Abstract: A packaged image sensor assembly utilizes a spacer paste to control the height of a transparent window above an image sensor die to provide safe wire bond clearance. A dam structure is used to control the height of the transparent window. The dam may be formed either entirely from spacer paste or by depositing the spacer paste on an underlying patterned mesa. An additional encapsulant is provided outside of the dam to encapsulate wirebonds and provide additional protection from moisture permeation.

Abstract: This layered element (11) for encapsulating an element (12) that is sensitive to air and/or moisture, especially an element that collects or emits radiation such as a photovoltaic cell or an organic light-emitting diode, comprises a polymer layer (1) and a barrier layer (2) against at least one face (1A) of the polymer layer. The barrier layer (2) has a moisture vapor transfer rate of less than 10?2 g/m2 per day and consists of a multilayer of at least two thin hydrogenated silicon nitride layers (21, 22, 23, 24) having alternately lower and higher densities.

Abstract: A photoelectric conversion device including a first substrate; a second substrate located generally opposite to the first substrate; a first grid pattern located on the first substrate, wherein the first grid pattern includes a first finger electrode; a first collector electrode spaced from the first finger electrode and extending in a direction that intersects the first finger electrode; and a first connecting electrode connecting the first finger electrode and the first collector electrode; and a second grid pattern located on the second substrate, wherein the second grid pattern includes a second finger electrode; a second collector electrode spaced from the second finger electrode and extending in a direction that intersects the second finger electrode; and a second connecting electrode connecting the second finger electrode and the second collector electrode, wherein the first connecting electrode and the second connecting electrode are arranged alternately and do not overlap each other.

Abstract: A method for sealing the edges of photovoltaic modules, including the steps of i) providing a photovoltaic module by applying at least one photovoltaic laminate to a carrier; ii) treating the photovoltaic module produced in step i) along the edge region of the photovoltaic laminate by means of a plasma pretreatment or by flame application by means of a gas flame, such that both the edge region of the photovoltaic laminate and, at least partially, the carrier is detected by the plasma pretreatment or the flame application; and iii) applying a sealing mass at least partially to the pretreated location, wherein the sealing mass is a silicone composition or a composition based on silane-terminated poly(meth)acrylates.

Abstract: A solar cell module of the present invention is arranged such that is at least one of two-dimensionally arranged solar cells is positioned on an extended line of a boundary line between other adjacent solar cells. This makes it possible to provide a solar cell module which is less likely to be broken even if a bending stress and/or a twisting stress is applied, as compared to a conventional solar cell module.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane prepolymer with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: An antenna used for an ID chip or the like is disclosed with planarized antenna unevenness and an IC chip having such the antenna with a flat surface is disclosed. Manufacturing an integrated circuit mounted with an antenna is facilitated. A laminated body formed by stacking a conductive film 11, a resin film 13, an integrated circuit 12, and a resin film 14 are rolled so that the resin film 14 is outside. Then, the laminated body is integrated in a roll form by softening the resin films 13, 14 by applying heat. By slicing the rolled laminated body along with the direction in which the rolled conductive film 31 appears in the cross section, an IC chip with antenna formed by the rolled conductive film 11 is formed.

Abstract: A method of constructing a solar cell panel is disclosed that includes providing a solar cell that has a front side and a back side, where the front side faces the sun during normal operation, heating a thermoplastic polyimide to at least its reflow temperature, flowing the thermoplastic polyimide onto the back side of the solar cell while heated to at least its reflow temperature, and cooling the thermoplastic polyimide to a temperature below its reflow temperature to bond the thermoplastic polyimide directly to the solar cell. The direct bonding of the thermoplastic polyimide to the solar cell is accomplished without an adhesive such as RTV adhesives. The method may also include bonding a substrate directly to the thermoplastic polyimide opposite the solar cell.

Abstract: A photovoltaic module comprises at least one string of back contact solar cells and a porous non-conductive layer behind the cells including thereon flexible conductive pathways electrically interconnecting the solar cells. There is a back sheet and an encapsulant between the back sheet and the porous non-conductive layer flowable through the porous non-conductive layer and bonding the back sheet to the solar cells.

Abstract: A flexible solar module and manufacturing method for a portable device as an in-mold decoration is described. The solar module includes a flexible photovoltaic sheet of a predetermined shape and size, having an overmolded non-active side, mounted on the surface of a portable device. An electrical connection connected to the overmolded photovoltaic sheet terminates at any of the elements in the portable device requiring electrical power.

Abstract: Disclosed are a sealing material sheet for a solar cell module and a method of manufacturing a solar cell module capable of reducing damage to a photoelectric conversion cell and leakage of a sealing material during manufacturing of a solar cell module, and easily manufacturing a high-quality solar cell module. A sealing material sheet for a solar cell module includes transparent resin (A) exhibiting an MFR (190° C., 2.16 kg load) of 10 to 20 g/10 min and transparent resin (B) exhibiting an MFR (190° C., 2.16 kg load) of 30 to 40 g/10 min. The mass ratio ? (=WA/WB) of the transparent resin (A) (mass: WA) and the transparent resin (B) (mass: WB) is 0.7 to 1.5. A solar cell module uses the sealing material sheet for a solar cell module.

Abstract: A crystalline solar cell is provided that includes a front-sided n-doped area and a rear-sided p-doped area, a front-sided contact, a rear-sided contact and at least one front-sided first layer made from SiN. In order to reduce degradation of the parallel resistance, a second layer made of at least one material selected from the group SiN, SiOx, Al2Ox, SiOxNy:Hz, a-Si:H, TiOx or containing said type of material is disposed between the first layer and the n-doped area and is then doped for forming imperfections.

Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

Abstract: A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.

Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Abstract: A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area, and disposing an underfill material between the semiconductor die and leadframe. The light transmitting material includes an elevated area to prevent the underfill material from blocking the light transmission path. The elevated area includes a dam surrounding the light transmission path, an adhesive ring, or the light transmission path itself can be the elevated area. An adhesive ring can be disposed on the dam. A filler material can be disposed between the light transmitting material and contact pads.

Abstract: Provided herein is a process for fabricating a solar cell module that is resistant to discoloration. The solar cell module comprises a solar cell assembly and an encapsulant. The solar cell assembly in turn comprises a solar cell and a metal component. The encapsulant is in contact with the metal component. The process comprises the step of applying an additive that prevents or reduces discoloration to the encapsulant or to the metal component. Further provided is a solar cell module that is a product of the process described herein.

Abstract: A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bonding portion of each of the optical sensors exposed. The process further includes cutting the wafer into a plurality of image sensor dies after sealing the optical sensors such that each image sensor die includes one of the optical sensors sealed with a corresponding portion of the transparent material.

Abstract: A method for manufacture of a nanophotonic device can include the step of operatively coupling a planar light source and a photodetector with an optical waveguide. The planar light source, photodetector and optical waveguide can then be monolithically integrated in direct contact with a sapphire substrate, along with an electronic component that is also in direct contact with the sapphire substrate.

Abstract: A method for producing a photovoltaic module by forming solar cells on a glass plate and contacting at least one layer of liquid encapsulant with the solar cells. The liquid encapsulant has two components. The first component is an acrylic polyol having an average number of hydroxy-functional monomer units per polymer chain from 2 to 25 and Mn from 1,000 to 10,000. The second component is a polyisocyanate with an average functionality of at least two. The molar ratio of non-terminal hydroxy groups in the polyol to isocyanate groups in the polyisocyanate is from 0.5:1 to 1:0.5.

Abstract: A solar cell module comprises a solar cell assembly. The solar cell assembly is encapsulated by a poly(vinyl butyral) encapsulant and contains a metal component that is at least partially in contact with the poly(vinyl butyral) encapsulant. The poly(vinyl butyral) encapsulant comprises poly(vinyl butyral), about 15 to about 45 wt % of one or more plasticizers, and about 0.001 to about 10.0 wt % of one or more aldehyde scavengers, based on the total weight of the poly(vinyl butyral) encapsulant. Further provided are an assembly for preparing the solar cell module; a process for preventing or reducing the discoloration of a poly(vinyl butyral) encapsulant in contact with a metal component in the solar cell module; and the use of the solar cell module to convert solar energy to electricity.

Abstract: An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second solvent is also included, and the composition has a viscosity substantially between about 100 cps and about 25,000 cps at about 25° C. In an exemplary embodiment, a composition comprises: a plurality of diodes or other two-terminal integrated circuits; one or more solvents comprising about 15% to 99.9% of any of N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, N-octanol, ethanol, tetrahydrofurfuryl alcohol, cyclohexanol, and mixtures thereof; a viscosity modifier comprising about 0.10% to 2.5% methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof; and about 0.01% to 2.5% of a plurality of substantially optically transparent and chemically inert particles having a range of sizes between about 10 to about 50 microns.

Abstract: A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.

Abstract: An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus comprises: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.

Abstract: A multi-layer photovoltaic module including an integrated junction box base plate. A portion of the top layer of the module may be removed to form an aperture, within which the base plate may be disposed. Terminal connections of a string of photovoltaic cells may be exposed within the aperture, so that a base plate having an access opening allows electrical connections with the string when placed within the aperture. The base plate may be placed within the encapsulating layer aperture prior to lamination of the module layers, so that the base plate becomes more securely integrated into the module during the lamination process.

Abstract: Disclosed is a solar cell module wherein deterioration of the strength of adhering between a terminal box and an adhesive can be suppressed, while facilitating an adhering step. The solar cell module (1) is provided with the terminal box (3) which is adhered to a solar cell panel (2) with the adhesive (4) therebetween. The terminal box includes an adhesive opening (313), and the adhesive opening has a neck portion (313c) having a width narrower than that of the lower open end (313a) and/or that of the upper open end (313b), and the adhesive opening is filled with the adhesive.

Abstract: A method of constructing a solar cell panel is disclosed that includes providing a solar cell that has a front side and a back side, where the front side faces the sun during normal operation, heating a thermoplastic polyimide to at least its reflow temperature, flowing the thermoplastic polyimide onto the back side of the solar cell while heated to at least its reflow temperature, and cooling the thermoplastic polyimide to a temperature below its reflow temperature to bond the thermoplastic polyimide directly to the solar cell. The direct bonding of the thermoplastic polyimide to the solar cell is accomplished without an adhesive such as RTV adhesives. The method may also include bonding a substrate directly to the thermoplastic polyimide opposite the solar cell.

Abstract: The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention also relates to, the composition additionally comprises a polyolefin C, other than B, which carries a functional group Y capable of reacting with the functional group X. The invention further relates to a photovoltaic module comprising the film which is used of the composition and also a process for the manufacture of this module.

Abstract: Provided are a barrier film production method and a barrier film comprising at least one organic layer and two or more inorganic layers on a surface of a plastic film, wherein, under an atmosphere of at least 0.3 atmospheric pressure and at most 1.1 atmospheric pressure (1 atmospheric pressure is 1.01325×105 Pa), an organic layer coating liquid is applied on at least one surface of the plastic film, and dried to form the organic layer, thereafter, an inorganic layer coating liquid containing an inorganic compound is applied and dried on the organic layer to laminate at least 2 to 6 inorganic layers, and thereafter, at least two layers of the laminated inorganic layers are subjected to a modification process.

Abstract: A solar cell module that has a back protective sheet and a front transparent protective sheet and edge sealant members that seal an inner portion of the solar cell module so as to define a cavity that receives a plurality of solar cells. A portion of the back protective sheet extends beyond the sealant members so as to define a mounting region that can receive mounting structures such as holes, connectors, rails or the like. By providing the mounting region, the mounting structures can be spaced from the sealant members which limits the damage to the sealant members during the mounting process and preserves the moisture sealed state of the solar cell cavity.

Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.

Abstract: A multilayer article having a cell substrate; a thin-film photovoltaic cell disposed on the cell substrate; an encapsulant layer disposed on the photovoltaic cell; and at least one plastic substrate coated on at least one side with one or more transparent, amorphous barrier layers disposed on the encapsulant layer. The invention extends to the process of making the article.

Abstract: Disclosed is a solar cell module wherein deterioration of the strength of adhering between a solar cell panel and a terminal box can be suppressed, while reducing the quantity of an adhesive to be used. The solar cell module (1) is provided with the terminal box (3) which is adhered to the solar cell panel (2) with the adhesive (4) therebetween. The adhesive surface (31a) of the terminal box, said adhesive surface having the solar cell panel (2) adhered thereon, includes a top portion (31f) where the distance to the surface of the solar cell panel (2) is shortest, and an inclined portion (31g) which is configured such that the distance to the surface of the solar cell panel increases toward the side far from the top portion.

Abstract: One embodiment provides a semiconductor wafer structure including a semiconductor wafer and a spacer layer. The semiconductor wafer includes active areas. The spacer layer is configured to provide spacing between the semiconductor dice in a stacked die package and the spacer layer is disposed on one side of the semiconductor wafer.

Abstract: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

Abstract: The invention provides a solar cell module stacked member in which a pressure sensitive-type adhesive for bonding together a support member and a solar cell module is not photodegraded, and there is no concern of separation of the support member and the solar cell module. In a solar cell module stacked member in which a support member and a solar cell module having an internal solar cell element are stacked, the support member and the solar cell module are bonded together; the support member and the solar cell module are bonded together by a reaction hardening-type adhesive in an outer rim portion of the solar cell module irradiated with sunlight; and the support member and the solar cell module are bonded together by a pressure sensitive-type adhesive in a portion which is on the inside of the outer rim portion of the solar cell module and in which sunlight is blocked.

Abstract: The present invention can simplify a process. In the present invention, a transparent conductive layer (5) is provided on an electrode side substrate (12); a porous semiconductor layer (7) is provided on the transparent conductive layer (5); and a counter electrode layer (9) in a state in which it is separated from the porous semiconductor layer (7) is provided. A cell partition wall (6) which is provided on the electrode side substrate (12) and surrounds the periphery of the porous semiconductor layer (7) is provided. In the sensitized solar cell module (11), electrolytic solution (10) is impregnated in the porous semiconductor layer (7) and the counter electrode layer (9), and a sealing material in the form of liquid is disposed in such a manner as to cover an upper portion of the cell partition wall (6) to seal the electrolytic solution (10). Then, the sealing material in the form of liquid is solidified.

Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.

Abstract: A carrier assembly for temporary accommodation of one or more solar cell laminates while the solar laminates are conveyed through a lamination plant. The solar cell laminate comprises a solar cell layer of silicon material, an upper and a lower encapsulating layer of EVA material covering the top and bottom of the solar cell layer, an upper and lower protective layer covering the upper and lower encapsulating layer, respectively. The encapsulating layer has a specific melting temperature and a specific curing temperature; the melting temperature is lower than the curing temperature.

Abstract: A manufacturing method of a solar battery module includes a stacking step of arranging a peripheral sealing member at a peripheral portion of an upper surface of a glass substrate, arranging one or more solar cells on the upper surface of the glass substrate surrounded by the peripheral sealing member, arranging a first laminate film on an upper surface of the solar cells, and stacking a surface side plate glass above the first laminate film to face the glass substrate. The manufacturing method of a solar battery module further includes a sealing step of performing a lamination process by heating and applying pressure to the first laminate film in an air evacuation environment to obtain a translucent resin layer, and sealing the solar cells and the translucent resin layer in a space surrounded by the glass substrate, the surface side plate glass and the peripheral sealing member.

Abstract: This invention relates to the use of a thermoplastic elastomer comprising at least one silicone ionomer in the formation of electronic devices.

Abstract: A method of making a photovoltaic panel includes previously preparing one or more pre-formed substrates with a first temperature and pressure to be non-planar, textured, embossed, colored, or combinations thereof. A manufacturer can then prepare a laminate assembly comprising one or more organic photovoltaic components one or more pre-formed substrates, and a barrier layer with one or more thermally-activated thermoplastic tie layers there between. The manufacturer can then finish the photovoltaic panel lamination by subjecting the assembly to a second set of temperatures and pressures sufficient to activate and bond the pre-formed substrate, barrier layer, and photovoltaic components without significantly softening the pre-formed substrates or otherwise degrading/damaging the organic photovoltaic components. A non-planar panel made by this method can be used in both exterior and interior decorative and/or structural applications where electrical generation is desired.

Abstract: A solar cell module, a solar cell panel, a process for producing a solar cell module and a process for producing a solar cell panel that are capable of inhibiting EVA protrusions and recesses, and capable of inhibiting penetration of moisture into the interior of the solar cell module. The solar cell module comprises a transparent substrate and a back substrate disposed across a photovoltaic layer, an inner seal portion disposed between, and surrounding the periphery of, the transparent substrate and the back substrate, a gap formed in a portion of the inner seal portion and linking a region in which an encapsulant is disposed with the outside, an encapsulant disposed inside the region surrounded by the transparent substrate, the back substrate and the inner seal portion, and an outer seal portion that covers the gap.

Abstract: A thin film solar cell module includes a front substrate; a plurality of thin film solar cells disposed on the front substrate; a rear substrate disposed on the thin film solar cells; a plurality of inter-connection terminals electrically connected to the thin film solar cells, respectively, and exposed to an exterior surface of at least one of the front and rear substrates; and a connector electrically connecting the inter-connection terminals in a series or parallel configuration.

Abstract: An optical device includes at least one optical die (4) that is embedded, at least peripherally, in a plate made of an encapsulation material so that the optical die may transmit light, from one side of the plate to the other. An electronic package is formed by a semiconductor device which includes at least one optical, integrated-circuit chip with the optical device placed so that the optical die lies above optical integrated circuits formed in or on the integrated circuit chip. The optical device is attached onto the semiconductor device.

Abstract: A thin-film solar cell includes a body and a polymer layer. The body includes a first electrode layer, a photoelectric conversion layer, and a second electrode layer, and the polymer layer includes a hardening material and an interface material. The photoelectric conversion layer is disposed between the first electrode layer and the second electrode layer, and the polymer layer surrounds the photoelectric conversion layer, in which the interface material is used for bonding to the hardening material and the photoelectric conversion layer respectively. Therefore, the thin-film solar cell may reduce the Staebler-Wronski Effect generated by the photoelectric conversion layer in the photoelectric conversion procedure. Accordingly, the photoelectric conversion efficiency is improved.

Abstract: A method for the production of a photovoltaic module, which essentially combines a transparent front substrate, such as a glass cover 1, a rear substrate, such as a rear film 6, a layer of solar cells 3 positioned therebetween, and a thermally activated softening adhesive layer 2 to form a laminar structure. For sealing the edges of the photovoltaic module, a linear body 7 framing at the edges and surrounding the layer of solar cells 3 having a thermally activated adhesive material 9 is placed between the front substrate 1 and the rear substrate 6, with the thermally activated adhesive material 9 of the linear body 7 being selected such that it does not soften or softens slower and/or at higher temperatures compared to the thermally activated adhesive layer 2 or has a higher viscosity in reference to the thermally activated adhesive layer 2. A photovoltaic module is also provided.

Abstract: A process for producing a solar cell module, including (a) forming a seal part made of e.g. a double sided adhesive tape on the edge of a surface of a transparent surface material (first surface material), (b) supplying a liquid state photocurable resin composition to the region enclosed by the seal part, (c) laminating, in a reduced pressure atmosphere of not more than 100 Pa, on the photocurable resin composition, a glass substrate (second surface material) having a thin-film type solar cell device formed, to obtain a laminated material having the photocurable resin composition hermetically sealed, and (d) curing the photocurable resin composition in such a state that the laminated material is placed in a pressure atmosphere of not less than 50 kPa to form a resin layer.

Abstract: A solar cell module includes a glass substrate, a first sealing resin layer, a solar cell connected to a tab wire, a second sealing resin layer, and a protective sheet, which are laminated. The second sealing resin layer is formed from a blend polymer of a thermoplastic polyurethane resin having an ester-type polyol unit and a thermoplastic polyurethane resin having an ether-type polyol unit. The blend ratio of the thermoplastic polyurethane resin having the ester-type polyol unit to the thermoplastic polyurethane resin having the ether-type polyol unit in the blend polymer is 20:80 to 50:50 by mass.

Abstract: An electro-optical semiconductor device having a semiconductor die including an active region for detecting light which is covered by a cover. The cover has a transparent pane over the active region, and is supported by a standoff. The standoff sits on the die on a perimeter region between the active region and a plurality of bond pads disposed around the periphery of the die.