Abstract: A semiconductor device may include a substrate having a source region and a drain region, and a gate arranged over the substrate and between the source region and the drain region. A first interlevel dielectric (ILD) layer may be at least partially arranged over the substrate and the gate. A conductive field plate may be arranged over the first ILD layer. At least one drain contact may extend through the first ILD layer over the drain region and may be coupled to the conductive field plate. A drain captive structure may be disposed in the first ILD layer and adjacent to the drain region, the drain captive structure having a trench comprising an air gap, wherein the drain captive structure is laterally spaced apart from sidewalls of the gate.

Abstract: A structure includes a semiconductor fin; a first source/drain region and a second source/drain region in the semiconductor fin; a first doping region about the first source/drain region, defining a channel region in the semiconductor fin; and a second doping region about the second source/drain region, defining a drain extension in the semiconductor fin. A gate structure is over the channel region and the drain extension. The gate structure includes a gate dielectric layer, a first metal layer adjacent a second metal layer over the gate dielectric layer, and a contiguous gate conductor over the first metal layer and the second metal layer. One of the metal layers is over the channel region and the other is over the drain extension. The metal layers may have different thicknesses and/or work functions, to improve transconductance and RF performance of an LDMOS FinFET including the structure.

Abstract: A silicon carbide semiconductor device includes a diffusion protective layer provided below a gate insulating film, a gate line provided on an insulation film on the bottom face of a terminal trench and electrically connected to a gate electrode, the terminal trench being located more toward the outer side than the gate trench, a gate pad joined to the gate line in the terminal trench, a terminal protective layer provided below the insulation film on the bottom face of the terminal trench, and a source electrode electrically connected to a source region, the diffusion protective layer, and the terminal protective layer. The diffusion protective layer has first extensions that extend toward the terminal protective layer and that are separated from the terminal protective layer. This configuration inhibits an excessive electric field from being applied to the gate insulating film provided on the bottom face of the gate trench.

Abstract: An LDMOS device includes a handle portion having a buried dielectric layer and a semiconductor layer thereon doped a second dopant type. A drift region doped a first type is within the semiconductor layer providing a drain extension. A gate stack includes a gate electrode on a gate dielectric layer on respective sides of a junction with the drift region. A DWELL region is within the semiconductor layer. A source region doped the first type is within the DWELL region. A drain region doped the first type is within the drift region. A first partial buried layer doped the second type is in a first portion of the drift region including under the gate electrode. A second partial buried layer doped the first type is in a second portion of the drift region including under the drain.

Abstract: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F.sup.2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.

Abstract: The present disclosure provides a method for forming a Lateral Double-Diffused MOSFET (LDMOS). The method includes providing a semiconductor substrate having a first conductivity type; forming a first shallow trench isolation (STI) structure in the semiconductor substrate; and applying a first ion implantation to form a drift region of a second conductivity type into the semiconductor substrate with the drift region surrounding the first STI structure. The method also includes applying a counter-doping implantation to form a counter-doped region having the first conductivity in the drift region and forming a body region on one side of the drift region in the semiconductor substrate. The method further includes forming a gate structure on the semiconductor substrate, wherein one end of the gate structure extends to an area on the body region another end of the gate structure extends to an area on the first STI region.

Abstract: A semiconductor device and method of manufacturing the same are provided. A device can include an LDMOS region and a high side region on a semiconductor substrate. The device can further include an insulating region separating the LDMOS region from the high side region and the insulating region can include a plurality of second conductive type wells, a plurality of second conductive type buried layer patterns, or both.

Abstract: A laterally-diffused metal oxide semiconductor (LDMOS) device and method of manufacturing the same are provided. The LDMOS device can include a drift region, a source region and a drain region spaced a predetermined interval apart from each other in the drift region, a field insulating layer formed in the drift region between the source region and the drain region, and a first P-TOP region formed under the field insulating layer. The LDMOS device can further include a gate polysilicon covering a portion of the field insulating layer, a gate electrode formed on the gate polysilicon, and a contact line penetrating the gate electrode, the gate polysilicon, and the field insulating layer.

Abstract: A semiconductor device formed on a silicon-on-insulator substrate includes a gate electrode, a gate insulation film, a drain diffusion region, a drift region, a body region, a plurality of source diffusion regions, and a plurality of charge collection diffusion regions. The source diffusion regions and charge collection diffusion regions are of mutually opposite conductivity types, and alternate with one another in the direction paralleling the width of the gate electrode. The half-width of each source diffusion region is equal to or less than the length of the gate electrode plus the half-length of the drift region.

Abstract: A high voltage laterally diffused metal-oxide-semiconductor (HV LDMOS) device, particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate having at least one highly doped buried portion, a first doped well grown over the substrate, a gate structure formed on the first well, a source and a drain formed on either side of the gate structure, and a second doped well having a U-shaped cross section formed in the first well. A portion of the drain is formed over the first well outside of the second well.

Abstract: A semiconductor device, in particular, an extended drain metal oxide semiconductor (ED-MOS) device, defined by a doped shallow drain implant in a drift region. For example, an extend drain n-channel metal oxide semiconductor (ED-NMOS) device is defined by an n doped shallow drain (NDD) implant in the drift region. The device is also characterized by conductive layer separated from a substrate in part by a thin oxide layer and in another part by a thick/thin oxide layer. A method of fabricating a semiconductor device, in particular an ED-NMOS device, having a doped shallow drain implant of a drift region is also provided. A method is also provided for fabricating conductive layer disposed in part across a thin oxide layer and in another part across a thick/thin oxide layer.

Abstract: The p-channel LDMOS transistor comprises a semiconductor substrate (1), an n well (2) of n-type conductivity in the substrate, and a p well (3) of p-type conductivity in the n well. A portion of the n well is located under the p well. A drain region (4) of p-type conductivity is arranged in the p well, and a source region (9) of p-type conductivity is arranged in the n well. A gate dielectric (7) is arranged on the substrate, and a gate electrode (8) is arranged on the gate dielectric. A body contact region (14) of n-type conductivity is arranged in the n well. A p implant region (17) is arranged in the n well under the p well in the vicinity of the p well. The p implant region locally compensates n-type dopants of the n well.

Abstract: A laterally diffused metal oxide semiconductor (LDMOS) device, and a method of manufacturing the same are provided. The LDMOS device can include a drain region of a bootstrap field effect transistor (FET), a source region of the bootstrap FET, a drift region formed between the drain region and the source region, and a gate formed at one side of the source region and on the drift region.

Abstract: Disclosed are a TFT array substrate for decreasing a bezel width and a display device including the same. The display device includes a first substrate including a display area (including a pixel formed in a pixel area defined by a gate line and a data line which intersect) and a non-display area that includes a built-in shift register connected to the gate line and a gate link part connected to the built-in shift register, a second substrate facing the first substrate, and a seal pattern formed in the non-display area of the first substrate in correspondence with an edge portion of the second substrate to facing-couple the first and second substrates. The seal pattern includes a first hardening area hardened by a first hardening process, and a second hardening area hardened by a second hardening process.

Abstract: A method for filling a trench with a metal layer is disclosed. A deposition apparatus having a plurality of supporting pins is provided. A substrate and a dielectric layer disposed thereon are provided. The dielectric layer has a trench. A first deposition process is performed immediately after the substrate is placed on the supporting pins to form a metal layer in the trench, wherein during the first deposition process a temperature of the substrate is gradually increased to reach a predetermined temperature. When the temperature of the substrate reaches the predetermined temperature, a second deposition process is performed to completely fill the trench with the metal layer. The present invention further provides a semiconductor device having an aluminum layer with a reflectivity greater than 1, wherein the semiconductor device is formed by using the method.

Abstract: A device includes a semiconductor substrate, source and drain regions in the semiconductor substrate, a channel region in the semiconductor substrate between the source and drain regions through which charge carriers flow during operation from the source region to the drain region, and a drift region in the semiconductor substrate, on which the drain region is disposed, and through which the charge carriers drift under an electric field arising from application of a bias voltage between the source and drain regions. A PN junction along the drift region includes a first section at the drain region and a second section not at the drain region. The drift region has a lateral profile that varies such that the first section of the PN junction is shallower than the second section of the PN junction.

Abstract: A lateral-diffused-metal-oxide-semiconductor device having improved safe-operating-area is provided. The LDMOS device includes spaced-apart source and drain, separated by a first insulated gate structure, and spaced-apart source and body contact The spaced-apart source and BC are part of the emitter-base circuit of a parasitic bipolar transistor that can turn on prematurely, thereby degrading the SOA of prior art four-terminal LDMOS devices. Rather than separating the source and BC with a shallow-trench-isolation region as in the prior art, the semiconductor surface in the gap between the spaced-apart source and BC has there-over a second insulated gate structure, with its gate conductor electrically tied to the BC. When biased, the second insulated gate structure couples the source and BC lowering the parasitic resistance in the emitter-base circuit, thereby delaying turn-on of the parasitic transistor and improving the SOA of such 4-T LDMOS devices.

Abstract: The present invention discloses an LDMOS device having an increased punch-through voltage and a method for making same. The LDMOS device includes: a substrate; a well of a first conductive type formed in the substrate; an isolation region formed in the substrate; a body region of a second conductive type in the well; a source in the body region; a drain in the well; a gate structure on the substrate; and a first conductive type dopant region beneath the body region, for increasing a punch-through voltage.

Abstract: A device includes a semiconductor region in a semiconductor chip, a gate dielectric layer over the semiconductor region, and a gate electrode over the gate dielectric. A drain region is disposed at a top surface of the semiconductor region and adjacent to the gate electrode. A gate spacer is on a sidewall of the gate electrode. A dielectric layer is disposed over the gate electrode and the gate spacer. A conductive field plate is over the dielectric layer, wherein the conductive field plate has a portion on a drain side of the gate electrode. A deep metal via is disposed in the semiconductor region. A source electrode is underlying the semiconductor region, wherein the source electrode is electrically shorted to the conductive field plate through the deep metal via.

Abstract: A reduced surface field (RESURF) structure and a lateral diffused metal oxide semiconductor (LDMOS) device including the same are provided. The RESURF structure includes a substrate of a first conductivity type, a deep well region of a second conductivity type, an isolation structure, at least one trench insulating structure, and at least one doped region of the first conductivity type. The deep well region is disposed in the substrate. The isolation structure is disposed on the substrate. The trench insulating structure is disposed in the deep well region below the isolation structure. The doped region is disposed in the deep well region and surrounds a sidewall and a bottom of the trench insulating structure.

Abstract: Embodiments of the present invention describe a semiconductor device implementing the reduced-surface-field (RESURF) effect. The semiconductor device comprises a source/drain region having a plurality of isolation regions interleaved with source/drain extension regions. A gate electrode is formed on the semiconductor device, where the gate electrode includes gate finger elements formed over the isolation regions to induce capacitive coupling. The gate finger elements enhance the depletion of the source/drain extension regions, thus inducing a higher breakdown voltage.

Abstract: A silicon on insulator N type semiconductor device, includes a N type drift region, a P type deep well, an N type buffer well, a P type drain region, an N type source region and a P type body contact region; a field oxide layer and a gate oxide layer arranged on a silicon surface, and a polysilicon lattice arranged on the gate oxide layer; and an N type triode drift region, a P type deep well, an N type triode buffer well, a P type emitting region, an N type base region, an N type source region and a P type body contact region; a field oxide layer and a gate oxide layer arranged on a silicon surface, and a polysilicon lattice arranged on the gate oxide layer.

Abstract: An LDMOS is formed with a field plate over the n? drift region, coplanar with the gate stack, and having a higher work function than the gate stack. Embodiments include forming a first conductivity type well, having a source, surrounded by a second conductivity type well, having a drain, in a substrate, forming first and second coplanar gate stacks on the substrate over a portion of the first well and a portion of the second well, respectively, and tuning the work functions of the first and second gate stacks to obtain a higher work function for the second gate stack. Other embodiments include forming the first gate stack of a high-k metal gate and the second gate stack of a field plate on a gate oxide layer, forming the first and second gate stacks with different gate electrode materials on a common gate oxide, and forming the gate stacks separated from each other and with different gate dielectric materials.

Abstract: A semiconductor device includes a second conductive-type deep well configured above a substrate. The deep well includes an ion implantation region and a diffusion region. A first conductive-type first well is formed in the diffusion region. A gate electrode extends over portions of the ion implantation region and of the diffusion region, and partially overlaps the first well. The ion implantation region has a uniform impurity concentration whereas the impurity concentration of the diffusion region varies from being the highest concentration at the boundary interface between the ion implantation region and the diffusion region to being the lowest at the portion of the diffusion region that is the farthest away from the boundary interface.

Abstract: Disclosed are an LDMOS device and a method for manufacturing the same capable of decreasing the concentration of a drift region between a source finger tip and a drain, thereby increasing a breakdown voltage. An LDMOS device includes a gate which is formed on a substrate, a source and a drain which are separately arranged on both sides of the substrate with the gate interposed therebetween, a field oxide film which is formed to have a step between the gate and the drain, a drift region which is formed of first condition type impurity ions between the gate and the drain on the substrate, and at least one internal field ring which is formed inside the drift region and formed by selectively ion-implanting second conduction type impurity ions in accordance with the step of the field oxide film.

Abstract: A method of forming a semiconductor device is provided that includes forming an oxide containing isolation region in a semiconductor substrate to define an active semiconductor region. A blanket gate stack including a high-k gate dielectric layer may then be formed on the active semiconductor region. At least a portion of the blanket gate stack extends from the active semiconductor device region to the isolation region. The blanket gate stack may then be etched to provide an opening over the isolation region. The surface of the isolation region that is exposed by the opening may then be isotropically etched to form an undercut region in the isolation region that extend under the high-k gate dielectric layer. An encapsulating dielectric material may then be formed in the opening filling the undercut region. The blanket gate stack may then be patterned to form a gate structure.

Abstract: A first annular isolation trench is formed in a periphery of an element region, and a second annular isolation trench is formed around the first annular isolation trench with a predetermined distance provided from the first annular isolation trench, and a semiconductor layer between the first annular isolation trench and the second annular isolation trench is separated into a plurality of portions by a plurality of linear isolation trenches formed in the semiconductor layer between the first annular isolation trench and the second annular isolation trench, and the semiconductor layer (source-side isolation region) which opposes a p-type channel layer end portion and is located between the first annular isolation trench and the second annular isolation trench is separated from other semiconductor layers (drain-side isolation regions) by the linear isolation trenches.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate, a dielectric layer, a dielectric structure and an electrode structure. The dielectric layer is on an upper substrate surface of the semiconductor substrate. The dielectric structure and the semiconductor substrate have opposing first and second interfaces therebetween. The electrode structure comprises an electrode truck portion and at least one electrode branch portion. The at least one electrode branch portion is extended from the electrode truck portion down into the dielectric structure. The at least one electrode branch portion and the first interface have the smallest gap distance substantially bigger than 300 ? therebetween.

Abstract: A semiconductor device includes a second conductive-type deep well configured above a substrate. The deep well includes an ion implantation region and a diffusion region. A first conductive-type first well is formed in the diffusion region. A gate electrode extends over portions of the ion implantation region and of the diffusion region, and partially overlaps the first well. The ion implantation region has a uniform impurity concentration whereas the impurity concentration of the diffusion region varies from being the highest concentration at the boundary interface between the ion implantation region and the diffusion region to being the lowest at the portion of the diffusion region that is the farthest away from the boundary interface.

Abstract: The present disclosure discloses a lateral high-voltage transistor and associated method for making the same.

Abstract: A MOS transistor is described, including: a source region and a drain region in a semiconductor substrate, an isolation between the source region and the drain region, a first gate conductor between the source region and the isolation, at least one conductive plug electrically connected to the first gate conductor and penetrating into the isolation, and at least one second gate conductor on the isolation, which is electrically connected to the first gate conductor and the at least one conductive plug. One of the at least one conductive plug is between the first gate conductor and the at least one second gate conductor.

Abstract: A schottky diode includes a drift region of a first conductivity type and a lightly doped silicon region of the first conductivity type in the drift region. A conductor layer is over and in contact with the lightly doped silicon region to form a schottky contact with the lightly doped silicon region. A highly doped silicon region of the first conductivity type is in the drift region and is laterally spaced from the lightly doped silicon region such that upon biasing the schottky diode in a conducting state, a current flows laterally between the lightly doped silicon region and the highly doped silicon region through the drift region. A plurality of trenches extend into the drift region perpendicular to the current flow. Each trench has a dielectric layer lining at least a portion of the trench sidewalls and at least one conductive electrode.

Abstract: A lateral-diffused-metal-oxide-semiconductor device having improved safe-operating-area is provided. The LDMOS device includes spaced-apart source and drain, separated by a first insulated gate structure, and spaced-apart source and body contact The spaced-apart source and BC are part of the emitter-base circuit of a parasitic bipolar transistor that can turn on prematurely, thereby degrading the SOA of prior art four-terminal LDMOS devices. Rather than separating the source and BC with a shallow-trench-isolation region as in the prior art, the semiconductor surface in the gap between the spaced-apart source and BC has there-over a second insulated gate structure, with its gate conductor electrically tied to the BC. When biased, the second insulated gate structure couples the source and BC lowering the parasitic resistance in the emitter-base circuit, thereby delaying turn-on of the parasitic transistor and improving the SOA of such 4-T LDMOS devices.

Abstract: A semiconductor device includes a source region disposed with a semiconductor substrate; a drain region disposed with the semiconductor substrate; a gate region disposed onto the semiconductor substrate and positioned between the source region and the drain region. The semiconductor device also includes a gate oxide region disposed onto the semiconductor substrate in contact with the gate region and a well region implanted onto the semiconductor substrate and under the gate region and the gate oxide region. The gate oxide region has a lower outer edge portion that contacts the well region.

Abstract: A semiconductor device includes a substrate having first and second regions, a device isolation layer on the substrate defining an active region in each of the first and second regions, a gate pattern on the active region of each of the first and second regions, and a first dopant region and a second dopant region in each of the first and second regions of the substrate, the gate pattern in each of the first and second regions being between respective first and second dopant regions. At least one of upper surfaces of the first and second dopant regions in the second region is lower in level than an upper surface of the substrate under the gate pattern in the second region, the first and second dopant regions in the second region having an asymmetric recessed structure with respect to the gate pattern in the second region.

Abstract: A method of forming a semiconductor device is provided that includes forming an oxide containing isolation region in a semiconductor substrate to define an active semiconductor region. A blanket gate stack including a high-k gate dielectric layer may then be formed on the active semiconductor region. At least a portion of the blanket gate stack extends from the active semiconductor device region to the isolation region. The blanket gate stack may then be etched to provide an opening over the isolation region. The surface of the isolation region that is exposed by the opening may then be isotropically etched to form an undercut region in the isolation region that extend under the high-k gate dielectric layer. An encapsulating dielectric material may then be formed in the opening filling the undercut region. The blanket gate stack may then be patterned to form a gate structure.

Abstract: Embodiments of semiconductor devices and driver circuits include a semiconductor substrate having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within area of the substrate contained by the isolation structure, and a diode circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a body region of the second conductivity type, and the diode circuit is connected between the isolation structure and the body region. The diode circuit may include one or more Schottky diodes and/or PN junction diodes. In further embodiments, the diode circuit may include one or more resistive networks in series and/or parallel with the Schottky and/or PN diode(s).

Abstract: A multi-region (81, 83) lateral-diffused-metal-oxide-semiconductor (LDMOS) device (40) has a semiconductor-on-insulator (SOI) support structure (21) on or over which are formed a substantially symmetrical, laterally internal, first LDMOS region (81) and a substantially asymmetric, laterally edge-proximate, second LDMOS region (83). A deep-trench isolation (DTI) wall (60) substantially laterally terminates the laterally edge-proximate second LDMOS region (83). Electric field enhancement and lower source-drain breakdown voltages (BVDSS) exhibited by the laterally edge-proximate second LDMOS region (83) associated with the DTI wall (60) are avoided by providing a doped SC buried layer region (86) in the SOI support structure (21) proximate the DTI wall (60), underlying a portion of the laterally edge-proximate second LDMOS region (83) and of opposite conductivity type than a drain region (31) of the laterally edge-proximate second LDMOS region (83).

Abstract: The present invention discloses a hybrid high voltage device and a manufacturing method thereof. The hybrid high voltage device is formed in a first conductive type substrate, and includes at least one lateral double diffused metal oxide semiconductor (LDMOS) device region and at least one vent device region, wherein the LDMOS device region and the vent device region are connected in a width direction and arranged in an alternating order. Besides, corresponding high voltage wells, sources, drains, body regions, and gates of the LDMOS device region and the vent device region are connected to each other respectively.

Abstract: An ultra-high voltage n-type-metal-oxide-semiconductor (UHV NMOS) device with improved performance and methods of manufacturing the same are provided. The UHV NMOS includes a substrate of P-type material; a first high-voltage N-well (HVNW) region disposed in a portion of the substrate; a source and bulk p-well (PW) adjacent to one side of the first HVNW region, and the source and bulk PW comprising a source and a bulk; a gate extended from the source and bulk PW to a portion of the first HVNW region, and a drain disposed within another portion of the first HVNW region that is opposite to the gate; a P-Top layer disposed within the first HVNW region, the P-Top layer positioned between the drain and the source and bulk PW; and an n-type implant layer formed on the P-Top layer.

Abstract: A high voltage metal-oxide-semiconductor (HV MOS) device includes a substrate, a gate positioned on the substrate, a drain region formed in the substrate, a source region formed in the substrate, a first doped region formed in between the drain region and the source region, and a second doped region formed over a top of the first doped region or/and under a bottom of the first doped region. The drain region, the source region, and the second doped region include a first conductivity type, the first doped region includes a second conductivity type, and the first conductivity type and the second conductivity type are complementary.

Abstract: A semiconductor structure comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate and extending down from a surface of the substrate; a first well having the first conductive type and a second well having the second conductive type both formed in the deep well and extending down from the surface of the substrate, and the second well spaced apart from the first well; a gate electrode formed on the substrate and disposed between the first and second wells; an isolation extending down from the surface of the substrate and disposed between the gate electrode and the second well; a conductive plug including a first portion and a second portion electrically connected to each other, and the first portion electrically connected to the gate electrode, and the second portion penetrating into the isolation.

Abstract: A method of forming a drain extended metal-oxide-semiconductor (MOS) transistor includes forming a gate structure including a gate electrode on a gate dielectric on a semiconductor surface portion of a substrate. The semiconductor surface portion has a first doping type. A source is formed on one side of the gate structure having a second doping type. A drain is formed including a highly doped portion on another side of the gate structure having the second doping type. A masking layer is formed on a first portion of a surface area of the highly doped drain portion. A second portion of the surface area of the highly doped drain portion does not have the masking layer. Selectively siliciding is used to form silicide on the second portion. The masking layer blocks siliciding on the first portion so that the first portion is silicide-free.

Abstract: A method for semiconductor processing is provided wherein a workpiece having an underlying body and a plurality of features extending therefrom, is provided. A first set of the plurality of features extend from the underlying body to a first plane, and a second set of the plurality features extend from the underlying body to a second plane. A protection layer overlies each of the plurality of features and an isolation layer overlies the underlying body and protection layer, wherein the isolation has a non-uniform first oxide density associated therewith. The isolation layer anisotropically etched based on a predetermined pattern, and then isotropically etched, wherein a second oxide density of the isolation layer is substantially uniform across the workpiece. The predetermined pattern is based, at least in part, on a desired oxide density, a location and extension of the plurality of features to the first and second planes.

Abstract: A semiconductor device includes a second conductive-type deep well configured above a substrate. The deep well includes an ion implantation region and a diffusion region. A first conductive-type first well is formed in the diffusion region. A gate electrode extends over portions of the ion implantation region and of the diffusion region, and partially overlaps the first well. The ion implantation region has a uniform impurity concentration whereas the impurity concentration of the diffusion region varies from being the highest concentration at the boundary interface between the ion implantation region and the diffusion region to being the lowest at the portion of the diffusion region that is the farthest away from the boundary interface.

Abstract: A semiconductor device includes a second conductive-type well configured over a substrate, a first conductive-type body region configured over the second conductive-type well, a gate electrode which overlaps a portion of the first conductive-type body region, and a first conductive-type channel extension region formed over the substrate and which overlaps a portion of the gate electrode.

Abstract: A lateral insulated-gate bipolar transistor includes a buried insulation layer which opens only part of the collector ion implantation region and isolates the other regions, thereby reducing the loss by the turn-off time. The lateral insulated-gate bipolar transistor further includes a deep ion implantation region formed to face towards the open part of the collector ion implantation region, thereby decreasing the hole current injected into a base region under an emitter ion implantation region, and thereby greatly increasing the latch-up current level by relatively increasing the hole current injected into the deep ion implantation region having no latch-up effect.

Abstract: The present invention discloses a method for controlling the impurity density distribution in semiconductor device and a semiconductor device made thereby. The control method includes the steps of: providing a substrate; defining a doped area which includes at least one first region; partially masking the first region by a mask pattern; and doping impurities in the doped area to form one integrated doped region in the first region, whereby the impurity concentration of the first region is lower than a case where the first region is not masked by the mask pattern.

Abstract: A semiconductor device comprises a source region, a drain region, and a drift region between the source and drain regions. A split gate is disposed over a portion of the drift region, and between the source and drain regions. The split gate includes first and second gate electrodes separated by a gate oxide layer. A super-junction structure is disposed within the drift region between the gate and the drain region.

Abstract: A lateral DMOS transistor formed on a silicon-on-insulator (SOI) structure has a higher breakdown voltage that results from a cavity that is formed in the bulk region of the SOI structure. The cavity exposes a portion of the bottom surface of the insulator layer of the SOI structure that lies directly vertically below the drift region of the DMOS transistor.