Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Abstract: This present invention provides a high power electronic device which is used for transforming the alternating current into the direct current, or transforming the direct current into the alternating current: a thyristor valve module, there are two same thyristor valve segments in the whole thyristor valve module; each segment includes saturated reactor, thyristor valve unit, direct current equalizing resistor unit, acquiring energy unit, damped resistor unit, damped capacitor unit, gate series unit and water cooling system. This device series connects the thyristor valves to meet different transmission powers and different voltage ranks. This device is the key element of the high voltage direct current transmission. It can be used for different voltage ranks AD transmission system and can also be used for different voltage ranks DC system, including the ultra-high voltage 800 kV and above system.

Abstract: Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Abstract: A semiconductor module is disclosed that includes a semiconductor element, a capacitor configured to be electrically connected to the semiconductor element and a heat sink, wherein the semiconductor and the capacitor are stacked with each other via the heat sink, and wherein the semiconductor element is disposed in a position overlapping with the capacitor as viewed from a stack direction.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip stack; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chip stacks. The chip package further includes a cooling lid disposed above the chip stack providing additional cooling.

Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Abstract: By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techniques and may be positioned in close proximity to individual transistor elements and/or may be used for shielding particular circuit portions.

Abstract: An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.

Abstract: Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: A semiconductor device includes an enclosure of insulating material having an introduction portion and a discharge portion for an insulating refrigerant and also having an opening, filters mounted on the introduction portion and the discharge portion, respectively, so as to prevent conductive foreign matter from entering the enclosure, a power semiconductor element provided on the outside of the enclosure, a heat sink bonded to the power semiconductor element and extending through the opening and within the enclosure, and an insulator covering the portions of the power semiconductor element and the heat sink lying outside of the enclosure.

Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.

Abstract: An exemplary LED module includes a ceramic substrate, a heat spreader, a heat sink, an LED die, and a packaging layer. The substrate defines a hole extending therethrough from a top side to a bottom side thereof. The heat spreader is disposed in the hole with a top side thereof substantially coplanar with the top side of the substrate. An outer circumferential surface of the heat spreader contacts an inner circumferential surface of the substrate around the hole. The heat sink is attached to the top sides of the substrate and the heat spreader. The LED die is attached to a bottom side of the heat spreader, and the packaging layer encapsulates the LED die.

Abstract: Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.

Abstract: Vapor condensers and cooling apparatuses to facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel.

Abstract: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3?) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.

Abstract: A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate, forms in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate, forms respective bonding elements on at least one of the first and second substrates, and bonds the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel in between the first and second substrates.

Abstract: A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

Abstract: An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably to disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract: A drive with heat dissipation and energy-saving function for supplying power to drive a motor. The drive includes a driving circuit having a rectification section. The rectification section serves to receive AC current generated when the motor abruptly accelerates/decelerates and convert the AC current into DC current and output the DC current. The drive further includes a cooling module electrically connected to an output end of the rectification section. The cooling module is drivable by the DC current output from the rectification section to conduct out and dissipate heat.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chips or chip stacks.

Abstract: A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transfer during operation of the semiconductor package. Other embodiments are described and claimed.

Abstract: A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat generated by the device from the main body. The cooling structure includes a coolant flowing portion including a coolant supply port to which coolant is supplied, a coolant moving space which is positioned adjacent to the accommodating portion and in which the coolant moves in a back side of the basic circuit of the accommodating portion, and a coolant discharge port which discharges the coolant from the moving space. The semiconductor package assembly includes a package support body which supports the package and which includes a coolant circulation structure supplying coolant to the flowing portion of the main body through the supply port and collecting the supplied coolant through the discharge port.

Abstract: A semiconductor package comprises a semiconductor chip, through electrodes and cooling parts. The semiconductor chip has bonding pads on an upper surface thereof. The through-electrodes are formed in the semiconductor chip. The cooling parts are formed in the semiconductor chip and on the upper surface of the semiconductor chip in order to dissipate heat.

Abstract: There is provided an electrical power component attached to a chassis of an electrical power apparatus, including a semiconductor element constituting an electronic circuit, and cooling unit having a planar shape which cools the semiconductor element and serves as a reinforcing material for increasing strength of the chassis.

Abstract: A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member.

Abstract: A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.

Abstract: Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: In some embodiments, a semiconductor cooling apparatus includes a monolithic array of cooling elements. Each cooling element of the monolithic array of cooling elements is configured to thermally couple to a respective semiconductor element of an array of semiconductor elements. At least two of the semiconductor elements have a different height and each cooling element independently flexes to conform to the height of the respective semiconductor element.

Abstract: The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).

Abstract: As a result of a lower arm side having a small thermal resistance being positioned downstream of the coolant flow, cooling efficiency of the lower arm positioned on the downstream side of the coolant flow becomes higher than that of an upper arm positioned on an upstream side. Hence, rise in coolant temperature on the upstream side can be suppressed, and the first and second semiconductor chips disposed upstream and downstream can be effectively cooled. Alternatively, even when the coolant temperature rises on the upstream side, the first and second semiconductor chips disposed upstream and downstream can be effectively cooled by sufficient cooling being performed on the downstream side based on the high cooling efficiency. Therefore, the rise in semiconductor chip temperature on the downstream side to a temperature higher than that on the upstream side can be suppressed.

Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

Abstract: Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wiring board (10), and liquid cooling mechanisms (13, 14) are respectively placed on the LSI (11) and the optical modules (12). The plurality of optical modules (12) may be arranged only on a surface of the electric wiring board (10) where the LSI (11) is mounted, only on a surface opposite to the surface where the LSI (11) is mounted, or on both the same surface as and the opposite surface to the surface where the LSI (11) is mounted.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatuses include a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple fluid-boiling fins of a heat spreader coupled to one or more of the electronic components immersed within the dielectric fluid. The interleaved fins facilitate localized cooling and condensing of dielectric fluid vapor within the sealed compartment.