Abstract: A cooling system for use in conjunction with electronic devices (such as a computer) is disclosed. The cooling system is composed of several segments that comprise a continuous thermal path from the heat producing electronic component to a primary fluid circuit. The system transfers the heat to a secondary fluid circuit. The primary circuit is sealed and allows the transfer of heat to the secondary circuit without the requirements of the secondary fluid being directly connected through hoses or other means to the electronic device.

Abstract: A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick.

Abstract: A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the condenser to the semiconductor die.

Abstract: A low-cost, fan assisting cooling device is disclosed and includes a heat mass, a thermal core, a vapor chamber, and a phase change liquid sealed in the vapor chamber at a low pressure. Waste heat in the thermal core boils the phase change liquid and converts it into a vapor that rises to contact surfaces of the vapor chamber where it is cooled down and converted back into the phase change liquid. A plurality of vanes and fins are connected with the heat mass and an air flow over the vanes and fins dissipates heat from the heat mass. Consequently, the heat mass is convection cooled by the air flow and evaporatively cooled by the boiling of the phase change liquid.

Abstract: A bubble cycling heat exchanger is disclosed. A closed fluid loop is in contact with a heat absorbing source through a heat conducting block; the loop has a bubble generator, an expanding area for generating bubbles is installed at loop; the loop is also formed with a guide region from which bubbles is easily separable and a radiator; a heat conducting block of the closed loop is connected to a heat absorbing source; since the overheat of the heat absorbing source will cause the loop to generate bubble; by an unequilibrium formed at the guide region of the loop, the bubbles will separate from the heat absorbing source so that the liquid in the loop flows for transferring heat so that heat is radiated by the fins or other elements of the radiator from the primary element of a computer at the heat absorbing source, the loop operates continuously until a heat equilibrium is achieved.

Abstract: A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.

Abstract: A tabular heat pipe structure with support bodies has a housing, working fluid received in the housing and support bodies. The top and bottom faces of the support bodies are zigzag faces having a plurality of contact points. The support bodies use these contact points to adhere to the housing by means of welding. The tabular heat pipe structure is uniform and intact, has a high rigidity, will not cave in and deform due to back pressure in the heat pipe, and will not let the housing separate from the support bodies because of expansion at high temperatures. Therefore, the tabular heat pipe structure has the advantages like a better heat-conducting characteristic, a smaller contact heat resistance, a simple processing procedure, a quick manufacturing speed, a lower cost, and a simple and stable operation of flat adhesion.

Abstract: Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/electrokinetic pump cooling systems utilize active cooling technology to reduce thermal gradients and operating temperature of a microelectronic die. This system disclosed here will enhance heat dissipation and provide immediate cooling of localized hot spots within the microelectronic die. This will have the effect of reducing the microelectronic die temperature or spreading the heat internally within the microelectronic die depending on the layout of the microchannels.

Abstract: A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.

Abstract: Optical systems for cooling optoelectronic elements are provided. A representative optical system includes a substrate and a first optoelectronic element supported by the substrate. Additionally, a first channel is formed in the substrate and a first heat transfer fluid is arranged in the first channel. The first heat transfer fluid is thermally coupled with the first optoelectronic element so that at least a quantity of heat produced by the first optoelectronic element is dissipated by the first heat transfer fluid. Methods and other systems also are provided.

Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: A semiconductor device is disclosed in which no protruding portion is required and an occurrence of parasitic capacitance is prevented. The semiconductor device includes a substrate 1 which has a wiring portion 5 and a semiconductor chip 2 which has a functional surface 2a in a front surface thereof and which is bonded by flip chip bonding onto said substrate through a holding member. The holding member which holds the semiconductor chip 2 and the substrate 1 is composed of an adhesive material 3 in one embodiment, and the adhesive material adheres the substrate 1 on at least one surface other than both of the front surface and an opposing surface thereof and it is arranged for the adhesive material not to enter a space between the substrate 1 and the semiconductor device 2.

Abstract: A heat dissipation apparatus for circuit boards includes a heat transfer plate, at least one heat transfer tube located on the heat transfer plate, a first radiator located on the heat transfer plate, a shell mounted onto the heat transfer plate, an airflow generator located in the shell, at least one latch member latching on the heat transfer plate, and a filter located on the shell. The heat dissipation apparatus is mounted onto a circuit board (such as, but not limited to, interface card, processor circuit board) for discharging heat generated by various elements to ensure stable operations of the elements.

Abstract: A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.

Abstract: A liquid cooled electronic device and a method for sealing a liquid cooled electronic device are disclosed. The liquid cooled electronic device has at least one heat generating electronic device suspended in an electrically insulative heat transfer fluid. The heat generating device or devices are electrically connected to at least two electrodes, which pass through and are sealed in electrically insulating portion of a sealed housing that encloses the electrically insulative heat transfer fluid. At least one thermally conductive surface is in direct contact with the electrically insulative heat transfer fluid, and at least one thermally conductive surface is sealed to the remainder of the housing, for example.

Abstract: In the intermediate plates (22 to 24) between five other plates (21 to 25), a coolant flow path consisting of openings (231, 241) for delivering vaporized coolant from a boiling area (61) to tubes (3a) and a communication path (242) for delivering the condensed liquid coolant, a communication hole (232), a peripheral flow path (221) and a linear flow path (222) are formed. The liquid coolant flow path is longer than the vaporized coolant flow path and is connected to the boiling area (61) solely from below.

Abstract: A heat dissipation device is mounted to an edge of a circuit board for removing heat from an electronic device mounted on the circuit board. The heat dissipation device includes a contact pad made of thermally conductive material and positioned on the electronic device. A top-and-bottom fan structure includes a casing defining an air passage in fluid communication with a front opening to which a heat sink is mounted and top and bottom openings to which top and bottom fans are respectively mounted. Heat pipes extend between the contact pad and the heat sink. Air is sucked into the casing by the fans and flows through the air passage to the heat sink for carrying heat away from the heat sink. The casing is mounted to an edge of the circuit board with the top and bottom fans respectively located above and below the circuit board. Side openings are defined in the casing for discharging air into upper and lower sides of the circuit board for simultaneously cooling the upper and lower sides of the circuit board.

Abstract: In a device and method for dissipating heat, a heat fin unit includes a stack of fin plates, each of which has an inner periphery provided with an annular spacer. The annular spacers of the fin plates cooperatively form a heat transfer pipe that contains a heat transfer medium, and that has an upper portion closed by a cover, a lower portion mounted on a heat transfer member disposed on a heat-generating source, and an inner pipe surface having a capillary unit formed therein.

Abstract: Among four plate 21 to 24 that make up a refrigerant container, an intermediate plate 22 in contact with a heat receiving plate 21 is so provided with semi-annular peripheral channels 221 that they surround a boiling area of a refrigerant and, at the same time, is provided with straight channels 222 extending from the peripheral channels 221 to the boiling area over substantially all around the circumference of the peripheral channels 221. According to this structure, even if the refrigerant container is used in a tilted position, a liquid refrigerant that has condensed completely is supplied to the boiling area through the straight channels 222 provided on the floor within the refrigerant container, after being stored in the lowest position of the refrigerant container through the peripheral channels 221 provided on the floor within the refrigerant container.

Abstract: It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature burn, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.

Abstract: A first intermediate plate 5C adjacent to a heat receiving plate 5A and a second intermediate plate 5D adjacent to the first intermediate plate 5C are provided so that the slit width of the openings (first opening 5a) in the first intermediate plate 5C is wider than that (second opening 5b) in the second intermediate plate 5D. In this way, when the first intermediate plate 5C and the second intermediate 5D are stacked, a tunnel structure is formed in which the opening dimension L3 (the opening dimension of the second openings 5b) of the communicating sections through which the first openings 5a and the second openings 5b communicate with each other is smaller than the length L2 (the opening dimension of the first openings 5a) of the tunnel portions (L2>L3). Therefore, a heat-generating member with large density of heat generation can be effectively cooled.

Abstract: A heat dissipating apparatus for use with an interface card including a display card or other add-on card has a heat sink, a heat pipe located on the heat sink and an airflow generator located on the hear sink. The apparatus can discharge heat generated by the interface card to the outside of the computer casing so that heat is not trapped inside the computer casing thereby achieving effective heat dissipation.

Abstract: A flexible heat pipe mainly has a heat pipe disposed between an electronic heat generating component and a heat sink; the middle segment of the said heat pipe is a flexible hose with a capillary structure disposed on the inner tube wall and connects with metal tubes at two ends by means of lashing rings; a flexible heat pipe formed accordingly can be adjusted toward any direction, placed over various parts inside a computer and respectively assembled to the electronic heat generating component as well as the heat sink which is to be mounted in any proper and ventilating area for evenly and rapidly diffusing the heat so as to achieve the effect of space utilization and best heat dissipation.

Abstract: Tubes 3 are provided substantially upright on an upper surface of a refrigerant container 2 by inserting lower end portions thereof into inserting holes 5 of the refrigerant container 2. The tube 3A, differed from the tubes 3B, has a trumpet shape which is suddenly increased in its passage cross section towards the lower end opening portion. Thus, most of refrigerant vapor boiled and evaporated in the refrigerant container 2 can be collectively introduced into the tube 3A located within the boiling area. The refrigerant vapor entered a header tank 4 from the tube 3A is diffused in the header tank 4, and is introduced into the tubes 3B located out of the boiling area. The condensate produced by cooling the refrigerant vapor upon passing through the tubes 3B can be circulated into the refrigerant container 2.

Abstract: The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.

Abstract: A cooling device having a high cooling efficiency in a miniature size that is neither influenced by gravity nor restricted in its position of installation. The device exchanges, transports and dissipates heat generated by a heat source. The device includes a coolant storing part for storing liquid coolant, a heat absorbing part including at least one micro channel, the heat absorbing part is closely positioned to the heat generating source and connected to the coolant storing part. The liquid coolant is partly filled in the micro channel by surface tension and vaporized to become a gaseous coolant in the micro channel when heat is absorbed from the heat generating source. The device includes a heat insulating part positioned adjacent to the heat absorbing part to prevent the heat absorbed by the heat absorbing part from transferring to other zones. The device includes a condensing part for condensing the gaseous coolant. The condensing part is positioned apart from the heat absorbing part.

Abstract: A heat transferring device having an adiabatic unit is provided. The heat transferring device includes a lower plate including an evaporator which contacts a heating element and allows a liquid refrigerant to absorb heat transferred from the heating element to thus evaporate, a condenser in which gas flowing from the evaporator is condensed, a gas passage through which the gas flowing from the evaporator into condenser, a liquid refrigerant passage through which the liquid refrigerant flows from the condenser into the evaporator and which includes a portion used as a channel region bordering the evaporator, and an adiabatic unit provided between the liquid refrigerant passage and the gas passage so that elements hindering the flow of the liquid refrigerant can be prevented from being introduced from the gas passage into the liquid refrigerant passage; and an upper plate which contacts some members of the lower plate including the adiabatic unit.

Abstract: A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.

Abstract: A double heat exchange module for a portable computer, which is applied to cool an integrated circuit within the portable computer. The double heat exchange module includes a thermally conductive structure, a fan, and a heat exchanger. The thermally conductive structure is coupled with the integrated circuit, for conducting heat from the integrated circuit. The fan facilitates airflow from the air inlet to the air outlet. The heat exchanger disposed at the fan and coupled with the thermal conductive structure is used for double heat transfer and includes an inflow portion located at the air inlet and an outflow portion located at the air outlet.

Abstract: A circuit type modularized heat exchanger system comprises a heat exchange unit and a vapor chamber. The vapor chamber is jointed to the bottom of the heat exchange unit. The vapor chamber has a hollow space with a wick layer and the hollow space communicates with the tube tubes of the heat exchange unit so as to form a circuit. The heat exchanger system provides the advantages such as a better efficiency of heat transfer, less component parts and easy assembly and manufacture.

Abstract: In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.

Abstract: The performance of a heat pipe system is greatly improved by the use of a dilute aqueous solution of about 0.0005 and about 0.005 moles per liter of a long chain alcohol as the working fluid. The surface tension-temperature gradient of the long-chain alcohol solutions turns positive as the temperature exceeds a certain value, for example about 40° C. for n-heptanol solutions. Consequently, the Marangoni effect does not impede, but rather aids in bubble departure from the heating surface. Thus, the bubble size at departure is substantially reduced at higher frequencies and, therefore, increases the boiling limit of heat pipes. This feature is useful in microgravity conditions. In addition to microgravity applications, the heat pipe system may be used for commercial, residential and vehicular air conditioning systems, micro heat pipes for electronic devices, refrigeration and heat exchangers, and chemistry and cryogenics.

Abstract: An apparatus for cooling electronic components disposed in a sealed container in a phase change electronic cooling system includes a hood disposed in the container adjacent the electronic components. The electronic components and the hood are immersed in a nonconductive liquid that partially fills the container when the container is in a predetermined location relative to the ground. The apparatus also includes at least one cooling tube having one end connected to the hood and an opposite end disposed adjacent a portion of the electronic components whereby during operation the electronic components transfer heat to the liquid, causing the liquid below the hood to vaporize forming bubbles, the bubbles traveling through the at least one tube and carrying an entrained portion of the liquid to said opposite end.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.

Abstract: An elongate tubular refrigerant container 2 has a barrier 5 which partitions its internal space into a heat-generating member side path 2b and a heat radiating path 2c, so that refrigerant vapor evaporated by the heat-generating member 3 is separated from the condensate that circulates after being cooled in the heat radiating section 4. The barrier 5 includes a heat insulating space 5a which does not communicate with the internal space 2a that stores a refrigerant. The refrigerant is prevented from boiling in the heat radiating section side path 2c and the condensate that circulates from the heat radiating section 4 and the refrigerant vapor do not collide violently with each other because the heat of the refrigerant vapor in the heat-generating member side path 2b is prevented from being transferred to the liquid refrigerant in the heat radiating section side path 2c.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.

Abstract: A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover. The system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.

Abstract: In a cooling device for cooling a heat-generating member, a refrigerant tank includes a heat-receiving wall onto which the heat-generating member is attached in an attachment area, and a radiation wall opposite to the heat-receiving wall. A main wick is provided on an approximate entire inner surface of the heat-receiving wall, and an auxiliary wick is arranged opposite to at least a middle portion of an inner surface of the radiation wall within the attachment area. Condensation fins are provided to protrude from an inner surface of the radiation wall, and are separately arranged on both sides of the auxiliary wick. In the cooling device, the auxiliary wick is connected to the main wick and condensation fins.

Abstract: By construction of heat pipes with two phase heat carrying fluid, an efficient heat transfer system is available. The heating section is used to create, within the heat pipe, build up of vapor pressure which causes the heat carrying fluid to move which then allows for dissipations of the heat into the cooling section. Additions to the system allow for storage of kinetic energy to enhance or regulate the flow, and by introduction of heating elements or porous surfaces, the mechanic can be improved or regulated.

Abstract: An apparatus for cooling electronic components disposed in a sealed container in a phase change electronic cooling system includes a hood disposed in the container adjacent the electronic components. The electronic components and the hood are immersed in a nonconductive liquid that partially fills the container when the container is in a predetermined location relative to the ground. The apparatus also includes at least one cooling tube having one end connected to the hood and an opposite end disposed adjacent a portion of the electronic components whereby during operation the electronic components transfer heat to the liquid, causing the liquid below the hood to vaporize forming bubbles, the bubbles traveling through the at least one tube and carrying an entrained portion of the liquid to said opposite end.

Abstract: A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.

Abstract: Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical heat pipes to transfer heat both horizontally and vertically in the heat sinks. Selection of the number of heat pipes used allows tailoring of the heat sink capabilities for different applications using the same fundamental assemblage of parts. Various embodiments are disclosed.

Abstract: An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing coolant from the condenser and collecting a uncondensed gas contained in the in-flowing coolant in an upper space, a cooling part for cooling the heating body through vaporization of the coolant, and superstructure and substructure combined with each other, for defining a channel region in which the coolant flows from the coolant storing part to the cooling part by a capillary action. In this case, the substructure includes a first substructure used as a substrate and a second substructure formed along a border of the substrate, or includes first through third segments equal to the first and second substructures.

Abstract: A composite heat dissipation assembly having a net shape injection molded thermally conductive elastomeric heat sink and at least one integral heat pipe is provided in the present invention. The molded conformable heat sink is formed from a base elastomeric material that is loaded with thermally conductive filler. The base material is mixed with the filler and net shape molded to form the outer geometry of the assembly. Within the geometry of the part an integral channel is formed that is capable of receiving a heat pipe. The channel is formed to have an opening that is slightly smaller than the outer cross-sectional dimensions of the heat pipe. When the heat pipe is pressed into the channel a portion of the elastomeric material is compressed and the reactionary force of the compressed material firmly presses the elastomer into thermal communication with the outer surface of the heat pipe.

Abstract: A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.

Abstract: A refrigeration system for cooling a logic module includes an evaporator housing including an evaporator block in thermal communication with the logic module. The evaporator housing includes a humidity sensor for detecting a humidity within the evaporator housing. The system further comprises a controller for controlling a refrigeration unit supplying cold refrigerant to the evaporator block in response to the operating conditions of the logic module and the temperature of the evaporator block. In another aspect of the invention, two modular refrigeration units are independently operable to cool the evaporator block, and each refrigeration unit is controllable in various modes of operation including an enabled mode in which it is ready to cool the evaporator and an on mode in which it is actively cooling the evaporator. In another aspect of the invention, the evaporator block and a heater on a reverse side of the circuit board are particularly controlled during concurrent repair operations.

Abstract: A cooling apparatus for an electronic module, to enhance air cooling of electronic devices using a closed loop, phase change fluid heat transfer mechanism to transfer thermal energy from electronic devices to air cooled fins. The evaporator includes a surface for making thermal contact with an electronic module to be cooled. The boiling chamber is disposed within the evaporator, and includes a plurality of fluid inlet ports disposed near one end, and a plurality of fluid outlet ports disposed near an opposite end. The condenser includes a plurality of tubes and a plurality of thermally conductive fins. Each tube is in fluid flow communication with one fluid inlet port and one fluid outlet port, forming a fluid flow path. Each fin is in thermal contact with one or more tubes. A check valve is disposed within each fluid flow path proximate an inlet port.

Abstract: A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.