With Deforming Of Lead Or Terminal Patents (Class 29/838)
  • Patent number: 9692173
    Abstract: A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: June 27, 2017
    Assignee: Greatbatch Ltd.
    Inventors: Thomas Marzano, Keith W. Seitz, Michael F. Scalise
  • Patent number: 9595782
    Abstract: A contact pin includes a retention section having at least one retention member extending radially outward from contact pin. A first portion is angularly offset in the linear direction of the longitudinal axis of the longitudinal body from a second portion. The at least one retention member has a surface which extends outwardly, beyond an outer diameter of a first end section of the contact pin. As the at least one retention member is angled linearly, the displacement of material around the opening of the deformable component causes forces to be applied to the at least one retention member in at least two directions thereby increasing the retention force of the pin in the deformable component. The angularly offset first portion and the second portion cause the retention section and the pin to rotate relative to the opening as the pin is inserted into the opening.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 14, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Dominic Anthony Farole
  • Patent number: 9474152
    Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: October 18, 2016
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: David Bruce Sarraf, Charles Randall Malstrom
  • Patent number: 9379469
    Abstract: Mechanisms for aligning electrical contacts of electronic components in a multiple layer electronic assembly are disclosed. A mounting plate is configured to align multiple layers of the multiple layer electronic assembly. The mounting plate includes a surface that a plurality of first anchor features at first predetermined locations of the surface configured to anchor a plurality of first layer electronic assemblies with respect to the surface. The mounting plate also includes a plurality of second anchor features at second predetermined locations configured to anchor at least one second layer electronic assembly with respect to the plurality of first layer electronic assemblies.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: June 28, 2016
    Assignee: Lockheed Martin Corporation
    Inventors: Sunder Shahani, John D. Santoro, Kenneth M. Jackson, Jr., Kurt G. Presing
  • Patent number: 8922859
    Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Shuji Takamatsu
  • Patent number: 8813341
    Abstract: A device for attaching a line or wire cable to a connecting element includes an upper and a lower die that each has a press surface. At least one recess outside of the press surfaces is provided between the upper and the lower die that decreases the risk of damage to the dies should an erroneous attachment of the wire cable to the connecting element occur.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: August 26, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: Klaus Kaufmann, Lars Meier, Christian Staab
  • Patent number: 8800137
    Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: August 12, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Su Kim, Seog Moon Choi
  • Publication number: 20130063798
    Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 14, 2013
    Applicant: RICOH COMPANY, LTD.
    Inventor: Shuji TAKAMATSU
  • Patent number: 8363400
    Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 29, 2013
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Chih-Kai Yang
  • Publication number: 20120251038
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.
    Type: Application
    Filed: March 7, 2012
    Publication date: October 4, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue, Mitsuru Honjo
  • Patent number: 8215009
    Abstract: This is directed to a power adapter plug arm manufactured from a single piece of material. The plug arm can include a plug operative to extend into a wall socket, an elongated plate coupled to an end of the plug such that the plug extends from a first surface of one end of the plate, and a pin coupled to the opposite end of the plate and extending from the opposite surface of the plate. The pin can be operative to engage a circuit board of the power adapter to provide power received from the wall socket to an electronic device coupled to the power adapter. To enhance the strength of the plug arm, the plate can be manufactured by creating a co-axial plug and a stem from a single piece of material, bending the stem, and cold heading the bent portion of the stem to form a plate. Because the cold heading process involves cold working the material, the arm and in particular the bridge member at the interface between the plate and the stem can become stronger as a result of the manufacturing process.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: July 10, 2012
    Assignee: Apple Inc.
    Inventors: Malcolm Early, Brandon Connors, Kevin Walsh
  • Patent number: 8171623
    Abstract: A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: May 8, 2012
    Assignee: Apple Inc.
    Inventors: Stephen R. McClure, Joshua D. Banko, John P. Ternus
  • Publication number: 20110222282
    Abstract: An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.
    Type: Application
    Filed: October 26, 2009
    Publication date: September 15, 2011
    Applicant: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
    Inventor: Thomas Preuschl
  • Publication number: 20100216283
    Abstract: A lead frame facilitates the handling, positioning, attachment, and/or continued integrity of multiple dies, without the use of multiple separate parts, such as jumpers. The lead frame includes a number of structures, each of which is attached to at least one lead. At least one receiving surface, arranged to receive a die, is associated with each structure. When dies are disposed on the receiving surfaces, anodes are similarly-oriented. A number of fingers are attached to the lead frame, and one or more electrode contact surfaces are attached to each finger. Each electrode contact surface can be positioned (for example, bent) with respect to one receiving surface, to facilitate electrical connection between the anode of a die and a lead. The lead frame may be used in connection with surface- and through-hole-mountable electronic devices, such as bridge rectifier modules.
    Type: Application
    Filed: May 6, 2010
    Publication date: August 26, 2010
    Applicant: VISHAY GENERAL SEMICONDUCTOR LLC
    Inventors: Peter Chou, Lucy Tian, Bear Zhang
  • Patent number: 7752738
    Abstract: Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: July 13, 2010
    Assignee: Palo Alto Research Center Incorporated
    Inventor: Thomas H. DiStefano
  • Patent number: 7721423
    Abstract: A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: May 25, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Jae Kim, Jae-Woo Joung, Young-Seuck Yoo
  • Publication number: 20080196246
    Abstract: A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.
    Type: Application
    Filed: February 19, 2007
    Publication date: August 21, 2008
    Applicant: Northrop Grumman Space & Missions Systems Corp.
    Inventors: Dean Tran, Alan Hirschberg, Melissa Fuller, Phillip Hayes, Greg Keller
  • Patent number: 7284321
    Abstract: A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: October 23, 2007
    Assignee: Micronas GmbH
    Inventors: Wolfgang Hauser, Heiko Dreher, Christian Kimstedt, Markus Rogalla
  • Patent number: 7254890
    Abstract: A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: August 14, 2007
    Assignee: Lexmark International, Inc.
    Inventors: Johnathan L. Barnes, Craig M. Bertelsen, Brian C. Hart, Gary R. Williams, Sean T. Weaver, Girish S. Patil
  • Patent number: 7251872
    Abstract: A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necessary between adjacent leads. The leads are formed by placing asymmetric top and bottom masks on a lead frame, and partially etching the top of the lead frame, while partially and over etching the bottom of the lead frame. Although the resulting leads are staggered in three dimensions, no additional processing steps are needed beyond those used to fabricate conventional packages.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: August 7, 2007
    Assignee: International Business Machines Corporation
    Inventors: Elie Awad, Paul J. Panaccione
  • Patent number: 7093357
    Abstract: A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on the tip side from the bending point so as to be extended substantially parallel to a lead portion of the lead terminal, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires, forming a cup-shaped holder portion by bending the flat portion inwards, holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions, and electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: August 22, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masanobu Sugimori, Kenichi Nakamura
  • Patent number: 7059047
    Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: June 13, 2006
    Assignee: FormFactor, Inc.
    Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
  • Patent number: 7051432
    Abstract: A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 30, 2006
    Assignee: Elster Electricity, LLC
    Inventors: Garry M. Loy, Kenneth C. Shuey
  • Patent number: 7047623
    Abstract: A device is provided for installing at least one linear motor line in the grooves (14) of an inductor (15) which is situated underneath a cover plate (10). The device includes a vehicle (31) which can be moved on the cover plate (10), a supply (34) of line (16), a device (36, 40) for forming the meander of the line (16), a device (35) for drawing the line (16) from the supply (34) and for delivering the line (16) to the device (36) and a tool (42) for pressing the line (16) into the grooves (14). The line may be installed automatically, even if the spacing of the grooves varies in dimension, by providing for an assembly slide (46) which can be moved in relation to the vehicle (31). The slide is located at least partially under the cover plate (10) and the device (36, 40) and tool (42) are located thereon.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: May 23, 2006
    Assignees: Thyssenkrupp Transrapid GmbH, NKT Cables GmbH
    Inventors: Peter Funken, Christian Rosin
  • Patent number: 7043831
    Abstract: A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer; etching the metal layer to form patterns of leads; etching recesses in the substrate to cantilever the leads and form contacts for electrically engaging bumped contacts on a component; and then forming conductors to the leads. With the substrate comprising silicon, insulating layers can also be formed on the substrate, and within the recesses, for electrically insulating the leads and the conductors. With the conductors formed on a same surface of the substrate as the contacts, the same etching process can be used to form the conductors and the leads.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: May 16, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Salman Akram
  • Patent number: 7032292
    Abstract: A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the auxiliary winding has an admittance that is greater than the admittance of the primary winding thereby yielding an asymmetry in the admittances. As such, a push/pull mechanism is obtained in a 2-port system (e.g., 1st and 2nd nodes of the primary winding) that produces a large Q factor for an on-chip inductor.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: April 25, 2006
    Assignee: Broadcom Corporation
    Inventors: Sissy Kyriazidou, Harry Contopanagos, Reza Rofougaran
  • Patent number: 6966109
    Abstract: A method attaches a center conductor to one or both of a load end conductor and a line end conductor. The center conductor has two cylindrical projections. The load end conductor and the line end conductor both have a non-circular opening, such as a square opening. One of the cylindrical projections of the center conductor is passed through the non-circular opening of the load end conductor. The cylindrical projection of the center conductor is deformed, in order to attach the center conductor and the load end conductor together. The other of the cylindrical projections of the center conductor is passed through the non-circular opening of the line end conductor. The load and line end conductors are aligned and the other cylindrical projection of the center conductor is deformed, in order to attach the center conductor and the line end conductor together.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: November 22, 2005
    Assignee: Eaton Corporation
    Inventors: Michael P. Puskar, Thomas A. Whitaker, William M. Randal, Roger W. Helms
  • Patent number: 6964095
    Abstract: A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately semicylindrical depressions on opposite sides of the centerline of the ear, shearing the ribbon at the depression bisectors to form a pair of legs on opposites of the centerline, and forming the legs into a predetermined shape about the centerline. Forming the legs includes straightening the legs and bending the legs to the appropriate predetermine relative angle. Optionally, the ear is coined. Optionally, serrations are inscribed across the ear.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: November 15, 2005
    Assignee: Etco, Inc.
    Inventor: Ralph Jacques
  • Patent number: 6935002
    Abstract: A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate with the substrate in between. An outer peripheral edge of a ground electrode (or another connected electrode), to which a capacitor electrode of the single-board-type capacitor is connected, is positioned inwardly from an outer peripheral edge of the capacitor electrode.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: August 30, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshihiro Makino, Akihito Masuda, Takashi Kawanami
  • Patent number: 6910267
    Abstract: An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the telecommunications device in which at least one of the electronic modules would normally be disposed. The catch basin module includes a rear wall having a window, the window being dimensioned to surround a group of pin connectors disposed on the backplane. The catch basin module also includes a bottom surface disposed below the window which projects out from the catch basin module and abuts the backplane under the pin connectors when the catch basin module is inserted into the slot. When pins in the pin connectors are pushed out of the pin connectors from a rear side of the backplane, the pins fall onto the bottom surface of the catch basin module and do not fall into the chassis of the telecommunications device.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: June 28, 2005
    Assignee: CIENA Corporation
    Inventor: Charles Matthew Erwin
  • Patent number: 6864572
    Abstract: A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: March 8, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng Chi Lee, Xue Jin Fu, Zheng Liang Liu, Wen Qiu Deng
  • Publication number: 20040187308
    Abstract: A method for fixing an electrical element, in particular a diode (20), using an insert, in particular a diode socket (26) in a support body (23), is disclosed. The insert, in particular, the diode socket (26), is applied in an opening (35) in the support body (23). Said method is characterized in that, in a further step, material of the support body (23) around the insert is forced into the insert, in order to achieve a strong connection between the electrical element and the support body (23).
    Type: Application
    Filed: May 21, 2004
    Publication date: September 30, 2004
    Inventor: Holger Haussmann
  • Patent number: 6797541
    Abstract: A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common “over-packaging” problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: September 28, 2004
    Assignee: Millenium Microtech Co., Ltd.
    Inventors: DoSung Chun, Sung Chul Chang
  • Patent number: 6762117
    Abstract: A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: July 13, 2004
    Assignee: Atmel Corporation
    Inventors: Ken M. Lam, Julius A. Kovats
  • Patent number: 6751849
    Abstract: A movable contact arrangement suitable for use in a switching device has a rigid contact body and a flexible conductor piece connecting the contact body to a fixed conductor. The contact body is connected to the conductor piece by mechanically compressing a section of a semifinished product in the form of a cable or strand, with the flexible conductor piece being formed by an uncompressed part of the semifinished product. The compressing operation can also be used at the same time to produce the contact body from the semifinished product. The method described allows low-cost production of contact modules for power circuit breakers used in sophisticated mechanical and electrical equipment.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: June 22, 2004
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ulrich Helmke, Harald Kurzmann
  • Publication number: 20040107567
    Abstract: Method for producing an electrical connection between a first and a second contact partner, provision being made, according to the invention, for the two contact partners to be led together as a plug-in connection and then non-detachably connected to each other in an integral or quasi-integral manner.
    Type: Application
    Filed: December 1, 2003
    Publication date: June 10, 2004
    Applicant: Mannesmann VDO AG
    Inventor: Gunther Bender
  • Patent number: 6729026
    Abstract: Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp members to a closed position and thereafter rotating the clamp members relative to one another in at least one complete relative revolution in a direction which is anti-helical relative to the coiled strands to form the bulge. The wire is gripped and rotated in the anti-helical direction for a relative rotational interval of greater than one-half, and preferably three-fourths, of a complete relative revolution. Thereafter, during the remaining rotational interval of each relative revolution, the clamp members are opened to permit the wire to be advanced to the next position where a bulge is to be formed.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: May 4, 2004
    Assignee: Medallion Technology, LLC
    Inventors: Steven E. Garcia, James A. Harden, Jr.
  • Patent number: 6725537
    Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: April 27, 2004
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventor: Koji Suzuki
  • Patent number: 6658728
    Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: December 9, 2003
    Assignee: Xerox Corporation
    Inventors: David Kirtland Fork, Jackson Ho, Rachel King-ha Lau, JengPing Lu
  • Patent number: 6647620
    Abstract: A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is sized and configured to receive a conductive connecting structure. The elastomeric material has a gap at the seat to allow electrical connection of the conductive connecting structure with a semiconductor die.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: November 18, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Alan G. Wood
  • Publication number: 20030204948
    Abstract: A method and apparatus for the safe and easy installation of wall-mounted electrical outlets and switches utilizing a multi-functional tool. Two different but similar tools are provided, each in the form of an insulated handle that may be detachably engaged with either a wall socket or a wall switch. The wall socket device includes one or more prongs for temporary engagement with slots in the socket fixture, and may include testing circuitry. The wall switch device is temporarily attached to a switch fixture using one or more magnets. Both tools may also include built-in electrical wire measuring, stripping and bending structures.
    Type: Application
    Filed: June 12, 2002
    Publication date: November 6, 2003
    Inventors: Bryan Cahill, Deborah Unser
  • Publication number: 20030192175
    Abstract: An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said, paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane.
    Type: Application
    Filed: May 8, 2003
    Publication date: October 16, 2003
    Inventor: Morley J. Weyerman
  • Patent number: 6625885
    Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: September 30, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Walter Moden
  • Patent number: 6581274
    Abstract: Apparatus having a mandrel, and a ring having an aperture therein, the ring being slidable over the mandrel. A multilead electronic component having electric leads extending therefrom is positioned atop the mandrel. The ring is pressed over the mandrel, bending the electric leads downward. When the ring is retracted, springback forces within the bent electric leads forces them against the inside of the ring; and the multilead electronic component is retained therewithin. The ring is then used, either manually or robotically, to position the component proximate a printed-circuit board with the electric leads aligned with connection apertures in the printed-circuit board. The multilead electronic component is pressed toward the printed-circuit board, forcing the leads through the connection apertures; and the ring is withdrawn for subsequent use.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: June 24, 2003
    Assignee: Trans Tron Ltd., Inc.
    Inventors: Michael E. Salmon, Gary L. Dumer, Martin F. Folgmann, William S. Hyde
  • Publication number: 20030029025
    Abstract: A device is provided for installing at least one linear motor line in the grooves (14) of an inductor (15) which is situated underneath a cover plate (10). The device includes a vehicle (31) which can be moved on the cover plate (10), a supply (34) of line (16), a device (36, 40) for forming the meander of the line (16), a device (35) for drawing the line (16) from the supply (34) and for delivering the line (16) to the device (36) and a tool (42) for pressing the line (16) into the grooves (14). The line may be installed automatically, even if the spacing of the grooves varies in dimension, by providing for an assembly slide (46) which can be moved in relation to the vehicle (31). The slide is located at least partially under the cover plate (10) and the device (36, 40) and tool (42) are located thereon.
    Type: Application
    Filed: September 3, 2002
    Publication date: February 13, 2003
    Inventors: Peter Funken, Christian Rosin
  • Publication number: 20020189095
    Abstract: It is a terminal crimping die system for crimping a terminal (6) to an electric wire by fitting an anvil (4), in which a terminal receiving groove (5a) is provided in a crimping face part (5), into a recess (2) of a crimper (3). In this terminal crimping die system, the width of each of receiving surfaces (5b), each of which is provided between a corresponding one of both end parts of the terminal receiving groove (5a) and a corresponding one of both end parts of the crimping face part (5), is not more than ½ of the thickness of the terminal (6).
    Type: Application
    Filed: June 12, 2002
    Publication date: December 19, 2002
    Applicant: YAZAKI CORPORATION
    Inventors: Naoki Ito, Hironori Kitagawa, Tsutomu Takayama
  • Publication number: 20020179326
    Abstract: A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.
    Type: Application
    Filed: May 30, 2001
    Publication date: December 5, 2002
    Inventor: Cristian Tabacutu
  • Patent number: 6477766
    Abstract: An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: November 12, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita, Dai Yokoyama
  • Publication number: 20020133941
    Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.
    Type: Application
    Filed: April 11, 2002
    Publication date: September 26, 2002
    Inventors: Salman Akram, David R. Hembree, Warren M. Farnworth
  • Patent number: RE40283
    Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: May 6, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuzuru Inaba, Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita