Abstract: A device is provided for installing at least one linear motor line in the grooves (14) of an inductor (15) which is situated underneath a cover plate (10). The device includes a vehicle (31) which can be moved on the cover plate (10), a supply (34) of line (16), a device (36, 40) for forming the meander of the line (16), a device (35) for drawing the line (16) from the supply (34) and for delivering the line (16) to the device (36) and a tool (42) for pressing the line (16) into the grooves (14). The line may be installed automatically, even if the spacing of the grooves varies in dimension, by providing for an assembly slide (46) which can be moved in relation to the vehicle (31). The slide is located at least partially under the cover plate (10) and the device (36, 40) and tool (42) are located thereon.

Abstract: It is a terminal crimping die system for crimping a terminal (6) to an electric wire by fitting an anvil (4), in which a terminal receiving groove (5a) is provided in a crimping face part (5), into a recess (2) of a crimper (3). In this terminal crimping die system, the width of each of receiving surfaces (5b), each of which is provided between a corresponding one of both end parts of the terminal receiving groove (5a) and a corresponding one of both end parts of the crimping face part (5), is not more than ½ of the thickness of the terminal (6).

Abstract: A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.

Abstract: An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.

Abstract: The invention relates to a method and an arrangement implementing the method for installing a connector and a cable, in which method the connector is fastened at its middle part with a fastening agent, the rest of the connector is fastened with fastening means and the cable is connected to the connector. Further, in the method, the middle part of the connector separate from the rest of the connector is fastened with a fastening agent, the rest of the connector is fastened to the cable, the cable is connected to the separate middle part of the connector, and the cable is fastened through the rest of the connector with fastening means.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Abstract: An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of contact pins disposed on the socket body in substantially equally adjacent arrangement, each of the contact pins having one end to be connected to a terminal of the IC package and another end to be connected to the printed board, and an interval widening member provided for the socket body for widening a pitch interval between the other ends of adjacent contact pins so as to provide a predetermined distance therebetween.

Abstract: A nonreciprocal circuit device, which has superior performances and can be manufactured with a high productivity, is provided by avoiding problems in an etching method, such as long manufacturing time, and large variation of line widths, and by avoiding problems in a punching method, such as occurrence of breakage and bending during transportation of elements. When the nonreciprocal circuit device, such as an isolator, is manufactured having central conductors disposed adjacent to a magnetic body, to which a DC magnetic field is applied, and a case receiving the central conductors and the magnetic body therein, the central conductors integral with a hoop are formed by punching the hoop made of a metal film, the hoop is wound around a reel while the central conductors are transported, and when the nonreciprocal circuit devices are manufactured, the central conductors are fed into a manufacturing step after being separated from the hoop.

Abstract: In a method of inserting, into a board, axial-type electronic components, wherein each of the electronic components has a pair of lead wires extending from a main body and belongs to an assembly of electronic components connected by a tape as arranged at regular intervals, the components are grasped with a plurality of chucks which are intermittently moved to a component supplying position and a component transferring position, respectively. Each of these chucks comprises grasping pieces having first and second grasping grooves, the first grasping grooves having inner surfaces for grasping end portions of each of a first kind of the components whose taped portions are of a first tape interval, the second grasping grooves having inner surfaces for grasping end portions of each of a second kind of the components whose taped portions are of a second tape interval smaller than the first tape interval, the second grasping grooves being slightly deeper than the first grasping grooves.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting with one or more blades. The shape of the blades determines the shape of the probetips. The probetips can be coated with other conductive materials to enhance the hardness and profile of protuberances formed at the probetip ends by the blade-cutting process. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer.

Abstract: An area division unit divides a part placement area into a plurality of divided areas based on an area granularity. A part gravity value operation unit and a parts replacement unit extract a set of parts at each end of a connection line for each placement according to a connection line definition table and a parts placement table. If each part belonging to the set of parts obtained in the second process exists in a different divided area for each connection line, then the placement of each part belonging to a divided area is amended in the divided area in such a way that a connection line length between the parts can be shortened. A repetition control unit repeats a series of the above described processes while optionally changing a division starting position of the area division unit. An area granularity change unit repeats the series of the processes up to this point while gradually reducing an area granularity each time the above described series of processes terminate.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Abstract: A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a substrate hole in a press-fitting relationship. The conforming section comprises opposed beam members configured to accommodate a considerably larger hole tolerance yet still provide sufficient retention force to stabilize the pin during a soldering process that such substrates may typically undergo. The beam cross-sections are configured to allow them to occupy a side-by-side position. Contact members with the conforming section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.

Abstract: In an electronic part inserting apparatus with a checking function for a clinched state, a database for clinch-checking is generated by extracting information for clinch-checking having coordinates of holes of each part to be inserted and a size and a shape of a corresponding land to the part from BOM data and CAD data. One part is selected from the database for clinch-checking. X, Y coordinates and a size of a land of the holes of the part are extracted. A corresponding hole position on a printed circuit board to the X, Y coordinates extracted from the database is found. A line length of the clinched lead is compared with the size of the land. If the line length of the clinched lead is larger than the size of the land, the clinched state of the hole is judged to be bad, but if not larger, the clinched state of the hole is judged to be good. A judged result is displayed on a monitor.

Abstract: A method of manufacturing an electric member having a number of leads such as in a remote-controlled light receiving module, loosening prevention kinks created on at least one of the leads are shaped such that, the shorter the distance from the loosening prevention kink to the tip of the lead the thinner the loosening prevention kink. When the electric member is mounted on a printed circuit board, the leads are inserted into wiring through-holes on the printed circuit board by pressing the electric member against the board, allowing the position and orientation of the electric member to be firmly fixed automatically by virtue of the loosening prevention kinks.

Abstract: A clinching assembly for use with an insertion machine of the type used to form and insert the lead-wires of an electronic component into openings of a printed circuit board insertion machine. The clinching assembly includes two clinch heads that are selectively movable along a U-axis, parallel to the circuit board. Each clinching assembly is further selectively movable along a Z-axis, perpendicular to the circuit board. A single pneumatic actuator is used to raise and lower both clinch heads simultaneously. A T-shaped linkage attaches each clinch head with the single pneumatic actuator. Vertical movement of the pneumatic actuator is translated through the T-shaped linkage to vertically displace both clinch heads, and simultaneously, allow horizontal displacement of each clinch head, independent of the vertical location of the T-shaped linkage.

Abstract: An inserting apparatus inserts, into specified holes of a board, an axial type electronic component having a pair of lead wires extending from a main body and belonging to an assembly of electronic components which are connected by a tape and arranged at regular intervals. The apparatus includes chucks constructed so that the chucks can move forward and backward while grasping end portions of the axial type electronic component. A component carrying device is provided with the chucks and arranged at regular intervals in a circular form, each operating intermittently so that each chuck stops at least in a component supplying position and a component transferring position. A component supplying device is provided with a cutter for cutting the tape connecting the assembly of axial type electronic components, and operates to supply each axial type electronic component to each chuck located in the component supplying position.

Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Abstract: A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Abstract: A method and apparatus for measuring the concentration of mobile ions in the oxide layer of a semiconductor wafer from the contact potential shift caused by ion drift across the oxide that includes depositing charge (e.g., using a corona discharge device) on the surface of the oxide and heating the wafer to allow mobile ions in the oxide (especially Na.sup.+) to drift. The difference in the contact potential measured before and after heating provides an indication of the mobile ion concentration in the oxide layer.

Abstract: A terminal insertion machine (10) is disclosed that automatically actuates the insertion head (14) when the lower tooling (24) senses that the circuit board (26) is in proper alignment for receiving the tabs (166, 168) of the terminal (20). The lower tooling (24) includes a locating member (82) that senses the presents of two spaced holes (156, 158) in the circuit board (26) that are to receive tabs of the terminal and a rod (138) that senses the presence of the portion (162) of the circuit board (126) between the two holes (156, 158). A controller responds to a signal that the portion (162) of the circuit board is present and concurrently, that both holes (156, 158) are properly positioned. Upon receiving this signal the controller automatically actuates the insertion head (14) to insert the terminal 20 into the circuit board (26).

Abstract: An axial type electronic component inserting apparatus inserts into specified holes of a board an axial type electronic component having a pair of lead wires.

Abstract: Probes include proximal ends electrically connected to the respective conductive patterns of said insulating substrate, and free ends for being contact with the respective electrode pads of the object. The probes can be buckled in such a manner that the free ends are brought into contact with the respective electrode pads of the object under a predetermined contact pressure. Probes are formed from a wire for wire bonding by means of a wire bonder, and include proximal ends wire-bonded to each corresponding conductive patterns on the insulating substrate, and free ends formed by being cut after the wire is wire-bonded to a dummy substrate.

Abstract: A method and apparatus for reducing electromagnetic emissions from switching-type battery chargers safely and at low cost. The method and apparatus generally comprises enclosing the battery charger in a conductive metal case, electrically and physically isolating the low voltage, high current output components from the remainder of the circuitry, reducing the loop area of the output circuit, use of ferrite beads on various conductors, use of an output common-mode inductor wound within a ferrite core, use of inductors and transformers having foil windings, and use of a fusible resistor to protect internal circuitry. The battery charger includes a secondary assembly printed circuit board and a primary assembly printed circuit board which are supported in a spaced apart, substantially parallel arrangement.

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.

Abstract: A device for automatically fixing bus bars and after-fixing bus bars on an insulating board includes a workpiece setting table, on which a bus bar plate and an insulating board are set, is moved towards an upper die and a lower die, which are provided with an insulating board holding section and a bridge cutting and bus bar fixing section. The upper die is moved downwardly and upwardly, so that the bridges are removed from the bus bar plate, and the insulating board is picked up. Thereafter, an insulating board holding board holding the insulating board is moved to the bridge cutting and bus bar fixing section. The upper die is moved downwardly and upwardly again, so that bus bars are fixed onto the insulating board. As the upper die moves downwardly and then upwardly, the bridges are removed from the bus bar plate, and the insulating board and the intermediate product are lifted.

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract: A mounting system having a function of picking up one of several different type works from a pickup position where the works having the different types are selectively fed, and of moving a picked up work to an insertion position so as to mount the work on a printed circuit board. The mounting system includes a rotary member arranged to be rotatable, head mechanisms having different types and mounted on the rotary member, the head mechanisms having a number of types corresponding to that of the types of the works, a memory for storing a pickup order and an insertion order in units of types of works, a driver for rotating and stopping the rotary member at predetermined angles, and a control device for preferentially driving the head mechanism to the pickup or insertion position.

Abstract: An electromagnetic shielding clip for providing an electrical connection between two mating surfaces. The clip of the present invention comprises an electrically conductive sheet. The sheet is curved into a series of interconnected arc-shaped sections, each oriented opposite to the arc-shaped section adjacent to it. Two of the arc-shaped sections appear at opposite ends of the clip and are used to attach the clip to a mating surface through two parallel slots. Another arc-shaped section curves away from the parallel slots for contract to another mating surface. The present invention also includes a tool and method for inserting the clip.

Abstract: An electrical connector assembly and method includes a connector body and at least one unitary fastening member that is deformed at a central region of the fastening member after insertion through a mounting hole in the connector body. Projecting integrally from the deformed region of the fastening member is an internally threaded post which may receive cable screws of a cable mated with the connector assembly. In a preferred embodiment, the fastening member secures a ground strap and a faceplate to the connector body, and the internally threaded post is inserted through a panel of a computer system component.

Abstract: Alkali metal-containing glass beads for use as sources in thermionic detectors for gas chromatography are manufactured by a method which produces reproducible beads of preselected sizes. A glass tube of the desired composition is reduced to capillary size. A section having the volume of the desired bead is cut from the capillary tube and threaded onto a support wire. It is then melted and caused to coalesce onto the support wire. The resultant bead and a portion of the support wire are then incorporated into the detector.

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract: A multi-layer rigid prototype printed circuit board is fabricated by applying a heat activated, rapid setting or tacking melt-remelt adhesive utilizing a moderate temperature heat laminating device onto appropriate surfaces of pre-etched and plated insulative film based, flexible film layers. A computer guided drill drills through-holes within an electrical insulative material planar substrate core using prescribed drill sizes for each through-hole pin size desired for a given hole location. The etched layers with the adhesive applied are positioned in proper sequence aligned to the drilled hole pattern and heat laminated thereto as a stacked array on the top and/or bottom surfaces of the substrate core. Computer guided drilling of the adhered films with prescribed smaller drill sizes at each through-hole location is effected to create film cantilever portions extending radially outwardly of the edge of the through-holes.

Abstract: A parts inserting apparatus of this invention includes clinch elements arranged to be engaged with lead wires of an electronic part inserted into a printed circuit board, a detecting unit for detecting completion of insertion of the lead wires into the printed circuit board, a driving unit, connected to the clinch elements, for engaging the clinch elements with the lead wires to bend the lead wires, and a control unit for driving the driving unit to perform a clinch operation for bending the lead wires after the detecting unit detects completion of insertion of the lead wires.

Abstract: A heat sink/electromagnetic shield assembly for a circuit element disposed upon a circuit board. A spring clip containing at least one hooked projection forming the spring is positioned in a confronting relationship with the circuit element. A U-shaped housing is slidingly positioned over the circuit element and the spring clip to enclose the circuit element and to compress the hooked projection which forms the spring. Compression of the hooked projection causes the hooked projection to exert a spring force to retain the housing in position about the circuit element. The assembly may be constructed in-line during construction of the electrical circuit disposed upon the circuit board.

Abstract: An electrical device comprises a three-dimensional body formed from an organic polymer and a plurality of electrical elements attached to the body. The body has a regular pattern of sockets in its surface, and the electrical elements have barbed appendages, or, alternatively, the body has appendages and the electrical elements have sockets. The elements are affixed to the body by insertion of the appendages into the sockets. Electrical connections between the electrical elements are formed by selective deposition of tungsten onto the surface of the body with a scanning laser beam. A miniature ("gnat") robot can be constructed using those constructional techniques.

Abstract: The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body and the support.The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part, which is embedded in the metal layer.

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the hold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the disc and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.

Abstract: Subject-matter of this invention is a method for assembling components, such as M.O.S, devices and the like, upon printed circuit boards by clinching, such method including the steps of providing a board bearing a printed circuit with places upon which a component is to be assembled; applying the component upon the board with its pins in contact with the places of the circuit among which it is to be assembled; pressing the component in order that the pins are forced to penetrate through the thickness of the board; and clinching the end portions of the pins protruding from the back side of the board.

Abstract: An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.

Abstract: A circuit board assembly system is disclosed. One aspect of the system is the robotic end effector for gripping and inserting each component into the circuit board. The end effector includes a compliance mechanism which compensates for variations in body-to-lead configurations to permit components to be precisely placed without damage to the component body or leads. Another aspect of the system is a programmable lead clinching system for clinching leads of each component as the component is inserted into the circuit board. The clinching system includes a clinch element and a drive system for driving the clinch element through a predetermined series of strokes to clinch the component leads.The system further includes a component presentation module, with a plurality of component feeder devices for feeding a number of different component types, and a presentation robot for sequentially selecting each component to be inserted in the board and delivering the component to a part presentation station.

Abstract: An apparatus for cutting the leads of an electronic part inserted into a printed board and simultaneously detecting the insertion of said leads and/or the characteristics of said electronic part, said apparatus comprising:a first blade means having an electrically conductive surface;a second cutting blade means positioned in a cooperating relation to the first cutting blade means so as to cut the lead, said blade means having a substrate made of an electrically non-conductive material, a blade edge provided at one end of the substrate, and at least one wear-resisting electrode coating secured to the substrate in the vicinity of the blade edge so that the electrode coating is electrically in communication with the first cutting blade means through the lead only at the time of the cutting of the lead, said coating being made of a metal having wear resistance or an electrically conductive ceramic; andmeans for electrically connecting said electrode coating to said first blade member and for detecting the inserti

Abstract: A method of manufacturing a chip carrier having the J-shaped leads extending from the lateral sides of the enclosure of the chip carrier with the end facing the bottom of the enclosure is disclosed. The leads first extending laterally is made to have a circular arc at its end portion by use of a roller and then bent downward by using a die and then a roller, hollowed by being further curled by use of a roller to bring the end therefo to face the bottom of the enclosure.

Abstract: An electronic component lead or tab crimping apparatus adapted for use with a conveyor system in the assembly of printed circuit (PC) boards includes an upper assembly having an upper interchangeable plate and a lower actuator plate and further includes a pneumatically actuated lower assembly. The interchangeable plate includes a plurality of spaced apertures within each of which is disposed a lead/tab engaging, crimping element. The upper assembly is initially displaced upward by the pneumatically actuated lower assembly to a position in close proximity to and in alignment with the lower surface of a PC board such that each of the crimping elements is disposed in close proximity to a lead, or leads (or tabs), of an electronic component positioned on the PC board. The lower assembly then displaces the actuator plate upward by cam action such that the actuator plate simultaneously engages and pivotally displaces the crimping elements resulting in crimping of the electronic component leads or tabs.

Abstract: A method for bending and inserting a pin in one sequential operation includes the steps of feeding an end of a pre-notched pin wire, shearing a connector terminal from the end of the wire, clamping one part of the terminal between jaws, displacing the jaws toward a hole in a printed circuit board, displacing a bending sheet at a rate faster than the rate at which the jaws are displaced whereby the bending shoe bends the connector terminal pin while the jaws are moving, and inserting the bent terminal in the hole in the printed circuit board. The apparatus for carrying out the method includes a bending shoe ram and an insertion ram driven at different speeds and with different stroke lengths by an eccentric pin mounted on the end of a drive shaft.

Abstract: The invention involves apparatus for equipping circuit boards with electronic components wherein the terminal pins of the components inserted into openings in the circuit board lying on an anvil. The anvil serves the purpose of severing and bending the terminal lugs by means of suitable cutting tools each consisting of a stationary and a movable knife. Monitoring devices are provided for the terminal pin ends protruding from the openings on the side of the circuit board opposite the components. According to the invention, there is assigned to each terminal pin (26, 27) a magnetic field-dependent sensor (151, 251), whose actuating magnet (131-140, 231) is movable over monitored. Preferably the individual push rods (101 to 110) are guided at a lateral distance between the movable knifes (7, 10; 17, 20), under spring pressure.