Abstract: The present invention relates to UV curable encapsulant compositions based on acrylic and/or methacrylic block copolymers, to structures containing these compositions especially photovoltaic cells and to the use of these compositions in photovoltaic cells. The liquid encapsulant composition according to the invention comprises: an acrylic or methacrylic block copolymer, at least one acrylic or methacrylic monomer and/or oligomer, and at least one photo initiator.

Abstract: Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.

Abstract: A photoelectric conversion device includes: a first substrate of which end portions are cut off so as to slope or with a groove shape; a photodiode and an amplifier circuit over the first substrate; a first electrode electrically connected to the photodiode and provided over one end portion of the first substrate; a second electrode electrically connected to the amplifier circuit and provided over an another end portion of the first substrate; and a second substrate having third and fourth electrodes thereon. The first and second electrodes are attached to the third and fourth electrodes, respectively, with a conductive material provided not only at the surfaces of the first, second, third, and fourth electrodes facing each other but also at the side surfaces of the first and second electrodes to increase the adhesiveness between a photoelectric conversion device and a member on which the photoelectric conversion device is mounted.

Abstract: A method of producing a LED package through controlled wetting.

Abstract: The presently disclosed subject matter describes a new sealing process of a specific type of photovoltaic cells named dye-sensitized solar cells. Currently, the sealing of these cells is made by means of a polymer, which connects the two electrode substrates made of glass, isolating the cell's inner content from the outside. The glass-based sealing method has the advantage of enhancing the cell's lifetime. However, glass sealing should not lead to the heating of the whole cell, which may cause its degradation. The process here unveiled employs a string of a glass precursor, a powder or a paste, that bounds the cell's entire external perimeter. The glass precursor string is then heated to its melting point with a laser beam, allowing the two substrates of the cell to stick together.

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

Abstract: A photovoltaic solar panel includes a front glass, a back glass, and a photovoltaic (PV) power generating layer encapsulated between the front glass and the back glass. The PV power generating layer is configured to convert ambient electromagnetic energy, received through the front glass, to a direct current (DC) power output. The PV solar panel also includes at least one component, disposed behind the PV power generating layer, selected from the group consisting of: a direct current to alternating current (DC-AC) inverter configured to convert the DC power output from the PV power generator to an alternating current (AC) power output, a battery, and an antenna.

Abstract: A packaged optoelectronic device and a method for manufacturing is provided. The packaged optoelectronic device includes at least one optoelectronic device with two electrodes sandwiched between a first barrier layer and a second barrier layer. At least one of the barrier layers comprises at least one aperture. Further, the packaged device includes a plurality of thin electrically conductive connectors. Each of the thin connectors extends out through the at least one aperture and is coupled to the anode or the cathode. Further, the thin connectors are connected to an external power source to provide power to the anode and the cathode.

Abstract: Photovoltaic modules are disclosed. The photovoltaic module comprises a front transparency, a potting material deposited on at least a portion of the front transparency, electrically interconnected photovoltaic cells applied to the potting material and a topcoat deposited on at least a portion of the electrically interconnected photovoltaic cells. Methods of making photovoltaic modules are also disclosed.

Abstract: An ultraviolet light-absorbing solar module is disclosed. The ultraviolet light transmission of a first sealant disposed between a solar cell and a transparent substrate is greater than the ultraviolet light transmission of a second sealant disposed between the solar cell and a back plate. The ultraviolet light can pass through the first sealant and be utilized by the solar cell. The ultraviolet light can be further absorbed by the second sealant. Therefore the degradation of the back plate caused by being exposed of ultraviolet light can be prevented. A fabricating method of the ultraviolet light-absorbing solar module is also disclosed.

Abstract: A thin film solar module including a first film web, a series of electrically conductive contact pads arranged at intervals on the first film web, where the contact pads each have a first and a second area, and a series of flexible thin film solar cells. The thin film solar cells each include a first side which at least partially forms a first electrically conductive pole, a second side, which at least partially forms a second electrically conductive pole, a photovoltaically active layer composition, and at least one electrical contact located on the layer composition, which contacts the first electrically conductive pole, wherein the electrical conductor extends past a side of the photovoltaically active layered composition.

Abstract: A photovoltaic module is disclosed. The photovoltaic module comprises an array of shingled tiles disposed between a transparent front substrate and a back substrate, wherein the array of shingled tiles comprises a plurality of photovoltaic tiles in electrically contact with each other and positioned in overlapping rows. Each photovoltaic tile comprises a front metallic contact layer disposed on an epitaxial film stack disposed on a back metallic contact layer disposed on a support carrier layer. The photovoltaic module includes at least one busbar in electrical contact with the array of shingled tiles and disposed between the front and back glass substrates. The photovoltaic module also includes an encapsulation layer between the front and back glass substrates.

Abstract: An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.

Abstract: According to one embodiment, a solid-state imaging device includes a photoelectric conversion element, a light blocking section, and a protective layer. The protective layer protects the photoelectric conversion element and the light blocking section. A step section is formed on a surface of the protective layer. The step section is formed having a difference in height in a direction perpendicular to an irradiation surface of the photoelectric conversion element. The step section is provided in the light receiving area.

Abstract: A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate; providing a sensor chip disposed on the substrate; providing a lens module set over the sensing area of the chip to form a semi-finished component; providing a mold that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween; injecting a molding compound into the mold cavity; and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound. The buffer layer can fill the air gap between the upper surface of the lens module and the upper mold member, thereby preventing the upper surface of the lens module from being polluted by the molding compound.

Abstract: A method of forming an embedded wafer level optical package includes attaching a sensor die, PCB bars and an LED on adhesive tape laminated on a carrier, attaching a dam between two light sensitive sensors of the sensor die, encapsulating the sensor die, the PCB bars, the LED, and the dam in an encapsulation layer, debonding the carrier, grinding a top surface of the encapsulation layer, forming vias through the encapsulation layer to the sensor die and the LED, filling the vias with conductive material, metalizing the top surface of the encapsulation layer, dielectric coating of the top surface of the encapsulation layer, dielectric coating of a bottom surface of the encapsulation layer, patterning the dielectric coating of the bottom surface of the encapsulation layer, and plating the patterned dielectric coating of the bottom surface of the encapsulation layer.

Abstract: A thin film solar cell and process for forming the same. The solar cell includes a bottom electrode layer, semiconductor light absorbing layer, top electrode layer, and a protective moisture barrier layer. In some embodiments, the barrier layer is formed of a water-insoluble material. The barrier layer helps protect the top electrode layer from exposure and damage caused by water and oxygen.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.

Abstract: Photovoltaic devices are provided that can include a transparent substrate defining a front surface; a plurality of thin film layers on an inner surface of the transparent substrate that is opposite of the front surface; a first lead connected to one of the photovoltaic cells defined by the plurality of thin film layers; an encapsulation substrate defining a connection aperture through which the first lead extends upon lamination of the encapsulation substrate and the transparent substrate together; and, a reinforcement element positioned on the front surface of the transparent substrate opposite from the connection aperture defined in the encapsulation substrate. Methods and kits are also provided for strengthening a photovoltaic device.

Abstract: Disclosed is a dye-sensitized solar cell module and a method of manufacturing the same. More specifically a counter electrode has connection parts formed within the side surfaces of the transparent conductive substrates. Edges of the working electrode and the counter electrode are bonded with each other by a sealant along the outer peripheral except for at one or more portions of the edges to form an electrolyte injection port. An electrolyte is then injected through the electrolyte injection hole into a space between the working electrode and the counter electrode. The electrolyte injection hole is then sealed by a sealant.

Abstract: The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining. By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.

Abstract: A solar energy module includes one or more solar cells, each having a front side for receiving light and an opposite back side. An encapsulant material covers at least the front side of each of the solar cells. The solar energy module also includes a backskin layer formed from a cross-linked mixture of high density polyethylene (HDPE) and acid copolymer bonded to the back side of each of the solar cells.

Abstract: A plurality of MEMS devices are formed on a substrate, a sacrificial layer is formed to cover each of the MEMS devices and a protective cap layer is formed on the sacrificial layer. A release hole is formed through the protective cap layer to the underlying sacrificial layer, and a releasing agent is introduced through the release hole to remove the sacrificial layer under the protective cap layer and expose a MEMS device. Optionally, the MEMS device can be released with the same releasing agent or, optionally, with a secondary releasing agent. The release hole is solder sealed, to form a hermetic seal of the MEMS device. Optionally, release holes are formed at a plurality of locations, each over a MEMS device and the releasing forms a plurality of hermetic sealed MEMS devices on the wafer substrate, which are singulated to form separate hermetically sealed MEMS devices.

Abstract: A thin film photovoltaic module that is connectable to a terminal includes a first glass sheet defining a sun facing surface and a second glass sheet defining a back facing surface opposite the front side surface. The second glass sheet includes a feed-though opening extending through the second glass sheet. A photovoltaic material is between the first glass sheet and the second glass sheet. An encapsulant material is between the first glass sheet and the second glass sheet that bonds the first glass sheet and the second glass sheet together and seals the photovoltaic material from moisture. A conductor is electrically connected to the photovoltaic material at one end. The conductor passes through the feed-though opening. A reinforcing member is disposed on the sun facing surface of the first glass sheet. The reinforcing member has a footprint hanging over at least a portion of the feed-through opening.

Abstract: Disclosed are a dye sensitized solar cell and a sealing method thereof. The dye sensitized solar cell includes: an upper electrode glass substrate and a lower electrode glass substrate having a hole formed in at least one thereof; a first sealing material forming a cell internal space by maintaining an interval between the upper electrode glass substrate and the lower electrode glass substrate; an electrolytic solution filled in the cell internal space between the upper electrode glass substrate and the lower electrode glass substrate; and a plug inserted and pressed into the hole to seal the hole.

Abstract: A multilayer film suitable as a backing for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises at least 35% by weight, based on the overall layer moulding composition, of polyamide; b) a layer of a moulding composition which comprises at least 50% by weight, based on the overall layer moulding composition, of a polymer fraction consisting of: I) 30 to 95 parts by weight of polyamide and II) 5 to 70 parts by weight of polyolefin, where a sum of I) and II) in parts by weight is 100; and c) a layer of a moulding composition which comprises at least 35% by weight, based on the overall moulding composition, of polyamide; wherein at least one of layers a), b) and c) further comprises a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof.

Abstract: A method of concentrated photovoltaic (CPV) packaging of a semiconductor solar cell for converting solar energy into electricity. The method includes affixing a photovoltaic device to a laminated substrate structure that is obtained by an additive or subtractive lamination process, attaching a photovoltaic device to a mounting paddle of the laminated substrate structure, connecting wire bonding of the photovoltaic device to leads of the laminated substrate structure, and applying overmold material to affix the photovoltaic device to the mounting paddle. During the application of the overmold material, a portion of the photovoltaic device is exposed to allow for the collection of the solar energy.

Abstract: An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite.

Abstract: A moisture trapping filler composition may include a filler material combined with a desiccant material.

Abstract: A imaging member, such as a photoreceptor, comprising a structured organic film comprising a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may comprise at least one secondary component, such as an antioxidant.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: Apparatus for accurately picking and placing one or more optoelectronic devices for vacuum lamination of materials in a way that minimizes stress to the materials.

Abstract: Methods and devices are provided for improved sensor systems. In one embodiment of the present invention, sensor system is provided that includes a sensor and sensor electronics integrated into the same ground plane.

Abstract: A shaped tab conductor configured to allow more incident light to strike a cell substrate, improving the photovoltaic efficiency of the cell. The shaped tab conductor is configured to reduce the amount of incident light that is blocked by the tab from reaching the surface of the cell substrate. The tab may also be configured to redirect light reflected from the cell surface back to the cell surface. The cross-section of the tab conductor may be polygonal, such as a rhombus, with at least one generally planar surface that forms an acute angle with the substrate.

Abstract: An integrated circuit chip includes a window cover over etchant holes in a dielectric layer and over a cavity in the substrate of said integrated circuit chip. The window cover extends at least 400 microns beyond the edge of the cavity. An integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edges of a cavity. A method of forming an integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edge of a cavity.

Abstract: Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.

Abstract: A method of making a photovoltaic panel includes previously preparing one or more pre-formed substrates with a first temperature and pressure to be non-planar, textured, embossed, colored, or combinations thereof. A manufacturer can then prepare a laminate assembly comprising one or more organic photovoltaic components one or more pre-formed substrates, and a barrier layer with one or more thermally-activated thermoplastic tie layers there between. The manufacturer can then finish the photovoltaic panel lamination by subjecting the assembly to a second set of temperatures and pressures sufficient to activate and bond the pre-formed substrate, barrier layer, and photovoltaic components without significantly softening the pre-formed substrates or otherwise degrading/damaging the organic photovoltaic components. A non-planar panel made by this method can be used in both exterior and interior decorative and/or structural applications where electrical generation is desired.

Abstract: A laminated module or panel of solar cells and a laminating method for making same comprise a top layer of melt flowable optically transparent molecularly flexible thermoplastic and a rear sheet of melt flowable insulating molecularly flexible thermoplastic both melt flowing at a temperature between about 80° C. and 250° C. and having a low glass transition temperature. Solar cells are encapsulated by melt flowing the top layer and rear sheet, and electrical connections are provided between front and back contacts thereof. Light passing through the transparent top layer impinges upon the solar cells and the laminated module exhibits sufficient flexural modulus without cross-linking chemical curing. Electrical connections may be provided by melt flowable electrically conductive molecularly flexible thermoplastic adhesive or by metal strips or by both.

Abstract: A photovoltaic module includes at least one photovoltaic cell, a back plate, at least two ribbons, an encapsulant layer, and a filler. The back plate is disposed over the photovoltaic cell, in which the back plate has a ribbon hole therein. The ribbons are electrically connected to the photovoltaic cell and pass through the ribbon hole. The encapsulant layer is disposed between the back plate and the photovoltaic cell, in which the encapsulant layer has at least one through hole therein, and both of the ribbons pass through the through hole. The filler fills the through hole of the encapsulant layer, in which a flowability of a material of the filler is greater than a flowability of a material of the encapsulant layer.

Abstract: A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.

Abstract: Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.

Abstract: An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface. A cover is mounted to the second surface and extends over and covers the aperture. The cover is optically transparent to at least one range of light wavelengths. A sensor chip is disposed in the cavity and mounted to the at least one step. The sensor chip includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors.

Abstract: The present invention relates to UV curable encapsulant compositions based on acrylic and/or methacrylic block copolymers, to structures containing these compositions especially photovoltaic cells and to the use of these compositions in photovoltaic cells. The liquid encapsulant composition according to the invention comprises: an acrylic or methacrylic block copolymer, at least one acrylic or methacrylic monomer and/or oligomer, and at least one photo initiator.

Abstract: A photovoltaic module is formed by encasing the edge of the photovoltaic module with a dielectric while passing internal module conductors through the edge encased. The edge encasing may be an overmolded dielectric through which the internal conductors pass or connectors may be provided in the overmolded dielectric to allow for external connection to the module. The photovoltaic module can also include mechanical attachment points formed in the molded dielectric to allow the module to be attached to a support structure.

Abstract: A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.

Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Abstract: Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.

Abstract: A photovoltaic device is generally provided that includes a plurality of thin film layers on a glass substrate. The plurality of thin film layers define a plurality of photovoltaic cells connected in series to each other. An insulating layer is positioned on the plurality of thin film layers, and a sealing layer on the thin film layers, wherein the sealing layer comprises a polymeric material. A first lead is positioned on the insulating layer and connected to a first bus bar. An encapsulating substrate is positioned on the adhesive layer, wherein the encapsulating substrate defines a connection aperture through which the first lead extends. The sealing layer is positioned under the connection aperture defined by the encapsulating substrate to act as a moisture barrier therethrough. Methods are also generally provided for manufacturing a photovoltaic device.

Abstract: The present invention is directed to techniques for fabricating solar cells that feature annealing of a substrate and subsequent formation of a combination passivation and antireflective layer in superimposition with a p-n junction formed on the substrate by introductions of impurities. It was determined that the time and cost for manufacture may be reduced by annealing the substrate before formation of the combination layer and maintaining the temperature proximate to the annealing temperature. To that end, upon completion of the anneal process the temperature of the substrate is maintained within an acceptable temperature range to reduce the time required for the substrate to reach temperature for formation of the combination layer. The combination layer is then formed without undue delay using plasma deposition processes.

Abstract: The present invention relates to an epoxy resin composition for optical semiconductor light-receiving element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a curing accelerator; and (D) a yellow colorant, in which the component (D) is contained in a ratio of 0.01% by weight or more based on the whole of the epoxy resin composition.