For Integrated Circuit Patents (Class 257/713)
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Patent number: 9998100Abstract: A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.Type: GrantFiled: August 28, 2015Date of Patent: June 12, 2018Assignee: Ampere Computing LLCInventors: Rich Thaik, Alfred Yeung, April Lambert, Jeremy Plunkett
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Patent number: 9997377Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.Type: GrantFiled: December 14, 2012Date of Patent: June 12, 2018Assignee: Intel CorporationInventor: Arnab Choudhury
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Patent number: 9992915Abstract: Size reduction of a power conversion device is intended. A power conversion device according to the present invention includes: a first power semiconductor module; a second semiconductor module; and a fixing member which fixes the first power semiconductor module, wherein the first power semiconductor module has a first power semiconductor device, a first case which houses the first power semiconductor device, and a first flange portion connected to the case, the second power semiconductor module has a second power semiconductor device, and a second case which houses the second power semiconductor device, the second case is connected to the first flange portion so as to provide a first flow path space for allowing a coolant to flow between the second case and the first case, and the first flange portion is fixed to the fixing member while supporting the first case and the second power semiconductor module.Type: GrantFiled: October 1, 2014Date of Patent: June 5, 2018Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takahiro Shimura, Akira Matsushita, Shinichi Fujino
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Patent number: 9979073Abstract: The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.Type: GrantFiled: July 6, 2016Date of Patent: May 22, 2018Assignee: MEDIATEK INC.Inventors: Min-Chung Wu, Shao-Chin Lo
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Patent number: 9960099Abstract: A method of forming a semiconductor package includes forming a thermal conductivity layer and attaching the thermal conductivity layer to a chip. The chip has a first surface and a second surface. The thermal conductivity layer is attached to the first surface of the chip. The thermal conductivity layer provides a path through which heat generated from the chip is dissipated to the ambient. A substrate is attached to the second surface of the chip. A molding compound is formed above the substrate to encapsulate the chip and the thermal conductivity layer.Type: GrantFiled: November 11, 2013Date of Patent: May 1, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Hao Tseng, Ying-Hao Kuo, Kuo-Chung Yee
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Patent number: 9941251Abstract: A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending laterally beyond a respective edge of the first die. The package further includes a first Thermal Interface Material (TIM) over and contacting a top surface of the first die, a heat dissipating lid having a first bottom surface contacting the first TIM, a second TIM over and contacting the second portion of the second die, and a heat dissipating ring having a portion over and contacting the second TIM. The heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring has a plurality of fins and a plurality of recesses separating the plurality of fins from each other.Type: GrantFiled: February 6, 2017Date of Patent: April 10, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wensen Hung, Szu-Po Huang, Kim Hong Chen, Shin-Puu Jeng
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Patent number: 9922910Abstract: An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.Type: GrantFiled: September 21, 2016Date of Patent: March 20, 2018Assignee: Infineon Technologies Austria AGInventors: Ralf Otremba, Edward Fuergut, Christian Kasztelan, Hsieh Ting Kuek, Teck Sim Lee, Sanjay Kumar Murugan, Lee Shuang Wang
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Patent number: 9901009Abstract: According to one embodiment, a semiconductor memory device includes a case, a first substrate, an element, and a first heat conduction member. The first substrate is provided in the case and includes a first face. The element is provided on the first face. The first heat conduction member is disposed at least between the element and the case. The element includes a second substrate, a control unit, and a storage unit. The second substrate includes a second face attached to the first face and a third face located opposite to the second face. The control unit and the storage unit are provided on the third face. The first heat conduction member covers the third face and the control unit and is disposed in a state in which the first heat conduction member is held between and compressed by the third face, the control unit, and the case.Type: GrantFiled: September 11, 2015Date of Patent: February 20, 2018Assignee: Toshiba Memory CorporationInventors: Masato Sugita, Masayasu Kawase
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Patent number: 9887166Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.Type: GrantFiled: May 26, 2016Date of Patent: February 6, 2018Assignee: Invensas CorporationInventors: Rajesh Katkar, Laura Wills Mirkarimi, Arkalgud R. Sitaram, Charles G. Woychik
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Patent number: 9879666Abstract: A motor-driven compressor includes a compression mechanism compressing refrigerant gas, an electric motor driving the compression mechanism, a housing made of a thermally conductive material and accommodating the compression mechanism and the electric motor and an inverter assembly controlling rotation of the electric motor. The inverter assembly includes an elastic member made of a thermally conductive material and disposed in contact with the housing, a circuit board supported directly by the elastic member, an electronic part mounted on the circuit board and a base member made of a thermally conductive material, fixed to the housing and having a closed end. The base member fixes the electronic part. The base member and the housing cooperate to form an accommodation space that accommodates the elastic member, the circuit board and the electronic part. The closed end of the base member and the elastic member forms therebetween a space.Type: GrantFiled: October 16, 2012Date of Patent: January 30, 2018Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Ken Suitou, Yusuke Kinoshita, Tsuyoshi Yamaguchi
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Patent number: 9842811Abstract: A heat-dissipating semiconductor package includes a substrate, a chip, a first encapsulation body, a second encapsulation body and a heat sink. The substrate has an inner surface. The chip is disposed on the inner surface of the substrate. The first encapsulation body is formed on the inner surface of the substrate and encapsulates the chip. The second encapsulation body is formed on the first encapsulation body and a periphery area of the inner surface to encapsulate sidewalls and a top surface of the first encapsulation body and cover the periphery area of the inner surface. Wherein, the Young's modulus of the second encapsulation body is less than the Young's modulus of the first encapsulation body. The heat sink is attached to the second encapsulation body. Thereby, the design of the heat-dissipating semiconductor package utilizes multiple encapsulation bodies to reduce the package warpage after installing the heat sink.Type: GrantFiled: November 17, 2016Date of Patent: December 12, 2017Assignee: POWERTECH TECHNOLOGY INC.Inventor: Chia-Jen Chou
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Patent number: 9823691Abstract: According to one embodiment, a semiconductor storage device includes a first substrate, a casing, a first non-volatile memory, a controller, and a first member. The first member connects thermally the first substrate and the casing. At least a portion of the first member is positioned between the first non-volatile memory and the controller.Type: GrantFiled: March 4, 2016Date of Patent: November 21, 2017Assignee: TOSHIBA MEMORY CORPORATIONInventors: Fumiaki Kimura, Yoshimichi Sakai
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Patent number: 9818669Abstract: A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.Type: GrantFiled: August 6, 2014Date of Patent: November 14, 2017Assignee: Honeywell International Inc.Inventors: Kirk Jones, Thom Kreider, Larry Jackson
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Patent number: 9806002Abstract: Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM-layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.Type: GrantFiled: December 23, 2015Date of Patent: October 31, 2017Assignee: Intel CorporationInventors: Arnab Choudhury, John Beatty, Prakriti Choudhary
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Patent number: 9806003Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.Type: GrantFiled: June 29, 2016Date of Patent: October 31, 2017Assignee: Intel CorporationInventors: Jeffory L. Smalley, Susan F. Smith, Thu Huynh, Mani Prakash
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Patent number: 9775229Abstract: This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive plate before transferring it across the interface. Surface area is a significant factor in TIM thermal performance, so this increases the performance substantially when using the same type of TIM pad. This device allows the use of lower performance TIM pads that resolve the issues of high die pressure and non-resilient behavior of high thermal conductivity TIMs. Additionally, the device mechanically isolates the SoC from the heatsink, which reduces stress and provides improved thermal performance.Type: GrantFiled: January 25, 2017Date of Patent: September 26, 2017Assignee: Nvidia CorporationInventors: David Haley, Carlo Galutera
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Patent number: 9693462Abstract: A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part.Type: GrantFiled: July 2, 2015Date of Patent: June 27, 2017Assignee: Mitsubishi Electric CorporationInventor: Takeshi Hosomi
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Patent number: 9686853Abstract: A method comprises applying an adhesive to a first substrate and a second substrate to secure the first substrate to the second substrate. The adhesive extends in a plane on one side of an interposer that also extends in the plane, and is contiguous with the adhesive. The interposer comprises openings to enable flow of adhesive through the openings to form adhesive bond areas on one of the substrates where the areas substantially conform to the openings and lie adjacent to adhesive free areas. The adhesive substantially covers the other of the substrates so that the bond areas produce regions of reduced adhesive strength to the one substrate compared to the bond strength of the adhesive to the other substrate. Adjusting opening sizes adjusts area bond strengths. One substrate may comprise a VTM, the other a heat spreader, and the adhesive, a TIM. An article of manufacture comprises the substrate-adhesive-interposer-adhesive-substrate layers.Type: GrantFiled: June 9, 2014Date of Patent: June 20, 2017Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael Gaynes
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Patent number: 9666701Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: March 18, 2016Date of Patent: May 30, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Patent number: 9640405Abstract: A chip package included a chip, a first though hole, a laser stop structure, a first isolation layer, a second though hole and a conductive layer. The first though hole is extended from the second surface to the first surface of the chip to expose a conductive pad, and the laser stop structure is disposed on the conductive pad exposed by the first through hole, which an upper surface of the laser stop structure is above the second surface. The first isolation layer covers the second surface and the laser stop structure, and the first isolation layer has a third surface opposite to the second surface. The second though hole is extended from the third surface to the second surface to expose the laser stop structure, and a conductive layer is on the third surface and extended into the second though hole to contact the laser stop structure.Type: GrantFiled: December 29, 2015Date of Patent: May 2, 2017Assignee: XINTEC INC.Inventors: Ying-Nan Wen, Chien-Hung Liu, Shih-Yi Lee, Ho-Yin Yiu
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Patent number: 9627292Abstract: A semiconductor housing includes a fixing mechanism and at least one side having structurings. A method for producing a semiconductor device is provided in which a thermally conductive paste is applied on the at least one side of the semiconductor housing and/or of a heat sink. The semiconductor housing is fixed to the heat sink by means of the fixing mechanism. A pressure is exerted on the thermally conductive paste by means of the fixing mechanism and the thermally conductive paste is diverted by means of diversion channels depending on the pressure exerted.Type: GrantFiled: September 25, 2013Date of Patent: April 18, 2017Assignee: Infineon Technologies AGInventors: Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Juergen Schredl
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Patent number: 9576872Abstract: A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor chips, wherein depositing the first material layer includes a vapor deposition, and wherein the first material layer includes at least one of an organic material and a polymer.Type: GrantFiled: December 18, 2013Date of Patent: February 21, 2017Assignee: Infineon Technologies AGInventors: Thomas Mueller, Horst Theuss
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Patent number: 9570373Abstract: A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.Type: GrantFiled: December 9, 2015Date of Patent: February 14, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mark D. Schultz, Todd E. Takken, Shurong Tian, Yuan Yao
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Patent number: 9545026Abstract: An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.Type: GrantFiled: February 2, 2015Date of Patent: January 10, 2017Assignee: PANASONIC CORPORATIONInventors: Toshiyuki Fukuda, Keisuke Kodera, Fumito Itou, Toshihiro Miyoshi
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Patent number: 9515012Abstract: The present invention concerns a package of power dies composed of a first part and a second part, the first part including a plaque having cavities on which dies are placed, the plaque is placed on a first, a second, and a third metallic plates placed on an electric insulation substrate placed on a fourth metallic plate, the second part including a fifth and a sixth metallic plates placed on another electric insulation substrate placed on a seventh metallic plate, the dies are divided into a first group of dies and a second group of dies and wherein the first and second plate are a positive and negative DC voltage connections, the third plate is a gate connection of the second group of dies, the fourth plate is an AC voltage connection and the fifth plate is a gate connection of the first group of dies.Type: GrantFiled: February 12, 2015Date of Patent: December 6, 2016Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Jeffrey Ewanchuk, Stefan Mollov, Guillaume Lefevre
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Patent number: 9490188Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.Type: GrantFiled: September 12, 2014Date of Patent: November 8, 2016Assignee: International Business Machines CorporationInventors: Amilcar R. Arvelo, Michael J. Ellsworth, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro
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Patent number: 9472738Abstract: A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.Type: GrantFiled: August 1, 2014Date of Patent: October 18, 2016Assignee: TOYODA GOSEI CO., LTD.Inventors: Yosuke Tsuchiya, Hiroyuki Tajima, Shota Shimonishi, Shigeo Takeda, Tomohiro Miwa
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Patent number: 9466594Abstract: A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate.Type: GrantFiled: September 5, 2014Date of Patent: October 11, 2016Assignee: ANALOG DEVICES, INC.Inventor: David Frank Bolognia
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Patent number: 9444193Abstract: Electrical connector assembly includes a housing assembly having first and second housing shells that are coupled to each other along a housing seam and define an interior cavity therebetween. The housing seam extends along a three-dimensional (3D) path. The electrical connector assembly also includes an electrical connector having a back end that is disposed within the interior cavity and a front end that is configured to mate with an external mating connector. The electrical connector also including a conductive gasket having a 3D gasket frame that substantially matches the 3D path of the housing seam. The 3D gasket frame being a discrete structure that is positioned along the housing seam to reduce electromagnetic interference (EMI) leakage through the housing seam.Type: GrantFiled: April 7, 2015Date of Patent: September 13, 2016Assignee: Tyco Electronics CorporationInventors: John Eugene Westman, Richard Elof Hamner
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Patent number: 9440652Abstract: An autonomous vehicle may be configured to receive, using a computer system, a plurality of remission signals from a portion of a lane of travel in an environment in response to at least one sensor of the vehicle sensing the portion of the lane of travel. A given remission signal of the plurality of remission signals may include a remission value indicative of a level of reflectiveness for the portion of the lane of travel. The vehicle may also be configured to compare the plurality of remission signals to a known remission value indicative of a level of reflectiveness for a lane marker in the lane of travel. Based on the comparison, the vehicle may additionally be configured to determine whether the portion of the lane of travel in the environment is indicative of a presence of the lane marker.Type: GrantFiled: January 4, 2016Date of Patent: September 13, 2016Assignee: Google Inc.Inventors: David I. Ferguson, David Silver
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Patent number: 9416930Abstract: A process of manufacturing an LED lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of LED chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the LED chips respectively, and finally cutting the scrollable lead frame. In light of this, the LED lamp strip can be produced under the circumstances of low production cost and less production time.Type: GrantFiled: January 10, 2014Date of Patent: August 16, 2016Assignee: LINGSEN PRECISON INDUSTRIES, LTD.Inventors: Ming-Te Tu, Mu-Tsan Liao
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Patent number: 9401467Abstract: Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body. The LED package has a structure in which the LED chip may be buried into a recess formed on a planar surface on the upper portion of the package body such that a bottom surface of the recess lies below the planar surface. Thus, a main path through which heat generated from the LED chip is transmitted may be expanded from a bottom surface of the LED chip up to a lateral surface thereof to widen a dissipation area, thereby improving thermal emission efficiency.Type: GrantFiled: April 27, 2010Date of Patent: July 26, 2016Assignee: LG INNOTEK CO., LTD.Inventor: Kyoung Woo Jo
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Patent number: 9362192Abstract: According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.Type: GrantFiled: June 10, 2014Date of Patent: June 7, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Hajime Takagi, Takeshi Miyakawa
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Patent number: 9355932Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.Type: GrantFiled: August 17, 2015Date of Patent: May 31, 2016Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Seshasayee S. Ankireddi, David W. Copeland
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Patent number: 9355939Abstract: A method of manufacture of an integrated circuit package system includes: providing a base package substrate including: forming component contacts on a component side of the base package substrate, forming system contacts on a system side of the base package substrate, and forming a reference voltage circuit between the component contacts and the system contacts; mounting a first integrated circuit die on the component contacts; mounting a lead frame on the first integrated circuit die and coupled to the component contacts; and isolating a conductive shield from the lead frame, the conductive shield coupled to the reference voltage circuit.Type: GrantFiled: March 2, 2010Date of Patent: May 31, 2016Assignee: STATS ChipPAC Ltd.Inventors: NamJu Cho, HeeJo Chi, HanGil Shin
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Patent number: 9326423Abstract: A method for limiting temperature variation of an electrical component includes detecting a switch from passive to active states and, in response, varying a potential difference between capacitor electrodes from a first value to a second value, the electrodes being mechanically and electrically insulated from each other by a layer of electrocaloric dielectric, and in response to detecting a switch from active to passive states, varying the potential difference between the electrodes from the second to the first value.Type: GrantFiled: August 2, 2013Date of Patent: April 26, 2016Assignee: Commissariat a L'Energie Atomique et Aux Energies AlternativesInventors: Emmanuel Defay, Neil Mathur, Sohini Kar-Narayan, Jordane Soussi
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Patent number: 9265176Abstract: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.Type: GrantFiled: March 8, 2013Date of Patent: February 16, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever
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Patent number: 9261881Abstract: An autonomous vehicle may be configured to receive, using a computer system, a plurality of remission signals from a portion of a lane of travel in an environment in response to at least one sensor of the vehicle sensing the portion of the lane of travel. A given remission signal of the plurality of remission signals may include a remission value indicative of a level of reflectiveness for the portion of the lane of travel. The vehicle may also be configured to compare the plurality of remission signals to a known remission value indicative of a level of reflectiveness for a lane marker in the lane of travel. Based on the comparison, the vehicle may additionally be configured to determine whether the portion of the lane of travel in the environment is indicative of a presence of the lane marker.Type: GrantFiled: August 1, 2013Date of Patent: February 16, 2016Assignee: Google Inc.Inventors: David Ian Franklin Ferguson, David Harrison Silver
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Patent number: 9224681Abstract: The present interposer makes it possible to tailor the coefficient of thermal expansion of the interposer to match components to be attached thereto within very wide ranges. The semiconductor interposer, includes a substrate of a semiconductor material having a first side and an opposite second side. There is at least one conductive wafer-through via including metal. At least one recess is provided in the first side of the substrate and in the semiconductor material of the substrate, the recess being filled with metal and connected with the wafer-through via providing a routing structure. The exposed surfaces of the metal-filled via and metal-filled recess are essentially flush with the substrate surface on the first side of the substrate. The wafer-through via includes a narrow part and a wider part, and contact elements are provided on the routing structure having an aspect ratio, height:diameter, <1:1, preferably 1:1 to 2:1.Type: GrantFiled: April 15, 2013Date of Patent: December 29, 2015Assignee: SILEX MICROSYSTEMS ABInventors: Thorbjorn Ebefors, Daniel Perttu
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Patent number: 9210785Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.Type: GrantFiled: March 13, 2013Date of Patent: December 8, 2015Assignee: Palo Alto Research Center IncorporatedInventors: Bowen Cheng, Dirk DeBruyker, Eugene M. Chow
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Patent number: 9209715Abstract: An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc).Type: GrantFiled: November 8, 2011Date of Patent: December 8, 2015Assignee: International Business Machines CorporationInventors: Carsten Goettert, Harald Huels, Hans-Guenter Kraemer, Manfred Ries, Rolf Schaefer
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Patent number: 9202772Abstract: The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material.Type: GrantFiled: February 28, 2013Date of Patent: December 1, 2015Assignee: Altera CorporationInventor: William Y. Hata
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Patent number: 9184108Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.Type: GrantFiled: December 8, 2011Date of Patent: November 10, 2015Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Seshasayee S. Ankireddi, David W. Copeland
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Patent number: 9165855Abstract: A packaged semiconductor device has an integrated circuit (IC) die and a heat spreader. The heat spreader has a first portion with holes formed entirely therethrough. The first portion is attached to the die using thermally-conductive adhesive that fills the holes. The holes enable the heat spreader to be attached to the die without placing excess pressure on the IC die that could cause the die to crack.Type: GrantFiled: July 2, 2014Date of Patent: October 20, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Kai Yun Yow, Poh Leng Eu
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Patent number: 9165793Abstract: A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond.Type: GrantFiled: May 2, 2014Date of Patent: October 20, 2015Assignee: Invensas CorporationInventors: Liang Wang, Hong Shen, Rajesh Katkar
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Patent number: 9157687Abstract: A heat pipe can include a microchannel heat exchanger at the heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at the heat sink end, with one or more pipes flowably connecting the two ends for transporting liquid working fluid to the head absorber and vaporized working fluid to the heat sink. The heat pipes may be used to cool electronic devices with rejection of heat outside an enclosure, and optionally outside a room, containing the electronic devices. The heat pipes may be used to cool photovoltaic or solar collection devices with rejection of heat to ambient air at a distance removed from the photovoltaic devices. Heat pipe systems are disclosed wherein the working fluid is a hydrofluorocarbon or a mono-chlorinated hydrofluoroalkene having a normal boiling point in a range from 10° C. to 80° C.Type: GrantFiled: November 10, 2008Date of Patent: October 13, 2015Assignee: QCIP Holdings, LLCInventor: Steven G. Schon
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Patent number: 9117827Abstract: A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond.Type: GrantFiled: May 2, 2014Date of Patent: August 25, 2015Assignee: Invensas CorporationInventors: Liang Wang, Hong Shen, Rajesh Katkar
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Patent number: 9105500Abstract: A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.Type: GrantFiled: July 13, 2012Date of Patent: August 11, 2015Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 9095942Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.Type: GrantFiled: September 26, 2012Date of Patent: August 4, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 9099540Abstract: A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.Type: GrantFiled: April 16, 2013Date of Patent: August 4, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Oscar M. K. Law, Kuo H. Wu