Including Metal Fusion Patents (Class 29/839)
  • Patent number: 10368432
    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 30, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: John Song, George William Rhyne
  • Patent number: 10264679
    Abstract: A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: April 16, 2019
    Assignee: The Procter & Gamble Company
    Inventor: Christian Ellsaesser
  • Patent number: 9941611
    Abstract: Techniques and mechanisms for providing a reference potential with a flexible circuit device. In an embodiment, the flexible circuit device includes a first interconnect to exchange a signal and a second interconnect to exchange a reference potential that facilitates shielding of the signal. The first and second interconnects are variously coupled to a printed circuit board (PCB) via a first contact and a second contact of a hardware interface. During such coupling, a maximum height of the second interconnect from a side of the PCB at the hardware interface is greater than a maximum height of the first interconnect from the side of the PCB at the hardware interface. In another embodiment, a distance of the first contact from an end of the flexible circuit device is different than a distance of the second contact from the end of the flexible circuit device.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 10, 2018
    Assignee: INTEL CORPORATION
    Inventors: Kuan-yu Chen, Hao-han Hsu, Jingbo Li, Xiang Li
  • Patent number: 9357657
    Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: May 31, 2016
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Andrew Albert Hrametz, Alexander T. Duncan
  • Patent number: 9046549
    Abstract: According to one embodiment, a method for manufacturing a pressure sensing device includes preparing a sensor unit and a mounting substrate. The sensor unit includes: a membrane body; and an element unit provided on the membrane body. The element unit includes: a first electrode; a second electrode; and a first magnetic layer provided between the first electrode and the second electrode and having magnetization in a first direction. The mounting substrate includes: a base; a first electrode pad provided on the base; and a second electrode pad provided on the base and provided apart from the first electrode pad. The method further includes joining the first electrode pad to the first electrode while heated, and joining the second electrode pad to the second electrode while heated, with an external magnetic field along the first direction applied to the sensor unit.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 2, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiro Higashi, Michiko Hara, Hideaki Fukuzawa, Yoshihiko Fuji, Hiromi Yuasa, Tomohiko Nagata
  • Publication number: 20150093920
    Abstract: A magnetic connector system (100) having a cable-end connector (110) and a printed circuit board connector (115). The cable-end connector has a ferro-magnetic strike plate (155). The printed circuit board connector has plugs or bosses (120A, 120B) which mate with corresponding sockets in the cable-end connector and are configured to properly align or orient the connectors. The plugs may include electrical contacts (120A1 , 120A2, 120B1) which mate with corresponding electrical contacts in the cable-end connector. The printed circuit board connector has a magnet assembly (122) which is inserted or installed into a receiving area, and secured by retainers, after the printed circuit board connector has been wave- or reflow-soldered to a printed circuit board. The magnet assembly and the strike plate hold the cable-end connector and the printed circuit board connector together.
    Type: Application
    Filed: September 11, 2014
    Publication date: April 2, 2015
    Inventors: Robert Colantuono, Earl Anthony Daughtry, JR.
  • Patent number: 8922859
    Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Shuji Takamatsu
  • Patent number: 8832933
    Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 16, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsin Kuo, Wensen Hung, Po-Shi Yao
  • Publication number: 20140198469
    Abstract: An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing the electronic circuit on which the electronic component is mounted on the substrate are described. The electronic component has a plurality of lead pins to be electrically connected to wirings on the substrate. The substrate is formed with a hole having a larger dimension than a maximum distance between at least two lead pins of the lead pins. The lead pins are inserted into the hole from sides of tips of the lead pins while being bent at a plurality of bending portions, and fixed to the substrate by a solder.
    Type: Application
    Filed: December 23, 2013
    Publication date: July 17, 2014
    Inventors: Hiroyuki BASHO, Katsuhiko MAEDA, Masashi SUZUKI, Yuugo MATSUURA
  • Publication number: 20140111958
    Abstract: The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.
    Type: Application
    Filed: July 31, 2013
    Publication date: April 24, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Soo Lee
  • Publication number: 20140036218
    Abstract: A camera module includes a lens module having a lens holder having a top surface, a bottom surface, a side surface and a through hole through the top surface and the bottom surface, a liquid crystal lens, wires, and a driving unit, a PCB, and solder balls. The liquid crystal lens is received in the through hole. The wires are arranged on the top surface and the side surface. One end of each wire is electrically connected to the liquid crystal lens, and the other end includes a solder terminal on the side surface. The driving unit drives the liquid crystal lens. The PCB includes a rigid print circuit board supporting the lens holder and a flexible print circuit board having a free end bent toward the side surface. The solder balls interconnect the solder terminals and the free end.
    Type: Application
    Filed: October 30, 2012
    Publication date: February 6, 2014
    Inventor: YUN-KAI YU
  • Patent number: 8522425
    Abstract: A method for assembling an electronic device comprises inserting a thermal element into an electrical connector contained within a special volume defined by a constricted enclosure that comprises a housing of the electronic device. The spatial volume contains a printed circuit board and the electrical connector includes internal electrical contacts that are positioned proximate to solder connection pads on the printed circuit board when the electrical connector and the printed circuit board are contained within the constricted enclosure. Insertion of the thermal element heats the internal electrical contacts so that solder on the solder connection pads reflows to form solder connections respectively between the internal electrical contacts and the solder connection pads. Thereafter, the thermal element is removed from the electrical contact.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: September 3, 2013
    Assignee: Apple Inc.
    Inventor: Stephen Brian Lynch
  • Patent number: 8484837
    Abstract: The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: July 16, 2013
    Assignee: Schott AG
    Inventors: Andreas Nickut, Bernd Albrecht, Peter Kracht
  • Publication number: 20130146347
    Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
  • Publication number: 20130063798
    Abstract: A method of assembling a light source comprises the steps of inserting multiple lead wires of a light emitting element into an insertion hole formed in a circuit board from one side of the circuit board at once, striking tips of the multiple lead wires with corresponding multiple guides formed on a circumference of a pressing device serving as a jig from the other side of the circuit board, moving the pressing device toward the one side from the other side of the circuit board, and in a first stage guiding the multiple lead wires to corresponding terminals formed in an inner wall of the insertion hole of the circuit board, respectively.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 14, 2013
    Applicant: RICOH COMPANY, LTD.
    Inventor: Shuji TAKAMATSU
  • Patent number: 8266792
    Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: September 18, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woon-Chun Kim, Soon-Gyu Yim
  • Patent number: 8254146
    Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: August 28, 2012
    Assignee: ASUSTeK Computer Inc.
    Inventors: Chung-Wei Kuo, Chien-Jung Wu, Ming-Chuan Lee
  • Patent number: 8217274
    Abstract: A wiring member comprising a substrate, a copper wiring layer having an electrical resistivity of not larger than 4×10?6 ?cm in directly or indirectly contact with the substrate, an aluminum diffusion layer, contiguous to the copper wiring layer, having an aluminum concentration gradient descending towards the inside, and an aluminum oxide layer contiguous to and covering the aluminum diffusion layer, wherein a ratio of a thickness of the copper wiring layer to a thickness of the aluminum diffusion layer is 1.5 to 5. The disclosure is also concerned with a method of manufacturing the wiring member and an electronic device.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: July 10, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Hiroki Yamamoto, Takashi Naito, Takuya Aoyagi, Yuuichi Sawai, Takahiko Kato
  • Publication number: 20120020042
    Abstract: One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 26, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Nickolaus J. Gruendler, Paul M. Harvey, Tae Hong Kim, Sang Y. Lee, Michael J. Shapiro
  • Patent number: 8087164
    Abstract: A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 ?m.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: January 3, 2012
    Assignee: IBIDEN Co., Ltd.
    Inventors: Katsuhiko Tanno, Youichirou Kawamura
  • Publication number: 20110222282
    Abstract: An illumination device may include at least one light source; and at least two printed circuit boards arranged at least partially one above the other; wherein the at least two circuit boards are connected by means of at least one plug-connection element, with the plug-connection element being embodied on at least one side as a press-fit plug.
    Type: Application
    Filed: October 26, 2009
    Publication date: September 15, 2011
    Applicant: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
    Inventor: Thomas Preuschl
  • Publication number: 20110061233
    Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 17, 2011
    Applicant: Sun Microsystems, Inc.
    Inventors: Jorge Eduardo Martinez-Vargas, Lien-Fen(Livia) Hu, Samuel Ming Sien Lee, James David Britton, Martin John Henson
  • Patent number: 7891089
    Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: February 22, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
  • Patent number: 7849594
    Abstract: A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in the positioning blind hole; positioning the passive component in the positioning blind hole of the circuit layer and electrically connecting the passive component to the circuit layer via the conductive material in the positioning blind hole; and laminating a core layer, the passive component, and the circuit layer as the substrate.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: December 14, 2010
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Chien-Hao Wang
  • Patent number: 7815122
    Abstract: A method of making an electronic label including a chip (1) provided with two contact strips (2, 3) onto which a conducting wire (4) is welded in a single operation. The segment of conducting wire (4) forming the antenna is then cut between the two contact strips (2, 3) of chip (1). The group of chip and antenna thus realized may then be encapsulated between two sheets of a fibrous or plastic material.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: October 19, 2010
    Inventor: Pierre-Alain Bauer
  • Patent number: 7772047
    Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: August 10, 2010
    Assignee: SanDisk Corporation
    Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
  • Patent number: 7752749
    Abstract: One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY? direction.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: July 13, 2010
    Assignee: Panasonic Corporation
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Shinobu Masuda, Satoru Tomekawa
  • Publication number: 20100116534
    Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.
    Type: Application
    Filed: February 27, 2009
    Publication date: May 13, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Seung Wan Kim
  • Publication number: 20100083495
    Abstract: A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.
    Type: Application
    Filed: December 17, 2009
    Publication date: April 8, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Katsuro HIRAYAMA, Shigeo NISHIMURA
  • Patent number: 7642130
    Abstract: A bonding pad and flip chip pads in which the surfaces are formed by different metals are juxtaposed on a substrate. The substrate is immersion-treated with a first adhesive treatment liquid which contains an adhesive giving compound for reacting with only a metal surface and giving adhesion properties and is adjusted to a pH value for forming adhesive layers on both of the metal surfaces of the flip chip pads and the bonding pad. Solder powder is attached to the adhesive layers formed on each of the metal surfaces of the pads. Then, the substrate is again immersion-treated with a second adhesive treatment liquid which contains an adhesive giving compound for reacting with only a metal surface and giving adhesion properties and is adjusted to a pH value for forming the adhesive layers on the metal surfaces of the flip chip pads while peeling the adhesive layer of the metal surface of the bonding pad.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 5, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Yoko Nakabayashi
  • Publication number: 20090301760
    Abstract: As BGA's and CSP's become widespread, the number of steps in soldering module boards to rigid printed wiring boards increases. A printed circuit board warps due to heating during reflow, so even if mounting is carried out at a temperature sufficiently exceeding the melting point of a solder alloy, there was a problem of the phenomenon of fusion defects in which the solder bumps of a module board of a CSP, a BGA, or the like and the mounting paste do not fuse or parts having leads and solder paste do not fuse, resulting in conduction defects. Means for Solving the Problem When soldering a module board to a rigid printed wiring board, a post-flux is applied to a module board before mounting, a solder paste is then applied to the rigid printed wiring board, and the module board is soldered.
    Type: Application
    Filed: June 13, 2006
    Publication date: December 10, 2009
    Inventors: Masato Shimamura, Ko Inaba, Hiroshi Okada, Tsukasa Ohnishi
  • Patent number: 7571541
    Abstract: A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b) depositing sacrificial material so as fill the trenches and form a scaffold on the substrate; (c) defining openings in the sacrificial material; (d) depositing roof material over the sacrificial material to form nozzle chambers and filter structures simultaneously; (e) etching nozzle apertures through the roof material; and (f) removing the sacrificial material.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: August 11, 2009
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, David Charles Psaila, Garry Raymond Jackson, Akira Nakazawa, Jonathan Mark Bulman, Jan Waszczuk
  • Patent number: 7546682
    Abstract: A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: June 16, 2009
    Assignee: Phoenix Precision Technology Corporation
    Inventors: Shih-Ping Hsu, Chao Wen Shih
  • Publication number: 20090049687
    Abstract: [Problem] To improve productivity and reliability in mounting an electronic component. [Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder.
    Type: Application
    Filed: March 17, 2006
    Publication date: February 26, 2009
    Inventors: Tsukasa Shiraishi, Yukihiro Ishimaru, Shinobu Masuda, Satoru Tomekawa
  • Publication number: 20090016039
    Abstract: A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.
    Type: Application
    Filed: January 13, 2006
    Publication date: January 15, 2009
    Applicant: FUJIFILM CORPORATION
    Inventor: Takashi Imamura
  • Publication number: 20080307643
    Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.
    Type: Application
    Filed: June 15, 2007
    Publication date: December 18, 2008
    Inventor: Wayne A. Sozansky
  • Patent number: 7219419
    Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: May 22, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
  • Patent number: 7191516
    Abstract: A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose tolerance of the circuit die. An integrated circuit device for use in high reliability applications. The integrated circuit device is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: March 20, 2007
    Assignee: Maxwell Technologies, Inc.
    Inventor: Janet Patterson
  • Patent number: 7168160
    Abstract: A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electromagnetic field, whereby the plurality of microelectronic structures are heated by the oscillating electromagnetic field and the non-metallic substrate is essentially not heated by the oscillating electromagnetic field; (b) maintaining the non-metallic substrate and the plurality of microelectronic structures in the oscillating electromagnetic field until each of the plurality of microelectronic structures obtains a defined heat-treatment temperature substantially greater than an ambient temperature; (c) removing the non-metallic substrate and the plurality of microelectronic structures from the oscillating electromagnetic field; and (d) cooling the plurality of microelectronic structures to the ambient temperature.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: January 30, 2007
    Assignee: FormFactor, Inc.
    Inventor: Jimmy Kuo Chen
  • Patent number: 7168964
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: January 30, 2007
    Assignee: FCI Americas Technology, Inc.
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 7065858
    Abstract: A method of affixing head suspension components to one another using an edge weld formed at the edge of one head suspension assembly component positioned in an overlapping fashion relative to another head suspension assembly component, and an apparatus assembled by the method.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: June 27, 2006
    Assignee: Hutchinson Technology Incorporated
    Inventor: David J. Zachmeyer
  • Patent number: 7066376
    Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: June 27, 2006
    Assignee: Siemens Technology-To-Business Center LLLC.
    Inventors: Irving S. Scher, Daniel Conrad Benson
  • Patent number: 7013557
    Abstract: A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited. Solder paste is printed on the lands using the mask which has a convex shape such that the edges of the solder paste lie inside the edges of the lands. The electrodes are then placed on the solder paste, and the solder paste is caused to reflow to solder the electrodes to the lands.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: March 21, 2006
    Assignee: NEC Corporation
    Inventors: Hiroshi Sakai, Motoji Suzuki, Makoto Igarashi, Akihiro Tanaka
  • Patent number: 6993835
    Abstract: A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used to apply a conductive metal ball at the junction of angularly disposed conductive patterns by orienting a cornerbond assembly whereby one or more conductive metal balls are orthogonally applied and electrically connected to the respective conductive patterns.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: February 7, 2006
    Assignee: Irvine Sensors Corp.
    Inventor: Douglas Marice Albert
  • Patent number: 6988312
    Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the c
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: January 24, 2006
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
  • Patent number: 6981316
    Abstract: A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates, stacking the conductive plates, mounting contact pins to selected contact pads, and heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: January 3, 2006
    Assignee: Cooper Technologies Company
    Inventor: Jacek M. Korczynski
  • Patent number: 6910265
    Abstract: A pick and place system comprises a pick and place nozzle. The nozzle includes a groove comprising tapered sides that feed into a depression at the bottom of the groove, and a plurality of air holes configured to allow air suction to attract a component and hold it in the groove in such a manner as to ensure that the component can be accurately placed. The system also comprises a tray configured to hold a plurality of components to be picked up and placed using the pick and place nozzle. The tray can be configured to hold the components in a precise location within the tray.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: June 28, 2005
    Assignee: Kyocera Wireless Corp.
    Inventor: Miguel A. Nieves
  • Patent number: 6884708
    Abstract: The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and adhered or bonded to, via holes 22 of a TAB tape 21 and the small balls 24 are then melted so that a copper wiring 23 exposed at the via holes 22 of the TAB tape 21 can be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: April 26, 2005
    Assignee: Nippon Steel Corporation
    Inventors: Kohei Tatsumi, Kenji Shimokawa, Eiji Hashino
  • Patent number: 6871395
    Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: March 29, 2005
    Assignee: Siemens Technology-To-Business Center, LLC.
    Inventors: Irving S. Scher, Daniel Conrad Benson
  • Patent number: 6851184
    Abstract: A printed circuit board (PCB) and method of forming same is performed without incoming lines for plating. The plating is preferably performed on ball pad areas and/or bonding pad areas being the top layer of a multi-layer PCB. A metal layer that later forms circuit patterns serves to supply a power for plating ball pads for solder-ball bonding and bonding pads for wire-bonding with gold (Au). Thus, the gold (Au)-plating is performed prior to forming the circuit patterns. A positive-type first photoresist is coated on the metal layer to form the ball pads and the bonding pads. The coated first photoresist is also used to form circuit patterns. The gold (Au)-plated metal layer of ball pad areas and the bonding pad areas are protected by a second photoresist, which is reactive with a larger quantity of light than the first photoresist. Both first and second photoresists can be concurrently developed.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: February 8, 2005
    Assignee: LG Electronics Inc.
    Inventors: Sung Gue Lee, Yong Il Kim, Yong Soon Jang