Abstract: The present application provides a test assembly, including: a detection pin (11), a pressure sensor (12) connected to the detection pin (11), and a drive mechanism (18) configured to drive each detection pin (11), and each pressure sensor (12) is configured to detect the pressure applied to the detection pin (11) in real time.

Abstract: A display device and a manufacturing method thereof, wherein the display device includes a light emitting diode chip, including: a light emitting structure which includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; a second electrode which is electrically connected to the second conductive semiconductor layer; an insulation unit which is disposed to cover a part of the top surface of the second electrode and side surfaces of the light emitting structure; and a second fixed part which covers the top surface of the insulation unit and is electrically connected to the second electrode, and at least a part of which extends to the side surfaces of the light emitting structure.

Abstract: A display device is provided. The display device includes a substrate and a light-emitting unit disposed on the substrate. The light-emitting unit includes a transporting layer having a first semiconductor region and a second semiconductor region, and a conductive layer having a contact region that is in contact with the second semiconductor region. The distance between an edge of the contact region and an edge of the transporting layer is greater than or equal to 0.1 ?m.

Abstract: In some embodiments, a driver circuit for a light emitting diode (LED) lightbulb having a plurality of series-coupled LED strings, includes a power supply circuit coupled to a first LED string of the plurality of LED strings, an energy storage circuit coupled to the power supply circuit, and a current steering circuit coupled to the power supply circuit and coupled to at least one LED string of the plurality of LED strings. Power delivered to the LED strings is the power from the power supply circuit, plus a discharge power from the energy storage circuit, minus power diverted from the power supply circuit and directed to the energy storage circuit. The energy storage circuit stores energy during a first portion of a rectified AC power waveform and provides power during a second portion of the rectified AC power waveform.

Abstract: An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.

Abstract: A light emitting device has a covering member. The covering member includes light reflecting material and a second fluorescent material, and a dominant wavelength of an emission spectrum of the second fluorescent material differs from a dominant wavelength of an emission spectrum of the light emitting device by 30 nm or less. The light emitting device emits light with chromaticity that is within a four-sided region on a CIE 1931 chromaticity diagram, where chromaticity coordinates (x, y) are (0.645, 0.335) at a first point, (0.665, 0.335) at a second point, (0.735, 0.265) at a third point, (0.721, 0.259) at a fourth point, and a first line joins the first and second points, a second line joins the second and third points, a third line joins the third and fourth points, and a fourth line joins the fourth and first points to define the four-sided region of the chromaticity diagram.

Abstract: An array substrate, includes a base substrate and a plurality of pixel units arranged in an array on the base substrate. Each pixel unit includes an OLED and a pixel driver circuit. Each pixel unit of at least one of the plurality of pixel units further includes a repair line. An orthographic projection of the repair line on the base substrate partially overlaps with an orthographic projection of an anode of the OLED on the base substrate. The repair line is coupled to a pixel driving circuit in an adjacent pixel unit adjacent to the pixel unit of the plurality of pixel units.

Abstract: Embodiments relate to fabricating a display device by assembling strips of ?LED devices onto a backplane instead of individually picking and placing each ?LED device onto the backplane. A strip of first ?LED devices is coupled to a set of interconnections on the backplane. Then, the first fabrication substrate is removed from the strip of first ?LED devices. A strip of second ?LED devices producing another color (e.g., green) is attached to a second fabrication substrate. The strip of second ?LED devices is coupled to another set of interconnections on the backplane. The process may be repeated for a strip of third ?LED devices producing yet another color (e.g., blue). After attaching the second and third ?LED devices, fabrication substrates on the second and third ?LED devices are simultaneously removed by laser based lift-off (LLO) method.

Abstract: A pixel array substrate includes a substrate, pixels, and connection wires. The substrate has a transparent window, a wire region, and an active region. The connection wires are disposed in the wire region. Each connection wire is electrically connected to first signal lines of the pixels respectively located on two opposite sides of the transparent window. The connection wires include first and second wire groups. The first wire group includes first connection wires. Each first connection wire has a first segment and a second segment. A first insulation layer is disposed between the first and second segments that are electrically connected to each other. The second wire group includes second connection wires. The first segments of the first connection wires and the second connection wires are overlapped, and the first insulation layer is disposed between the first segments of the first connection wires and the second connection wires.

Abstract: A display panel and a display device are provided. The display panel comprises a display area; a non-display area surrounding the display area; a first edge; and a first insulating layer. The non-display area includes a binding area disposed between the display area and the first edge, and the binding area includes a plurality of bonding pads. The first insulating layer includes a plurality of through-holes disposed at the binding area and one-to-one corresponding the plurality of bonding pads, and a through-hole at least partially exposes a corresponding bonding pad. The first insulating layer includes a sub-edge arranged adjacent to the first edge, and a distance between the sub-edge and the first edge is D1, and the bonding pad has a first bonding pad edge arranged adjacent to the first edge, and a distance between the first bonding pad edge and the first edge is D2, where D1?D2.

Abstract: A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.

Abstract: A light-emitting module is provided. The light-emitting module includes a light-emitting structure and a carrying substrate. The light-emitting structure includes a plurality of light-emitting elements and a first positioning mark. The carrying substrate includes a second positioning mark. The light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction.

Abstract: Disclosed is a light emitting apparatus including: first and second substrates having light transmissive property and flexibility arranged to face each other; a plurality of light emitting element groups arranged along a predetermined straight line between the first and second substrates and each of the light emitting element groups includes a first light emitting element and a second light emitting element; and a conductor pattern formed on the first substrate and including respective individual line patterns individually connected to the first and second light emitting elements and a common line pattern commonly connected to the first and second light emitting elements. The individual line patterns are routed to one side and the other side of the straight line centered on at least a part of the common line pattern.

Abstract: A light emitting diode including a first semiconductor layer, a mesa disposed thereon and including a second semiconductor layer and an active layer, an ohmic reflection layer disposed on the mesa to form an ohmic contact with the second semiconductor layer, a lower insulation layer covering the mesa and the ohmic reflection layer and partially exposing the first semiconductor layer and the ohmic reflection layer, a first pad metal layer disposed on the lower insulation layer and electrically connected to the first semiconductor layer, a metal reflection layer disposed on the lower insulation layer and laterally spaced apart from the first pad metal layer, and an upper insulation layer covering the first pad metal layer and the metal reflection layer, and having a first opening exposing the first pad metal layer, in which at least a portion of the metal reflection layer covers a side surface of the mesa.

Abstract: The present invention relates to a display device using a semiconductor light-emitting element and, particularly, to a display device using a semiconductor light-emitting element. A display device according to the present invention comprises: a substrate including a driving thin-film transistor; a semiconductor light-emitting element including a first conductive electrode and a second conductive electrode; and a planarization layer formed to cover the driving thin-film transistor and including a reception hole in which the semiconductor light-emitting element is received, wherein a height adjustment layer is formed between the substrate and the planarization layer so as to make one of the first and the second conductive electrode and one surface of the planarization layer coincide with each other in height.

Abstract: A display device in an embodiment includes a first light emitting region; a second light emitting region located at a position away from the first light emitting region by a first distance in a first direction; a third light emitting region located at a position away from the second light emitting region by a second distance shorter than the first distance in the first direction; a first conductive portion located between the first light emitting region and the second light emitting region as seen from a display plane, the first conductive portion having a first width in the first direction, and a second conductive portion located between the second light emitting region and the third light emitting region as seen from the display plane, the second conductive portion having a second width shorter than the first width in the first direction.

Abstract: Disclosed is in the embodiment is a semiconductor device comprising: a first conductive semiconductor layer; a second conductive semiconductor layer; an active layer disposed between the second conductive semiconductor layer and the second conductive semiconductor layer; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the first conductive semiconductor layer includes a first sub semiconductor layer, a third sub semiconductor layer and a second sub semiconductor layer disposed between the first sub semiconductor layer and the third sub semiconductor layer, wherein proportion of aluminum in the first sub semiconductor layer and the third sub semiconductor layer is larger than an proportion of aluminum in the active layer, and an proportion of aluminum in the second sub semiconductor layer is smaller than the proportion of aluminum in the first sub semiconductor layer and the

Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.

Abstract: A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.

Abstract: A display apparatus includes a substrate; a light-emitting diode on the substrate; a pixel separating layer surrounding the light-emitting diode; and a light dispersion layer on the light-emitting diode and the pixel separating layer.

Abstract: A luminous laminated glazed roof of a vehicle includes a first glazing, forming an exterior glazing, with first and second main faces; a lamination interlayer made of polymeric material of thickness e1 of at most 1.8 mm; a second glazing, forming an interior glazing, with third and fourth main faces, the second and third main faces being the internal faces of the laminated glazing; a lamination interlayer with through or blind apertures housing diodes; and collimating optics between the diodes and the third main face.

Abstract: An OLED plate comprises: a substrate; a plurality of OLED devices, disposed on one side of the substrate and located in the display area; and an auxiliary cathode, disposed on the one side of the substrate and at least located in the peripheral area. Each of the OLED devices includes a reflective anode, an organic material functional layer and a transparent cathode disposed in a direction distal from the substrate in sequence. A portion of the auxiliary cathode located in the peripheral area is electrically connected to transparent cathodes of the plurality of OLED devices, and resistivity of the auxiliary cathode is less than resistivity of a transparent cathode of the plurality of OLED devices.

Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.

Abstract: A light emitting structure including mixing cups are described. In an embodiment, a light emitting structure includes a light emitting diode (LED) bonded to a substrate, a diffuser layer adjacent the LED, an angular filter directly over the diffuser layer and the LED, and an overcoat layer directly over the angular filter and the LED.

Abstract: A SiC wafer defect measuring method which includes a device management step of managing a defect measuring device by irradiating a reference sample made of a material having a light-emitting intensity that does not change with repeated irradiation by excitation light and which has a pattern made of recesses and/or protrusions in the surface, the irradiation by the excitation light being performed before measuring defects in a SiC wafer and under the same irradiation conditions as the measurement of the defects in the SiC wafer, and then measuring the S/N ratio of the pattern from a reflection image of the pattern.

Abstract: An active-matrix substrate according to an embodiment of the present invention includes a plurality of first TFTs that are arranged within a display area, an inorganic insulating layer that covers the plurality of first TFTs, an organic insulating layer that is provided on the inorganic insulating layer, a plurality of second TFTs that are arranged within a non-display area, and a source and gate metal connection portion that is positioned within the non-display area, a first conductive layer that is formed from an identical conductive film with a gate wiring line and a second conductive layer that is formed from an identical conductive film with a source wiring line being connected to each other at the source and gate metal connection portion. Each of the plurality of first TFTs is an oxide semiconductor TFT. At least one second TFT among the plurality of second TFTs is covered with the organic insulating layer. The source and gate metal connection portion is not covered with the organic insulating layer.

Abstract: Provided is an organic light emitting device including an overcoat layer on a substrate, a first electrode disposed on the overcoat layer, an organic light emitting layer disposed on the first electrode and including a convex or concave curve; and a second electrode disposed on the organic light emitting layer.

Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.

Abstract: A color conversion panel includes a first color conversion layer, a second color conversion layer, and a light wavelength conversion layer. The first color conversion layer includes a first semiconductor nanocrystal set for providing red light. The second color conversion layer neighbors the first color conversion layer and includes a second semiconductor nanocrystal set for providing first green light. The light wavelength conversion layer neighbors the second light conversion layer, may provide blue light, and includes a third semiconductor nanocrystal set for providing second green light.

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Abstract: The present disclosure provides a pixel structure, an OLED display screen, and an evaporation mask. The pixel structure includes a plurality of pixel unit groups arranged in an array. Each of the pixel unit groups includes a first sub-pixel, a second sub-pixel and a third sub-pixel. An edge of the first sub-pixel close to the third sub-pixel is not parallel to an edge of the first sub-pixel away from the third sub-pixel. An edge of the second sub-pixel close to the third sub-pixel is not parallel to an edge of the second sub-pixel away from the third sub-pixel. At least two adjacent first sub-pixels and/or at least two adjacent second sub-pixels of at least two adjacent pixel unit groups are formed by a same mask opening in the evaporation mask.

Abstract: The present disclosure relates to a monolithic full-color light-emitting diode (LED) display panel. The display panel includes a plurality of pixels and each pixel includes a first LED for emitting light having a first primary color, a second LED for emitting light having a second primary color, a third LED for emitting light having the first primary color, and a color converting layer for converting light generated by the third LED into light having a third primary color. Since the first, second and third LEDs of each pixel are formed with the same multi-layer semiconductor structure, the fabrication process of the display panel can be substantially simplified resulting in higher yield, increased throughput and lower cost.

Abstract: A display device and an electronics apparatus, the display device comprises: a display substrate; and at least two stacked layers on the display substrate, wherein each stacked layer includes one micro-LED array.

Abstract: A display apparatus includes a semiconductor substrate, a transistor, and a light-emitting diode. The transistor is disposed on the semiconductor substrate and uses a portion of the semiconductor substrate as an active layer thereof. The light-emitting diode is disposed on the semiconductor substrate and is electrically connected to the transistor.

Abstract: An active matrix substrate 10 includes: switching elements 120 that are connected with gate lines and data lines provided on a substrate; pixel electrodes 130 that are connected with the switching elements 120; counter electrodes 140 that overlap with the pixel electrodes 130 when viewed in a plan view; a flattening film 154; and lines 142. The flattening film 154 covers the switching elements 120, and first contact holes CH1 that pass through the flattening film 154 are formed at positions that overlap with the lines 142 when viewed in a plan view. The pixel electrodes 130 and the counter electrodes 140 are arranged so that each of the same partially covers the flattening film 154. The line 142 and the counter electrode 140 are connected with each other in the first contact hole CH1.

Abstract: This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.

Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

Abstract: A display device includes a first substrate including a circuit portion and a transmission portion, a first organic light emitting diode disposed over one surface of the first substrate and overlapping with the circuit portion, a second organic light emitting diode disposed over the other surface of the first substrate and overlapping with the transmission portion, and a second substrate facing one surface of the first substrate, in which the first organic light emitting diode and the second organic light emitting diode emit light to the second substrate.

Abstract: A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.

Abstract: A micro LED display panel includes a back plate, a plurality of micro LEDs on the back plate, a first partition wall on a side of the back plate having the plurality of micro LEDs, an insulating layer on the back plate, and a common electrode on the insulating layer and covering the plurality of micro LEDs. The first partition wall divides the back plate into a plurality of light-emitting regions independent from each other. Each of the light-emitting regions is provided with one of the micro LEDs. The insulating layer is located in each of the light-emitting regions and surrounds each of the micro LEDs.

Abstract: A system for light source calibration and aging compensation is disclosed. In one or more embodiments, the system includes a light source driver, a sensor, and a controller. The light source driver is configured to generate one or more power signals for a plurality of light sources. The sensor is configured to detect an illumination power output by at least one light source of the plurality of light sources. The controller is communicatively coupled to the sensor and the light source driver. The controller is configured to compare the illumination power detected by the sensor to a target illumination power. The controller is further configured to generate one or more control signals to adjust an electrical power output of the light source driver based on the comparison of the illumination power detected by the sensor to the target illumination power.

Abstract: Embodiments of the present disclosure provide an OLED array substrate, a method for fabricating an OLED array substrate, an OLED pixel circuit, an OLED array substrate including the OLED pixel circuit, and a display device including the OLED array substrate. The OLED array substrate includes a substrate, an OLED arranged on the substrate, and a photosensor positioned between the OLED and the substrate. The photosensor includes a first electrode, a photosensitive layer, and a second electrode sequentially arranged from bottom to top. The OLED includes an anode, an organic light-emitting layer, and a cathode sequentially arranged from bottom to top. The anode includes a first portion and a second portion.

Abstract: A display panel includes a substrate having a first area and a second area, a non-display area surrounding the first area and the second area, and a display area surrounding the non-display area, a plurality of display elements arranged in the display area, and a plurality of signal lines electrically connected to the plurality of display elements, wherein the plurality of signal lines includes a first signal line and a second signal line neighboring each other and extending in a first direction, wherein the first signal line bypasses in the non-display area along a first side of the first area, and the second signal line bypasses in the non-display area along a second side of the first area, and wherein the first and second signal lines are asymmetrical with respect to a virtual central line through a center of the first area in the first direction.

Abstract: A light-emitting device includes a substrate including a first electrode group and a second electrode group, a first light emitting unit, a second light emitting unit, and a side wall. The first light emitting unit is provided on the upper surface of the substrate and electrically connected to the first electrode group. The second light emitting unit is provided on the upper surface of the substrate and electrically connected to the second electrode group. The side wall surrounds the first light-emitting unit and the second light-emitting unit. The first light emitting unit and the second light emitting unit are arranged side by side such that a separation space between the first light emitting unit and the second light emitting unit is smaller than a space between the second light emitting unit and an outer peripheral surface of the side wall.

Abstract: A lighting apparatus using an organic light emitting diode that has a first area and a second area, the lighting apparatus comprises a substrate; a barrier layer disposed on the substrate; an auxiliary line disposed in the first area on the substrate; a first electrode disposed on an entire surface of the substrate; an organic layer disposed on the first electrode; and a second electrode disposed on the organic layer, wherein the barrier layer includes a first inorganic barrier layer, an organic barrier pattern disposed in the second area, and a second inorganic barrier layer.

Abstract: A laser illumination or dazzler device and method. More specifically, examples of the present invention provide laser illumination or dazzling devices power by one or more violet, blue, or green laser diodes characterized by a wavelength from about 390 nm to about 550 nm. In some examples the laser illumination or dazzling devices include a laser pumped phosphor wherein a laser beam with a first wavelength excites a phosphor member to emit electromagnetic at a second wavelength. In various examples, laser illumination or dazzling devices according to the present invention include polar, non-polar, or semi-polar laser diodes. In a specific example, a single laser illumination or dazzling device includes a plurality of violet, blue, or green laser diodes. There are other examples as well.

Abstract: Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps.

Abstract: A transmissive-type liquid crystal display device includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a base material, a pixel electrode, a light-shielding body, a first insulator that overlaps the light-shielding body in a plan view and is disposed between the base material and the pixel electrode, a second insulator that overlaps the pixel electrode in the plan view and is disposed in contact with the first insulator, and a transmissive lens member that overlaps the pixel electrode in the plan view, is disposed between the base material and the second insulator, and has a surface on the base material side including a convex lens surface. The second insulator has a refractive index greater than a refractive index of the first insulator. A surface of the second insulator on the pixel electrode side includes a concave lens surface.