With Separate Tie Bar Element Or Plural Tie Bars Patents (Class 257/670)
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Publication number: 20120146200Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.Type: ApplicationFiled: May 20, 2011Publication date: June 14, 2012Inventors: John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
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Patent number: 8193618Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first lead structure comprising a die attach pad, a second lead structure, and a third lead structure. It also includes a semiconductor die comprising a first surface and a second surface. The semiconductor die is on the die attach pad of the leadframe structure. The first surface is proximate the die attach pad. The semiconductor die package further includes a clip structure comprising a first interconnect structure and a second interconnect structure, the first interconnect structure comprising a planar portion and a protruding portion, the protruding portion including an exterior surface and side surfaces defining the exterior surface. The protruding portion extends from the planar portion of the first interconnect structure.Type: GrantFiled: December 12, 2008Date of Patent: June 5, 2012Assignee: Fairchild Semiconductor CorporationInventor: Ruben P. Madrid
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Patent number: 8193619Abstract: Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.Type: GrantFiled: March 10, 2010Date of Patent: June 5, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Geun-Woo Kim, Ho-Geon Song, Man-Hee Han
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Patent number: 8188579Abstract: In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include bottom surface portions which, in the completed semiconductor package, are exposed and at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body in the completed semiconductor package. The semiconductor package also includes one or more power bars and/or one or more ground rings which are integral portions of the original leadframe used to fabricate the same.Type: GrantFiled: December 10, 2010Date of Patent: May 29, 2012Assignee: Amkor Technology, Inc.Inventors: Gi Jeong Kim, Yeon Ho Choi
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Patent number: 8188583Abstract: To improve the heat dissipation characteristics of a semiconductor device. The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality of members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate, wherein a semiconductor chip the outer shape of which is larger than the die pad is mounted over the die pad and the members. The top surface of the die pad and the top surface of the members at the part in opposition to the back surface of the semiconductor chip are bonded to the back surface of the semiconductor chip in their entire surfaces with a silver paste.Type: GrantFiled: March 25, 2010Date of Patent: May 29, 2012Assignee: Renesas Electronics CorporationInventors: Junichi Arita, Kazuko Hanawa, Makoto Nishimura
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Publication number: 20120126384Abstract: The present invention employs tie bar(s) of a lead frame as contact(s) so as to increase the number of contacts in a package structure. Therefore, a die can be packaged in a package structure with a smaller dimension to lower packaging cost of an integrated circuit.Type: ApplicationFiled: September 14, 2011Publication date: May 24, 2012Applicant: GREEN SOLUTION TECHNOLOGY CO., LTD.Inventor: Shang-Shin MENG
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Patent number: 8183088Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.Type: GrantFiled: June 25, 2010Date of Patent: May 22, 2012Assignee: Fairchild Semiconductor CorporationInventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Byoung-Ok Lee
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Publication number: 20120112331Abstract: A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.Type: ApplicationFiled: September 9, 2011Publication date: May 10, 2012Applicant: SILICONIX ELECTRONIC CO., LTD.Inventors: Frank Kuo, Suresh Belani
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Publication number: 20120104579Abstract: An integrated circuit package system includes an external interconnect having a lead tip and a lead body, including a recess in the lead body including a first recess segment, having an orientation substantially parallel to the lengthwise dimension of the lead body, and a second recess segment intersecting and perpendicular to the first recess segment along a lead body top surface of the lead body, the first recess segment at a bottom portion of the second recess segment; an internal interconnect between an integrated circuit die and the external interconnect; and an encapsulation to cover the external interconnect with the recess filled.Type: ApplicationFiled: January 6, 2012Publication date: May 3, 2012Inventors: Byung Tai Do, Sung Uk Yang
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Patent number: 8164203Abstract: A leadframe has a die pad, first marks, and second marks, and the die pad allows thereon mounting of a first semiconductor chip. The first marks indicate a mounting region for the first semiconductor chip, the second marks indicate a mounting region for the second semiconductor chip, and the first marks and the second marks are different from each other in at least either one of size and geometry.Type: GrantFiled: July 28, 2009Date of Patent: April 24, 2012Assignee: Renesas Electronics CorporationInventor: Kenji Nishikawa
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Patent number: 8153478Abstract: A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.Type: GrantFiled: June 29, 2011Date of Patent: April 10, 2012Assignee: STATS ChipPAC Ltd.Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
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Patent number: 8143707Abstract: A semiconductor device includes a circuit base including an inner lead portion and an outer lead portion. The inner lead portion has a plurality of inner leads. At least part of the inner leads is routed inside a chip mounting area. On both upper and lower surfaces of the circuit base, a first and a second semiconductor chip are mounted. At least part of electrode pads of the first semiconductor chip are electrically connected to electrode pads of the second semiconductor chip via the inner leads.Type: GrantFiled: December 18, 2009Date of Patent: March 27, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Yoshiaki Goto
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Patent number: 8138595Abstract: A method of manufacture of an integrated circuit packaging system includes: forming an elevated contact above and between a lead and a die pad that is coplanar with the lead; connecting an integrated circuit and the lead; attaching a jumper interconnect between the elevated contact and the lead; and forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.Type: GrantFiled: March 26, 2010Date of Patent: March 20, 2012Assignee: Stats Chippac Ltd.Inventors: Zigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan
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Patent number: 8110913Abstract: An integrated circuit package system includes: fabricating a lead frame including: providing inner leads having an inner lead pitch of progressive length, forming a lead shoulder, on the inner leads, having a shoulder height of a progressive height, and forming outer leads coupled to the lead shoulder and the inner leads; mounting an integrated circuit die on the lead frame; and molding a package body on the lead frame and the integrated circuit die.Type: GrantFiled: June 24, 2008Date of Patent: February 7, 2012Assignee: Stats Chippac Ltd.Inventors: Byung Tai Do, Linda Pei Ee Chua, Zheng Zheng, Lee Sun Lim
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Publication number: 20120018862Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.Type: ApplicationFiled: September 29, 2011Publication date: January 26, 2012Inventors: Nan-Jang Chen, Yau-Wai Wong
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Patent number: 8097934Abstract: A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features “up-set” bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.Type: GrantFiled: August 13, 2008Date of Patent: January 17, 2012Assignee: National Semiconductor CorporationInventors: Felix C. Li, Yee Kim Lee, Peng Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee
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Patent number: 8097942Abstract: A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically short-circuited to any other conductive part are provided. An inner lead portion has a tip arranged outside the outer circumferential end of the semiconductor chip as viewed on a plane. A power supply bar has a jutted portion extended between the outer circumferential end of the semiconductor chip and the tip of the inner lead portion as viewed on a plane. The upper face of the jutted portion is in a position lower than the upper face of the tip of the inner lead portion. A bonding wire for electrically coupling the semiconductor chip and the inner lead portion with each other has a bent portion outside the outer circumferential end of the semiconductor chip as viewed on a plane.Type: GrantFiled: May 11, 2009Date of Patent: January 17, 2012Assignee: Renesas Electronics CorporationInventors: Kazuyuki Misumi, Katsuyuki Fukudome, Kazushi Hatauchi, Kazuya Fukuhara, Kunihiro Yamashita
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Patent number: 8093707Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.Type: GrantFiled: October 19, 2009Date of Patent: January 10, 2012Assignee: National Semiconductor CorporationInventors: Shaw Wei Lee, Ein Sun Ng, Chue Siak Liu, Lee Han Meng @ Eugene Lee, Yee Kim Lee
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Patent number: 8089166Abstract: An integrated circuit package system includes a bottom pad with a bottom tie bar, attaching an integrated circuit die over the bottom pad, attaching a top pad with a top tie bar, over the integrated circuit die, and applying an encapsulant wherein the top tie bar integral to the top pad, is exposed on a side of the encapsulant.Type: GrantFiled: December 30, 2006Date of Patent: January 3, 2012Assignee: Stats Chippac Ltd.Inventor: OhSug Kim
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Patent number: 8076183Abstract: A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.Type: GrantFiled: October 27, 2009Date of Patent: December 13, 2011Assignee: Alpha and Omega Semiconductor, Inc.Inventors: Yan Xun Xue, Jun Lu, Le Shi, Liang Zhao
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Patent number: 8071426Abstract: A leadframe for use in fabricating a no lead semiconductor package contains connecting bars between individual electrical contact pads. For embodiments having a die pad, the leadframe further includes connecting bars between the contact pads and the die pad. The lower surfaces of the connecting bars are coplanar with the lower surfaces of the contact pads and/or the die pad, and the upper surfaces of the connecting bars are recessed with respect to the upper surfaces of the contact pads and/or the die pad. The semiconductor package is fabricated by encapsulating the die and the leadframe in a molding compound and then removing the connecting bars. The leadframe is typically formed by half etching a metal sheet to form the connecting bars. The connecting bars are removed from the encapsulated package by a selected cutting, sawing, or etching means, based on a predetermined pattern.Type: GrantFiled: July 16, 2010Date of Patent: December 6, 2011Assignee: Utac Thai LimitedInventors: Saravuth Sirinorakul, Somchai Nondhasitthichai
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Patent number: 8067271Abstract: An integrated circuit package system is provided including forming an external interconnect and a tie bar, forming a lead tip and a lead body of the external interconnect, forming a hole in the external interconnect, forming a slot in the tie bar, connecting an integrated circuit die and the external interconnect, and molding the external interconnect and the tie bar with the slot and the hole filled.Type: GrantFiled: September 15, 2006Date of Patent: November 29, 2011Assignee: Stats Chippac Ltd.Inventors: Byung Tai Do, Sung Uk Yang
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Patent number: 8062934Abstract: An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.Type: GrantFiled: June 21, 2007Date of Patent: November 22, 2011Assignee: Stats Chippac Ltd.Inventors: Jeffrey D. Punzalan, Henry Descalzo Bathan, Zigmund Ramirez Camacho
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Patent number: 8063470Abstract: A leadframe for use in fabricating a no lead semiconductor package contains connecting bars between individual electrical contact pads. For embodiments having a die pad, the leadframe further includes connecting bars between the contact pads and the die pad. The lower surfaces of the connecting bars are coplanar with the lower surfaces of the contact pads and/or the die pad, and the upper surfaces of the connecting bars are recessed with respect to the upper surfaces of the contact pads and/or the die pad. The semiconductor package is fabricated by encapsulating the die and the leadframe in a molding compound and then removing the connecting bars. The leadframe is typically formed by half etching a metal sheet to form the connecting bars. The connecting bars are removed from the encapsulated package by a selected cutting, sawing, or etching means, based on a predetermined pattern.Type: GrantFiled: May 22, 2008Date of Patent: November 22, 2011Assignee: Utac Thai LimitedInventors: Saravuth Sirinorakul, Somchai Nondhasitthichai
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Patent number: 8058720Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground bar downset from the first horizontal plane to a second horizontal plane between the leads and the die pad; a plurality of downset tie bars connecting the ground bar with the die pad; a plurality of ground wires bonding to both of the ground bar and the die pad; and a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.Type: GrantFiled: November 19, 2008Date of Patent: November 15, 2011Assignee: Mediatek Inc.Inventors: Nan-Jang Chen, Yau-Wai Wong
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Publication number: 20110266661Abstract: A semiconductor device is manufactured using a lead frame for a mold array package (MAP) where multiple mount parts are arranged in the shape of an array, each configured to have a semiconductor chip mounted thereon. Multiple leads for coupling to the semiconductor chip are formed in each of the mount parts of the lead frame. The tips of the leads are mutually coupled by tie bars thinner than the leads. A dummy lead having a slot coupling to the tie bar is formed on a portion corresponding to a portion further outside the tie bar and corresponding to a portion where the lead is formed in the mount parts at predetermined locations among the mount parts. Once the resin is supplied, air in a tie bar part is pushed out into the slot of the dummy lead; therefore, generation of void in the tie bar part can be controlled.Type: ApplicationFiled: May 2, 2011Publication date: November 3, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventor: Muneharu MORIOKA
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Publication number: 20110260305Abstract: A method for packaging one or more power semiconductor devices is provided. A lead frame comprising one or more base die paddles, multiple lead terminals, and a tie bar assembly is constructed. The lead terminals extend to a predetermined elevation from the base die paddles. The base die paddles are connected to the lead terminals by the tie bar assembly. The tie bar assembly mechanically couples the base die paddles to each other and to the lead terminals. The tie bar assembly is selectively configured to isolate the lead terminals from the base die paddles and to enable creation of multiple selective connections between one or more of the lead terminals and one or more power semiconductor devices mounted on the base die paddles, thereby enabling flexible packaging of one or more isolated and/or non-isolated power semiconductor devices and increasing their power handling capacity.Type: ApplicationFiled: April 9, 2011Publication date: October 27, 2011Inventor: Romeo Alvarez Saboco
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Patent number: 8039932Abstract: A lead frame is provided which can prevent a short circuit between wires and the ends of adjacent leads, the short circuit being caused by wire sweep during the injection of molding resin, in a configuration where the electrodes of a semiconductor chip and the leads disposed around the semiconductor chip. The lead having sides substantially perpendicular to the direction of a resin flow has an end whose upstream side relative to the resin flow is constricted.Type: GrantFiled: August 12, 2008Date of Patent: October 18, 2011Assignee: Panasonic CorporationInventor: Akira Oga
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Publication number: 20110241189Abstract: A frame includes heat slug pads coupled together in a N×M matrix such that singulation of the heat slug pads consists of one or more passes across the frame, wherein the one or more passes are parallel. A method of attaching heat slug pads to packages includes gathering a plurality of packages, preparing a heat slug frame including a N×M matrix of heat slug pads, dispensing thermally conductive material onto surfaces of the heat slug pads, attaching the plurality of packages onto the heat slug pads, and singulating the heat slug pads, wherein the singulating step consists of one or more parallel passes across the N×M matrix. A method of attaching heat slug foil to packages includes preparing a plurality of packages, laminating the heat slug foil to one side of the plurality of packages using thermally conductive material, and singulating the plurality of packages.Type: ApplicationFiled: February 1, 2011Publication date: October 6, 2011Applicant: UTAC THAI LIMITEDInventor: Saravuth Sirinorakul
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Patent number: 8030741Abstract: One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a front face of the lead frame, at least one electrically conductive structure element mechanically coupled to but electrically isolated from the front face of the lead frame, at least one connector electrically connecting the chip to the structure element, at least one connector electrically connecting the structure element to at least one of the leads, and a mold material encasing the semiconductor package except for an end portion of the leads which are electrically connected to the printed circuit board.Type: GrantFiled: May 5, 2010Date of Patent: October 4, 2011Assignee: Infineon Technologies AGInventors: Thomas Bemmerl, Thomas Mende, Bernd Rakow
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Patent number: 8026591Abstract: A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.Type: GrantFiled: March 19, 2010Date of Patent: September 27, 2011Assignee: Rohm Co., Ltd.Inventor: Kazutaka Shibata
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Publication number: 20110227205Abstract: The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume.Type: ApplicationFiled: March 18, 2010Publication date: September 22, 2011Inventors: Jun Lu, Ming Sun, Yueh-Se Ho, Kai Liu, Lei Shi
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Patent number: 8022517Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.Type: GrantFiled: November 7, 2008Date of Patent: September 20, 2011Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Sung-Hwan Yoon, Sang-Wook Park, Min-Young Son
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Patent number: 8008759Abstract: A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.Type: GrantFiled: June 24, 2010Date of Patent: August 30, 2011Assignee: Fairchild Semiconductor CorporationInventors: Erwin Victor Cruz, Maria Cristina B. Estacio
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Patent number: 8008131Abstract: The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package manufacturing. Disclosed are improved heat blocks and methods for their use in ensuring adequate clearance between leadfingers and adjacent heat spreaders, as well as semiconductor chip package assemblies wherein a selected clearance between leadfingers and parallel surfaces may be assured. Methods of the invention include steps for supporting the proximal ends of the leadfingers using the wirebonding cavity of a heat block. Thus supported, a plurality of bondwires are attached to couple bond pads of the semiconductor chip to the proximal ends of leadfingers. Thereafter, the clearance between the wirebonded proximal ends of the leadfingers and the adjacent parallel surface of the heat spreader is adjusted using a spacing cavity of the heat block.Type: GrantFiled: March 26, 2008Date of Patent: August 30, 2011Assignee: Texas Instruments IncorporatedInventors: Chien-Te Feng, Kevin Jin
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Publication number: 20110204498Abstract: A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length.Type: ApplicationFiled: February 24, 2010Publication date: August 25, 2011Applicant: FREESCALE SEMICONDUCTOR, INCInventors: Yin Kheng Au, Mohd Rusli Ibrahim, Meng Kong Lye, Zi Song Poh, Seng Kiong Teng, Kesyakumar V.C. Muniandy
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Patent number: 8003447Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.Type: GrantFiled: December 9, 2010Date of Patent: August 23, 2011Assignee: Fairchild Semiconductor CorporationInventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Edwin Man Fai Lee, David Chong Sook Lim, Adriano M. Vilas-Boas
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Patent number: 7989048Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.Type: GrantFiled: December 19, 2007Date of Patent: August 2, 2011Assignee: Foxconn Advanced Technology Inc.Inventors: Tso-Hung Yeh, Chia-Cheng Chen, Pei-Yu Chao
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Patent number: 7989931Abstract: An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.Type: GrantFiled: September 26, 2007Date of Patent: August 2, 2011Assignee: Stats Chippac Ltd.Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
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Patent number: 7986032Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.Type: GrantFiled: August 25, 2009Date of Patent: July 26, 2011Assignee: Stats Chippac Ltd.Inventors: Seng Guan Chow, Ming Ying, Ii Kwon Shim, Lip Seng Tan
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Patent number: 7982293Abstract: A lead frame assembly includes at least one die paddle. The die paddle includes a first landing area for receiving a first semiconductor chip and a second landing area for receiving a second semiconductor chip. One or more steps are provided between the first landing area and the second landing area.Type: GrantFiled: May 1, 2009Date of Patent: July 19, 2011Assignee: Infineon Technologies AGInventors: Wei Kee Chan, Weng Shyan Aik
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Patent number: 7977774Abstract: A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of the leads of each row. At least portions of the die paddle, the leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the leads of at least one row thereof being exposed in a common exterior surface of the package body.Type: GrantFiled: July 10, 2007Date of Patent: July 12, 2011Assignee: Amkor Technology, Inc.Inventors: YeonHo Choi, GiJeong Kim, WanJong Kim
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METHOD AND APPARATUS FOR DIRECTING MOLDING COMPOUND FLOW AND RESULTING SEMICONDUCTOR DEVICE PACKAGES
Publication number: 20110163427Abstract: Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as a paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice.Type: ApplicationFiled: March 15, 2011Publication date: July 7, 2011Applicant: MICRON TECHNOLOGY, INC.Inventor: Stephen L. James -
Patent number: 7964940Abstract: A chip package with asymmetric molding including a lead frame, a chip, an adhesive layer, bonding wires and an encapsulant, is provided. The lead frame includes a frame body and at least a turbulent plate. The frame body has inner lead portions and outer lead portions. The turbulent plate is bended upwards to form a bulge portion and the first end of the turbulent plate is connected to the frame body. The chip is fixed under the inner lead portions and the turbulent plate is located at one side of the chip. The adhesive layer is disposed between the chip and the inner lead portions, and the bonding wires are electrically connected between the chip and the corresponding inner lead portions, respectively. The encapsulant encapsulates at least the chip, the bonding wires, the inner lead portions, the adhesive layer and the turbulent plate.Type: GrantFiled: November 14, 2008Date of Patent: June 21, 2011Assignees: ChipMOS Technologies, ChipMOS Technologies (Bermuda) Ltd.Inventor: Geng-Shin Shen
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Patent number: 7964941Abstract: A wire short-circuit defect during molding is prevented. A semiconductor device has a tab, a plurality of leads arranged around the tab, a semiconductor chip mounted over the tab, a plurality of wires electrically connecting the electrode pads of the semiconductor chip with the leads, and a molded body in which the semiconductor chip is resin molded. By further stepwise shortening the chip-side tip end portions of the leads as the first edge or side of the principal surface of the semiconductor chip goes away from the middle portion toward the both end portions thereof, and shortening the tip end portions of those of first leads corresponding to the middle portion of the first edge or side of the principal surface which are adjacent to second leads located closer to the both end portions of the first edge or side, the distances between second wires connected to the second leads and the tip end portions of the first leads adjacent to the second leads can be increased.Type: GrantFiled: September 16, 2010Date of Patent: June 21, 2011Assignee: Renesas Electronics CorporationInventors: Shigeki Tanaka, Kazuto Ogasawara
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Publication number: 20110140249Abstract: A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.Type: ApplicationFiled: December 10, 2009Publication date: June 16, 2011Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Lee Han Meng Eugene LEE, Kuan Yee WOO
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Publication number: 20110140250Abstract: A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is formed to include recesses within the bottom surface thereof which create regions of reduced thickness. A semiconductor chip bonded to the chip mounting board may be electrically connected to leads of the lead frame and to the ground ring via conductive wires. Those conductive wires extending to the ground ring are bonded to the top surface thereof at locations which are not aligned with the recesses within the bottom surface, i.e., those regions of the ground ring of maximum thickness.Type: ApplicationFiled: February 28, 2011Publication date: June 16, 2011Inventor: HYUNG JU LEE
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Patent number: 7952175Abstract: Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.Type: GrantFiled: July 2, 2008Date of Patent: May 31, 2011Assignee: Samsung Techwin Co., Ltd.Inventors: Se-hoon Cho, Jeung-il Kim, Sang-moo Lee
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Patent number: 7948068Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.Type: GrantFiled: March 10, 2009Date of Patent: May 24, 2011Assignee: Renesas Electronics CorporationInventors: Kenji Amano, Hajime Hasebe
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Patent number: RE43443Abstract: In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.Type: GrantFiled: November 16, 2001Date of Patent: June 5, 2012Assignees: Renesas Electronics Corporation, Hitachi ULSI Systems Co., Ltd.Inventors: Yujiro Kajihara, Kazunari Suzuki, Kunihiro Tsubosaki, Hiromichi Suzuki, Yoshinori Miyaki, Takahiro Naito, Sueo Kawai