Abstract: An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.

Abstract: A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.

Abstract: An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

Abstract: A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spreader is fit tightly into the opening. The second lower surface and the first lower surface are coplanar. A thickness of the second heat spreader is smaller than that of the first heat spreader. A chip is located on the second upper surface. A substrate is located on the first upper surface of the first heat spreader, and the opening is exposed by the substrate.

Abstract: A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom panel delimit a hollow volume partly filled with a cooling liquid and containing a thermally conductive permeable material providing a thermal bridge between the two walls.

Abstract: An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: A phase change heat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.

Abstract: A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing through channels which are formed therein. The wiring board of each semiconductor module is provided with sockets having I/O pins and concavities. Electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module. The channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals.

Abstract: The invention is a method for increasing the capacity of an electrical component, such as a bus bar, to carry an electrical current. The method comprises the step of exposing the electrical component to an evaporative fluid that is in fluid and thermal contact with the electrical component. Upon heating, fluid undergoes a phase change at least partially to a vapor state. Thus, electrical energy in the form of heat generated by the flow of current is dissipated at least partially by the evaporative fluid. As a result, the temperature of the electrical component is maintained within an acceptable range when carrying the electrical current.

Abstract: A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. Also, the evaporator includes an auxiliary capillarity generator having a plurality of pins extending towards the center of the vaporization cavity region between the top plate and the substrate. The evaporator can be implemented as a small cooling device for performing cooling without external power.

Abstract: A package with high heat dissipation, comprising a carrier and a chip located thereon, with electric connection between the chip to the carrier. A molding compound is used to encapsulate the chip, part of the carrier, and the connection between the chip and the carrier. A heat pipe is provided such that one end thereof is embedded in the molding compound, is close to the active surface of the chip and is substantially normal to the chip, and the other end thereof is extended outside of the molding compound.

Abstract: A vacuum feedthrough heatpipe assembly includes a heatpipe having an inner end coupled to a heat generating device within a vacuum chamber, and an outer end disposed externally of the vacuum chamber. A vacuum flange seals the heatpipe to an opening in the chamber wall. The invention also includes an articulated arm assembly, each arm being a sealed heat pipe, the arms joined by angularly adjustable elbow joints. The heatpipe may comprise an electrically insulating construction formed of quartz or ceramic tube.

Abstract: The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.

Abstract: An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.

Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.

Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

Abstract: A boiling and cooling apparatus is provided which has a refrigerant tank for maintaining a liquid refrigerant for boiling when it receives heat from a heating body, a radiator which receives refrigerant vapor boiled in the refrigerant tank. The radiator cools refrigerant vapor to form the liquid refrigerant by exchanging heat with an external fluid. The radiator includes a first passage for receiving the refrigerant vapor and a second passage for returning condensed liquid to the refrigerant tank. The radiator has an upper space which provides communication between the first passage and the second passage, whereby the refrigerant vapor is guided to flow preferentially into the first passage.

Abstract: A heat transfer system includes a wick, a vacuum pump and a heat exchanger. The wick receives a condensed liquid. The wick receives heat from a heat source. The vacuum pump reduces pressure in the wick while turned on, so that at least a portion of the liquid evaporates within the wick to form a vapor that is pumped by the pump. The heat exchanger is coupled to receive the vapor from the pump. The heat exchanger rejects heat to form the condensed liquid from the vapor. The heat exchanger returns the condensed liquid to the wick.

Abstract: A heatsink device includes a plurality of heatsink plates (1, 4, 5, 6) each made of heat conductive material. Each of the heatsink plates (1, 4, 5, 6) is formed with at least one through hole (11, 41, 51, 61). A periphery of the through hole (11, 41, 51, 61) is formed by an annular wall (12, 52) or sidewalls 62 which defining a opening(13, 53, 63). A heat conductive post (2, 7) formed as a rod and made of heat conductive material, the heat conductive post (2, 7) is forced to fittingly insert into the through hole (11, 41, 51, 61), so that the heat conductive post (2, 7) may be combined with the heatsink plates (1, 4, 5, 6) more rigidly and stably.

Abstract: A hollow evaporator is disposed in contact with the upper surface of the CPU. Heat from the CPU is absorbed by the evaporation of the refrigerant. The vaporized refrigerant ascends through the vapor flow channel by convection, flows into a condenser located above the evaporator, and radiates heat to be liquefied. The liquefied refrigerant flows down by its own weight through the liquid flow channel and returns to the evaporator. This circulation is repeated in this manner.

Abstract: A heat dissipating assembly (1) includes a pair of concertinaed heat pipes (10), a plurality of fins (20), a shell (30), a heat-conductive block (40) and a fan (50). The fins are spaced and stacked one above the other. A plurality of channels (22) is defined through opposite sides of the fins, for insertion of the heat pipes thereinto. The shell includes a frame (32) and a cover (34) mounted to a top side of the frame, thereby defining a space for accommodating the fins and the heat pipes therein. A plurality of openings (362, 342) is defined in a bottom plate (36) of the frame and in the cover, for extension of bottommost and topmost portions of the heat pipes therethrough. A horizontal end portion (12) of each heat pipe extends over the cover and engages with the block. The fan is mounted to one end of the shell.

Abstract: A transpiration cooled heat sink, a self contained coolant supply and a method of using a transpiration cooled heat sink and a self contained coolant supply is provided and includes a heat sink base structure, the heat sink base structure having a coolant inlet for receiving a coolant and a coolant outlet for distributing a coolant, wherein the heat sink base structure defines at least one coolant channel disposed so as to be communicated with the coolant inlet and the coolant outlet and a coolant distribution structure, wherein the coolant distribution structure defines at least one distribution cavity and includes at least one distribution inlet communicated with the distribution cavity and wherein the coolant distribution structure is disposed relative to the heat sink base structure such that the distribution inlet is communicated with the coolant outlet.

Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.

Abstract: A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.

Abstract: An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

Abstract: The invention introduces a two part wick for use in the evaporator of a two phase loop (LHP/CPL). The primary wick controls evaporation from the primary heat input area. The secondary or “distribution” wick separates the liquid and vapor volumes of the evaporator and feeds liquid to the primary wick. The secondary wick allows the primary wick to be configured so heat enters from the liquid side of the wick, this constitutes a non-inverted meniscus evaporator which can tolerate high heat fluxes without restricting vapor flow. The secondary wick is removed from the primary heat flow path lends itself to fabrication in small dimensions compatible with direct cooling of electronic devices.

Abstract: A cooling system for various electronic packages used in electronic equipment such as electronic computers, work stations, word processors, etc. and, particularly, a cooling system capable of efficiently cooling various electronic packages and, particularly, highly dense electronic packages used in electronic equipment without greatly limiting the freedom for designing the electronic equipment as a whole. The cooling system includes a heat radiator (40, 40′, 40″) installed in at least one independent holding portion formed in advance in a housing (30) of the electronic equipment, a heat conducting plate element (36) provided for at least one electronic package in said housing so as to receive heat therefrom, and a heat conducting passage element (38) laid down to conduct heat from the heat conducting plate element to a heat radiator.

Abstract: The invention introduces a two part wick for use in the evaporator of a two phase loop (LHP/CPL). The primary wick controls evaporation from the primary heat input area. The secondary or “distribution” wick separates the liquid and vapor volumes of the evaporator and feeds liquid to the primary wick. The secondary wick allows the primary wick to be configured so heat enters from the liquid side of the wick, this constitutes a non-inverted meniscus evaporator which can tolerate high heat fluxes without restricting vapor flow. The secondary wick is removed from the primary heat flow path lends itself to fabrication in small dimensions compatible with direct cooling of electronic devices.

Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: A high efficiency heat sink includes a first chamber, a second chamber and at least one cooling fin. The first chamber contains coolant and absorbs heat from a heat source, vaporizing the coolant. The second chamber receives the vaporized coolant from the first chamber, transmits the heat from the vaporized coolant to the cooling fin so that the vaporized coolant is condensed, and forces the condensed coolant back to the first chamber via capillary pressure.

Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.

Abstract: A cooling unit has a vessel that is filled with a refrigerant. The vessel includes a heat receiving portion for receiving heat from a heat generating component, a heat dissipating portion for dissipating the heat from the heat generating component, and a heat transfer portion for transferring the heat transmitted to the heat receiving portion to the heat dissipating portion via a refrigerant. At least the heat receiving portion of the vessel is formed of a soft heat conduction sheet that receives the heat from the heat generating component. The heat conduction sheet is directly in contact with the heat generating component.

Abstract: A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the heat generated by the heat source. The heat is then transferred via the vapor chamber to a plurality of fins attached to the vapor chamber. If a heat sink is provided, the heat is also transferred via the vapor chamber to the heat sink. The heat sink can also include a plurality of fins. The fins and the heat sink then convectively dissipate the heat to the atmosphere.

Abstract: A heat dissipater has a heat conductive device. The heat conductive device has a cavity therein. The cavity is filled with heat transfer medium. A plurality of heat transfer elements are installed in the heat conductive device. The heat conductive device is made of material with good conductivity, such as aluminum or copper. The heat transfer medium is a liquid in a normal temperature, such as paraffin, water, alcohol or mercury. The heat transfer medium is in contact with the heat source, the heat will be transferred to the heat transfer element of the heat conductive device so as to have the effect of heat conduction and dissipating.

Abstract: A compact, lightweight, and efficient evaporative spray cooling system is provided for removing high heat fluxes from surfaces of devices such as micro-electronic chips, metal, mirrors, and lasers. The system uses expanding metastable two-phase flow and a method of controlling the spray for optimum heat flux removal. Control includes spray atomization, fluid-phase, mass flow, and spray temperature.

Abstract: A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled.

Abstract: A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

Abstract: A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.

Abstract: An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing coolant from the condenser and collecting a uncondensed gas contained in the in-flowing coolant in an upper space, a cooling part for cooling the heating body through vaporization of the coolant, and superstructure and substructure combined with each other, for defining a channel region in which the coolant flows from the coolant storing part to the cooling part by a capillary action. In this case, the substructure includes a first substructure used as a substrate and a second substructure formed along a border of the substrate, or includes first through third segments equal to the first and second substructures.

Abstract: The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.

Abstract: A heat dissipater for a CPU (Central Processing Unit) includes an upper block and a lower block abutting each other. The upper block has a series of fins extending upward from a first side of the upper block and a recess defined in a second side of the upper block. The lower block includes a first side having a recess defined to correspond to the recess in the upper block and forming a closed chamber with the recess in the upper block and a second side adapted to abut the CPU. Volatile liquid is received in the closed chamber to promote the heat dissipation of the heat dissipater for a CPU.

Abstract: A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member.

Abstract: An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element generates more heat than the second element. A cooling device includes a heat conductive plate to which heat is transferred from the first element and radiation fins mounted on the heat conductive plate. The radiation fins extend toward the second element, so that at least part of heat transferred from the first element is radiated in the neighborhood of the second element. Even in the case where the electronic part is arranged in a limited space, the cooling efficiency of the electronic part can be improved by alleviating the difference in heat generation density between the neighborhood of the first element and the neighborhood of the second element.

Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.