Abstract: An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally conductive structure in mechanical contact with a first portion of the first thermally conductive film layer, and a first thermal energy extraction structure formed over the first thermally conductive structure. The first thermal energy extraction structure is in thermal contact with the first thermally conductive structure. The first thermal energy extraction structure is configured to extract a first portion of thermal energy from the first electrical component through the first thermally conductive film layer and the first thermally conductive structure.

Abstract: A heat dissipation device adapted for cooling a heat-generating electronic component includes a heat sink (30), a fan (40) mounted on the heat sink (30), a fan duct (70) mounted on the fan (40) and a clip (50) securing the fan duct (70) on the fan (40). The fan (40) is sandwiched between a top of the heat sink (30) and a bottom of the fan duct (70). The clip (70) includes an axis (51) pivotably mounted on to a bottom of the fan duct (70), a locking portion (52) extending from an end of the axis (51) and buckled with the fan duct (70), and a pressing portion (53) bent from the axis (51) and engaging with a bottom surface of the top plate (42) of the fan (40).

Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.

Abstract: A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a second metal foil laminated on a second side of the dielectric interposer. A recessed cavity is etched into the second metal foil and the dielectric interposer with a portion of the first metal foil as its bottom. A die is mounted within the recessed cavity and makes thermal contact with the first metal foil. A build-up material layer covers the second metal foil and an active surface of the die. The build-up material layer also fills the gap between the die and the dielectric interposer. At least one interconnection layer is provided on the build-up material layer and is electrically connected with a bonding pad disposed on the active surface of the die via a plated through hole.

Abstract: An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).

Abstract: A bottom loaded assembly for securing heat sinks to printed circuit boards may use a preloaded spring. The preloaded spring may be positioned on one side of the printed circuit board and the heat sink may be positioned on the opposite side.

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract: A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

Abstract: An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by the integrated circuit chip. The electronic assembly further comprises a standoff structure disposed adjacent the thermal-gap-filler pad and coupled to the support board, the standoff structure configured to prevent excessive force from being applied onto the thermal-gap-filler.

Abstract: A heat sink fixture for fixing a heat sink to a heat generating device is disclosed. The heat sink fixture at least has a suppressing section, two force-exertion sections and two fixing sections. The suppressing section is used to suppress the heat sink. The force-exertion sections are respectively bent upwards and extended away from both ends of the suppressing section. The ends of the force-exertion sections are bent and hollow. The fixing sections are respectively extended from the force-exertion sections for being fixed to the heat generating device. The heat sink fixture decreases difficulty in assembling.

Abstract: A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

Abstract: A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at least a connecting member. The first connecting portion is included in the circuit board. The second connecting portion is included in the heat sink. The connecting member is disposed on a first surface of the circuit board and includes a first connecting part and a second connecting part. The first connecting part is coupled to the first connecting portion of the circuit board and the second connecting part is coupled to the second connecting portion of the heat sink, thereby facilitating fixing the heat sink on the first surface of the circuit board.

Abstract: A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.

Abstract: A heat sink mount including a body, a first operating member, and two second operating members is provided. The body is formed with a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side and connecting the first side and the second side. One end of the first operating member is pivotally attached to the first side of the body, and the other end thereof is rotatably coupled to the second side of the body. The first operating member further includes a second positioning portion and a third positioning portion. Each of the second operating members is pivotally attached to the third side and the fourth side of the body respectively and fixed in position by the second positioning portion and the third positioning portion respectively.

Abstract: A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate and one or more thermally conductive discs attached to the primary plate. The one or more thermally conductive discs make intimate contact with the one or more ICs mounted to the printed circuit board such that the heat generated by the one or more ICs in operation transfers through the one or more discs and onto the plate, whereupon the heat laterally distributes across the primary plate and dissipates into the environment.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a fastener. The heat-conducting area includes the tip portion, which is a substantially middle portion of the heat-conducting area and is arranged substantially closest to the heat generating object among the other areas of the heat-conducting area, and the inclined surface which is a part of the heat-conducting area and inclines outwardly from the tip portion such that a distance between the inclined surface and the heat generating object gradually increases. The fastener includes an attaching portion to mount the heat dissipating device to the base, and the attaching portion is arranged substantially radially outside of an outer peripheral portion of the heat generating object. When the attaching portion is secured to the base, the tip portion of the heat-conducting area is pressed to the heat generating object.

Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A heat dissipation device includes a retention module (60), a heat sink (10), a fan bracket (50), a fan (70) mounted on the fan bracket, and a pair of wire clips (30) cooperating with the fan bracket and the retention module to secure the heat sink to a heat-generating electronic element (82). The retention module forms a pair of fixture blocks (64) at a pair of lateral sidewalls thereof. The heat sink defines grooves (160) at lateral sides thereof. Each of the clips includes an operating portion (356) fastened to the fan bracket, a central axle (33) connecting with the operating portion and a locking portion (31) connecting with the central axle. Each central axle is slidably engaged in corresponding grooves of the heat sink and the locking portions of the clips engage with the fixture blocks of the retention module.

Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

Abstract: An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Abstract: The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

Abstract: A heat sink assembly (100) which has a heat sink clip (20) is provided. The heat sink clip includes a pin (22) and a spring (24) disposed around the pin. The pin has a head (222) and a clamping portion (224) at opposite ends thereof. An abutting portion (226) in the form of an annular flange is formed between the head and the clamping portion. The spring is located between the head and the abutting portion. The pin includes an upper section (22a) and a lower section (22b) having a diameter smaller than that of the upper section. The flange extends radially outwardly from an outer surface of the lower section of the pin. The abutting portion is for engaging with a bottom surface of a heat sink (10) when the clip is mounted to the heat sink.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A method and apparatus is provided for attaching a cooling structure to the surface of an integrated circuit (IC). The attachment of the cooling structure, for example a heat sink, to the IC requires that certain pressure is applied, usually by connecting the cooling structure to a Printed Circuit Board (PCB). However, excess pressure may damage the ball grid array (BGA) that connects the IC to the PCB. Attachment of a cooling structure to the IC package substrate is provided without support from the PCB. In one embodiment, shock absorbers are also attached to the cooling structure and the PCB to prevent undesirable vibration of the heat sink mass from affecting the IC.

Abstract: A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

Abstract: A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that is mounted on the copper layer, and another electrically conducting layer which covers at least one load terminal of the power semiconductor chip. According to at least one embodiment of the invention, devices are provided for safely connecting the load terminal to a load circuit. The devices are configured such that a contact area thereof presses in a planar manner onto the electrically conducting layer.

Abstract: An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.

Abstract: An apparatus and method for manufacturing a display device substrate are provided. In one embodiment, the apparatus comprises a clamp for clamping an edge of a plastic substrate, and a tension member applying tension along a surface of the plastic substrate by interacting with the clamp to strain the plastic substrate. Advantageously, the flexible plastic substrate is substantially prevented from deflecting in a manufacturing process thereby reducing defects in the display device substrate.

Abstract: A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface material disposed in thermal conductive communication with the die and a heat spreader disposed in thermal conductive communication with the thermal interface material. A mold material is provided to enclose the die and the thermal interface material, and partially embedding the heat spreader to expose at least a surface of the heat spreader to an ambient environment. The heat spreader may include an anchor portion to reinforce coupling of the heat spreader to the mold material. If and when required, the heat spreader may be coupled in thermal communication with an external heat sink.

Abstract: A graphics card heat-dissipating device includes: a main body, a support seat, and a fixed element. The main body has a first heat-dissipating portion and a second heat-dissipating portion, and the first heat-dissipating portion has a first opening and the second heat-dissipating portion has a second opening. The support seat is used for supporting a chip, and the support seat has a third opening. The fixed element is fixed on the first heat-dissipating portion by passing through the second opening, the third opening and the first opening in sequence for attaching the chip on the first heat-dissipating portion. Therefore, the heat convection function and the heat-dissipating efficiency are increased.

Abstract: A plasma display device that diversifies heat dissipating paths of integrated circuit modules in a circuit board assembly, thereby enhancing heat dissipation of the integrated circuit modules. The plasma display device includes a plasma display panel, a chassis base on which the plasma display panel is attached and supported, integrated circuit modules that are mounted on the circuit board assembly on an opposite side of the chassis base to the plasma display panel, and heat sinks, each being attached to one side of each of the integrated circuit modules to dissipate heat therefrom. The heat sink is formed such that one end thereof extends to come in contact with the chassis base.

Abstract: A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.

Abstract: In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component disposed adjacent the top surface of the PCB, having a base portion with a plurality of legs extending therefrom; and at least one mechanism to generate a clamping force between the at least one wiffle tree and the top surface of the PCB, and between the bottom surface of the PCB and the heat sink. There is disclosed a method of attaching a printed circuit board (PCB) to a heat sink. In an embodiment, the method includes providing at least one wiffle tree component; disposing one of the at least one wiffle tree component adjacent to the PCB; and securing the one of the at least one wiffle tree component with a fastener. Other embodiments are also disclosed.

Abstract: A fixing means for a heat dissipater is provided to position the heat dissipater and a heat-generating element, which includes a heat-dissipating base and a positioning frame. The surface of the heat-dissipating base is provided with a plurality of heat-dissipating pieces. The center of the plurality of heat-dissipating pieces is provided with a sliding groove. Further, the positioning frame is formed into a T-lettered shape and constituted of a transverse rod and a pressing end. The pressing end is accommodated in the sliding groove of the base to abut against the surface of the base. Both side faces of the transverse rod are provided with a screw hole, respectively, for receiving a locking element.

Abstract: A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one opening exposing the surface of the interconnect metal. A heat sink has elastic means integral therewith for cooperating with the opening to position and secure the heat sink to the semiconductor support substrate.

Abstract: A chip package structure includes a substrate, a chip, a first B-stage adhesive, bonding wires, a heat sink and a molding compound. The substrate comprises a first surface, a second surface and a through hole. The chip is arranged on the first surface of the substrate and electrically connected thereto while the through hole of the substrate exposes a portion of the chip. The first B-stage adhesive is arranged between the chip and the first surface of the substrate, and the chip is attached to the substrate through the first B-stage adhesive. The bonding wires are connected between the chip exposed by the through hole and second surface of the substrate. The heat sink is arranged on the first surface of the substrate, covering the chip. The molding compound is arranged on the second surface of the substrate, covering a portion of the substrate and bonding wires.

Abstract: An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

Abstract: A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of the fixing posts being surrounded with a spring. The frame member provides a plurality of corners with a support leg vertically extending from the corners respectively and a first flat fixing ear horizontally extending outward from the corners. The first fixing ear has a first elongated hole with a first end part for being pierced by the fixing post and a second end part for fitting with the neck recess. The first elongated hole extends from the first end part to the second end part in a way of allowing the frame member being moved along a direction before the second end part fitting with neck recess.

Abstract: A semiconductor module has a housing, including a power semiconductor, a cooler bearing against the latter and serving for dissipating heat loss. In at least one embodiment, a spring element, which is supported between housing and cooler, is arranged on the side of the cooler remote from the power semiconductor and prestresses the cooler against the power semiconductor.

Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

Abstract: A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating component is pivotally disposed on the retaining component and pivotally rotated between a release position and a locking position. When the rotating component is at the locking position, a clamping portion of the rotating component is snapped onto the chip unit and presses the retaining component against the heat sink and the chip unit, thus improving the stability, reliability and fastness of the integral combination and meanwhile achieving the goal of being extremely convenient in assembling or disassembling.

Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

Abstract: An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has a plurality of sleeves (46). A plurality of clips (50) is assembled on the fan holder. Each clip includes a locking column (52) received in a corresponding sleeve of the fan holder, a shank (56) extending through the column, a spring (54) mounted around the column and sandwiched between a top of the column and a bottom of the shank, and an operating member (58) pivotably connected to the shank. The back plate forms a plurality of studs snappingly engaging with the locking columns to securely mount the heat sink on the PCB.

Abstract: A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chps stacked by intervening a spacer on the base substrate and defined with through-holes for electrical connections on positions corresponding to the connection pads; electrical connection members for electrically connecting the stacked semiconductor chips and the base substrate to each other; a pair of heat sinks formed such that they contact the side surfaces of the stacked semiconductor chips and extend in a direction perpendicular to the base substrate; and outside connection terminals attached to the ball lands located on the lower surface of the base substrate.

Abstract: A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.

Abstract: Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.

Abstract: A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.