Abstract: Problems exist in areas such as image visibility, endurance of the device, precision, miniaturization, and electric power consumption in an information device having a conventional resistive film method or optical method pen input function. Both EL elements and photoelectric conversion elements are arranged in each pixel of a display device in an information device of the present invention having a pen input function. Information input is performed by the input of light to the photoelectric conversion elements in accordance with a pen that reflects light by a pen tip. An information device with a pen input function, capable of displaying a clear image without loss of brightness in the displayed image, having superior endurance, capable of being miniaturized, and having good precision can thus be obtained.

Abstract: Disclosed in a method that is for producing a solar cell and that is characterized by performing an annealing step on a semiconductor substrate before an electrode-forming step. By means of performing annealing in the above manner, it is possible to improve the electrical characteristics of the solar cell without negatively impacting reliability or outward appearance. As a result, the method can be widely used in methods for producing solar cells having high reliability and electrical characteristics.

Abstract: Photovoltaic devices are produced using a minimally modified standard process flow by forming lateral P-I-N light-sensitive diodes on silicon islands that are isolated laterally by trenches performed by RIE, and from an underlying support substrate by porous silicon regions. P+ and N+ doped regions are formed in a P? epitaxial layer, trenches are etched through the epitaxial layer into a P+ substrate, a protective layer (e.g., SiN) is formed on the trench walls, and then porous silicon is formed (e.g., using HF solution) in the trenches that grows laterally through the P+ substrate and merges under the island. The method is either utilized to form low-cost embedded photovoltaic arrays on CMOS IC devices, or the devices are separated from the P+ substrate by etching through the porous silicon to produce low-cost, high voltage solar arrays for solar energy sources, e.g., solar concentrators.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: A semiconductor device is formed having a trench adjacent to a current carrying region of the device. The trench is formed having a depth greater than the depth of a tub region of the device. Increasing the trench depth moves a region of higher field strength from the tub region to a region along the trench. The region along the trench does not have a junction and may withstand the higher field strength.

Abstract: Embodiments of a method of integration of a non-volatile memory device into a MOS flow are described. Generally, the method includes: forming a dielectric stack on a surface of a substrate, the dielectric stack including a tunneling dielectric overlying the surface of the substrate and a charge-trapping layer overlying the tunneling dielectric; forming a cap layer overlying the dielectric stack; patterning the cap layer and the dielectric stack to form a gate stack of a memory device in a first region of the substrate and to remove the cap layer and the charge-trapping layer from a second region of the substrate; and performing an oxidation process to form a gate oxide of a MOS device overlying the surface of the substrate in the second region while simultaneously oxidizing the cap layer to form a blocking oxide overlying the charge-trapping layer. Other embodiments are also disclosed.

Abstract: Electrostatic discharge devices and methods of forming thereof are disclosed. In one embodiment, a semiconductor device includes an electrostatic discharge (ESD) device region disposed within a semiconductor body. A first ESD device is disposed in a first region of the ESD device region, and a second ESD device disposed in a second region of the ESD device region. The second region is separated from the first region by a first trench.

Abstract: A bipolar transistor structure with multiple electrodes configured to include an enhanced base capacitive element. Alternatively, a transistor with an integrated light emitting capacitive (LEC) element at the source or drain of the transistor. The transistor may be a stand alone transistor for usage in discrete applications, or may be implemented in a pixel circuit used in a display apparatus. In the pixel circuit embodiment, driver circuitry causes appropriate charging and discharging of the LEC elements of respective pixels to provide a desired display. In one alternative, a transistor may be configured to have multiple LEC elements integrated therewith, to provide respective different colors used in forming a display.

Abstract: Provided is an electrically erasable and programmable nonvolatile semiconductor memory device having a tunnel region; the tunnel region and the peripheral of the tunnel region are dug down to be made lower, and a depletion electrode, to which an arbitral potential is given to deplete a part of the tunnel region through a depletion electrode insulating film, is arranged in the lowered drain region.

Abstract: Provided is an electrically erasable and programmable nonvolatile semiconductor memory device having a small hole in a second conductivity-type drain region, a tunnel insulating film formed on the surface of the hole, and a protrusion extended from the floating gate electrode and arranged to fill the hole. Further a tunneling restriction region which is an electrically floating first conductivity type region arranged in a vicinity of the surface of the drain region around the hole to define the size of the tunnel region through which the tunnel current flows.

Abstract: Insufficient gain in bipolar transistors (20) is improved by providing an alloyed (e.g., silicided) emitter contact (452) smaller than the overall emitter (42) area. The improved emitter (42) has a first emitter (FE) portion (42-1) of a first dopant concentration CFE, and a second emitter (SE) portion (42-2) of a second dopant concentration CSE. Preferably CSE?CFE. The SE portion (42-2) desirably comprises multiple sub-regions (45i, 45j, 45k) mixed with multiple sub-regions (47m, 47n, 47p) of the FE portion (42-1). A semiconductor-metal alloy or compound (e.g., a silicide) is desirably used for Ohmic contact (452) to the SE portion (42-2) but substantially not to the FE portion (42-1). Including the FE portion (42-1) electrically coupled to the SE portion (42-2) but not substantially contacting the emitter contact (452) on the SE portion (42-2) provides gain increases of as much as ˜278.

Abstract: An electrostatic discharge protection circuit has a bipolar transistor which includes a first diffusion layer of a first conductive type connected with a first power supply and functioning as a base; a second diffusion layer of a second conductive type connected with a second power supply and functioning as a collector; and a third diffusion layer of the second conductive type connected with an input/output pad and functioning as an emitter. An area of a first region of the third diffusion layer which is opposite to the first diffusion layer is larger than an area of a second region of the second diffusion layer which is opposite to the first diffusion layer.

Abstract: In one embodiment, a memory device includes a substrate, a tunneling oxide, a silicide nanocrystal floating gate, and a control oxide. The tunneling oxide is positioned upon a first surface of the substrate, the silicide nanocrystal floating gate is positioned upon the tunneling oxide, and the control oxide positioned upon the nanocrystal floating gate.

Abstract: A memory array comprising transistors having isolated inter-gate dielectric regions with respect to one another. Transistors are formed such that each of the transistors in the array has a charge storage region such as a floating gate, a control gate and an inter-gate dielectric layer therebetween. The inter-gate dielectric layer for each transistor is isolated from the inter-gate dielectric of each of the other transistors in the array.

Abstract: Insufficient gain in bipolar transistors (20) is improved by providing an alloyed (e.g., silicided) emitter contact (452) smaller than the overall emitter (42) area. The improved emitter (42) has a first emitter (FE) portion (42-1) of a first dopant concentration CFE, and a second emitter (SE) portion (42-2) of a second dopant concentration CSE. Preferably CSE?CFE. The SE portion (42-2) desirably comprises multiple sub-regions (45i, 45j, 45k) mixed with multiple sub-regions (47m, 47n, 47p) of the FE portion (42-1). A semiconductor-metal alloy or compound (e.g., a silicide) is desirably used for Ohmic contact (452) to the SE portion (42-2) but substantially not to the FE portion (42-1). Including the FE portion (42-1) electrically coupled to the SE portion (42-2) but not substantially contacting the emitter contact (452) on the SE portion (42-2) provides gain increases of as much as ˜278.

Abstract: Electrostatic discharge devices and methods of forming thereof are disclosed. In one embodiment, a semiconductor device includes an electrostatic discharge (ESD) device region disposed within a semiconductor body. A first ESD device is disposed in a first region of the ESD device region, and a second ESD device disposed in a second region of the ESD device region. The second region is separated from the first region by a first trench.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes: a semiconductor substrate; an element isolation insulator formed in an upper portion of the semiconductor substrate and dividing the upper portion into first and second active areas extending in a first direction; a first contact connected to the first active area; and a second contact connected to the second active area. Each of the first and second active area includes: a first portion connected to one of the first contact and the second contact; and a second portion having an upper surface being placed lower than an upper surface of the first portion. The first contact and the second contact are mutually shifted in the first direction. The first portion of the first active area is disposed adjacent to the second portion of the second active area.

Abstract: A bipolar transistor at least includes a semiconductor substrate including an N? epitaxial growth layer and a P? silicon substrate, an N+ polysilicon layer, a tungsten layer, two silicide layers, a base electrode, an emitter electrode, and a collector electrode. The N+ polysilicon layer formed on the semiconductor substrate is covered with one of the silicide layers. The tungsten layer that is formed on the silicide layer is covered with the other silicide layer.

Abstract: A semiconductor device is formed having a trench adjacent to a current carrying region of the device. The trench is formed having a depth greater than the depth of a tub region of the device. Increasing the trench depth moves a region of higher field strength from the tub region to a region along the trench. The region along the trench does not have a junction and may withstand the higher field strength.

Abstract: Problems exist in areas such as image visibility, endurance of the device, precision, miniaturization, and electric power consumption in an information device having a conventional resistive film method or optical method pen input function. Both EL elements and photoelectric conversion elements are arranged in each pixel of a display device in an information device of the present invention having a pen input function. Information input is performed by the input of light to the photoelectric conversion elements in accordance with a pen that reflects light by a pen tip. An information device with a pen input function, capable of displaying a clear image without loss of brightness in the displayed image, having superior endurance, capable of being miniaturized, and having good precision can thus be obtained.

Abstract: Manufacturers encounter limitations in forming low resistance ohmic electrical contact to semiconductor material P-type Gallium Nitride (p-GaN), commonly used in photonic applications, such that the contact is highly transparent to the light emission of the device. Carbon nanotubes (CNTs) can address this problem due to their combined metallic and semiconducting characteristics in conjunction with the fact that a fabric of CNTs has high optical transparency. The physical structure of the contact scheme is broken down into three components, a) the GaN, b) an interface material and c) the metallic conductor. The role of the interface material is to make suitable contact to both the GaN and the metal so that the GaN, in turn, will make good electrical contact to the metallic conductor that interfaces the device to external circuitry. A method of fabricating contact to GaN using CNTs and metal while maintaining protection of the GaN surface is provided.

Abstract: A first plurality of memory cells is in a first plane in a first column of the array. A second plurality of memory cells is in a second plane in the same column. The second plurality of memory cells are coupled to the first plurality of memory cells through a series connection of their source/drain regions.

Abstract: Disclosed are embodiments of a method of fabricating a bipolar transistor with a self-aligned raised extrinsic base. In the method a dielectric pad is formed on a substrate with a minimum dimension capable of being produced using current state-of-the-are lithographic patterning. An opening is aligned above the dielectric pad and etched through an isolation oxide layer to an extrinsic base layer. The opening is equal to or greater in size than the dielectric pad. Another smaller opening is etched through the extrinsic base layer to the dielectric pad. A multi-step etching process is used to selectively remove the extrinsic base layer from the surfaces of the dielectric pad and then to selectively remove the dielectric pad. An emitter is then formed in the resulting trench. The resulting transistor structure has a distance between the edge of the lower section of the emitter and the edge of the extrinsic base that is minimized, thereby, reducing resistance.

Abstract: A process for manufacturing an array of bipolar transistors, wherein deep field insulation regions of dielectric material are formed in a semiconductor body, thereby defining a plurality of active areas, insulated from each other and a plurality of bipolar transistors are formed in each active area. In particular, in each active area, a first conduction region is formed at a distance from the surface of the semiconductor body; a control region is formed on the first conduction region; and, in each control region, at least two second conduction regions and at least one control contact region are formed. The control contact region is interposed between the second conduction regions and at least two surface field insulation regions are thermally grown in each active area between the control contact region and the second conduction regions.

Abstract: A semiconductor device is formed having a trench adjacent to a current carrying region of the device. The trench is formed having a depth greater than the depth of a tub region of the device. Increasing the trench depth moves a region of higher field strength from the tub region to a region along the trench. The region along the trench does not have a junction and may withstand the higher field strength.

Abstract: A plurality of transistors are formed on a substrate in a plurality of columns. Each transistor has a first conductivity type region and second conductivity type regions provided on both sides thereof in a column direction, and has an active layer on the side of each second conductivity type region closer to the substrate. Between two columns adjacent to each other, the second conductivity type region on a first side in the column direction of each transistor arranged on a first column, the second conductivity type region on a second side in the column direction of the transistor adjacent to this transistor on the first side in the column direction and the first conductivity type region of each transistor arranged on a second column are electrically connected by a first wire.

Abstract: A nonvolatile semiconductor memory device has: a semiconductor substrate; a control gate and a floating gate that are formed side by side on a gate insulating film on a channel region in the semiconductor substrate; an erase gate facing an upper surface of the floating gate; a first device isolation structure having a first projecting portion; and a second device isolation structure having a second projecting portion. The first and second projecting portions have a first sloping surface and a second sloping surface, respectively. The first sloping surface and the second sloping surface face each other, and an interval between the first and second sloping surfaces becomes larger away from the semiconductor substrate. The floating gate is sandwiched between the first and second projecting portions and at least has a portion located on the semiconductor substrate side of the first and second sloping surfaces.

Abstract: A configuration is adopted comprising an NchMOS transistor 1 equipped with an insulating isolation layer 4 providing insulation and isolation using an SOI structure, and a capacitor formed using an insulating film, with a silicon substrate B being made thin and substrate capacitance being reduced. The NchMOS transistor 1 is equipped with insulating isolation regions 5a, 5b that are perfectly depleted or partially depleted in a manner close to being perfectly depleted. An electrode 6 connected to a gate electrode G of the NchMOS transistor 1 and an impurity diffusion layer 7 are connected via a capacitor 2. A source electrode S is connected to a power supply terminal 3a, a gate electrode G is connected to an internal signal line S1, and a drain electrode D is connected to an internal signal line S2. Substrate bias voltage is then controlled using capacitor coupling when the NchMOS transistor 1 is turned on/off.

Abstract: The invention includes optoelectronic devices containing one or more layers of semiconductor-enriched insulator (with exemplary semiconductor-enriched insulator being silicon-enriched silicon oxide and silicon-enriched silicon nitride), and includes solar cells containing one or more layers of semiconductor-enriched insulator. The invention also includes methods of forming optoelectronic devices and solar cells.

Abstract: The present invention relates to a microelectronic device having a bipolar epitaxial structure that provides at least one bipolar transistor element formed over at least one field effect transistor (FET) epitaxial structure that provides at least one FET element. The epitaxial structures are separated with at least one separation layer. Additional embodiments of the present invention may use different epitaxial layers, epitaxial sub-layers, metallization layers, isolation layers, layer materials, doping materials, isolation materials, implant materials, or any combination thereof.

Abstract: A semiconductor device includes a semiconductor chip having a collector region, a base region, and an emitter region that are formed in a semiconductor substrate. The semiconductor chip also includes a base electrode strip in contact with the base region, an emitter electrode strip in contact with the emitter region, an emitter electrode plate disposed above the base electrode strip and the emitter electrode strip, and a base electrode plate disposed adjacent the emitter electrode plate. The device also includes a base terminal external to the semiconductor chip and connected to the base electrode plate and an emitter terminal external to the semiconductor chip and connected to the emitter electrode plate. The base terminal and the emitter terminal are disposed along an edge of the semiconductor chip, and the base electrode strip and the emitter electrode strip are perpendicular to the edge of the semiconductor chip.

Abstract: A nonvolatile semiconductor memory device according to an example of the present invention includes source/drain diffusion layers, a first insulation film on a channel between the source/drain diffusion layers, a floating gate electrode on the first insulation film and composed of first electrically conductive layers, a second insulation film on the floating gate electrode, and a control gate electrode on the second insulation film. In the case where one first electrically conductive layer excluding a top layer is defined as a reference layer among first electrically conductive layers, a work function of the reference layer is 4.0 eV or more and work functions of the reference layer and of the first electrically conductive layers above the reference layer gradually increase as the layers are proximal to the second insulation film.

Abstract: A TFT and an OLED device are provided. The TFT includes a substrate, a gate, a gate insulator, a source/drain layer, an isolated layer, and a channel layer. The gate is disposed on the substrate. The gate insulator is disposed on the substrate and covers the gate. The source/drain layer is disposed on the gate insulator, and exposes a portion of the gate insulator above the gate. The isolated layer is disposed on the source/drain layer and has an opening to expose a portion of the gate insulator and a portion of the source/drain layer above the gate. The channel layer is disposed in the opening of the isolated layer. Further, the channel layer is exposed by the opening and is electrically connected to the source/drain layer. On the other hand, the OLED device mainly includes a driving circuit and an organic electro-luminescent unit.

Abstract: To achieve a high-speed and reliable read operation. A unit cell is constituted by a select gate 3 provided in a first region and on a substrate 1 with an insulating film 2 interposed inbetween, a floating gate 6a provided in a second region adjacent to the first region with an insulating film 5 interposed inbetween, a diffusion region 7a provided in a third region adjacent to the second region and on the surface of the substrate, and a control gate 11 provided on the top of the floating gate 6a with an insulating film 8 interposed inbetween. Each data bit is stored using corresponding first unit cell and second unit cell.

Abstract: A method of forming semiconductor device treating a surface of a substrate to produce a discontinuous growth of a material on the surface through rapid thermal oxidation of the substrate surface at a temperature of less than about 700° C.

Abstract: A method for producing a compound semiconductor wafer used for production of HBT by vapor growth of a sub-collector layer, a collector layer, a base layer and an emitter layer in this turn on a compound semiconductor substrate using MOCVD method wherein the base layer is grown as a p-type compound semiconductor thin film layer containing at least one of Ga, Al and In as a Group III element and As as a Group V element under such growth conditions that the growth rate gives a growth determined by a Group V gas flow rate-feed.

Abstract: A double-polysilicon, self-aligned bipolar transistor has a collector region formed in a doped semiconductor substrate, an intrinsic counterdoped base formed on the surface of the substrate and a doped intrinsic emitter formed in the surface of the intrinsic base. An etch stop insulator layer overlies the intrinsic base layer above the collector. A base contact layer of a conductive material overlies the etch stop dielectric layer and the intrinsic base layer. A dielectric layer overlies the base contact layer. A wide window extends through the insulator layer and the base contact layer down to the insulator layer. An island or a peninsula is formed in the wide window leaving at least one narrowed window within the wide window, with sidewall spacers in either the wide window or the narrowed window. The narrowed windows are filled with doped polysilicon forming an extrinsic emitter with the intrinsic emitter formed below the extrinsic emitter in the surface of the intrinsic base.

Abstract: According to one embodiment of the invention, a method used in manufacturing an intermediate structure in a bipolar junction transistor includes implanting a base dopant in a semiconductor substrate to form a base, forming a dielectric layer outwardly from the semiconductor substrate, etching a portion of the dielectric layer to form an emitter region, forming an emitter polysilicon layer on the semiconductor substrate, and after forming the emitter polysilicon layer, annealing the semiconductor substrate.