Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: A heat dissipation device includes a plurality of fins (40), a post (20) and a plurality of heat pipes (30). Each fin defines an opening (42) and a plurality of punctures (44) spaced from the opening. The post is received in the openings of the fins. The heat pipes are engaged at opposite portions thereof with the post and the punctures of the fins.

Abstract: A heat dissipation device includes a base (10), fins (40), two plates (30), a post (50), a pair of heat pipes (20) and a fan (60). The fins are spaced from each other and defines a plurality of air passages therebetween. The plates are positioned at opposite sides of the fins. The post is perpendicularly engaged in central positions of the fins and the base. The post is coplanar with the base at lowest surfaces. The heat pipes have central segments (22) engaged in the base and end segments (24) sandwiched between the plates and the fins. The fan is positioned to the plates and in communication with the air passages.

Abstract: A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.

Abstract: A heat dissipation device includes a base (10), a post (20), a plurality of fins (50), a pair of heat pipes (30) and a pair of plates (40). The base is for contacting an electronic component. Each fin defines an aperture (52) therein. When the fins are parallelly stacked upon the base, the apertures cooperatively define a channel. The post is extended perpendicularly from the base and received in the channel. The post defines a pair of through holes (21) along a length direction thereof. The plates are located at opposite peripheries of the stacked fins and parallel to the post. Each plate defines an engaging hole (41) therein. Each heat pipe is substantially inverted U-shaped and includes parallel first and second section (32, 34) respectively soldered into a corresponding through hole of the post and the engaging hole of a corresponding plate.

Abstract: An apparatus including a heat pipe having an evaporator portion and a condenser portion, the evaporator portion to be thermally coupled to a heat generating component; and an actuation membrane unit to generate air movement in a direction of the condenser portion of the heat pipe.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: A capillary wick for use in capillary evaporators has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels to the liquid reservoir. Use of a central liquid flow channel in the wick is eliminated, and pore size in the wick is chosen to maximize available pressure for fluid pumping, while preventing nucleation in the wick body. The wick is embodied with different geometries, including cylindrical and flat. A flat capillary evaporator has substantially planar heat input surfaces for convenient mating to planar heat sources. The flat capillary evaporator is capable of being used with working fluids having high vapor pressures (i.e., greater that 10 psia). To contain the pressure of the vaporized working fluid, the opposed planar plates of the evaporator are brazed or sintered to opposing sides of a metal wick. Additionally, a terrestrial loop heat pipe and a loop heat pipe having overall flat geometry are disclosed.

Abstract: A cooling device is constructed to include a heat sink attached to a heat generating device and adapted to absorb heat energy from the heat generating device, and at least one heat pipe mounted in the heat sink, each heat pipe having a condensing side formed at each end and disposed at a relatively lower temperature area at the heat sink and an evaporation side formed at the middle and disposed at a relatively higher temperature area at the heat sink.

Abstract: Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: A flat heat pipe has a vacuum chamber, an evaporator connected to a heating element, and a condenser connected to a cooling device. The vacuum chamber is provided in an interior with a wick structure and a working fluid by which an evaporation-condensation cyclic process is effected. The vacuum chamber is further provided in the interior with a plurality of heat conduction pillars, which are confined to the area of the evaporator and are connected with an upper wall and a lower wall of the interior of the chamber. The heat conduction pillars serve to enhance the heat conduction to the condenser from the evaporator.

Abstract: A heat-pipe cooler includes a housing having no air contained therein, working liquid contained in the housing, a sinter metal held in the housing, and hollow cooling fins formed on the housing and communicating with interior space of the housing. Thus, heat produced by a heat source will be transferred to the sinter metal, and then the working liquid, which has been absorbed by the sinter metal, is evaporated by the heat, and travels into the cooling fins. And, the evaporated working liquid is cooled, and changes into liquid form in the cooling fins, drops onto, and is absorbed by the sinter metal. And finally, the working liquid flows back to the evaporating section of the cooler along the sinter metal with the help of capillary force.

Abstract: A heat transfer structure includes a heat transfer module having a plurality of heat transfer members in the duct chamber with the density increased in the direction of the flow of the coolant and having a greatest density adjacent to the position of a heat source attached in thermal contact with the heat transfer module. The profile of the duct chamber is adjusted to the position of the heat source to increase the velocity of coolant directly under the heat source and to partially or completely block the coolant flow to the areas which do not need to be temperature adjusted. The heat transfer members may be formed as pin fins fabricated from springs compressed to a predetermined density in a direction perpendicular to the longitudinal axis of the spring (and/or in parallel to the longitudinal axis of the heat transfer module).

Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

Abstract: The invention relates to heat engineering, in particular to heat pipes and can be used for removing heat from miniature high-heat object, in particular elements of radiotechnical instruments and computers requiring efficient removal of heat and minimum dimensions of a cooling system, the aim of said invention is to increase the heat load of an evaporation chamber at a predetermined temperature and to reduce the dimensions thereof. The inventive evaporation chamber for a loop heat pipe comprises a body having a side and an end wall and a capillary-porous orifice provided with steam-outlet channels and arranged inside said chamber. Said steam-outlet channels are united with the aid of a steam header and disposed on the part of the orifice perimeter of the side of a heat sink. Said evaporation chamber is also provided with an asymmetric hold offset in a direction opposite with respect to the heat sink. The ends of the steam-outlet channels are embodiment in such a way that they are dead on one side thereof.

Abstract: A capillary tube heat pipe and the like are provided, in which is applicable for a case that a heat receiving portion is separated apart from a heat radiating portion, and a sufficient space for connecting the both portions does not exist. This capillary tube heat pipe (1) is provided with two turn portions (a heat receiving portion and a heat radiating portion) (3-1) and (3-2) at the both ends thereof and a straight portion (a heat transfer portion) (5) extending between the both turn portions (3), and has a closed loop structure in which both terminals of a single pipe are communicated. Since the heat transfer portion is made from two straight pipes (7) and (9), the straight portion (5) can be small in size.

Abstract: An isothermal heat sink use operational principles of heat pipes and includes a plate-like body including a housing, an interior partition and a wick. The housing has an inner chamber under a vacuum. The interior partition divides the inner chamber into an upper and lower half chamber and has a central through hole and multiple air passages. The wick containing a working fluid is held in the central through hole and has a lower evaporating section and an upper condensing section that are held respectively in the lower and the upper half chambers. Therefore, the working fluid in the evaporating section evaporates and produces a vapor that enters the upper half chamber from the lower half chamber through the air passages. The vapor condenses into liquid that enters the condensing section and returns to the evaporating section to improve cooling efficiency of the heat sink.

Abstract: Manufacturable processes and the resultant structures utilize metal hydride as an internal source of hydrogen to enhance heat removal within semiconductor packages that employ low dielectric constant materials. The use of a metal hydride heated by internal or external sources facilitates pressurizing hydrogen gas or hydrogen-helium gas mixtures within a hermetically-sealed package. The configuration of the metal hydride can include, where needed to generate the pressure required in larger packages, a relatively large area of metal hydride material on at least one or a plurality of hydrogen generation-dedicated chips. Alternatively, the configuration can include at least one or a plurality of relatively small “islands” of metal hydride material on each of at least one or a plurality of integrated circuit-bearing chips.

Abstract: Means for cooling a heated surface comprising an enclosure for enclosing the heated surface and two interleaved radial arrays of micro electrodes positioned on the surface within the enclosure thereby forming an interleaved radial array. The radial array has a ‘near-vertex’ end and a periphery. The micro electrodes at the near-vertex end have a smaller interelectrode distance and the micro electrodes at the periphery have a larger interelectrode distance. A volatile cooling liquid is contained within the enclosure and moved from the near-vertex array end toward the periphery along the lengths of micro electrodes by non-alternating voltages applied to the micro electrodes, thereby creating a polarization effect and evaporation of the volatile liquid.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: A heat pipe heat spreader is provided having a substantially L-shaped enclosure with an internal surface and a plurality of post projecting from the surface. A working fluid is disposed within the enclosure, and a grooved wick is formed on at least a portion of the internal surface. The grooved wick includes a plurality of individual particles having an average diameter, and including at least two lands that are in fluid communication with one another through a particle layer disposed between the at least two lands that comprises less than about six average particle diameters. A method for making a grooved heat pipe wick on an inside surface of a heat pipe container a layer of sintered powder between adjacent grooves that comprises no more than about six average particle diameters.

Abstract: Tubes 3 are provided substantially upright on an upper surface of a refrigerant container 2 by inserting lower end portions thereof into inserting holes 5 of the refrigerant container 2. The tube 3A, differed from the tubes 3B, has a trumpet shape which is suddenly increased in its passage cross section towards the lower end opening portion. Thus, most of refrigerant vapor boiled and evaporated in the refrigerant container 2 can be collectively introduced into the tube 3A located within the boiling area. The refrigerant vapor entered a header tank 4 from the tube 3A is diffused in the header tank 4, and is introduced into the tubes 3B located out of the boiling area. The condensate produced by cooling the refrigerant vapor upon passing through the tubes 3B can be circulated into the refrigerant container 2.

Abstract: The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these systems. These electronic systems have to be cooled due to their fixed operating temperature ranges. Operating an electronic component beyond its rated operating temperature range will damage electronic components. Instead of conventionally utilising a bigger fan, a smaller sized solution is required for cooling an electronic component contained in a compact electronic system, for example a notebook computer. A heat transfer apparatus includes a heat carrier for conveying heat away from the electronic system into a radiator for dissipation. The radiator is placed into a cooler for directing air through the radiator and expelling heated air, cooling the radiator in the process.

Abstract: A heat-dissipating device includes a hollow heat-transfer member adapted to be disposed on a heat-generating source and confining a vacuum sealed chamber therein, an amount of coolant medium contained in the vacuum sealed chamber for heat exchange, and a plurality of heat-dissipating fins provided on the heat-transfer member. The vacuum sealed chamber has a wider section, a narrower section, and a neck section between the wider and narrower sections. The neck section hampers movement of the coolant medium from the wider section to the narrower section when the heat-transfer member is tilted from an upright position, where the narrower section is disposed above the wider section.

Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 ?m, a depth in the range of 25 to 1,000 ?m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 ?m, and the base plate 5 has a thickness in the range of 200 to 2,000 ?m.

Abstract: In a cooling device boiling and condensing refrigerant, a heat conductor portion for thermally connecting a heat reception wall and a heat radiation wall defining a closed container is disposed in the closed container, a heat-generating member is attached on the heat reception wall, and a heat radiation fin for radiating heat generated from the heat-generating member to an outside is provided on the heat radiation wall. In the cooling device, both ends of the tube are connected to the closed container at different position of the heat radiation wall to communicate with the closed container, so that the heat radiation fin is enclosed by the heat radiation wall and the tube.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: This cooling apparatus can improve a radiation performance by increasing the boiling area and make it difficult to cause the burnout on boiling faces by filling the boiling faces with a refrigerant necessary for the boiling. In refrigerant chambers for reserving a refrigerant, there are inserted corrugated fins for increasing the boiling area. These corrugated fins are composed of lower corrugated fins arranged to correspond to the lower sides of the boiling faces for receiving the heat of a heating body, and upper corrugated fins arranged to correspond to the upper sides of the boiling faces, and these lower and upper corrugated fins and are individually held in thermal contact with the boiling faces of the refrigerant chambers. The lower corrugated fins and the upper corrugated fins are given a common fin pitch P and are individually inserted vertically in the individual refrigerant chambers to define the individual passages further into a plurality of small passage portions.

Abstract: A light source device for pumping a solid-state laser medium of a laser generator, which is compact and capable of economically using LD bars constituting the LD stack with easy maintenance. The light source device is constituted by a plurality of LD modules. Each LD module comprises a plurality of cooling devices on which LD bars are respectively mounted and connection plates on both sides thereof. The LD bars are stacked such that longitudinal directions thereof extend perpendicular to a stacking direction thereof. A desired number of LD modules are mechanically connected with each other using the connection plates to form the LD stack. A sealing member is intervened between confronting connection plates of adjacent LD modules, so that flow passages of coolant formed in the respective LD modules are continuously connected. The connection plates have functions of fixedly supporting the cooling devices of each LD module and electrically connecting the adjacent LD modules.

Abstract: A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.

Abstract: A heat pipe unit is comprised of a tank, a plurality of pipes provided upright on and joined to a side of the tank to be in communication with the tank, the pipes being closed at an end thereof opposite an end where the pipes are joined to the tank; a working fluid sealed in the tank and movable between the plurality of pipes and the tank, and a plurality of fins fitted over and assembled to the plurality of pipes. The tank of this heat pipe unit is embedded in a base block of metal to provide a heat pipe type heat exchanger. A plurality of heat pipe units may be arranged in a row on the base block. The tank is preferably formed from a pipe of circular cross section and has spiral grooves provided on an inner surface thereof. The heat pipe unit and the heat pipe type heat exchanger are simple in structure and excellent in cooling performance, and are easy to produce.

Abstract: A flat sheet structured thermal device using a two-phase active fluid. The device including at least a top sheet, at least two intermediary sheets, and a back sheet stacked longitudinally. Each intermediary sheet has at least one zone etched through its entire thickness to form a gas transport channel. The etched zone being longitudinally bordered by at least one groove formed on the same sheet. The at least one groove contributing to the formation of at least one capillary channel when the sheet is covered by another sheet. The capillary channel is of a section adapted to enable the liquid phase of the fluid to be pumped therein by capillary forces. The device allows fluid to pass reversibly between the capillary channel and the gas transport channel during the liquid/gas or gas/liquid transition due to temperature variations to which at least one zone of the device is subjected.

Abstract: The present invention provides a cooling device having improved cooling performance and providing higher flexibility, an electronic apparatus and an acoustic apparatus employing the cooling device, and a method for producing the cooling device. The cooling device is provided with an evaporator that is capable of cooling an object to be cooled, and a condenser that is capable of releasing to the outside heat that has been absorbed during the cooling by the evaporator. A vapor-phase conduit and a liquid-phase conduit, both of which are made of fluorocarbon resin and through which an operating medium flows, are disposed between and coupled to the evaporator and the condenser, thereby circulating the operating medium.

Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Abstract: A radiation apparatus for dispersing heat energy generated by a heat-generating element includes a first and a second board chambers, a condenser tube, an evaporation tube and working fluid. The condenser tube and the evaporation tube have respectively two ends located on the first and the second board chambers. The first and second board chambers, condenser tube and evaporation tube jointly form a closed space to contain the working fluid. The working fluid in the evaporation tube absorbs heat energy from the heat-generating element and vaporizes to flow through the first board chamber to the condenser tube. In the condenser tube, the heat energy previously absorbed in vaporized working fluid is dispersed and the working fluid is condensed to become liquid flowing through the second board chamber to the evaporation tube to proceed another heat dissipation cycle. Thus heat dissipation efficiency may increase in the limited space of the server.

Abstract: A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.

Abstract: A heat dissipating apparatus (10) includes a heat pipe (20) and a heat sink (30). The heat sink is made by die-casting, and includes a chassis (32) and a plurality of fins (34) extending upwardly from the chassis. The heat pipe is U-shaped, and is embedded in the heat sink in intimate contact with the chassis and the fins. The heat pipe includes a first end (12) and a second end (14). The first end is partially embedded in the chassis of the heat sink, for transfer of heat from the chassis to the first end by way of vaporization of working medium in the heat pipe. The second end is embedded in upper portions of the fins, for transfer of heat from the heat pipe to the fins by way of condensation of the vaporized working medium.

Abstract: A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).

Abstract: A heat pipe includes a tubular body, a heat transfer fluid, and a heat sink member. The tubular body has opposite bottom and top ends, a peripheral wall between the bottom and top ends, and an inner chamber defined by the bottom and top ends and the peripheral wall for receiving the fluid therewithin. The heat sink member has a bottom face adapted to contact a heat source, and a top face indented downwardly to define a fluid accumulating portion. The fluid in the fluid accumulating portion absorbs heat from the heat source and vaporizes to carry heat away from the heat source.

Abstract: A cooling system and method, and a cooled electronics assembly are provided employing a thermal spreader having an inner chamber evacuated and partially filled with a liquid. A phase separator is disposed within the thermal spreader to at least partially divide the inner chamber into a boiling section and a condensing section, while allowing vapor and liquid to circulate between the sections. A heat extraction assembly is disposed at least partially within the inner chamber to extract heat therefrom. When the thermal spreader is coupled to a heat generating component with the boiling section disposed adjacent thereto, liquid within the thermal spreader boils in the boiling section, producing vapor which flows upward from the boiling section and causes liquid to flow into the boiling section from the condensing section, thereby providing circulatory flow between the sections and facilitating removal of heat from the heat generating component.

Abstract: A microcooling device is provided. The microcooling device includes a substrate, a microchannel array, and a condenser. A predetermined region of a lower surface of the substrate contacts a heat source. The microchannel array is placed on the substrate so that a coolant concentrating portion is opposite to the predetermined region of the lower surface. The condenser fixes the microchannel array, condenses vapor generated in a process of cooling the heat source, and allows the condensed vapor to flow into the microchannel array.

Abstract: A boiling cooler has a heat exchange part in which refrigerant vapor performs heat exchange with cooling water. The refrigerant vapor is produced from liquid refrigerant that is boiled and gasified by heat transferred from a heating element. In this boiling cooler, the refrigerant vapor can be cooled by cooling water having a thermal conductivity larger than that of air.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.

Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.