Containing Carbon, E.g., Fullerenes (epo) Patents (Class 257/E23.165)
  • Flexible rewiring plate for semiconductor components, and process for producing it
    Patent number: 7268423
    Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: September 11, 2007
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • COPPER AND CARBON NANOTUBE THERMAL CONDUCTOR
    Publication number: 20070050870
    Abstract: A thermal conductor is made of copper and carbon nanotubes powders that are compressed together and then cold rolled into sheets for aligning the carbon nanotubes for providing a composite matrix having a low coefficient of thermal expansion, high thermal conductivity, and high electrical conductivity, for preferred use as a conducting heat sink, such as a laser submount, for heat sinking dissipation and electrical grounding of high-power electrical components and circuits, such as a laser diode.
    Type: Application
    Filed: August 29, 2005
    Publication date: March 1, 2007
    Inventor: Heinrich Muller
  • Substrate structure and manufacturing method of the same
    Publication number: 20060290003
    Abstract: A Ti film is pattern-formed on a desired portion on a silicon substrate, and a Co film is formed on the substrate so as to cover the Ti film. CNTs are formed only on a portion, under which the Ti film is formed, of the surface of the Co film at approximately 600° C. by a thermal CVD method. The length of the CNT can be controlled by adjusting the thickness of the Ti film.
    Type: Application
    Filed: July 14, 2005
    Publication date: December 28, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Akio Kawabata, Mizuhisa Nihei, Masahiro Horibe, Shintaro Sato, Daiyu Kondo, Yuji Awano