Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.

Abstract: A structure of a holding mechanism with a rotatable bidirectional knob suitable for securing a radiator is disclosed. The holding mechanism comprises a pressure-bearing unit, a buckling element and an operation assembly. The buckling element and the pressure-bearing unit have a positioning opening respectively. The pressure-bearing unit provides a slot for being penetrated with the buckling element. The operation assembly is pivotally positioned on the buckling element and comprises a bidirectional knob and a protrusion member. The protrusion member presses against the pressure-bearing unit while the bidirectional knob being turned. The buckling element is movably disposed at and of the pressure-bearing unit to effectively secure the radiator in place.

Abstract: An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base. The extendable heat dissipation member can be extendable to an extending location and can also be stored in a storing location with respect to the base.

Abstract: A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a) and a lower section (22b). The upper section (22a) has a head (222) thereon, and the lower section (22a) has a clamping portion (224) and an abutting portion (226) which is located between the head (222) and the clamping portion (224) and is in the form of an annular flange extending radially outwardly from an outer surface of the pin (22). A plurality of slots (22c) are defined through the clamping portion (224) and the lower section (22b) of the pin. The abutting portion (226) engages with a bottom surface of a heat sink (10) before the clip (20) secures the heat sink assembly (100) to a circuit board (40).

Abstract: A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

Abstract: A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider pins secured in one of the holes in the elastomeric base. The alignment frame supporting and aligning the slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base. A method of assembling a heat spreader is also described.

Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

Abstract: Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.

Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

Abstract: A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least one first channel (18) is defined in the top surface. The fin assembly has a first bottom surface (32). At least one second channel (38) is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion (324) is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.

Abstract: A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securing an electronic device. Rotating an electronic device on the heat sink secures the electronic device in a friction fit with the resilient mounting flanges. Multiple electronic devices may be mounted to the heat sink, either manually or through an automated process.

Abstract: A plasma display device includes: a Plasma Display Panel(PDP); a chassis base adapted to support the PDP attached to one surface thereof, a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of the chassis base and adapted to control the PDP; and a reinforcing member arranged on the chassis base, one surface of each of the IC modules being in contact with the reinforcing member. The integrated circuit module is attached to the reinforcing member which reinforces the mechanical strength of the chassis base, so that a heat sink is not needed. The thickness of a plasma display device is thereby reduced and the appearance of the plasma display device is improved.

Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

Abstract: A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

Abstract: A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the top plate of the support part, pressing against the heat plate, such that the heat plate and the heating element are tightly attached to each other, thereby achieving good heat conductive integration.

Abstract: A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and extends a pair of clamping arms in the cutouts of the heat sink. Each clamping arm defines a slit. A clip includes two abutting portions rotatablely connecting with the pads and the clamping arms, and two pressing portions slidably received in the slots of the pads and the slits of the clamping arms. When the clip is moved to a locked position, the pressing portions of the clip press the pads downwardly a distance relative to the clamping arms so that the heat sink can have an intimate contact with an electronic device.

Abstract: A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the fins and the fan. The retention assembly includes four pegs each having a first end locked in the base of the heat sink and a second end, a back plate secured beneath the add-on card and two wire clips. The second ends of the pegs extend through the base, the add-on card and the back plate in turn and are held in position by the wire clips beneath the back plate, whereby the heat sink and the back plate are secured to opposite sides of the add-on card.

Abstract: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes a main body (23) and a pair of legs (25). The main body includes a retaining portion (230) and a first pressing portion (232). The main body is received in the receiving groove and the first pressing portion is accommodated in the positioning slot. The retaining portion is offset from the first pressing portion. The legs can be pressed to securely connect with a printed circuit board (3), whereby the heat sink can have an intimate contact with a CPU (4).

Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

Abstract: A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

Abstract: The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

Abstract: A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In the mounted position, the heat sink is held in thermal communication with the component directly or through a thermally conductive material.

Abstract: A semiconductor package assembly is presented. The assembly comprises a first chip and a second chip. The back surfaces of the first and the second chips are thermally attached through a die attach material. The front surface of the first chip is attached to a substrate through bumps. A heat spreader extends from a surface of the semiconductor package assembly into the semiconductor package assembly and thermally attaches to the back surface of the first chip or the front surface of the second chip. Depending on the sizes of the chips and the location of the bonding pads, the heat spreader may be attached to the back surface of the first chip or the front surface of the second chip.

Abstract: An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer.

Abstract: A printer apparatus is disclosed. The printer apparatus includes a heat dissipation plate structure including a thermally conductive material, and a processor comprising a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor. An array of pins is substantially perpendicular to the major surface of the processor. The apparatus also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly. The apparatus also includes a memory for storing print image data, the memory being operatively coupled to the processor. It also includes a printing unit operatively coupled to the memory for printing on paper.

Abstract: A fastener for mounting a heat dissipation module on a central processing unit, includes a shank having opposite upper and lower ends and a head at the upper end of the shank. The shank includes a first portion located between the upper and lower ends, and adapted to engage, by snap engagement, with a fastener retaining portion of the heat dissipation module. The shank also includes a second portion located at the lower end and adapted to engage with a matching mounting element of a base, thereby fastening the central processing unit between the base and the heat dissipation module.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the receptacle cavity. The heat sink may have a groove in which the gasket is mounted and upon mounting the heat sink to the receptacle, the gasket surrounds the opening in the receptacle and provides a resilient shield to maintain a seal during movement of the heat sink due to insertion of the electronic module within the receptacle.

Abstract: A fixing device for a radiator provides a joining side projecting outward from a lateral side of each of the elastic strip members and has an engaging part at two inclining ends of the respective elastic strip member. The respective joining side is inserted into a locating groove at two lateral sides of the heat sink block of the radiator and the respective engaging part is fixedly attached to the circuit board by means of a fastening element.

Abstract: A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compressive force. The first thermal element is held in contact with a portion of the first lead by a compressive force such that the first thermal element is capable of removing heat from the first lead and from the die. The second lead is held in contact with the second surface of the die by a compressive force. The second thermal element is held in contact with a portion of the second lead by a compressive force such that the second thermal element is capable of removing heat from the second lead and from the die.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

Abstract: The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.

Abstract: A locking device is for locking a heat sink to an electronic device. The locking device includes a retaining frame and a guiding member positioned on the retaining frame. The guiding member includes a seat having a base sitting on the retaining frame, a sleeve extending upwardly from the seat, and two spaced legs descending from the base of the seat to retain the guiding member to the retaining frame. A fastener is accommodated in the sleeve of the guiding member and is kept vertical to the retaining frame by the guiding member.

Abstract: The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.

Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.

Abstract: A dispensing device is described that comprises a base, a chip attaching member which is provided movably with respect to the base and to which a dispensing chip is attached removably, a first elastic member for suppressing a movement of the chip attaching member with respect to the base, a second elastic member serving to suppress the movement of the chip attaching member with respect to the base and having a greater elastic constant than an elastic constant of the first elastic member and a detector for detecting that the chip attaching member is moved with respect to the base. An analyzing apparatus is also described.

Abstract: A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.

Abstract: A captive shoulder nut assembly, to hold a heat sink onto a PC board, has a nut member with a threaded portion and a tubular portion extending therefrom. The nut member mates with an upstanding threaded stud. A biasing compression spring rides over the nut with an end coil loop secured to the nut. The nut's tubular portion is suitable for insertion through a straight hole in the heat sink, with the spring remaining above the hole and operating against the heat sink. The free end of the tubular portion can be flared to a larger diameter than the hole, thereby captivating it to the heat sink and permitting movement by the nut through the hole while acting against the spring force. A stop shoulder on the nut and a projecting shoulder on the stud define the length travel of the nut onto the stud and establishes a pre-load compression force on the spring. A self-centering structure included for the nut to engage the stud.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract: A locking device for securing a heat sink to a heat generating electronic device includes a retaining member attached to the heat sink and a plurality of fasteners positioned to the retaining member. The retaining member includes a frame and a plurality of fastening feet integrally formed with the frame by metal extrusion. The frame has an opening for receiving a bottom protrusion of the heat sink therein. Each fastening foot has a slot therein communicating with the opening of the frame and defines a fastening hole. The fasteners are respectively positioned in the fastening holes of the fastening feet of the retaining member.

Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

Abstract: A fixing structure for computer mainboard is provided. The mainboard is clamped between a guard board and a back board. Through the appropriate arrangement of a snap pillar of the guard board and a gourd-shaped hole of the back board, after the snap pillar penetrates the mainboard and the gourd-shaped hole, the mainboard, the guard board and the back board are snapped by moving the back board properly. Furthermore, in the snap state, a fixing pillar penetrates the mainboard and the back board, so as to fasten the two boards. Thus, the step of locking by screws in the conventional art is simplified, and the assembly or disassembly can be fulfilled without any assembling/disassembling tools.

Abstract: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

Abstract: A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in an end of each locking arm for engaging with catches (82) of a socket (80). The post has a pressing block (44) at a bottom portion and a cutout (42) at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture (13) of the horizontal portion, and the cutout pivotally receives a cam (32) at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.

Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.

Abstract: A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed in the ASIC assembly.

Abstract: An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face. The second face of the die pad is orthogonally offset from the second face of the leads so that the second face of the die pad and the second face of the leads are not coplanar. The package also comprises an integrated circuit chip substantially laterally disposed between the plurality of leads, and having a first face and a second face opposite to the first face. The first face of the integrated circuit chip is proximate to the second face of the die pad and the first face of the integrated circuit chip is coupled to the second face of the die pad. The package further comprises a plurality of wires that link the plurality of leads to the integrated circuit chip.

Abstract: An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat sink such that the LED die has a fixed relationship to the heat sink. Accordingly, the reference datum feature provides a frame of reference to the position of the LED die within the LED package. The reference datum feature may be mounted to the heat sink or integrally formed from the heat sink. A pick-and-place head holds the LED package by engaging the datum reference feature, e.g., with an alignment pin. In addition, the LED package may include a lead that extends laterally into the insulating body, and extends towards the LED die to reduce the vertical distance between the lead and the LED die.