Abstract: The present application provides a method for preparing a semiconductor structure and a semiconductor structure, relating to the technical field of semiconductors. The method for preparing a semiconductor structure includes: providing a base; forming a support layer having capacitor holes and electric contact structures; forming a first dielectric layer in the capacitor holes, the first dielectric layer surrounding first intermediate holes; forming a first electrode layer in the first intermediate holes, the first electrode layer filling the first intermediate holes; removing part of the support layer to form second intermediate holes; forming a second dielectric layer in the second intermediate holes, the first dielectric layer and the second dielectric layer forming a dielectric layer; and, forming a second electrode layer on the dielectric layer.

Abstract: A device includes a substrate including a low-resistance top surface and a fin structure including a first fin and a second fin. Each of the first and second fins includes a low-resistance fin-top surface and two low-resistance sidewall surfaces. The device includes an insulation material over the top surface of the substrate and between the first fin and the second fin. The fin-top surface and a first portion of the sidewall surfaces of each of the first and the second fins are above the insulation material. The device further includes a dielectric layer over the insulation material and in direct contact with the fin-top surface and the first portion of the sidewall surfaces of each of the first and the second fins; a first electrode in direct contact with the fin-top surface of the first fin; and a second electrode over the dielectric layer that is over the second fin.

Abstract: A metal-insulator-metal (MIM) capacitor module is provided. The MIM capacitor module includes a bottom electrode base formed in a lower metal layer, a bottom electrode conductively coupled to the bottom electrode base, a planar insulator formed over the bottom electrode, and a top electrode formed in an upper metal layer over the insulator. The bottom electrode includes a cup-shaped bottom electrode component and a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component.

Abstract: A semiconductor device may include a substrate including a cell region and a core/peripheral region. A plurality of bit line structures may be in the cell region of the substrate. A gate structure may be in the core/peripheral regions of the substrate. A lower contact plug and an upper contact plug may be between the bit line structures. The lower contact plug and the upper contact plug may be stacked in a vertical direction. A landing pad pattern may contact an upper sidewall of the upper contact plug. The landing pad pattern may be between an upper portion of the upper contact plug and an upper portion of one of the bit line structures. An upper surface of the landing pad pattern may be higher than an upper surface of each of the bit line structures. A peripheral contact plug may be formed in the core/peripheral regions of the substrate. A wiring may be electrically connected to an upper surface of the peripheral contact plug.

Abstract: A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

Abstract: A semiconductor device may include a bottom sub-electrode on a substrate, a top sub-electrode on the bottom sub-electrode, a dielectric layer covering the bottom and top sub-electrodes, and a plate electrode on the dielectric layer. The top sub-electrode may include a step extending from a side surface thereof, which is adjacent to the bottom sub-electrode, to an inner portion of the top sub-electrode. The top sub-electrode may include a lower portion at a level that is lower than the step and an upper portion at a level which is higher than the step. A maximum width of the lower portion may be narrower than a minimum width of the upper portion. The maximum width of the lower portion may be narrower than a width of a top end of the bottom sub-electrode. The bottom sub-electrode may include a recess in a region adjacent to the top sub-electrode.

Abstract: A three-dimensional metal-insulator-metal (MIM) capacitor is formed in an integrated circuit structure. The 3D MIM capacitor may include a bottom conductor including a bottom plate portion (e.g., formed in a metal interconnect layer) and vertically-extending sidewall portions extending from the bottom plate portion. An insulator layer is formed on the bottom plate portion and the vertically extending sidewall portions of the bottom conductor. A top conductor is formed over the insulating layer, such that the top conductor is capacitively coupled to both the bottom plate portion and the vertically extending sidewall portions of the bottom conductor, to thereby define an increased area of capacitive coupling between the top and bottom conductors. The vertically extending sidewall portions of the bottom conductor may be formed in a single metal layer or by components of multiple metal layers.

Abstract: A method of fabricating a semiconductor device. A cell area and a core area is defined in a substrate. A bit line structure disposed in the cell area is provided. A gate structure disposed in the core area is provided, and a core capping film disposed on the gate structure is provided. A height of the core capping film is greater than a height of the bit line structure. A first contact film is formed on the bit line structure. A second contact film is formed on the core capping film. A mask is formed on the first contact film. An upper surface of the core capping film is exposed using the mask. The first contact film is etched until a height of the first contact film becomes less than a height of the bit line structure using an etching process. In the etching process, an etching rate for the first contact film is greater than etching rates for the bit line structure and the core capping film.

Abstract: A capacitor structure including a semiconductor substrate; a dielectric layer on the semiconductor substrate; a storage node pad in the dielectric layer; a lower electrode including a bottle-shaped bottom portion recessed into the dielectric layer and being in direct contact with the storage node pad; and a lattice layer supporting a topmost part of the lower electrode, wherein the lattice layer is not directly contacting the dielectric layer, but is directly contacting the topmost part of the lower electrode. The bottle-shaped bottom portion extends to a sidewall of the storage node pad. The bottle-shaped bottom portion has a width that is wider than other portion of the lower electrode.

Abstract: Some embodiments relate to an integrated circuit (IC) that includes a semiconductor substrate. A shallow trench isolation region downwardly extends into the frontside of the semiconductor substrate and is filled with dielectric material. A first capacitor plate and a second capacitor plate are disposed in the shallow trench isolation region. The first capacitor plate and the second capacitor plate have first and second sidewall structures, respectively, that are substantially parallel to one another and that are separated from one another by the dielectric material of the shallow trench isolation region.

Abstract: A variable resistance memory device includes a first conductive line structure having an adiabatic line therein on a substrate, a variable resistance pattern contacting an upper surface of the first conductive line structure, a low resistance pattern contacting an upper surface of the variable resistance pattern, a selection structure on the low resistance pattern, and a second conductive line on the selection structure.

Abstract: A capacitor includes a plurality of lower bottom electrodes, a lower supporter supporting the lower bottom electrodes and including a plurality of lower supporter openings, upper bottom electrodes formed on the lower bottom electrodes, respectively, and an upper supporter supporting the upper bottom electrodes and including a plurality of upper supporter openings, wherein the lower supporter openings and the upper supporter openings do not vertically overlap each other.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece that includes an inter-level dielectric layer. A first contact that includes a fill material is formed that extends through the inter-level dielectric layer. The inter-level dielectric layer is recessed such that the fill material extends above a top surface of the inter-level dielectric layer. An etch-stop layer is formed on the inter-level dielectric layer such that the fill material of the first contact extends into the etch-stop layer. A second contact is formed extending through the etch-stop layer to couple to the first contact. In some such examples, the second contact physically contacts a top surface and a side surface of the first contact.

Abstract: A method of forming an array comprising pairs of vertically opposed capacitors comprises forming a conductive lining in individual capacitor openings in insulative-comprising material. An elevational mid-portion of individual of the conductive linings is removed to form an upper capacitor electrode lining and a lower capacitor electrode lining that are elevationally separate and spaced from one another in the individual capacitor openings. A capacitor insulator is formed laterally inward of the upper and lower capacitor electrode linings in the individual capacitor openings. Conductive material is formed laterally inward of the capacitor insulator in the individual capacitor openings and elevationally between the capacitor electrode linings. The conductive material is formed to comprise a shared capacitor electrode that is shared by vertically opposed capacitors in individual of the pairs of vertically opposed capacitors. Additional methods and structure independent of method are disclosed.

Abstract: Provided are a semiconductor memory device including a capacitor and a method of fabricating the same. The capacitor may include a plurality of contacts that are electrically connected to the switching device, exposed on the top surface of a substrate, and are arranged in a first direction and a second direction different from the first direction, and the first direction and the second direction are parallel to the substrate; mold insulators that are formed on the substrate between the contacts adjacent to one another in the first direction from among the plurality of contacts, are formed to have a predetermined thickness and have a predetermined width in the second direction, and extend in a direction vertical to the substrate; bottom electrodes that have a vertical plate-like structure, are provided on and supported by sidewalls of the mold insulators, and are electrically and respectively connected to the plurality of contacts.

Abstract: A method of fabricating a semiconductor device includes providing a substrate, and forming an interlayered insulating layer on the substrate. The method includes forming a preliminary via hole in the interlayered insulating layer. The method includes forming a passivation spacer on an inner side surface of the preliminary via hole. The method includes forming a via hole using the passivation spacer as an etch mask. The method includes forming a conductive via in the via hole. The passivation spacer includes an insulating material different from an insulating material included in the interlayered insulating layer.

Abstract: The present disclosure relates to methods of protecting a structure of an integrated circuit (IC) from rework, and more particularly, to methods of protecting a structure of an IC without impacting the critical dimension or the profile of the structure. For example, a method of protecting a structure of an IC from rework may include forming a first layer on a second layer; forming one or more first openings in the first layer, the first openings exposing a top surface of the second layer; selectively growing a Group VIII metal within the one or more first openings, thereby forming one or more first plugs; forming one or more final openings in the first layer; and removing the one or more first plugs.

Abstract: The present invention relates to a method of forming a memory capacitor. A substrate is provided with a plurality of storage node contacts. A patterned supporting structure is formed on the substrate, following by forming a bottom electrode conformally on surface of plural openings in the patterned supporting structure, thereby contacting the storage node contacts. A sacrificial layer is formed in the opening. A soft etching process is performed to remove the bottom electrode on top and partial sidewall of the patterned supporting structure, wherein the soft etching process includes using a fluoride containing compound, a nitrogen and hydrogen containing compound and an oxygen containing compound. The sacrificial layer is completely removed away. A capacitor dielectric layer and a top electrode are formed on the bottom electrode layer.

Abstract: A method for fabricating a semiconductor device includes: forming a mold stack pattern including a plurality of openings in an upper portion of a substrate and including a mold layer and a supporter layer which are stacked; forming a bottom electrode layer filling the plurality of the openings and covering the supporter layer; forming a filler portion disposed inside the plurality of the openings, a barrier portion extended upwardly from the filler portion, and an electrode cutting portion exposing a surface of the supporter layer by selectively etching the bottom electrode layer; forming a supporter by using the barrier portion as an etch barrier and etching the supporter layer exposed by the electrode cutting portion; selectively removing the barrier portion to form a hybrid pillar-type bottom electrode disposed inside the plurality of the openings; and removing the mold layer.

Abstract: Dynamic random access memory (DRAM) and fabrication methods thereof are provided. An exemplary fabrication method includes providing a base substrate; forming an interlayer dielectric layer over the base substrate; forming an opening passing through the interlayer dielectric layer; and forming a memory structure, having a first conductive layer, a memory medium layer on the first conductive layer, and a second conductive layer on the memory medium layer, in the opening.

Abstract: A display substrate is disclosed. The display device includes a first electrode, a second electrode, and a vertical storage capacitor in an insulating layer. The vertical storage capacitor includes a first plate and a second plate which are spaced apart. The first plate is connected with the first electrode, the second plate is connected with the second electrode, and the first plate and the second plate are perpendicular with or tilted with respect to the substrate. A method for fabricating the display substrate and a display device are also disclosed.

Abstract: There is provided an apparatus includes a substrate having a main surface, a wordline buried in the substrate and a bitline buried in a shallower area than the wordline in the substrate.

Abstract: Artificial synaptic devices with an HfO2-based ferroelectric layer that can be implemented in the CMOS back-end are provided. In one aspect, an artificial synapse element is provided. The artificial synapse element includes: a bottom electrode; a ferroelectric layer disposed on the bottom electrode, wherein the ferroelectric layer includes an HfO2-based material that crystallizes in a ferroelectric phase at a temperature of less than or equal to about 400° C.; and a top electrode disposed on the bottom electrode. An artificial synaptic device including the present artificial synapse element and methods for formation thereof are also provided.

Abstract: A manufacturing method of a semiconductor memory device is provided in the present invention. A cleaning treatment to a storage node contact on a semiconductor substrate is performed, and a metal silicide layer is formed after the cleaning treatment. A gate contact opening penetrating a capping layer of a transistor on the semiconductor substrate is formed after the step of forming the metal silicide layer for exposing a gate structure of the transistor. By the manufacturing method of the semiconductor memory device in the present invention, the gate structure of the transistor may be kept from being influenced and/or damaged by the cleaning treatment of the storage node contact, and the electrical performance of the transistor may be ensured accordingly.

Abstract: Semiconductor structures including a plurality of conductive structures having a dielectric material therebetween are disclosed. The thickness of the dielectric material spacing apart the conductive structures may be adjusted to provide optimization of capacitance and voltage threshold. The semiconductor structures may be used as capacitors, for example, in memory devices. Various methods may be used to form such semiconductor structures and capacitors including such semiconductor structures. Memory devices including such capacitors are also disclosed.

Abstract: A semiconductor device and a method of forming the same are provided. A substrate is provided. A trench is formed in the substrate and a conductive material is formed filling the trench. A portion of the conductive material filling an upper portion of the trench is removed to expose an upper surface of the substrate and an upper corner and an upper sidewall of the trench. A doping process is performed to form a doped region in the substrate along the exposed upper surface of the substrate and the exposed upper corner and upper sidewall of the trench. The doped region has an upside-down L shape.

Abstract: A method for manufacturing semiconductor device is provided. A substrate having a memory region and a capacitance region is provided. A plurality of word line structures are formed on the memory region of the substrate. A capacitance structure is formed on the capacitance region of the substrate. The word line structures and the capacitance structure each include a first dielectric layer on the substrate, a first conductive layer on the first dielectric layer, a second dielectric layer on the first conductive layer, and a second conductive layer on the second dielectric layer. The second conductive layers of the word line structures close to an edge of the memory region and a portion of the second conductive layer of the capacitance structure are removed at the same time to form a trench exposing a portion of the second dielectric layer.

Abstract: A method of patterning a semiconductor device is disclosed. A tri-layer photoresist is formed over a plurality of patterned features. The tri-layer photoresist includes a bottom layer, a middle layer disposed over the bottom layer, and a top layer disposed over the middle layer, the top layer containing a photo-sensitive material. The top layer is patterned via a photolithography process, the patterned top layer including an opening. The opening is extended into the bottom layer by etching the bottom layer and continuously forming a protective layer on etched surfaces of the bottom layer and on exposed surfaces of the patterned features. The bottom layer is removed. At least some portions of the protective layer remain on the exposed surfaces of the patterned features after the bottom layer is removed.

Abstract: A three-dimensional (3D) capacitor includes a semiconductor substrate; a fin structure including one or more fins formed on the semiconductor substrate; an insulator material formed between each of the one or more fins; a dielectric layer formed on a first portion of the fin structure; a first electrode formed on the dielectric layer; spacers formed on sidewalls of the first electrode; and a second electrode formed on a second portion of the fin structure. The first and second portions are different. The second electrode includes a surface that is in direct contact with a surface of the spacers.

Abstract: The disclosure relates to a method of forming a Co contact module, the method including depositing a liner layer on a trench block, partially plating the lined trenches with Co as a first metal such that the resulting Co layer has a top surface below an opening top surface of a shallowest trench, depositing a second metal on the Co layer and exposed surfaces of the liner layer, planarizing the second metal layer, and etching the second metal layer and portions of the liner layer. The disclosure also relates to a Co contact module formed by the noted method.

Abstract: Many aspects of an improved IC package are disclosed herein. The improved IC package exhibits low-impedance and high power and signal integrity. The improved IC package comprises an IC die mounted on a multilayer coreless substrate. The thicknesses of prepreg layers of the coreless substrate are specific chosen to minimize warpage and to provide good mechanical performance. Each of the prepreg layers may have different coefficient of thermal expansion (CTE) and/or thickness to enable better control of the coreless substrate mechanical properties. The improved IC package also includes a vertically mounted die side capacitor and a conductive layer formed on the solder resist layer of the substrate. The conductive layer is formed such that it also encapsulates the vertically mounted capacitor while being electrically coupled to one of the capacitor's electrode.

Abstract: An optoelectronic device including a substrate having a surface, openings which extend in the substrate from the surface, and semiconductor elements, each semiconductor element partially extending into one of the openings and partially outside said opening, the height of each opening being at least 25 nm and at most 5 ?m and the ratio of the height to the smallest diameter of each opening being at least 0.5 and at most 15.

Abstract: A method for manufacturing a semiconductor device may include forming contact pads spaced apart from each other in a first direction on a substrate and between first insulating patterns; forming first holes between the first insulating patterns and having bottom ends adjacent top surfaces of the contact pads; forming second holes between second insulating patterns and overlapping with partial portions of the first holes in a second direction perpendicular to the first direction; and forming a bottom electrode layer including first portions to cover the bottom ends of the first holes and sidewalls of the second holes. In forming the first and second holes, the first and second holes are formed simultaneously.

Abstract: A method of fabricating an image sensor includes the following steps. A semiconductor substrate is provided. A first photoresist structure is formed on the semiconductor substrate. A second photoresist structure is formed on the semiconductor substrate and covering the first photoresist structure. A third photoresist structure is formed on the semiconductor substrate and covering the first photoresist structure and the second photoresist structure. A first etching back process is performed to remove a first portion of the third photoresist structure above a top surface of the second photoresist structure. A second etching back process is performed to remove a portion of the second photoresist structure above a top surface of the first photoresist structure and to remove a second portion of the third photoresist structure above the top surface of the first photoresist structure.

Abstract: A shielding and decoupling capacitor structure can be fabricated within an integrated circuit (IC) by forming recesses in a top surface of a dielectric layer and forming a trench in a top surface of an intra-metal dielectric portion of a metal layer deposited on the top surface of the dielectric layer. A bottom of the trench exposes the recesses. A bottom of each recess exposes a conductive structure. A first plate may be formed by depositing a conductive liner onto the bottom and side of the recess and onto the bottom and side of the trench. A conformal dielectric film may be deposited onto the first plate within the trench and recesses. A second plate may be formed by depositing an electrically conductive material within the trench and recesses over the conformal dielectric film. The conformal dielectric film electrically insulates the first and second plates from each other.

Abstract: A method for manufacturing a semiconductor device includes forming first and second lower structures including selection elements on first and second chip regions of a substrate, respectively, forming first and second mold layers on the first and second lower structures, respectively, forming first and second support layers on the first and second mold layers, respectively, patterning the first support layer and the first mold layer to form first holes exposing the first lower structure, forming first lower electrodes in the first holes, forming a support pattern including at least one opening by selectively patterning the first support layer while leaving the second support layer, and removing the first mold layer through the opening. A top surface of the support pattern is disposed at a substantially same level as a top surface of the second support layer.

Abstract: A NAND memory is provided that includes a memory cell region and a peripheral region. The peripheral region includes a shallow trench isolation trench disposed in a substrate. The shallow trench isolation trench includes a first top surface, and a second top surface. A difference between a height of the second top surface and a height of the first top surface is less than a predetermined value ?MAX.

Abstract: Provided is a semiconductor device. The semiconductor device includes a capacitor structure including a plurality of lower electrodes, a dielectric layer that covers surfaces of the plurality of lower electrodes, and an upper electrode on the dielectric layer. The semiconductor device further includes a support structure that supports the plurality of lower electrodes. The support structure includes a first support region that covers sidewalls of one of the plurality of lower electrodes, and an opening that envelops the first support region when the semiconductor device is viewed in plan view.

Abstract: A method of forming a semiconductor structure, comprising forming a dual damascene structure having a capacitor trench and an interconnect trench, forming a first electrode a dielectric of the capacitor, and, depositing a metal within said capacitor trench and said interconnection trench wherein the metal forms a second electrode of the capacitor and also forms an interconnection between layers of an interconnecting structure of a semiconductor device.

Abstract: A dynamic random access memory (DRAM) device includes a substrate, plural buried gates and plural bit lines. The buried gates are disposed in the substrate along a first trench extending along a first direction. The bit lines are disposed over the buried gates and extending along a second direction across the first direction. Each of the bit lines includes a multi-composition barrier layer, wherein the multi-composition barrier layer includes WSixNy with x and y being greater than 0 and the multi-composition barrier layer is silicon-rich at a bottom portion thereof and is nitrogen-rich at a top portion thereof.

Abstract: Semiconductor structures including a plurality of conductive structures having a dielectric material therebetween are disclosed. The thickness of the dielectric material spacing apart the conductive structures may be adjusted to provide optimization of capacitance and voltage threshold. The semiconductor structures may be used as capacitors, for example, in memory devices. Various methods may be used to form such semiconductor structures and capacitors including such semiconductor structures. Memory devices including such capacitors are also disclosed.

Abstract: A semiconductor device having a capacitor includes a substrate which has a transistor, a first insulating pattern which is formed on the substrate and does not overlap a first contact node formed in the substrate, a second insulating pattern which is formed on the substrate, does not overlap a second contact node formed in the substrate, and is separated from the first insulating pattern, a first lower electrode which is formed on part of the substrate and sidewalls of the first insulating pattern, a second lower electrode which is formed on part of the substrate and sidewalls of the second insulating pattern, a dielectric layer pattern which is formed on the first lower electrode and the second lower electrode, and an upper electrode which is formed on the dielectric layer pattern. Related fabrication methods are also discussed.

Abstract: A method of fabricating a semiconductor device comprises forming a first etch stop layer over a first dielectric layer. The method also comprises forming a first opening in the first etch stop layer and the first dielectric layer. The method further comprises filling the first opening with a conductive material. The method additionally comprises forming a second etch stop layer and a second dielectric layer over the first etch stop layer. The method further comprises forming a second opening to expose the conductive material. The method additionally comprises forming a capacitor in the second opening and in contact with the conductive material.

Abstract: There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed.

Abstract: A device capacitor structure within middle of line (MOL) layers includes a first MOL interconnect layer. The first MOL interconnect layer may include active contacts between a set of dummy gate contacts on an active surface of a semiconductor substrate. The device capacitor structure also includes a second MOL interconnect layer. The second MOL interconnect layer may include a set of stacked contacts directly on exposed ones of the active contacts. The second MOL interconnect layer may also include a set of fly-over contacts on portions of an etch-stop layer on some of the active contacts. The fly-over contacts and the stacked contacts may provide terminals of a set of device capacitors.

Abstract: An electronic device includes a semiconductor memory that includes: an inter-layer dielectric layer including a hole over a substrate; a first nitride layer disposed on sidewalls of the hole; a selector disposed in a bottom portion of the hole and over the first nitride layer on the sidewalls of the hole; a stacked structure including a variable resistance pattern disposed over a lower structure including the selector; and a second nitride layer disposed in an upper portion and on sidewalls of the stacked structure.

Abstract: Self-supported MEMS structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a MEMS plate over a substrate, forming a trench over the MEMS plate, forming an oxide liner in the trench on sidewalls of the trench, forming a metal liner over the oxide liner in the trench, and depositing a metallic filler in the trench to form a via. The method further includes removing the polymer layer such that the via and the MEMS plate form the self-supported MEMS structure, where the oxide liner provides mechanical rigidity for the metallic filler of the via. An exemplary structure formed by the disclosed method is also disclosed.

Abstract: An integrated circuit with vias with different depths stopping on etch stop layers with different thicknesses. A method of simultaneously etching vias with different depths without causing etch damage to the material being contacted by the vias.

Abstract: Self-supported MEMS structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a MEMS plate over a substrate, forming a via collar along sidewalls of a first portion of a trench over the polymer layer, and forming a second portion of the trench within the polymer layer. The method also includes forming an oxide liner in the trench lining sidewalls of the via collar and sidewalls of the second portion of the trench, depositing a metallic filler in the trench to form a via, and forming a metal cap layer over the via collar and the metallic filler. The method further includes removing a portion of the metal cap layer to form a via cap, and removing the polymer layer such that the via is supported only on a bottom thereof by the substrate. An exemplary structure formed by the disclosed method is also disclosed.