Abstract: Systems and methods are disclosed herein for a low cost, compact size, and thin half-etched leadframe quad-flat no-leads (QFN) package that integrates RF passive elements in the QFN leadframe for linearized PA design and RF FEMs. The integrated RF passive elements in the QFN leadframe may include RF inductors (e.g., meanders lines or spirals) for amplifier bias or RF matching, extension bar of the ground paddle for inter-stage matching or jumper pads for connection. The integrated RF passive elements may also include transmission lines for output power matching, coupled line structures such as RF couplers, RF divider or combiner realized using transmission lines with proper impedance and length, jumper pads for adjusting the bond wire length, etc. The RF parameters of the integrated passive elements are adjustable using different length and number of wire bond for fine tuning the performance of the PAM or the RF FEM.

Abstract: A lead frame comprises a plurality of electrical connection portions, a frame portion, and a plurality of connections. The frame portion comprises a segment and at least one opening that defines the segment. Each connection connects to at least one of the plurality of electrical connection portions. The plurality of connections are arranged along a direction passing through the at least one opening and the segment. A dimension of the segment in the direction is less than 2.7 millimeters.

Abstract: A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

Abstract: A method for fabricating a plurality of biosensors includes the steps of: providing a base with a surface; forming a carbon nanotube array including a plurality of carbon nanotubes substantially parallels to each other on the surface; forming a plurality of lead pairs on the surface, the plurality of lead pairs divides the plurality of carbon nanotubes into a plurality of first carbon nanotubes and a plurality of second carbon nanotubes; eliminating the plurality of second carbon nanotubes; cutting the plurality of first carbon nanotubes to form a plurality of third carbon nanotubes and a plurality of fourth carbon nanotubes; and fabricating a plurality of receptors to electrically connect the plurality of third carbon nanotubes to the plurality of fourth carbon nanotubes.

Abstract: A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the leadframe surface is roughed. A first set of leadframe areas is planished. A second set of leadframe areas are offsetted and the tape is cut into strips.

Abstract: A metal leadframe strip (500) for semiconductor devices is described. The leadframe strip has a plurality of sites (510) for assembling semiconductor chips. The sites alternate with zones (520) for connecting the leadframe to molding compound runners. The sites (510) have mechanically rough and optically matte surfaces (511, 512). The zones (520) have at least portions with mechanically flattened and optically shiny metal surfaces (521, 522). The flattened surface portions transition into the rough surface portions by a step.

Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.

Abstract: A semiconductor package includes a lead frame including a chip mounting portion and a terminal portion, a semiconductor chip, which is mounted on the chip mounting portion and connected to the terminal portion, a through groove penetrating the terminal portion from one surface on a side of the semiconductor chip to another surface in a thickness direction of the terminal portion, a lid portion covering an end portion of the through groove on the side of the semiconductor chip, and a resin portion sealing the semiconductor chip, wherein the another surface of the terminal portion and a side surface of the terminal portion facing an outside of the semiconductor package are coated by a plating film.

Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: A method of bonding two structures together with an adhesive line of controlled thickness is provided. The method includes: applying an adhesive of controlled thickness to a first surface of a first structure; at least partially curing the adhesive; applying additional adhesive to the partially cured adhesive applied to the first surface or to a second surface of a second structure; holding the first structure and the second structure in alignment with the first surface and the second surface disposed in spaced, opposing relation; applying a force to the first structure and/or the second structure to squeeze the additional adhesive between the second surface and the partially cured adhesive applied to the first surface to reduce a thickness of the additional adhesive; and at least partially curing the additional adhesive to bond the first and second structures together.

Abstract: An optical coupling device includes a first lead part, a light emitting element mounted on the first lead part, a first wire connected to the first lead part and the light emitting element, a second lead part, a light receiving element fixed to the second lead part, a second wire connected to the second lead part and the light receiving element, and an insulating film configured to allow passage of light emitted from the light emitting element. The insulating film does not make contact with the first lead part, the light emitting element, the first wire, the second lead part, the light receiving element, or the second wire.

Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of adjacent lead fingers are staggered proximate and distal the at least one edge.

Abstract: Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.

Abstract: The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. In one embodiment, a foil carrier structure is formed by ultrasonically bonding portions of a conductive foil to a metallic carrier. The bonded portions define panels in the foil carrier structure. In some embodiments, the foil carrier structure is cut to form multiple isolated panels that are sealed along their peripheries. Each isolated panel may be approximately the size of a conventional leadframe strip or panel. As a result, existing packaging equipment may be used to add dice, bonding wires and molding material to the panel. The ultrasonic welding helps prevent unwanted substances from penetrating the foil carrier structure during such processing steps. After the carrier portion of the molded foil carrier structure is removed, the structure is singulated into integrated circuit packages.

Abstract: A sub-component circuit board may be electrically and mechanically connected to a higher order circuit board using one or more leads extending from a lead frame embedded in the sub-component circuit board. The sub-component board is produced as a layered assembly with the embedded lead frame at the core. One or more dielectric layers and one or more circuitry layers are provided over the lead frame and then bonded using heat and pressure. Apertures in the dielectric and circuitry layers define a perimeter of the circuit board where the leads of the lead frame are exposed. The lead frame connects to the circuitry layer(s) using plated vias.

Abstract: Methods for fabricating a packaged semiconductor device includes providing a metal plate having a single flat first surface and a parallel second surface. The flat first surface ending in four sawed plate sides. The plate having on the second surface at least one mesa of the same metal and a linear array of insular mesas. The at least one mesa is raised from the second surface. A single terminal of a semiconductor chip is attached to the second plate surface.

Abstract: A method for maintaining orientation of a part during manufacturing includes feeding a carrier a supply apparatus. The carrier includes a flexible material and supports a plurality of manufactured parts and includes indexing parts and the supply apparatus stores the carrier. The method includes feeding the carrier into a part forming module to form a manufactured part, forming a plurality of manufactured parts onto the carrier and determining a position of the carrier by sensing the indexing marks. The carrier includes a plurality of parts formed onto the carrier and each manufactured part is connected to the carrier with connectors that hold the part from the carrier. The width of the connector less than or equal to the connector at a connection point to the carrier. Each part maintains orientation with respect to the carrier where the part is formed and maintains orientation during a subsequent operation.

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam.

Abstract: A coupling conductor for a YIG filter or YIG oscillator, which may be produced from a metallic foil by eroding, laser cutting and/or etching of a metallic foil. The coupling conductor includes at least one curved section, which at least partially surrounds a YIG element and at least one conductor section.

Abstract: The invention relates to a method for adapting an electronic component with leads that are not suited to surface mounting on an electrical circuit. The method includes a step of bending said leads. The bending step shapes the leads of said component so that they are suitable for mounting on the surface of the electrical circuit. In particular, the invention applies to electronic components such as radio frequency and microwave power transistors, marketed notably in a straight-lead version.

Abstract: A motion-powered liquid sprayer that can increase the number of rotations of the pump relative to each rotation of the wheel or axle is provided. The sprayer can include a gearing assembly that employs gears to increase the number of pump revolutions as a function of the wheel or axle rotation. The sprayer can also include a gear pump that employs an over-capacity or enhanced gullet together with blow-by spacing to control consistent liquid flow relative to variable motional velocities. Further, the sprayer can include a vertically adjustable nozzle as well as a free reverse rotation wheel hub.

Abstract: To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off. By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

Abstract: A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element

Abstract: A method for making a coaxial cable including an inner conductor, an outer conductor, and a dielectric material layer therebetween may include forming the inner conductor by at least forming a bimetallic strip into a tubular bimetallic layer having a pair of longitudinal edge portions at a longitudinal seam. The bimetallic strip may include an inner metal layer and an outer metal layer bonded thereto and coextensive therewith. Each of the longitudinal edge portions may be folded over. The method may also include forming a welded joint between adjacent portions of the folded over longitudinal edge portions and defining surplus material at the welded joint. The method may further include removing the surplus material at the welded joint and forming the dielectric material layer surrounding the inner conductor. The method may also include forming the outer conductor surrounding the dielectric material layer.

Abstract: A plurality of reference holes are formed in the surface of a first substrate made of a first material, and a plurality of columnar members are each fitted in the reference holes in such a manner that at least a part of each of the columnar members projects from the surface of the first substrate. Subsequently, an electrode surface layer made of a second material is formed on the surface of the first substrate in such a manner that an end portion of each of the columnar members are exposed at the surface and then the columnar members are removed. Thus obtained is a substrate-like electrode including at least an electrode surface layer provided with through holes having a cross section matching a sectional shape of the projecting portion of the columnar members.

Abstract: An apparatus and method are disclosed that may include a contact pin; and a plurality of loops of conductive wire, coated with insulation material, disposed in proximity to the contact pin, wherein along at least one portion of the conductive wire, at least one edge of the contact pin extends through the insulation material and thereby forms conductive electrical contact with the conductive wire.

Abstract: A method for fabricating a circuit board includes providing a first substrate, forming a circuit on the first substrate, the circuit having a first electrode, a second electrode and at least one nanostructure, and transferring the circuit from the first substrate to a surface of a second substrate made of a polymer.

Abstract: A process of twinning a pair of polymer-insulated conductors to form a twisted pair, where the polymer-insulated conductors are formed by extruding a uniformly thick coating of polymer onto the conductors. More than one twisted pair is encased in a polymer jacket forming a cable. The twisted pair obtains a desirable average impedance performance using a reduced amount by weight of polymer forming said polymer-insulated conductors by: (i) extruding to form longitudinally running peaks and valleys in the exterior surface of each of the polymer-insulated conductors of the pair of polymer-insulated conductors and (ii) twinning resultant polymer-insulated conductors to nest at least one of the peaks in the exterior surface of one of the polymer-insulated conductors in at least one of said valleys in the exterior surface of the other of the polymer-insulated conductors of the pair of polymer-insulated conductors.

Abstract: A method for forming an isolated inner lead from a leadframe is revealed. The leadframe primarily comprises a plurality of leads, the isolated inner lead, and an external lead. Each lead has an inner portion having a finger. The isolated inner lead having two fingers is completely formed inside a molding area and is made of the same metal leadframe as the leads. One finger of the isolated inner lead and the fingers of the leads are linearly arranged. The other finger of the isolated inner lead is adjacent to a finger of the external lead. At least one of the inner portions divides the isolated inner lead from the external lead. The isolated inner lead is integrally connected to an adjacent one of the inner portions by a connecting block. A tape-attaching step is performed to mechanically connect the isolated inner lead where two insulating tapes are attached in a manner that the connecting block can be removed.

Abstract: Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.

Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A lead frame for an optical semiconductor device, having: a layer 2 composed of silver or a silver alloy formed on an electrically-conductive substrate 1; a metal oxide layer 3 of a metal other than silver as an outer layer of the layer composed of silver or a silver alloy, wherein the metal oxide layer 3 is colorless and transparent or silver gray in color, and has a thickness thereof from 0.001 to 0.2 ?m; a method of producing the same; and an optical semiconductor device utilizing the same.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of high-aspect-ratio leads, each coupled at a first end to a contact pad of the package, and at a second end to a semiconductor die mounted to the die paddle. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and leads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and leads, and to thin a portion of each of the leads. Back surfaces of the leads remain exposed at a back face of the body. The thinned portions of the leads are covered with a dielectric. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of leads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A method of splicing a power cable used to supply electricity to down hole submersible pumps uses a pair of annular armored seal members that are slid over the ends of an insulated electrical conductor being spliced together. Each armored seal member has a plurality of O-ring seals on one end thereof and a plurality of openings in the side thereof and are used to cover and protect a crimped conductor being spliced together. The method and apparatus allow a pair of spliced electrical cables to be used in an adverse environment.

Abstract: A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a conductor and severing the conductive sheet at least along center mask. The plurality of interposing strips are preferably flexible and configurable into desired shapes for potential future attachment to an integrated circuit.

Abstract: In a lead frame for an electronic component according to the present invention, a metal plate 3 is extended by a punch 5 into a hole 4 formed on a metal plate 2 and the two metal plates are connected on the inner surface of the hole 4, thereby improving a bonding strength while keeping the small size and thickness of the lead frame with a simple method.

Abstract: A frame includes heat slug pads coupled together in a N×M matrix such that singulation of the heat slug pads consists of one or more parallel passes across the frame. Each heat slug pad has a top exposed surface and a bottom interfacing surface. The bottom interfacing surface typically interfaces with a package. In some embodiments, the top exposed surface is modified. Alternatively, the bottom interfacing surface is modified. Alternatively, both surfaces are modified. A modified top exposed surface can include a pattern to increase the top exposed surface area. A modified bottom interfacing surface can include a pattern to increase the bottom interfacing surface area, provide reference points, or both. Alternatively or in addition to, the modified bottom interfacing surface can be plated to increase the bottom interfacing surface area. A patterned surface can be obtained via a stamping process or an etching process.

Abstract: A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.

Abstract: Electroactive polymer transducers for sensory feedback applications are disclosed.

Abstract: A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.

Abstract: A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.

Abstract: An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and a semiconductor chip attached to the lead frame.

Abstract: A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of folding a first and a second elongated vane blank along a central fold line to form at least two V-shaped vane doublets; inserting each of the vane doublets into a slotted annular support member so that each vane in each vane doublet extends through an adjacent slot in the annular support member; and attaching the vane doublets at their vertices to define a vane array.

Abstract: A hearing aid includes a shell (104) manufactured by a rapid prototyping process, so as to include a first part customized to adapt it to the shape of the ear canal of a user, and a second part that defines an aperture; an electronics module; and a plug (200) with means for retaining it in a fixed position in the shell. The shell has guideways (212) for guiding lateral portions of the plug to support the plug in the aperture. The shell is adapted to receive by the aperture the electronics module; and the electronics module is adapted to engage a lip (206) of the plug to secure it in the shell. The invention further provides a method of assembling a part of a hearing aid.

Abstract: The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.