Abstract: An LED package includes a substrate, an LED chip mounted on the substrate. The LED chip has a side surface and an upper surface. A fluorescent layer is evenly distributed over the LED chip. An encapsulant covers the LED chip and the fluorescent layer. A method of manufacturing the LED package is also provided.

Abstract: A monolithic LED chip is disclosed comprising a plurality of junctions or sub-LEDs (“sub-LEDs”) mounted on a submount. The sub-LEDs are serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. Methods for fabricating a monolithic LED chip are also disclosed with one method comprising providing a single junction LED on a submount and separating the single junction LED into a plurality of sub-LEDs. The sub-LEDs are then serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of the serially interconnected sub-LEDs and the junction voltage of the sub-LEDs.

Abstract: A solid state lighting luminaire, which comprises a solid state light source, an encapsulated structure, and a first phosphor, is provided. The encapsulated structure encapsulates the solid state light source and has an outside illuminating surface. The first phosphor is patterned to cover a portion of the outside illuminating surface for down-converting the illumination from the solid state light source.

Abstract: A white-light emitter is disclosed, in which a silicone sheet is laminated between a pair of optically clear plastic sheets. The silicone sheet lacks the ability to retain its shape, while the three sheets, when sealed together, can retain a shape. The silicone sheet includes at least one phosphor, with a phosphor concentration between two percent and ten percent. The silicone sheet may be produced by molding. Compared to comparable silicone parts made by extrusion, the molded parts may show less part-to-part variation in color temperature, may be run in significantly smaller batches or as one-offs, and may allow the silicone and phosphor material to be mixed by hand or with a relatively simple mixing machine. In some cases, the sheets are sealed together at their perimeters and include a margin around the phosphor sheet. In some cases, the phosphor sheet includes a mixture of different phosphors.

Abstract: An LED light source device includes an LED light source, a first powder layer located at a light path of the LED light source and a lamp shell located around the LED light source and the first powder layer. The lamp shell defines a receiving room. A second powder layer is formed on an inner surface of the lamp shell. The first powder layer and the second powder layer each have a characteristic of scattering light.

Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.

Abstract: Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a sub-mount including a cavity, a light emitting device chip provided in the cavity, an electrode electrically connected to the light emitting chip, a reflective layer formed on a surface of the cavity, a dielectric pattern on the reflective layer, and an encapsulant filled in the cavity.

Abstract: An encapsulating sheet includes an encapsulating resin layer and a wavelength conversion layer laminated on the encapsulating resin layer. The wavelength conversion layer is formed by laminating a barrier layer formed of a light transmissive resin composition and having a thickness of 200 ?m to 1000 ?m, and a phosphor layer containing a phosphor.

Abstract: A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.

Abstract: The present invention relates to illuminating field, especially relates to LED chip, LED and a method of manufacturing LED chip, the method of manufacturing LED chip comprises: forming a first semiconductor layer, a luminous layer and a second semiconductor layer sequentially on a substrate; forming a phosphor powder layer on the second semiconductor layer; removing a part of the phosphor powder layer and a part of the second semiconductor layer to form at least one groove which exposes a part of the second semiconductor layer; removing a part of the phosphor powder layer, a part of the second semiconductor layer, a part of the luminous layer and a part of the first semiconductor layer to form at least one unfilled corner which exposes a part of the first semiconductor layer; forming a first electrode in the unfilled corner, and forming a second electrode in the groove.

Abstract: An organic light emitting diode lighting apparatus includes: a substrate main body including a sealing area and a sealing line surrounding the sealing area; a plurality of first line electrodes of which both ends are located within the sealing area; a plurality of second line electrodes, at least one end of which is located outside the sealing area; an encapsulating member disposed to face the substrate main body; a sealant disposed on the sealing line to bond the substrate main body and the encapsulating member and seal the sealing area; a first connection member coupled to the ends of the plurality of first line electrodes within the sealing area; and a second connection member coupled to the ends of the plurality of second line electrodes outside the sealing area.

Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides many features offered by traditional surface mount technology lamps, but also has a decreased height, increased light output, and enables a smaller viewing angle as compared to traditional surface mount technology lamps.

Abstract: Light emitter devices having improved chemical and physical resistance and related methods are disclosed herein. In one embodiment, the light emitter device includes a light emission area with a cavity with one or more light emitting chips disposed within the cavity. The device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete clear barrier layer. The clear barrier layer can include a layer of glass.

Abstract: An LED unit includes an LED and an optical element. The LED includes a substrate, an LED chip fixed on the substrate and an encapsulation encapsulating the LED chip. The LED further includes a first magnet fixed on the substrate. The optical element includes an optical adjustment layer and a second magnet. The second magnet attracts the first magnet to fix the optical element on the LED. The LED unit can be adjusted to have different optical characteristics by replacing the optical element thereof with another optical element.

Abstract: A light-emitting device comprises a base, a light-emitting unit comprising a semiconductor stack disposed on the base, and a wavelength conversion layer covering the light-emitting unit, wherein the wavelength conversion layer does not physically contact the base.

Abstract: A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.

Abstract: A white LED assembly includes a blue LED die attached to a substrate. A first volume of a first luminescent material surrounds the blue LED die in a lateral dimension such that none of the first luminescent material is disposed directly over the blue LED die. The first luminescent material includes a relatively inefficient phosphor having a peak emission wavelength longer than 620 nm and includes substantially no phosphor having a peak emission wavelength shorter than 620 nm. A second volume of a second luminescent material is disposed over the first volume and the blue LED die. The second luminescent material includes a relatively efficient phosphor having a peak emission wavelength shorter than 620 nm and includes substantially no phosphor having a peak emission wavelength longer than 620 nm. Placement of the first and second luminescent materials in this way promotes removal of heat from the inefficient phosphor and reduces the likelihood of interabsorption.

Abstract: An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.

Abstract: The present invention is a lighting device for plant growth, it is composed of a blue LED chip as the light source with different colors of phosphor powders. The wave length of blue chip falls in the range of 440-460 nm which stimulates stoma opening to absorb carbon dioxide. By formulating the right recipe of phosphors, the emitted light will have the spectra very close to that of light necessary for plant photosynthesis. It has the combined functions of good plant photosynthesis, stoma opening stimulation and some photomorphogenesis in one single device. It is a very prominent invention of artificial lights for plant growth ever seen.

Abstract: A light-emitting semiconductor chip is provided, the semiconductor chip comprising a semiconductor body having a pixel region with at least two electrically isolated sub-regions, each sub-region comprising an active layer, which generates electromagnetic radiation of a first wavelength range during operation, a separately manufactured ceramic conversion die over a radiation emission area of at least one sub-region, said conversion die being configured to convert radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, wherein a width of the conversion die does not exceed 100 ?m. Further, a method for the production of a light-emitting semiconductor chip and method for the production of a conversion die are provided.

Abstract: Optical conversion layers based on semiconductor nanoparticles for use in lighting devices, and lighting devices including same. In various embodiments, spherical core/shell seeded nanoparticles (SNPs) or nanorod seeded nanoparticles (RSNPs) are used to form conversion layers with superior combinations of high optical density (OD), low re-absorbance and small FRET. In some embodiments, the SNPs or RSNPs form conversion layers without a host matrix. In some embodiments, the SNPs or RSNPs are embedded in a host matrix such as polymers or silicone. The conversion layers can be made extremely thin, while exhibiting the superior combinations of optical properties.

Abstract: A solid state lighting device, including: a housing, which has a reflective cup inside; a solid state light source, placed inside the housing; a transparent adhesive material, used to seal the solid state light source in the housing; and a multi-layer fluorescent structure, placed on the transparent adhesive material and having a fluorescent layer or a phosphor layer sandwiched by two transparent adhesive layers, so as to absorb light beams from the solid state light source and then emit light of longer wavelengths.

Abstract: A package having a light-emitting element includes a substrate having a light-emitting element disposed thereon, an insulating layer formed on the substrate and having an opening for exposing the light-emitting element, a florescent layer formed in the opening of the insulating layer for encapsulating the light-emitting element, and a transparent material formed on the florescent layer and the insulating layer. As such, a specific space can be defined by the insulating layer for exposing the light-emitting element and forming the fluorescent layer, thereby overcoming the problem of non-uniform coating of phosphor powder as encountered in prior techniques.

Abstract: A light-emitting device includes: a substrate; a light-emitting section provided on an upper surface of the substrate, the light-emitting section including an LED chip and a sealing resin containing fluorescent material covering the LED chip; and a silicon oxide insulating film provided between the substrate and the light-emitting section, the silicon oxide insulating film being formed directly on an upper surface of the substrate or an alumina insulating film, the sealing resin containing fluorescent material formed directly on an upper surface of the silicon oxide insulating film so as to cover the LED chip. Thus, this invention provides the light-emitting device capable of making the sealing resin difficult to be separated from the substrate and a method for manufacturing the light-emitting device.

Abstract: A light emitting device is produced by depositing a layer of wavelength converting material over the light emitting device, testing the device to determine the wavelength spectrum produced and correcting the wavelength converting member to produce the desired wavelength spectrum. The wavelength converting member may be corrected by reducing or increasing the amount of wavelength converting material. In one embodiment, the amount of wavelength converting material in the wavelength converting member is reduced, e.g., through laser ablation or etching, to produce the desired wavelength spectrum.

Abstract: Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.

Abstract: An LED package structure includes: a substrate having a die attach pad; a first insulating layer formed on the die attach pad and having a plurality of openings; an LED chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; a second insulating layer formed on the inactive surface and having a plurality of openings, wherein the LED chip is disposed on the substrate with the openings of the second insulating layer corresponding in position to the openings of the first insulating layer; and a plurality of metallic thermal conductive elements formed in the openings of the first insulating layer and the corresponding openings of the second insulating layer, thereby effectively alleviating the conventional problem of thermal stresses induced by a mismatch in CTEs of the LED chip and the substrate.

Abstract: A process for producing a conformal electroluminescent system. An electrically conductive base backplane film layer is applied upon a substrate. A dielectric film layer is applied upon the backplane film layer, then a phosphor film layer is applied upon the dielectric film layer. An electrode film layer is applied upon the phosphor film layer using a substantially transparent, electrically conductive material. An electrically conductive bus bar may be applied upon the electrode film layer. Preferably, the backplane film layer, dielectric film layer, phosphor film layer, electrode film layer and bus bar are aqueous-based and are applied by spray conformal coating. The electroluminescent phosphor is excitable by an electrical field established across the phosphor film layer such that the device emits electroluminescent light upon application of an electrical charge between the backplane film layer and at least one of the electrode film layer and the bus bar.

Abstract: A light emitting diode (LED) device includes a substrate having a top surface, a first LED and a second LED arranged on the top surface of the substrate, and a lens arranged over the light emitting surface of the first and second LEDs. The first and second LEDs each have a light emitting surface away from the top surface of the substrate. A first wavelength of light emitted from the first LED is shorter than a second wavelength of light emitted from the second LED. The lens includes a convergent part located right above the second LED and a divergent part located right above the first LED.

Abstract: A film-covered LED device includes a high thermal conductive substrate, a reflector, a plurality of LED chips, and a fluorescent film. A pair of electrical contacts is respectively disposed on two ends of the high thermal conductive substrate. A thru opening is formed on the reflector, which is disposed on the high thermal conductive substrate. The LED chips are disposed on the high thermal conductive substrate and connected electrically, within the thru opening. The fluorescent film is disposed on the reflector and casted over the LED chips. Thereby, the LEDs illumination is more evenly distributed, in maintaining illumination efficiency uniformity. The yield rate is also enhanced with savings in labor cost.

Abstract: A light emitting apparatus is fabricated by measuring light output of a semiconductor light emitting device, and selectively applying luminous material to the light emitting device based on the measured output of the light emitting device. An amount of luminous material, different compositions of luminous material and/or different doping levels of luminous material may be selectively applied based on the measured output of the light emitting device.

Abstract: A display situated on a substrate surface is provided. The display includes a first light emitting sub-pixel situated on the substrate surface. The first light-emissive layer includes fluorescent material. The display also includes a second light emitting sub-pixel situated on the substrate surface. The second light-emissive layer includes phosphorescent material. The first light emitting sub-pixel and the second light emitting sub-pixel may be arranged proximate to each other on the substrate surface. The first light emitting sub-pixel and the second light emitting sub-pixel may be arranged laterally adjacent to each other on the substrate surface. A display situated on a substrate is provided first and second light-emissive layers interposed between a first base electrode and a first transparent electrode. The first light emitting sub-pixel further includes a first interlayer interposed between the first and second light-emissive layers.

Abstract: The present invention discloses a thin-film transistor liquid crystal display device, a substrate, and a manufacturing method. The thin-film transistor liquid crystal display device includes: a substrate and a signal line, a scan line, a pixel electrode, and a thin-film transistor that are formed on the substrate. The signal line and the scan line are arranged to intersect each other. The pixel electrode is located in a pixel display zone enclosed by the intersected signal line and scan line. The thin-film transistor includes a gate terminal, a source terminal, and a drain terminal. The gate terminal is electrically connected to the scan line. The drain terminal is electrically connected to the signal line. The source terminal is arranged at a position corresponding to the intersection of the signal line and the scan line and is electrically connected to the pixel electrode.

Abstract: A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.

Abstract: A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.

Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a plurality of pixels comprising a blue light emitting region, a green light emitting region, and a red light emitting region on a substrate and formed by stacking a lower electrode, an organic layer, and an upper electrode. In one embodiment, the blue and green light emitting regions are formed in a microcavity structure, and the red light emitting region is formed in a non-microcavity structure.

Abstract: An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Abstract: A side-emitting light emitting device (100) is provided, comprising at least one light emitting diode (101) arranged on a substrate (102) and facing a scattering reflector (103, 109) disposed at a distance from and extending along the extension of said substrate. The reflector comprises a plurality of non-parallel oriented reflective flakes (112) distributed in a transmissive carrier (113), such that light incident thereon from any angle of incidence is reflected and scattered. The scattering action of the reflector gives rise to an angular redistribution in the device, which increases the chance of light exiting the device through lateral openings between the reflector and the substrate, while the opacity of the reflector prevents light from being emitted through the top surface.

Abstract: There is provided a light emitting device which includes a light emitting element having a main emission peak in the wavelength region of greater than 420 nm and equal to or less than 500 nm, and a phosphor layer formed on the light emitting element. The light emitting element of this light emitting device has a junction temperature of from 100° C. to 200° C. at the time of continuous driving. Furthermore, the phosphor layer contains a phosphor represented by the following general formula (A), which absorbs the light emitted from the light emitting element and thereby emits light having a main emission peak in the wavelength region of equal to or greater than 650 nm and equal to or less than 665 nm: (Mg1-x,AEx)a(Ge1-y,Sny)bOcHAd:zMn??(A) wherein AE represents at least one or more elements selected from the group consisting of Ca or Sr; HA represents at least one or more elements selected from the group consisting of F or Cl; 2.54?a?4.40, 0.80?b?1.10, 3.85?c?7.00, 0?d?2.00, 0?x?0.05, 0?y?0.

Abstract: A III-N on silicon LED constructed to emit light in the visible range includes a layer of single crystal III-N with a light emitting diode formed therein and designed to emit light at a first wavelength through a lower surface, a REO-Si template mated to the layer of single crystal III-N and designed to approximately crystal lattice match a silicon substrate, and a light emission layer of rare earth oxide selected to receive and absorb light at the first wavelength, up-convert the absorbed light, and re-emit light at a second wavelength in the visible range. The lower surface of the REO-Si template is either mated to the upper surface of a crystalline silicon substrate with the light emission layer integrated into the REO-Si template or mated to an upper surface of the light emission layer with a lower surface of the light emission layer mated to the crystalline silicon substrate.

Abstract: A device manufacturing method including substrate preparation, pixel electrode formation, photosensitive film formation, first part exposure, second part exposure, and development. In first part exposure, after execution of photosensitive film formation, first photomask is arranged to face substrate and exposure is performed to cause first part of photosensitive film to be exposed to light via first photomask. In second part exposure, after or together with execution of first part exposure, second photomask is arranged to face substrate and exposure is performed to cause second part of photosensitive film, which is different from first part at least partially, to be exposed to light via second photomask. In second part exposure, second photomask is arranged such that end thereof overlaps with end of first photomask, and overlap between first and second photomasks positionally corresponds to electrical wire.

Abstract: Light-emitting systems and related methods of their fabrication are disclosed.

Abstract: A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and the color filters. Light emitting elements cover the thin film transistors and emit light through the substrate that is through the adhesive layer and color filter. The substrate may be plastic, thus increasing the heat resistance.

Abstract: A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.

Abstract: The present invention provides a thin film transistor having high performance in a liquid crystal display, and a manufacturing method of a liquid crystal display according to an exemplary embodiment of the present invention that includes: forming a gate line including a gate electrode on a substrate; forming a gate insulating layer on the gate line; forming a data line including a source electrode and a drain electrode facing the source electrode on the gate insulating layer; forming a partition defining a pixel area and having an opening region exposing the gate insulating layer on the gate electrode, the source electrode and the drain electrode on the gate line, and the data line and the drain electrode; forming a semiconductor in the opening region; forming a color filter in the pixel area defined by the partition; and forming a pixel electrode connected to the drain electrode on the color filter.

Abstract: The present invention discloses a method of enhancing color rendering index (CRI) of a white light emitting diode (LED), and particularly discloses a method of enhancing CRI of a white LED by adding a blue-green (or aquamarine) phosphor which can emit a light having wavelength of 485 nm to 519 nm.

Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

Abstract: This invention relates to a new method for the production of nitride-based phosphors, in particular, of phosphors containing rare earth elements. The phosphors can be used, for example, in light sources, especially in Light Emitting Devices (LEDs).

Abstract: A light source comprises an electroluminescent device that generates pump light and a wavelength converter that includes an absorbing element for absorbing at least some of the pump light. A first layer of light emitting elements is positioned proximate the absorbing element for non-radiative transfer of energy from the absorbing element to the light emitting elements. At least some of the light emitting elements are capable of emitting light having a wavelength longer than the wavelength of the pump light. In some embodiments the electroluminescent device is a light emitting diode (LED) that has a doped semiconductor layer positioned between the LED's active layer and the light emitting elements. The first doped semiconductor layer may have a thickness in excess of 20 nm. A second layer of light emitting elements may be positioned for non-radiative energy transfer from the first layer of light emitting elements.