 divided by the number of superlattices in the stack, as compared to a single-superlattice detector with about 20-30 periods. This allows a common bias voltage applied to the superlattices to be similarly reduced by a factor approximately equal to the number of superlattices in the stack.

Abstract: A vertical color filter detector group according to the present invention is formed on a semiconductor substrate and comprises at least six layers of alternating p-type and n-typed doped regions. PN junctions between the layers operate as photodiodes with spectral sensitivities that depend on the absorption depth versus wavelength of light in the semiconductor. Alternate layers, preferably the n-type layers, are detector layers to collect photo-generated carriers, while the intervening layers, preferably p-type, are reference layers and are connected in common to a reference potential referred to as ground. Each detector group includes a blue-sensitive detector layer at an n-type layer at the surface of the semiconductor, a green-sensitive detector layer at an n-type layer deeper in the semiconductor, and a red-sensitive detector layer at the n-type layer deepest in the semiconductor.

Abstract: The present invention relates to a multispectral photodiode for infrared radiation comprising a substrate, a first semiconductor layer of first conductivity with a large band gap arranged on the substrate, a second semiconductor layer of first conductivity with a small band gap arranged on the first semiconductor layer, a first diode area which is formed from a zone of second conductivity with the first semiconductor layer, and a second diode area which is formed from a zone of second conductivity with the second semiconductor layer. The disadvantage of known multispectral photodiodes is that the first diode area, which is sensitive to the short-wave portion, is smaller than the second diode area, which is sensitive to the long-wave portion.

Abstract: A three-color QWIP focal plane array is based on a GaAs/AlGaAs material system. Three-color QWIPs enable target recognition and discriminating systems to precisely obtain the temperature of two objects in the presence of a third unknown parameter. The QWIPs are designed to reduce the normal reflection over a significant wavelength range. One aspect of the present invention involves two photon absorptions per transition in a double quantum well structure which is different from typical QWIP structures. This design is expected to significantly reduce the dark current as a result of higher thermionic barriers and therefore allow the devices to operate at elevated temperatures. The device is expected to be fabricate using a GaAs/AlxGa1−xAs material system on a semi-insulating GaAs substrate by Molecular Beam Epitacy (MBE).

Abstract: A method for making an array of photodiodes with more uniform optical spectral response for the red, green, and blue pixel cells on a CMOS color imager is achieved. After forming a field oxide on a substrate to electrically isolate device areas for CMOS circuits, an array of deep N doped wells is formed for photodiodes for the long wavelength red pixel cells. An array of P doped well regions is formed adjacent to and interlaced with the N doped wells. Shallow diffused N+ regions are formed within the P doped wells for the shorter wavelength green and blue color pixels cells. The shallow diffused photodiodes improve the quantum efficiency (QE), and provide a color imager with improved color fidelity. An insulating layer and appropriate dye materials are deposited and patterned over the photodiodes to provide the array of color pixel cells. The N and P doped wells are also used for the supporting FET CMOS circuits to provide a cost-effective manufacturing process.

Abstract: A multi-quantum well infrared photo-detector, in which a plurality of multi-quantum well layers having respective sensitivities for different wavelength ranges of infrared are layered via a common contact layer. The infrared photo-detector includes a switch where one end is connected to the above common contact layer, and a current integration unit which is connected to the other end of the above switch. First and second voltages are applied to first and second contact layers at the opposite side of first and second multi-quantum well layer respectively. The above switch is conducted for a predetermined time so that either voltage between the above common contact layer and the first contact layer or voltage between the above common contact layer and the second contact layer becomes higher than the other, and the above current integration unit is charged or discharged by the current which flows in the above multi-quantum well layers.

Abstract: A pattern structure has at least two different color filter elements disposed one beside the other on a carrier substrate. Each element includes a layer of dielectric material, the layer of dielectric material residing at at least one of the filter elements on a layer of a material that is resistant to activated oxygen or activated water. The layer of resistant material has a second surface pointing toward the substrate and is made of silicon or silicon dioxide.

Abstract: A heterostructure or multilayer semiconductor structure having lattice matched layers with different bandgaps is grown by MOCVD. More specifically, a wide bandgap material such as AlInSb or GaInSb is grown on a substrate to form a lower-contact layer. An n-type active layer is lattice matched to the lower contact layer. The active layer should be of a narrow bandgap material, such as InAsSb, InTlSb, InBiSb, or InBiAsSb. A p-type upper contact layer is then grown on the active layer and a multi-color infrared photodetector has been fabricated.

Abstract: A vertical color detector group according to the present invention is formed on a semiconductor substrate and includes layers for collecting photons of different wavelength bands. The color detector group can be programmed to perform dynamic switching between sub-sampled color data and full measured color readout. The color detector group can also be configured in a portion of an array to emulate color filter array patterns, and programmed to dynamically alter the degree to which color information is sub-sampled. The programmable color detector groups can allow for switching between different levels of quality and resolution, allowing for selection of an optimal pattern based on image content or lighting conditions. By combining the color detector group of the present invention with conventional color filters, color filter arrays of more than three colors can be constructed.

Abstract: A tunable solid-state laser system whose bandwidth and wavelength are controlled by the injection of light from a semiconductor diode laser. This laser system is capable of providing output light pulses over substantially all wavelength ranges in the electromagnetic spectrum. When suitably configured, it creates wavelength tunable (or fixed wavelength) pulses having spectral bandwidths that are Fourier transform limited and wavelength stabilized. The coupling means between the semiconductor diode laser and the ring laser cavity incorporates a means for optically isolating the diode laser source from optical feedback from the ring laser, ensuring diode laser source stability.

Abstract: A method of manufacturing a thin film transistor liquid crystal display device. The method includes the steps of providing a first substrate and a second substrate, the first substrate positioned facing the second substrate; forming a black matrix layer on the first substrate, the black matrix layer including an opening exposing the first substrate; forming a coating layer on the black matrix layer and the opening; forming a light shielding layer on the second substrate facing the opening, the area of the light shielding layer being larger than the area of the opening; forming a insulator layer on the light shielding layer and the second substrate; and forming a sealant layer between the coating layer and the insulator layer. The method of the present invention increases the adhesive strength between the black matrix and the substrate.

Abstract: Exemplary embodiments of the present invention use a vertically stacked quantum well infrared detector where each “tuned” quantum well of the detector can be biased separately from any other quantum well of the detector. The vertically stacked detector can include three or more quantum well layers that are “tuned” to different peak wavelengths to permit detection of infrared radiation of three or more different bands or colors. The simultaneous detection of infrared radiation in three or more different spectral bands permits the determination of more information about an infrared source.

Abstract: A multi-wavelength semiconductor image sensor comprises a p-type Hg0.7Cd0.3Te photo-absorbing layer formed on a single crystal CdZnTe substrate, a CdTe isolation layer deposited on the photo-absorbing layer, a p-type Hg0.7Cd0.23Te photo-absorbing layer deposited on the CdTe isolation layer, n+ regions which are formed in these photo-absorbing layers and form a pn-junction with each of these photo-absorbing layers, an indium electrode connected to each of these n+ regions and a ground electrode connected to the photo-absorbing layer, the semiconductor isolation layer being electrically isolated from the photo-absorbing layer.

Abstract: The circuit structure of the present invention has a plurality of conductive path layers and at least one interlayer isolating layer formed between the plurality of conductive path layers. Each of the plurality of conductive path layers has at least one conductive path capable of transmitting light or electricity therethrough. Each of a plurality of input/output (I/O) sections is connected to any one of the plurality of conductive paths. Each of the plurality of conductive path layers has a first laminated structure that includes a plurality of first conductive layers and at least one first isolating layer formed therebetween. The interlayer isolating layer has a second laminated structure that includes a plurality of second isolating layers and at least one second conductive layer formed therebetween.

Abstract: A CMOS image sensor for preventing a formation of scum and overlaps of neighboring color filters is provided. The image sensor includes: a semiconductor structure; a first color filter formed on the semiconductor structure, wherein the first color filter includes a first stacked layer, the first stacked layer having a first nitride layer and a first oxide layer; a second color filter, wherein the second color filter is formed with a dyed photoresist and in contact with the first color filter; and a third color filter formed on a portion where is not overlapped with the first and the second color filter, wherein the third color filter includes a second stacked layer, the second stacked layer having a second nitride layer and a second oxide layer.

Abstract: A multi-wavelength semiconductor image sensor comprises a p-type Hg0.7Cd0.3Te photo-absorbing layer formed on a single crystal CdZnTe substrate, a CdTe isolation layer deposited on the photo-absorbing layer, a p-type Hg0.77Cd0.23Te photo-absorbing layer deposited on the CdTe isolation layer, n+ regions which are formed in these photo-absorbing layers and form a pn-junction with each of these photo-absorbing layers, an indium electrode connected to each of these n+ regions and a ground electrode connected to the photo-absorbing layer, the semiconductor isolation layer being electrically isolated from the photo-absorbing layer.

Abstract: A photodiode having a resin film painted upon an opening through which signal light goes in and a dielectric multilayered film piled upon the resin film for reflecting noise light.

Abstract: A multispectral radiation detector for detecting radiation in at least two spectral bands, comprises a substrate and a layer stack grown on the substrate. The layer stack comprises at least first and second photodiodes, each photodiode having at least one strain-compensating superlattice absorbing layer substantially lattice matched to adjacent layers of the detector. Each strain-compensating superlattice absorbing layer has an energy gap responsive to radiation energy in a corresponding spectral region and different from the energy gaps of other strain-compensating superlattice absorbing layers of the detector.

Abstract: A CMOS image sensor obtains color through the use of two or three superposed layers. Each pixel in the image sensor includes a plurality of superposed photosensitive p-n junctions with individual charge integration regions. The combination of each of the superposed layers provides increased sensitivity and resolution of a single chip color imager.

Abstract: A heterostructure or multilayer semiconductor structure having lattice matched layers with different bandgaps is grown by MOCVD. More specifically, a wide bandgap material such as AlInSb or GaInSb is grown on a substrate to form a lower-contact layer. An n-type active layer is lattice matched to the lower contact layer. The active layer should be of a narrow bandgap material, such as InAsSb, InTlSb, InBiSb, or InBiAsSb. A p-type upper contact layer is then grown on the active layer and a multi-color infrared photodetector has been fabricated.

Abstract: A first multi-quantum well structure 12 is formed on a GaAs substrate 10. The first multi-quantum well structure 12 is formed of an AlGaAs barrier layer and a GaAs well layer alternately laid one on the other to form a multi-quantum well. The GaAs barrier layer is not doped with an impurity. A second multi-quantum well structure 14 is formed on the first multi-quantum well structure 12. The second multi-quantum well structure 14 is formed of an AlGaAs barrier layer and a GaAs well layer alternately laid one on the other to form a multi-quantum well. The GaAs barrier layer is not doped with an impurity. Whereby a required electrode area can be smaller to thereby obtain higher detection sensitivity.

Abstract: The optical semiconductor device comprises a first contact layer 28 formed on a substrate 16; a first quantum well layer 34 formed on the first contact layer; a second contact layer 36 formed on the first quantum well layer; an optical coupling layer 44 formed on the second contact layer; and a first conductor plug 50 extended from an upper surface of the optical coupling layer and arriving at the first contact layer.

Abstract: A solid-state image pickup device including a sensor portion 22 having plural pixels arranged, a vertical scan portion 23 and a horizontal scan portion 24 for scanning the pixels of the sensor portion 22, an output portion 26 to which signals output from the sensor portion 22 are supplied, a bias current adjusting portion 30 for making the bias current of the output portion 26 variable, a driving signal generator 27 for supplying driving signals to the vertical scan portion 23, the horizontal scan portion 24 and said output portion 26, and an input portion 28 for supplying plural driving mode signals to the driving signal generator 27, wherein the driving frequency is made variable by the plural driving mode signals, and the bias current adjusting portion 30 is supplied with a signal for making the bias current variable in accordance with the plural driving mode signals.

Abstract: A semiconductor wafer includes a plurality of sensors. Each of the sensors has a field oxide transistor, and a detecting circuit electrically connected to the field oxide transistor for detecting if the field oxide transistor is switched on or off and generating corresponding detecting signals. The field oxide of a different field oxide transistor has a different thickness. Each field oxide transistor is coupled to a corresponding detecting circuit for detecting radiation impinging on the semiconductor wafer.

Abstract: A method and apparatus for deep sub-micron layout optimization is described. Components of an integrated circuit (IC) design (e.g., gates) can be identified and manufactured using a phase shifting process to improve circuit density and/or performance as compared to a circuit manufactured without using phase shifting processes. In one embodiment, a first mask (e.g., a phase shift mask) is generated that includes the component to be manufactured using the phase shifting process. A second mask (e.g., a trim mask) is also generated to further process the structure created using the first mask. Both masks are defined based on a region (e.g., a diffusion region) in a different layer of the integrated circuit layout than the structure (e.g., the gate) being created with the phase shifting process.

Abstract: More than one photodetectors, each sensitive to different wavelengths, are integrated on a common semiconductor substrate. The different photodetectors can be stacked over one another or placed laterally on the common substrate. Gratings may be placed over each photodetector to sharpen the spectral response. Three such photodetectors can form a pixel of an active matrix array for an image sensor. The different photodetectors in each pixel can be multiplexed electronically. The electronic circuits for activating the different photodetectors can be integrated on the same substrate.

Abstract: Light on the longer wavelength side can be photoelectrically converted and output reliably, whilst improving the structural and operational reliability of a photodetector, by means of a simple manufacturing process and inexpensive manufacturing costs. A first light-absorbing layer, a buffer layer of a second conductivity type, a second light-absorbing layer of a second conductivity type and a window layer of a second conductivity type are laminated in this order onto the first principal surface of a substrate of a first conductivity type. The first light-absorbing layer contains a region of the first conductivity type and a region of the second conductivity type, and a diffused region of the first conductivity type having a depth extending from the upper face of the window layer to the interface between the window layer and the second light-absorbing layer is provided in a portion of the window layer.

Abstract: A multilayer semiconductor structure includes a germanium substrate having a first surface. The germanium substrate has two regions, a bulk p-type germanium region, and a phosphorus-doped n-type germanium region adjacent to the first surface. A layer of a phosphide material overlies and contacts the first surface of the germanium substrate. A layer of gallium arsenide overlies and contacts the layer of the phosphide material, and electrical contacts may be added to form a solar cell. Additional photovoltaic junctions may be added to form multijunction solar cells. The solar cells may be assembled together to form solar panels.

Abstract: An improved focusing and color-filtering structure is provided for use in a semiconductor light-sensitive device, such as CMOS (complementary metal-oxide semiconductor) light-sensitive device, that can be used, for example, on a digital camera or a PC camera to convert photographed image directly into digital form. The focusing and color-filtering structure is used for the focusing and color-filtering of the light incident thereon prior to the light being detected by the light-sensitive device. The focusing and color-filtering structure is characterized in the forming of a dummy pattern layer in the non-filter area surrounding the array of color-filter layers, which allows the subsequently formed planarization layer to be highly planaized with a substantially uniformly flat top surface without having slopes such that the subsequently formed microlenses can all be disposed upright in position without being slanted.

Abstract: A solid-state wavelength demultiplexer comprising a plurality of photosensitive elements wherein each element has certain energy gap defined by the material composition. All photosensitive elements are grown on a common substrate where the first grown buffer layer, adjacent and near lattice matched to the first bottom photosensitive element, is heavily doped. A composition of photosensitive elements varies from the first bottom photosensitive element up to a first top photosensitive layer in such a way that corresponding energy gap has a minimum value in the lowermost element while the maximum value in the uppermost element. A wide gap doped “window” layer is grown on top of the uppermost element. Each individual photosensitive element consists of at least three sublayers comprising a first doped sublayer, a second heavily doped sublayer, and a photosensitive undoped sublayer sandwiched between them.

Abstract: A multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds. The vertical stacked structure is formed on a glass base having a transparent coating of ITO or similar metal to provide a substrate. Deposited on the substrate is the vertical stacked arrangement of three double heterostructure devices, each fabricated from a suitable organic material. Stacking is implemented such that the double heterostructure with the longest wavelength is on the top of the stack. This constitutes the device emitting red light on the top with the device having the shortest wavelength, namely, the device emitting blue light, on the bottom of the stack. Located between the red and blue device structures is the green device structure.

Abstract: A method for fabricating a color image sensor for scanning and converting an optical image into electrical signals, includes the steps of: (a) forming a P-type semiconductor layer on a substrate; (b) forming field oxide layers on the P-type semiconductor layer to define regions for red, green and blue photodiodes; (c) providing an ion implantation mask having different mask patterns for the red, the green and the blue photodiodes; (d) implanting impurity ions into the P-type semiconductor layer through the use of said ion implantation mask to form N-type diffusion regions in the P-type semiconductor layer; and (e) applying a thermal process to the resulting structure to form different first, second and third depletion regions corresponding to the red, the green and the blue photodiodes.

Abstract: A CMOS sensor. The CMOS sensor comprises a substrate, a gate electrode formed on the substrate, a source/drain region formed in the substrate on one side of the gate electrode, and a sensor region formed in the substrate on another side of the gate electrode. The impurity in the source/drain region is arsenic. The source/drain further comprises a lightly doped drain region. The sensor region comprises a first doped region and a second doped region which together have a dentoid profile. The impurity in the first doped region and the second doped region is phosphorus.

Abstract: A voltage-controlled, wavelenght-selective photodetector includes comprising a double diode having a counter-polarized Si-Schottky diode and a SiGe PIN diode. The short-wave portion (&lgr;<0.9 &mgr;m) of the light entering the detector through a window generates electron-hole pairs in the Si-Schottky diode, while the longer-wave portion (1 &mgr;m<&lgr;<2 &mgr;m) passes through the substrate and is absorbed in the epitaxially deposited SiGe superlattice or the quantum well diode. The photocurrents of both detectors flow in physically opposite directions and subtract from each other, resulting in a wavelength-dependent operational sign of the photocurrent. The level of the bias voltage applied determines whether the photocurrent of the Si-Schottky diode or the photocurrent of the Si/Ge PIN diode determines the spectrum.

Abstract: The invention relates to a multicolor sensor with a plurality of diode functions comprising a succession of layers with p and n doped layers. Conductive transparent contact layers are thereby fitted. According to the invention, pin, nip, npin and/or pnip structures can be provided.

Abstract: A photovoltaic conversion element comprising, a first transparent electrode, a transparent semiconductor layer disposed on the first transparent electrode, a sensitizing dye adsorption portion which is disposed on the surface of the transparent semiconductor layer, a carrier transport layer formed on the sensitizing dye adsorption portion, and a second transparent electrode disposed on the carrier transport layer, wherein the sensitizing dye adsorption portion comprises sensitizing dyes of plural kinds of color, which are adsorbed on a plurality of surface regions of the semiconductor layer.

Abstract: A light filter having a plurality of light-filtering portions of thin, medium and thick thickness corresponding to the red, green and blue photosensitive pixels of a charge-coupled device disposed behind the filter for enabling red, green and blue colors of light from a front lens to be respectively focused, refracted and then focused accurately onto the photosensitive pixels of the charge-coupled device on the same plane, so as to improve the image quality.

Abstract: Light transmitting filter elements are formed in holes etched in a covering passivation layer overlying light sensing devices formed in an integrated circuit. Filter material is spun on to the wafer to fill the etched holes. The filter material is cured and etched back below the passivation layer top surface. Subsequent filter materials transmitting different light frequencies may be similarly spun on to fill subsequently etched holes, cured, and etched back to form additional filter elements. A contiguous structure of individual filter elements may be formed.