Abstract: An electrolytic capacitor including: a capacitor element including an anode section and a cathode section; an anode lead terminal electrically connected to the anode section; a cathode lead terminal electrically connected to the cathode section; and an outer package covering the capacitor element, wherein the anode section includes an anode body, and an anode wire extending outwardly from an implantation face of the anode body, the outer package has a first face opposing the implantation face, and a second face and a third face sharing one side with the first face and opposing each other, an area of the second face is larger than an area of the third face, an angle ?1 formed between the first and second face is less than 90 degrees, and the first face includes a protruding portion located on an extension of the anode wire, and protruding to an outside of the outer package.

Abstract: A method for producing a device for measuring current intensities, including: providing a resistor arrangement having connection elements and a resistor element arranged therebetween in a current flow direction. The resistor element and the connection elements consist of different electrically conductive materials; forming a contact pin from the material of at least one connection element; positioning a printed circuit board with a conductor track and a passage bore on the resistor arrangement such that the contact pin projects through the passage bore and has on the side of the printed circuit board facing away from the resistor arrangement a protrusion; laterally widening the contact pin in the region of the protrusion by deforming the material such that the printed circuit board is mechanically fixed to the resistor arrangement; and producing an electrically conductive connection between the contact pin and the conductor track of the printed circuit board.

Abstract: A connector includes a terminal fitting, a housing that houses the terminal fitting at a housing complete position, and a terminal retaining member that, at an assembling complete position to the housing, retains the terminal fitting remaining at the housing complete position. The terminal fitting includes a penetration hole. The terminal retaining member includes a retaining protrusion that is, at the assembling complete position, inserted into the penetration hole at the housing complete position, and retains the terminal fitting while the terminal fitting remains at that position. The penetration hole is formed to have a left-right asymmetric shape including a first hole part on the left side and a second hole part having a shape different from a shape of the first hole part and arranged on the right side of the first hole part.

Abstract: A bracket comprises: a bracket body, at least one PCB mounting mechanism and at least one isolation needle mounting mechanism. The PCB mounting mechanism is disposed on the bracket body, for mounting a PCB parasitic unit, and the isolation needle mounting mechanism is disposed on the bracket body, for mounting the isolation needle parasitic unit. The bracket is capable of mounting different types of parasitic units.

Abstract: Contact assembly for high-current applications, comprising an electric circuit board (3); a non-flexible conductor rod (1) protruding in a longitudinal direction, the conductor rod (1) transmitting an electric current of more than 30 Ampere, in particular more than 50 Ampere, between the circuit board (3) and an electric device; and a receiving member (2), the receiving member (2) being fixed to the circuit board (3); wherein the receiving member (2) holds the conductor rod (1) and transmits the current between the conductor rod (1) and the circuit board (3); wherein the receiving member (2) comprises a plurality of elastically deformable tongues (5), the tongues (5) being arranged circumferentially about the conductor rod (1) and providing for a mechanical support as well as an electric contact between the conductor rod (1) and the receiving member (2).

Abstract: A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the semiconductor chips, respectively connected to the first and second semiconductor chips through third and fourth joining materials, the terminal having a through-hole above a place between the first and second semiconductor chips, the method including a positioning step in which the first and second semiconductor chips are respectively positioned at at least three positioning places, and at least one of the positioning places is positioned with a positioning member inserted into the through-hole.

Abstract: A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board.

Abstract: A contact pin includes a retention section having at least one retention member extending radially outward from contact pin. A first portion is angularly offset in the linear direction of the longitudinal axis of the longitudinal body from a second portion. The at least one retention member has a surface which extends outwardly, beyond an outer diameter of a first end section of the contact pin. As the at least one retention member is angled linearly, the displacement of material around the opening of the deformable component causes forces to be applied to the at least one retention member in at least two directions thereby increasing the retention force of the pin in the deformable component. The angularly offset first portion and the second portion cause the retention section and the pin to rotate relative to the opening as the pin is inserted into the opening.

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract: Mechanisms for aligning electrical contacts of electronic components in a multiple layer electronic assembly are disclosed. A mounting plate is configured to align multiple layers of the multiple layer electronic assembly. The mounting plate includes a surface that a plurality of first anchor features at first predetermined locations of the surface configured to anchor a plurality of first layer electronic assemblies with respect to the surface. The mounting plate also includes a plurality of second anchor features at second predetermined locations configured to anchor at least one second layer electronic assembly with respect to the plurality of first layer electronic assemblies.

Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.

Abstract: A device for attaching a line or wire cable to a connecting element includes an upper and a lower die that each has a press surface. At least one recess outside of the press surfaces is provided between the upper and the lower die that decreases the risk of damage to the dies should an erroneous attachment of the wire cable to the connecting element occur.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

Abstract: This is directed to a power adapter plug arm manufactured from a single piece of material. The plug arm can include a plug operative to extend into a wall socket, an elongated plate coupled to an end of the plug such that the plug extends from a first surface of one end of the plate, and a pin coupled to the opposite end of the plate and extending from the opposite surface of the plate. The pin can be operative to engage a circuit board of the power adapter to provide power received from the wall socket to an electronic device coupled to the power adapter. To enhance the strength of the plug arm, the plate can be manufactured by creating a co-axial plug and a stem from a single piece of material, bending the stem, and cold heading the bent portion of the stem to form a plate. Because the cold heading process involves cold working the material, the arm and in particular the bridge member at the interface between the plate and the stem can become stronger as a result of the manufacturing process.

Abstract: A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.

Abstract: An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.

Abstract: A lead frame facilitates the handling, positioning, attachment, and/or continued integrity of multiple dies, without the use of multiple separate parts, such as jumpers. The lead frame includes a number of structures, each of which is attached to at least one lead. At least one receiving surface, arranged to receive a die, is associated with each structure. When dies are disposed on the receiving surfaces, anodes are similarly-oriented. A number of fingers are attached to the lead frame, and one or more electrode contact surfaces are attached to each finger. Each electrode contact surface can be positioned (for example, bent) with respect to one receiving surface, to facilitate electrical connection between the anode of a die and a lead. The lead frame may be used in connection with surface- and through-hole-mountable electronic devices, such as bridge rectifier modules.

Abstract: Systems and methods are provided for fabricating compliant spring contacts for use in, for example, IC packaging and interconnection between multi-layers in stacked IC packages and electronic components. Internal stresses generated within an formed film are released to cause the film to buckle and/or bow away from a supporting terminal. A thin stressed metal film layer is selectively broken away from the substrate of the supporting terminal allowing the stressed metal film to take on a bowed and/or spring-like shaped through minute deformation based on a release of the internal stresses. The resultant thin compliant spring contact can deform a small amount as the spring contact is then pressed against a compatible mating contact surface in an overlying layer.

Abstract: A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.

Abstract: A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.

Abstract: A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.

Abstract: A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.

Abstract: A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necessary between adjacent leads. The leads are formed by placing asymmetric top and bottom masks on a lead frame, and partially etching the top of the lead frame, while partially and over etching the bottom of the lead frame. Although the resulting leads are staggered in three dimensions, no additional processing steps are needed beyond those used to fabricate conventional packages.

Abstract: A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on the tip side from the bending point so as to be extended substantially parallel to a lead portion of the lead terminal, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires, forming a cup-shaped holder portion by bending the flat portion inwards, holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions, and electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.

Abstract: A device is provided for installing at least one linear motor line in the grooves (14) of an inductor (15) which is situated underneath a cover plate (10). The device includes a vehicle (31) which can be moved on the cover plate (10), a supply (34) of line (16), a device (36, 40) for forming the meander of the line (16), a device (35) for drawing the line (16) from the supply (34) and for delivering the line (16) to the device (36) and a tool (42) for pressing the line (16) into the grooves (14). The line may be installed automatically, even if the spacing of the grooves varies in dimension, by providing for an assembly slide (46) which can be moved in relation to the vehicle (31). The slide is located at least partially under the cover plate (10) and the device (36, 40) and tool (42) are located thereon.

Abstract: A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer; etching the metal layer to form patterns of leads; etching recesses in the substrate to cantilever the leads and form contacts for electrically engaging bumped contacts on a component; and then forming conductors to the leads. With the substrate comprising silicon, insulating layers can also be formed on the substrate, and within the recesses, for electrically insulating the leads and the conductors. With the conductors formed on a same surface of the substrate as the contacts, the same etching process can be used to form the conductors and the leads.

Abstract: A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the auxiliary winding has an admittance that is greater than the admittance of the primary winding thereby yielding an asymmetry in the admittances. As such, a push/pull mechanism is obtained in a 2-port system (e.g., 1st and 2nd nodes of the primary winding) that produces a large Q factor for an on-chip inductor.

Abstract: A method attaches a center conductor to one or both of a load end conductor and a line end conductor. The center conductor has two cylindrical projections. The load end conductor and the line end conductor both have a non-circular opening, such as a square opening. One of the cylindrical projections of the center conductor is passed through the non-circular opening of the load end conductor. The cylindrical projection of the center conductor is deformed, in order to attach the center conductor and the load end conductor together. The other of the cylindrical projections of the center conductor is passed through the non-circular opening of the line end conductor. The load and line end conductors are aligned and the other cylindrical projection of the center conductor is deformed, in order to attach the center conductor and the line end conductor together.

Abstract: A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately semicylindrical depressions on opposite sides of the centerline of the ear, shearing the ribbon at the depression bisectors to form a pair of legs on opposites of the centerline, and forming the legs into a predetermined shape about the centerline. Forming the legs includes straightening the legs and bending the legs to the appropriate predetermine relative angle. Optionally, the ear is coined. Optionally, serrations are inscribed across the ear.

Abstract: A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate with the substrate in between. An outer peripheral edge of a ground electrode (or another connected electrode), to which a capacitor electrode of the single-board-type capacitor is connected, is positioned inwardly from an outer peripheral edge of the capacitor electrode.

Abstract: An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the telecommunications device in which at least one of the electronic modules would normally be disposed. The catch basin module includes a rear wall having a window, the window being dimensioned to surround a group of pin connectors disposed on the backplane. The catch basin module also includes a bottom surface disposed below the window which projects out from the catch basin module and abuts the backplane under the pin connectors when the catch basin module is inserted into the slot. When pins in the pin connectors are pushed out of the pin connectors from a rear side of the backplane, the pins fall onto the bottom surface of the catch basin module and do not fall into the chassis of the telecommunications device.

Abstract: A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.

Abstract: A method for fixing an electrical element, in particular a diode (20), using an insert, in particular a diode socket (26) in a support body (23), is disclosed. The insert, in particular, the diode socket (26), is applied in an opening (35) in the support body (23). Said method is characterized in that, in a further step, material of the support body (23) around the insert is forced into the insert, in order to achieve a strong connection between the electrical element and the support body (23).

Abstract: A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common “over-packaging” problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process.

Abstract: A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.

Abstract: A movable contact arrangement suitable for use in a switching device has a rigid contact body and a flexible conductor piece connecting the contact body to a fixed conductor. The contact body is connected to the conductor piece by mechanically compressing a section of a semifinished product in the form of a cable or strand, with the flexible conductor piece being formed by an uncompressed part of the semifinished product. The compressing operation can also be used at the same time to produce the contact body from the semifinished product. The method described allows low-cost production of contact modules for power circuit breakers used in sophisticated mechanical and electrical equipment.

Abstract: Method for producing an electrical connection between a first and a second contact partner, provision being made, according to the invention, for the two contact partners to be led together as a plug-in connection and then non-detachably connected to each other in an integral or quasi-integral manner.

Abstract: Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp members to a closed position and thereafter rotating the clamp members relative to one another in at least one complete relative revolution in a direction which is anti-helical relative to the coiled strands to form the bulge. The wire is gripped and rotated in the anti-helical direction for a relative rotational interval of greater than one-half, and preferably three-fourths, of a complete relative revolution. Thereafter, during the remaining rotational interval of each relative revolution, the clamp members are opened to permit the wire to be advanced to the next position where a bulge is to be formed.

Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is sized and configured to receive a conductive connecting structure. The elastomeric material has a gap at the seat to allow electrical connection of the conductive connecting structure with a semiconductor die.

Abstract: A method and apparatus for the safe and easy installation of wall-mounted electrical outlets and switches utilizing a multi-functional tool. Two different but similar tools are provided, each in the form of an insulated handle that may be detachably engaged with either a wall socket or a wall switch. The wall socket device includes one or more prongs for temporary engagement with slots in the socket fixture, and may include testing circuitry. The wall switch device is temporarily attached to a switch fixture using one or more magnets. Both tools may also include built-in electrical wire measuring, stripping and bending structures.

Abstract: An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said, paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane.

Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.