Abstract: A heat pipe and method that utilizes a multi-layered shape memory alloy (SMA) as the wick structure. Each layer has a different transformation temperature. The inner layer of the SMA begins contracting first when heat is applied along the surface of the heat pipe. The contraction reduces the effective capillary radius rc of the wick, thereby maintaining or increasing the capillary pumping pressure and thus the ability to remove heat. As the temperature of the heat pipe continues to rise, the outer layer begins contracting to reduce the capillary radius further. As a result, the local pumping pressure is maintained or even increased to accommodate higher local heat flux and remove the heat to prevent “dry-out.

Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump.

Abstract: The two-phase cooling module (200) for electronic components includes a first cooling chamber member (210) press formed as a unitary member having an offset surface and a perimeter surface. A second cooling chamber member (212, 600), such as a flat sheet, serves as cooling chamber member and is brazed to the perimeter surface. A non-integral support member (500) is interposed between the first cooling chamber member and the cover (600) and is located within the cooling cavity. In an alternative embodiment, the cooling cavity is defined by two cooling chamber members, each of which are press formed as separate unitary members (210, 212) each having offset surfaces and corresponding perimeter surfaces.

Abstract: A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.

Abstract: A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit.

Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Abstract: The invention is directed to a cooling system for a power electronics module to drive at least one unit in a motor vehicle, in particular a starter motor/generator, with a pressure sealed compartment (2) for housing an electronic assembly (1) and a bath (3) of electrically isolating primary coolant surrounding this, boiling, at operating pressure, at a temperature which does not exceed the permissible operating temperature of the electronic assembly (1), and a heat exchanger (5), fitted above the meniscus of the primary coolant or linked to it by means of a connecting assembly (9), whereby the primary coolant vaporized in the electronic assembly (1) reaches the heat exchanger (5) as vapor, there condenses and returns to the bath (30, thus providing circulation of the primary coolant. A secondary cooling circuit with a secondary coolant, has a cooler (8) cooling the heat exchanger (5).

Abstract: A cylindrical heat radiator comprises a cylindrical main body having a tightly sealing cavity, the cavity being filled with air; an inner surface of the cylindrical main body being formed with two penetrating channels. The penetrating channels of the cylindrical main body are located with fin sets. The cylindrical main body is formed by an inner tube, an outer tube and sealing rings at two ends. The inner tube and outer tube are arranged non-coaxially. A wick structure is installed in the cavity. By a degassing process, a heat-pipe type heat transferring structure is formed in the cylindrical main body, or by a non-degassing step, a boiling type heat transferring structure is formed. A heat dissipating body being in contact with the cylindrical main body. Fluid in the cylindrical main body is heated to boil and vaporized so that the fluid in the cylindrical main body will flow circularly.

Abstract: A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die, the liquid is vaporized in the vapor chamber generating vapor. The vapor flows through the MPs to condensation ends of the MPs.

Abstract: A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.

Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: A heatsink for dissipating thermal energy generated by a microprocessor and neighboring peripheral components. The heatsink is affixed to a printed circuit board within a computer housing. The heatsink includes a thermally conductive base, a plurality of thermally conductive fins, and a heat pipe. The thermally conductive base includes substantially planar upper and lower surfaces displaced from each other by a thickness of the base. The base defines a first channel, proximal to the lower surface, extending from a first end of the base to a second end. The plurality of conductive fins extends substantially perpendicularly from the upper surface of the base. Each of the plurality of fins includes substantially planar proximal and distal major surfaces displaced from each other by a thickness of the fin. The heat pipe is contained within the first channel. The heat pipe includes an elongated casing containing a heat transfer medium and a wick.

Abstract: A heat dissipation device comprising a thermally conductive, hollow housing having a fan and an active anti-noise module disposed within the hollow housing. The hollow housing may include a plurality of fins disposed therein to increase the surface area for convective heat transfer. The heat dissipation device further may further include heat pipes for the transportation and dispersion of heat to and about an external surface of the hollow housing.

Abstract: A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and comprising a heat transfer wall for transferring heat from the heat source into the chamber; a heat transfer fluid within the chamber; a fluid circulation path including the chamber interior; a fluid propelling mechanism for propelling the fluid through the circulation path and across the heat transfer wall so that the fluid absorbs heat at the heat transfer wall and flows to a heat discharge region remote from the heat transfer wall where the heat is dissipated into the surrounding environment; where the fluid propelling mechanism includes a mechanical fluid driving structure including blades within the chamber rotatably secured to the apparatus with a blade mounting structure to move adjacent to and along the heat transfer wall and within the flow layer of the fluid adjacent to the heat transfer wall to mechanical

Abstract: Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of condenser regions can be located within one of the plurality of hollow fins. The inner cavity also can include an evaporator region adjacent said bottom wall.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: A cooling device includes a boiling unit and a condensing unit. A diffusion plate having a plurality of holes is formed into a thin-long shape, and is disposed in an upper tank of the condensing unit at an approximate center in an up-down direction so that an inner space of the upper tank of the condensing unit is divided into upper and lower parts in the up-down direction. Each hole opened in the diffusion plate has an opening area smaller than a sectional surface area of an introduction port of a gas-refrigerant introduction pipe, opened in the upper tank of the condensing unit. Thus, gas refrigerant flowing into the upper tank of the condensing unit through the gas-refrigerant introduction pipe is diffused to all the upper part of the upper tank along the surface of the diffusion plate while passing through the holes of the diffusion plate downwardly.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantity of heat. The flow of air enters the air duct. The air duct has a restriction chamber that includes a venturi vent in which the flow of air into the duct and through the restriction chamber creates a new flow of air into the venturi vent. The new flow of air into the venturi vent does not pass over the at least one component in the electronic device.

Abstract: A freeze tolerant condenser (106) for a two-phase heat transfer system is disclosed. The condenser includes an enclosure (110) and a porous artery (112) located within and extending along the length of the enclosure. A vapor space (116) is defined between the enclosure and the artery, and a liquid space (114) is defined by a central passageway within the artery. The artery includes a plurality of laser-micromachined capillaries (130) extending from the outer surface of the artery to its inner surface such that the vapor space is in fluid communication with the liquid space. In one embodiment of the invention, the capillaries (130) are cylindrical holes having a diameter of no greater than 50 microns. In another embodiment, the capillaries (130′) are slots having widths of no greater than 50 microns. A method of making an artery in accordance with the present invention is also disclosed.

Abstract: A net-shape molded heat exchanger is provided which includes a thermally conductive main body and a number of thermally conductive arms connected to and extending from the main body. A number of thermally conductive fins are connected to the arms. The heat exchanger is formed by net-shape molding a main body, the arms which emanate from the main body and the fins from a thermally conductive composition, such as a polymer composition. The molded heat exchanger is freely convecting through the part which makes it more efficient and has an optimal thermal configuration. Optionally, heat pipes may be embedded within the arms of the heat exchanger to further enhance heat dissipation.

Abstract: The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion.

Abstract: A device for forming a heat dissipating fin set comprises a heat tube made of copper, and at least one heat dissipating fin set made of metal. Each fin in the heat dissipating fin set having a though hole. One side of the though hole is extended with a combining portion. A slender hole with a smaller diameter is formed on an upper edge of the though hole; the heat dissipating fin set being engaged to the heat tube through the though holes. A metal wire selected from silver, tin or copper is arranged into the slender holes at an upper edge of fin in the heat dissipating fin set; and then the heat tube and heat dissipating fin set are combined by heat melting. Thereby, a device for forming a heat dissipating fin set with a heat resistor without any interface and having a preferred heat conductance is formed.

Abstract: A capillary wick for use in capillary evaporators has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels to the liquid reservoir. Use of a central liquid flow channel in the wick is eliminated, and pore size in the wick is chosen to maximize available pressure for fluid pumping, while preventing nucleation in the wick body. The wick is embodied with different geometries, including cylindrical and flat. A flat capillary evaporator has substantially planar heat input surfaces for convenient mating to planar heat sources. The flat capillary evaporator is capable of being used with working fluids having high vapor pressures (i.e., greater that 10 psia). To contain the pressure of the vaporized working fluid, the opposed planar plates of the evaporator are brazed or sintered to opposing sides of a metal wick. Additionally, a terrestrial loop heat pipe and a loop heat pipe having overall flat geometry are disclosed.

Abstract: There is provided a boiling cooling system that exchanges heat between a higher-temperature fluid and a lower-temperature fluid through boiling heat transfer of a refrigerant sealingly contained within the boiling cooling system. The boiling cooling system includes a heat absorbing unit, a heat radiating unit, a vapor transfer pipe and a liquid return pipe. The refrigerant in the liquid state generally fills up to a top of an interior space of an upper tank of the heat absorbing unit and also generally fills up to a top of an interior space of a lower tank of the heat radiating unit while the boiling cooling system is not operated.

Abstract: A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The separation of the vapor space, and the wick structure of the liquid space, ensures that the vapor space will not be distorted or clogged by the wick structure. The heat transfer device can be bent to meet design criteria without distorting the width or radius of the vapor space. In one embodiment of the present invention the evaporator, condenser, and liquid space have different types of wick structure. Another embodiment of the present invention, the vapor space of the loop heat pipe has uniform thickness. The loop heat pipe device of the present invention provides reduced evaporator and condenser resistance and increased burn out flux, thereby increasing the power handling capacity of the device.

Abstract: Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical heat pipes to transfer heat both horizontally and vertically in the heat sinks. Selection of the number of heat pipes used allows tailoring of the heat sink capabilities for different applications using the same fundamental assemblage of parts. Various embodiments are disclosed.

Abstract: The apparatus provided with a heatsink (21) being in contact with an electronic component (16), a heat radiation plate (20) for radiating heat, a heat conduction member (22) for transferring heat in the heat sink to the radiation plate, and connection mechanisms (21-1 and 21-2) for connecting the heat sink and the heat conduction member and separating the heat sink and the heat conduction member. This connection mechanism enables to maintain small heat conduction resistance between the heat sink and the electronic component and also between heat sink and heat conduction member. Cooling capability can be prevented from decreasing even when the heat sink and the heat conduction member is of separated construction.

Abstract: A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted.

Abstract: A cooling device for cooling a heat-generating member includes a refrigerant tank for boiling liquid refrigerant by heat from the heat-generating member and a radiator for cooling and condensing gas refrigerant from the refrigerant tank. The refrigerant tank has therein a plurality of refrigerant passages defined by ribs which are integrally formed with any one of opposite wall parts of the refrigerant tank. The ribs continuously extend in an up-down direction to be slightly longer than an up-down dimension of a boiling surface of the refrigerant tank. In the cooling device, because each passage width of the refrigerant passages is set to be equal to or smaller than double Laplace length, an outer diameter of bubbles in the refrigerant passages becomes larger, and liquid refrigerant can be moved upwardly by bubbles. Accordingly, it can restrict liquid refrigerant surface from being lowered even when gas-generating amount is increased.

Abstract: A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.

Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.

Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: A heat dissipating device includes a heat sink (50) for removing heat from an electronic device (90), and a plurality of adjusters (45) for adjusting distance and contact force between the electronic device and the heat sink. The heat sink defines a plurality of receiving holes (62) for receiving respective adjusters, and a plurality of communicating through holes (66) whose diameters are smaller than those of the receiving holes. A shoulder (64) of the heat sink is formed where each receiving hole communicates with each through hole. Each adjuster comprises a connecting shaft (42), a lock screw (46) with a head (464), and a spring (44). The lock screw threadedly engages with the connecting shaft, and the spring is secured between the shoulder of the heat sink and the head.

Abstract: The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange assembly. The heat exchange assembly includes a primary housing, a fan at one end of the housing, and a secondary housing at the opposite end of the primary housing. The secondary housing has a plurality of fins and the primary housing as a plenum chamber between the fins and the fan. The invention also comprises a high-performance notebook computer and cooling apparatus combination which includes a pivoted outer cover and a cooling system located along the pivoting axis of the outer cover.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.

Abstract: A heat sink comprises at least one row of many tonguelike fins formed on one surface of a heat dissipating base plate and each having a circular-arc outer end. The midportion only of the entire circular-arc outer end portion is bent forward into a curl portion. The fin end portion has opposite side parts other than the midportion and remaining unbent as arcuate portions.

Abstract: A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat conductive surface for being connected to the heat source. The heat-transferring seat further has at least one heat-transferring seat for heat dissipation with the radiating surface. The radiating surface has a three dimensional form, i.e. one side of the radiating surface is higher than another side thereof so as to be beneficial to guide the airflow. The heat-transferring'seat is covered with the heat-dissipating device having a shape matching with the bottom thereof. The heat-transferring seat is formed by many pieces or is formed by a continuous folded structure, or is formed integrally through die casting, forging or slitting. The heat-dissipating device is buckled to the heat source through a buckle; the heat-dissipating device is connected to the fan.

Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, and a radiator having a header through which gas refrigerant from the boiling space flows into plural tubes connected to the header. One end of the header is inserted into the refrigerant tank, and the inserted end portion of the header has a communication port communicating with the boiling space through a gas refrigerant outlet. The communication port has a lower end at the same position as a lower end of the gas refrigerant outlet. Further, the tubes are inserted into the header to have opened ends within the header, and each lower end of the opened ends of the tubes is set at a position higher than the lower end of the communication port and the lower end of the gas refrigerant outlet.

Abstract: A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, first and second radiators disposed at upper and lower parts of the refrigerant tank, defined by a liquid refrigerant surface within the refrigerant tank, and a connection pipe connecting the first and second radiators. The first and second radiators have the same shape, and are disposed to cool and condense gas refrigerant from the boiling space. In the cooling device, even when the cooling device is used in a normal state or a vertically reversed state, sufficient radiating performance of the first and second radiators can be obtained.

Abstract: A heat dissipating device includes: a barrel having a plurality of fins circumferentially formed on a barrel wall; a buckle secured on a first end portion of the barrel to be fastened to a base board of a central processing unit (CPU); a cooling fan provided at a second end portion of the barrel for directing cooling air through the barrel wall and the fins for dissipating heat outwardly as emitted from the CPU which is adhered to the first end portion of the barrel; a vaporizable coolant filled in the barrel; and a transfer member fixed in the barrel for conducting the heat from the CPU to the vaporizable coolant for vaporizing the coolant in order to greatly absorb a vaporization heat during the phase change from the liquid coolant to the coolant vapor, whereby upon contact of the coolant vapor with the barrel wall as cooled by the cooling fan, the coolant vapor will be condensed to liberate the condensation heat which will soon be dissipated through the barrel wall and the fins by the cooling air as delive

Abstract: Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

Abstract: An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.

Abstract: A cooling apparatus includes a refrigerant tank containing boiling and condensing refrigerant and a radiator for cooling the refrigerant. The radiator is connected to the refrigerant tank on a front surface thereof, and hot objects to be cooled are attached to a heat-receiving surface formed on a rear surface of the refrigerant tank. The refrigerant is circulated in the apparatus so that the refrigerant is vaporized in the refrigerant tank and condensed in the radiator. The radiator is connected to the refrigerant tank by inserting a pair of header tanks thereof into the refrigerant tank. The insertion length is controlled to obtain good heat conductivity between the radiator and the refrigerant tank and to avoid deformation of a radiator fin contacting the refrigerant tank. Holes for mounting a substrate carrying the hot objects may be made on enlarged portions of a cover plate closing the refrigerant tank.

Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.