Abstract: A photovoltaic device and method of manufacture of a photovoltaic device including an assembly of at least two photovoltaic cells; and a lamination material inserted between each photovoltaic cell, each photovoltaic cell including: two current output terminals; at least one photovoltaic junction; current collection buses; and connection strips extending from the current collection buses to the current output terminals, all the current output terminals being placed on a single surface of the photovoltaic device.

Abstract: In a method of manufacturing a solar cell, an emitter layer is formed on a front surface of a substrate, a rear surface protective layer is formed on the emitter layer, and a plurality of recesses is formed in the rear surface protective layer. Then, a front electrode is formed on the emitter layer, and a rear surface electrode layer is formed on the rear surface protective layer. A substrate is heated to form a rear surface electric field layer. Since a portion of the rear surface protective layer is removed when the recesses are formed, the substrate may be prevented from being damaged, and thus photoelectric conversion efficiency of the solar cell may be improved.

Abstract: A process of manufacturing a solar cell module, the process comprising: (i) providing a solar cell pre-laminate assembly comprising a solar cell component comprising one or a plurality of solar cells and an encapsulant film or sheet consisting essentially of a non-neutralized acid copolymer composition prepared from (a) non-neutralized acid copolymer of an alpha olefin and about 15 to about 23 wt % of alpha,beta-ethylenically unsaturated carboxylic acid having 3 to 8 carbons, based on the total weight of the acid copolymer, wherein the acid copolymer has a Melt Index of greater than 100 to about 600 g/10 min, and (b) about 0.01 to about 10 wt %, based upon the total weight of the acid copolymer composition, of organic peroxide; and (ii) laminating the pre-laminate assembly to form the solar cell module by subjecting the assembly to heat and, optionally, vacuum.

Abstract: A new process of edge sealing for solar cell modules is described. The process comprises coating a waterproof material on the edge of the solar cell module to form a U-like shaped edge sealing which can achieve the function of shock absorber.

Abstract: Methods for fabricating a photovoltaic module, and the resulting photovoltaic module, are provided and include selecting a photovoltaic cell operable to convert photons to electrons, selecting a light transparent superstrate material having a superstrate absorption coefficient and a superstrate refractive index, and selecting an encapsulant having an encapsulant absorption coefficient and an encapsulant refractive index, wherein an absorption coefficient relationship between the superstrate absorption coefficient and the encapsulant absorption coefficient and a refractive index relationship between the superstrate refractive index and the encapsulant refractive index are selected such that there is a gain in efficiency, and assembling the photovoltaic module using the selected materials.

Abstract: An improved solar cell module and a method of manufacturing the same are disclosed in the invention. The solar cell modules includes: a solar cell matrix, having a number of conductive wires, for transforming solar energy into electric energy to be outputted; a front sheet, formed on one side of the solar cell matrix, for passing solar light; a back sheet, formed on the other side of the solar cell matrix, for passing solar light; and an isolating cover, covering the solar cell matrix, for protecting the solar cell matrix from stress, humidity and heat. A number of holes are formed through the back sheet and the isolating cover, the conductive wires are soldered with insulated cables passing through the holes, and an adhesive is used to seal the hole and fix the cables.

Abstract: A package for storing or transporting a solar cell sealing film includes: the solar cell sealing film containing a silane compound and/or a silane-modified resin; and a package bag packaging the solar cell sealing film. The absolute humidity inside the package is 1 to 15 g/m3. The package can store or transport the solar cell sealing film while adhesive force thereof with a substrate, solar cells, etc. is kept at a practicable level or higher. Furthermore, the package can reduce the breakage of the solar cells caused by an external shock while a solar cell module operates and the corrosion of electrodes caused by water etc. from the atmosphere.

Abstract: The invention relates to a composite structure comprising a photovoltaic cell adhering to an injected polymer (1), in which the photovoltaic cell exhibits an active face (2) adhering to a base (3), characterized in that the photovoltaic cell is continuous and its face directed away from the injected polymer (1) is caused to adhere to an encapsulating polymer (4) with a linear thermal expansion coefficient which does not differ by more than 65% from that of the injected polymer (1) and with a minimum melting point which allows it to withstand the injection of the latter and which promotes adhesion to the injected polymer (1), or in that the photovoltaic cell is openwork; a simple or multiple and monolithic or laminated window comprising such a structure.

Abstract: A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate; providing a sensor chip disposed on the substrate; providing a lens module set over the sensing area of the chip to form a semi-finished component; providing a mold that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween; injecting a molding compound into the mold cavity; and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound. The buffer layer can fill the air gap between the upper surface of the lens module and the upper mold member, thereby preventing the upper surface of the lens module from being polluted by the molding compound.

Abstract: In fabrication of a semiconductor device mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate. Then, an interposer having connection terminals are bonded to the semiconductor circuit portion. After that, the glass substrate is peeled off from the semiconductor circuit portion, and a mold resin is poured to cover the periphery of the semiconductor circuit portion from a direction of the separation plane. Then, the mold resin is heated under predetermined conditions to be hardened.

Abstract: The invention relates to a protective film for a solar cell module, to a process for manufacturing said protective film and to a solar cell module comprising said protecting and to a method for protecting a solar cell module comprising using of such protective film.

Abstract: The present invention provides a solar cell laminate comprising a preformed bi-layer sheet having a poly(vinyl butyral) sub-layer.

Abstract: In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.

Abstract: A sealing material for a solar cell and a solar cell including the same, and the sealing material includes a polymer resin having a vicat softening point at 100° C. or 130° C. or between 100° C. and 130° C.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: Discussed herein are a solar cell module, the edge of which is efficiently sealed, and a manufacturing method thereof. The solar cell module includes a front substrate, a rear substrate disposed opposite the front substrate, solar cells disposed between the front substrate and the rear substrate, a barrier layer disposed at least one of between an outer portion of the front substrate and at least one of the solar cells, between the outer portion of the front substrate and the rear substrate, and between the at least one of the solar cells and the rear electrode, and a sealant, at least a part of which is disposed between the rear substrate and the at least one of the solar cells to the inside of the barrier layer in the solar cell module.

Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.

Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

Abstract: An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.

Abstract: An optical device of the present invention comprises a light-emitting element or a light-receiving element mounted on a support and a cured silicone material unified into a single article onto the support by the sealing of the element with a hydrosilylation reaction curable silicone composition, and is characterized in that the surface of the cured silicone material has been treated with an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule. The optical device is resistant to the adherence of dust and dirt due to an inhibition of the stickiness of the surface of a cured silicone material that seals a light-emitting element or a light-receiving element mounted on a support and has thereby been unified into a single body onto the support.

Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.

Abstract: According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).

Abstract: Solar module comprising a number of solar cells, arranged and fixed in an insulating glass composite in the cavity between a front and a rear pane, wherein the solar cells are fixed to the inside of at least one of the panes by soldering.

Abstract: A thin-film solar cell includes a front-side glass substrate, a front contact arranged above the glass substrate, an absorber arranged above the front contact, and a rear contact arranged above the absorber. A TCO layer system composed of an intrinsic TCO layer deposited above the substrate and a doped TCO layer arranged thereabove is provided, as well as a method for producing such a thin-film solar cell. Improved transmission, reflection and absorption properties of the TCO layer is achieved by composing the TCO layer of a first doped TCO sublayer deposited directly on the intrinsic TCO layer, and a second doped TCO sublayer deposited directly on the first doped TCO sublayer.

Abstract: Photovoltaic modules and methods for making photovoltaic modules are disclosed. In one or more embodiments of the invention, the photovoltaic module includes a transparent sheet with a channel to accommodate a conductive member.

Abstract: A method for forming solar cells includes providing a crystalline silicon substrate which can be mono-, multi-, or poly-crystalline, the substrate being defined by a first thickness, the substrate including a first surface and a second surface, the first surface on an opposite side of the second surface. The method also includes forming a separation region within the first thickness, the separation region including hydrogen species, the separating region being substantially parallel to the first surface, the separation region defining a first portion and a second portion within the thickness. Additionally, the method includes providing a mould structure defining a support region on the first surface in which a layer of ceramic material is formed, followed by mould removal. Additionally, the method includes forming electrical devices on the first portion and packaging formed solar cells, including interconnections for solar tile applications.

Abstract: Solar module structures 210 and 270 and methods for assembling solar module structures. The solar module structures 210 and 270 comprise three-dimensional thin-film solar cells 110 arranged in solar module structures 210 and 270. The three-dimensional thin-film solar cell comprises a three-dimensional thin-film solar cell substrate (124 and 122, respectively) with emitter junction regions 1352 and doped base regions 1360. The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The 3-D TFSC substrate comprises a plurality of single-aperture or dual-aperture unit cells. The solar module structures 270 using three-dimensional thin-film solar cells comprising three-dimensional thin-film solar cell substrates with a plurality of dual-aperture unit cells may be used in solar glass applications.

Abstract: A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.

Abstract: Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.

Abstract: Disclosed are a protective sheet for a solar battery module including a base material sheet and a heat-fusible sheet made of a heat-fusible resin having a melting point measured by differential scanning calorimetry (a DSC method) of 80° C. or higher and lower than 130° C., laminated on one surface of the base material sheet, and including an air-flow path on a surface of the heat-fusible sheet; and a solar battery module using the same.

Abstract: According to the present invention, a method for producing a solar cell module comprises the steps of: arraying at least one solar cell on the upper surface of a base substrate; stacking a transparent upper substrate onto the base substrate to cover the solar cell; injecting a radiation-curable liquid adhesive resin composition into the space formed between the base substrate and the upper substrate such that the space is filled with the composition; and hardening the radiation-curable liquid adhesive resin composition.

Abstract: The present disclosure is directed toward a thin film photovoltaic cell including a support substrate; a contact layer disposed adjacent a first side of the substrate; a p-type semiconductor layer disposed on the first side of the substrate; an n-type semiconductor layer disposed on the first side of the substrate; and a protective back side layer structure disposed adjacent a second side of the substrate, wherein the protective back side layer structure may include a corrosion resistant material. In some embodiments, the back side layer includes at least a first layer and a second layer. Additionally and/or alternatively, the back side layer may include a molybdenum alloy, wherein the molybdenum alloy may include an alloy partner selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Al, and Si.

Abstract: A solar cell includes: a substrate; a photoelectric conversion cell which has a first electrode layer provided with permeability, a photoelectric conversion layer, and a second electrode layer, and is arranged on the substrate; and a protection layer which covers at least the second electrode layer. The protection layer includes a silicon nitride compound.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell and a transparent and abrasion resistant film which includes an organic-inorganic hybrid material formed over the glass layer.

Abstract: A photovoltaic device, including at least one photovoltaic cell, a flexible transparent layer formed over the at least one photovoltaic cell, a first encapsulant layer formed over a first major surface of the flexible transparent layer facing the at least one photovoltaic cell and a second encapsulant layer formed over a second major surface of the flexible transparent layer facing away from the at least one photovoltaic cell. The second encapsulant layer is made of a shear thickening polymer.

Abstract: A frameless solar cell panel includes: a stacked body (10) that has an end portion (10a) and in which a first substrate (2), a power generating section (3), a sealing layer (4), and a back sheet (5) or a second substrate (6) are sequentially stacked; and a silicone sealant member (11) that is disposed in the end portion (10a) of the stacked body (10).

Abstract: Disclosed herein are a photovoltaic panel and a method of manufacturing the same. The photovoltaic panel includes a photovoltaic unit having a single substrate and a protective polymer layer wrapping around the photovoltaic unit and being sealed around the edges of a surface of the substrate. The manufacturing method includes the steps of providing a substrate, forming a photovoltaic cell on a first surface of the substrate to form a photovoltaic unit, wrapping a protective polymer layer around the photovoltaic unit with a portion of the protective polymer layer extended beyond the first surface, and thermal treating the protective polymer layer so as to shrink the to protective polymer layer and thereby sealing the portion of the protective polymer layer extended beyond the first surface of the substrate around the edges of the second surface.

Abstract: A semiconductor arrangement including at least one lead arrangement with a top and a bottom opposite the top; a least one solder resist layer which partially covers the top and the bottom, at least sub-zones of the top and the bottom, which are not covered by the solder resist layer, forming electrical base members; an optoelectronic semiconductor element, which is mounted on at least one of the base members on the top of the lead arrangement and is connected electrically conductively therewith, and an encapsulant applied at least to the top of the lead arrangement, the encapsulant covering up the semiconductor element and lying at least partially against the solder resist layer, wherein the base members are bordered all round by the solder resist layer.

Abstract: The presently disclosed subject matter describes a new sealing process of a specific type of photovoltaic cells named dye-sensitized solar cells. Currently, the sealing of these cells is made by means of a polymer, which connects the two electrode substrates made of glass, isolating the cell's inner content from the outside. The glass-based sealing method has the advantage of enhancing the cell's lifetime. However, glass sealing should not lead to the heating of the whole cell, which may cause its degradation. The process here unveiled employs a string of a glass precursor, a powder or a paste, that bounds the cell's entire external perimeter. The glass precursor string is then heated to its melting point with a laser beam, allowing the two substrates of the cell to stick together.

Abstract: A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive forces, tensile forces, and solder migration by providing at least one localized glass barrier are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized glass barrier may be used to shield the diode assembly.

Abstract: Disclosed herein is a method of manufacturing a photovoltaic device. The method includes the steps of providing a front substrate and a back substrate, forming a photovoltaic cell on the front substrate, encapsulating the photovoltaic cell by an encapsulant, attaching a solid state sealant tape on one of the two substrates, and adhering the two substrates through the solid state sealant tape and the encapsulant. The solid state sealant tape is in solid state at room temperature. The photovoltaic cell and the encapsulant are situated within an enclosed space formed by the two substrates and the solid state sealant tape.

Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.

Abstract: A method for the production of a solar panel with plural solar cells, includes steps of: providing a package, respectively including a backing foil with a pattern of electrically conductive wires and provided with a thermally activated adhesive, a lower layer of fusible foil, such as ethylene vinyl acetate (EVA), applied to the side of the layer of the backing foil to which the adhesive is applied, an array of solar cells, the contacts of which are connected to or can be connected to the electrically conductive wires on the backing foil, an upper layer of fusible foil, such as EVA, provided upon the array of solar cells, and a translucent panel, placing the package in an auxiliary heating station, heating the package in the auxiliary heating station so that the package is fixated, the subsequent transfer of the fixated package to a primary heating station.

Abstract: An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) comprises at least one side face (31) which extends at least in places at an angle ? of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.

Abstract: Various combinations of a first encapsulant and a second encapsulant on different locations of a photovoltaic module are used to meet various requirements of optical clarity, tensile strength, waterproofness, and resistivity.

Abstract: A laminated module or panel of solar cells and a laminating method for making same comprise a top layer of melt flowable optically transparent molecularly flexible thermoplastic and a rear sheet of melt flowable insulating molecularly flexible thermoplastic both melt flowing at a temperature between about 80° C. and 250° C. and having a low glass transition temperature. Solar cells are encapsulated by melt flowing the top layer and rear sheet, and electrical connections are provided between front and back contacts thereof. Light passing through the transparent top layer impinges upon the solar cells and the laminated module exhibits sufficient flexural modulus without cross-linking chemical curing. Electrical connections may be provided by melt flowable electrically conductive molecularly flexible thermoplastic adhesive or by metal strips or by both.

Abstract: According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

Abstract: An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

Abstract: A photodiode device and the manufacturing method of the same are provided. The photodiode device includes a substrate; an epitaxy layer on the substrate, the epitaxy layer including a window layer and a cap layer on the window layer, the cap layer covering a portion of the window layer; and a patterned conductive layer on the cap layer, the patterned conductive layer being formed with a bottom area and a top area wherein the bottom area is greater than the top area.