Abstract: A clip for coupling a first board and second board, the first board having plurality of first post coupled thereto, the second board having a plurality of second posts coupled thereto, each second post being a cylinder for receiving a first post, the first and second boards having a predetermined relative position when the second posts fully engage the first posts, each second post having an aperture in a side exposing the interior of the cylinder, each first post having a tapered end and a notch around the posts. The clip includes a base member, the base member being coupled to the second board, a top member, the top member having an aperture therein, and a side member connecting the top member and the base member, the side member fabricated so that an edge of the aperture is forced through the aperture into the interior of the second post, edge being forced into the notch when the first and the second posts are engaged and the first and second boards are in the predetermined relationship.

Abstract: To prevent water intrusion, trolling motor heads cannot utilize ventilation methods of removing heat from power electronics. The assembly and method of the present application utilizes the existing metal column of a trolling motor to remove heat from the power electronics by utilizing a metal adapter that has flat outside surfaces for the power electronics and a round inside surface for the metal column.

Abstract: A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is provided between the holding block and the transistor. The spring fixes the pressure plate on the transistor, so that a uniform pressure is applied to the transistor via the pressure plate, and, at the side facing away from the pressure plate, the latter accordingly provides a good thermal conduction to a cooling element.

Abstract: An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the base and having first and second portions located opposite each other across the electronic device, and a plate spring supported by the first and second portions of the wall. The plate spring presses the electronic device against the base so that thermal resistance between the electronic device and the base is reduced. The plate spring has a thermal conductivity so that heat in the electronic device is transferred to the wall through the plate spring.

Abstract: An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield connected to the tie bar; and encapsulating the integrated circuit and the shield. An integrated circuit package system also includes: forming a lead and a support structure with substantially the same material as the lead and elevated above the lead; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the shield on the support structure; and encapsulating the integrated circuit and the shield.

Abstract: A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the cover. The heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment. Accordingly, the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink. To prevent excessive clamping force from damaging the semiconductor device, loading columns may extend between the cover and the heat sink.

Abstract: A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Abstract: According to an aspect of the embodiment, an optical module includes a case, an optical transceiver part in the case, a radiating part on the case; a thermal conductive sheet having a property of transferring and having a first end and second end; a first fixing part for fixing the first end of the thermal conductive sheet to the optical transceiver unit; and a second fixing part for fixing the second end of the thermal conductive sheet to the radiating point.

Abstract: An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure.

Abstract: A heat sink assembly includes a heat sink and a clip. The clip includes a main body, two pressing portions extending outwardly from two opposite ends of the main body, two extension portions each extending upwardly from an outer end of a corresponding pressing portion, a locking arm extending slantwise and upwardly from an upper end of each extension portion, a U-shaped operating portion extending from a far end of the locking arm and a J-shaped hook extending from a free end of the operating portion. The operating portion is provided for receiving a depressing force acting on the clip for moving the hook to engage with a clasp on a printed circuit board.

Abstract: Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10 ?m. This produces an anchoring effect occurs between the substrate and the insulating film, thereby improving the adhesiveness between the substrate and the insulating resin film.

Abstract: A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the planer member. The support members are attached to the first surface of the substrate to form a cavity over the die with the planer member positioned above the die. An encapsulant is provided for encapsulating the device, wherein an exterior surface of the planer member is exposed. A non-tapered opening is formed in the planer member. The encapsulant is injected through the opening to encapsulate the cavity and the encapsulant will partially fill the non-tapered opening.

Abstract: Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

Abstract: A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

Abstract: A fastening assembly used for securing a heat dissipation device to a printed circuit board, comprises a sleeve, an inserting device extending through the sleeve, a spring encircling the inserting device and received in the sleeve, and a supporting device inserted in the sleeve. The inserting device engages with a back plate below the printed circuit board. The sleeve is integrally formed of plastic and comprises a hollow body, a resilient portion extending from an outer surface of the body and pressing a bottom of the heat dissipation device upwardly, and four supporting portions extending from the outer surface of the body and pressing a top of the heat dissipation device downwardly. The supporting device is inserted between the body and the resilient portion, and abuts against the resilient portion, to thereby reliably keep the resilient portion at its locked position.

Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.

Abstract: A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate and pressing an end of the heat pipe to the heat absorbing plate, and a plurality of fasteners extending through the pressing plate to secure the end of the heat pipe, the heat absorbing plate and the pressing plate to a printed circuit board. Each of the fasteners includes a connecting portion extending through the pressing plate, a first operating portion extending from the connecting portion, and a second operating portion formed at an end face of the first operating portion. The first and second operating portions are configured to be operated by different tools.

Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board includes a heat sink, a wire clip and two operating members. The heat sink has a bottom for in contact with the electronic component. The wire clip includes a middle part spanning over the heat sink and two latching legs extending oppositely from two opposite ends of the middle part, respectively, the two latching legs being located in front of and in rear of the heat sink, respectively. Each operating member includes a plate cam placed on the heat sink and a handle extending laterally from the plate cam. The middle part of the wire clip extends through the plate cams and can be lifted away from the heat sink by turning the operating members from an unlocking state to a locking state.

Abstract: A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.

Abstract: A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates.

Abstract: A system and method is disclosed for allowing a solid substrate, such as a printed circuit board (PCB), to act as the support structure for an electronic circuit. In one embodiment, the LEDs which form a part of a scrambler assembly are constructed on a first substrate and the electrical connections are run to the edges of the substrate and end in electrical contacts positioned thereat. The substrate is then connected to the scrambler package by a series of electrical and mechanical connections to form the LED package. The electrical contacts which are part of the LED package extend from the LED package so as to enable electrical contact with a separate controller substrate.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: A heat-dissipating mechanism with a thermo-conducting sheet is arranged between a pluggable optical transceiver and a heat sink. One of the optical transceiver and the heat sink includes the thermo-conducting sheet. The heat sink is assembled with a cage to be movable vertically and against a downward force. The optical transceiver includes a projection that comes in contact with the heat sink. The heat sink includes a rail with a pocket. When the transceiver is inserted into the cage, the projection first runs along the rail to lift the heat sink upward; subsequently, the projection is set within the pocket to allow the thermo-conducting sheet to contact the transceiver.

Abstract: A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plurality of heat sinks having different sizes.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Abstract: A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

Abstract: Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.

Abstract: A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

Abstract: A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In a motor controller including an extrusion heat sink (1), and a power semiconductor module (4) including a plurality of external electrode terminals which closely contact the extrusion heat sink (1), and a printed circuit board having the plurality of external electrode terminals connected thereto, die-casting frames (2) in which a pedestal (2a) for attaching a motor controller and bosses (2b) for attaching a printed circuit board are molded are provided at both ends of the extrusion heat sink (1).

Abstract: A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract: The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.

Abstract: One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of the connection between a baseplate of the module and a circuit carrier connected thereto, recesses are provided in the baseplate. One aspect further relates to a power semiconductor module.

Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: Various apparatus and methods for improving the dissipation of heat from integrated circuit micro-modules are described. One aspect of the invention pertains to an integrated circuit package with one or more thermal pipes. In this aspect, the integrated circuit package includes multiple layers of a cured, planarizing dielectric. An electrical device is embedded within at least one of the dielectric layers. At least one electrically conductive interconnect layer is embedded within one or more of the dielectric layers. A thermal pipe made of a thermally conductive material is embedded in at least one associated dielectric layer. The thermal pipe thermally couples the electrical device with one or more external surfaces of the integrated circuit package. Various methods for forming the integrated circuit package are described.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: An electrical connector assembly for electrically connecting an electrical package to a printed circular board, includes an electrical connector mounted on a printed circular board, and a heat dissipating device located upon the electrical package. The heat dissipating device includes a supporting body located upon the electrical connector, two latching pieces retaining the supporting body and heat pipes assembled on the supporting body. The latching piece rivets with the supporting body on a center part thereof, so when one end of the latching pieces is pressed downwardly, the opposite end will not be influenced.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.

Abstract: The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

Abstract: For retaining a heatsink in contact with a processor on a board, a plurality of spaced apart mounting studs are mounted on the board. Each mounting stud includes a pivotally mounted resilient arm and a catch. A pair of the studs are positioned such that the resilient arm of one of the studs pivots to extend to engage the resilient arm catch of an adjacent one of the studs.

Abstract: According to one embodiment, a heat sink includes an extended end screwed to a printed circuit board. The extended end includes a screw hole and an engagement projection. A notch is formed by cutting the side of the printed circuit board to a position at which the notch does not interfere with signal lines. The notch is engaged with an engagement projection extending from the extended end, thereby preventing the heat sink from rotating when the heat sink is screwed to the printed circuit board.

Abstract: An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body.

Abstract: A hermetically sealed and/or ignition protection housing is provided with heat bridges at discreet points. The heat bridges form mounting faces in the interior space of the housing and also on the outer side. Heat from the interior of the housing generated by an item on the interior mounting faces is dissipated outwardly at the corresponding points by means of the heat bridges.

Abstract: Provided is a socket for testing a main board having a water-cooled cooler fixing structure that fixes a water-cooled cooler to the top surface of a central processing unit (CPU) mounted to a main board for a computer during testing of the fraction defective of the main board.

Abstract: An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.