Abstract: Structure usable in an assembly including a circuit component, as for example, a light unit, having a base and terminal or terminals projecting endwise from the base, comprises:(a) a body having at least one end portion adapted to provide support for the base of the light unit,(b) the body defining a cavity or cavities, and there being contact structure in the latter for removable endwise reception of the component terminal or terminals to establish electrical contact therewith when the base of the component is supported by the body end portion,(c) and an auxiliary terminal or terminals carried by the body and projecting exteriorly therefrom for reception by a circuit board or for surface attachment to the board, thereby to mount the body and component on the circuit board, the auxiliary terminal or terminals having electrical connection with the contact structure.The method of forming such an assembly is an additional feature of this invention.

Abstract: The method and the arrangement for the connection of a multipole connector to a circuit board (1), specifies that the circuit board (1) is provided with a plurality of blind holes (3), equivalent in number to and matching the location of terminals (4) extending out of the connector housing (2). The blind holes (3) are filled with solder paste (5) and the mechanical and electrical connection of the connector (2) with the circuit board (1) is carried out by reflowing the solder paste. Compared with the conventional technique utilizing through-drilled connection holes, the invention provides the advantage that conductor paths can be routed underneath the blind holes, soldering paste cannot get on the underside of the circuit board, and a tolerance compensation of the lengths of the terminals is insured without subjecting the circuit board to preload forces exerted by the terminals.

Abstract: A circuit component such as an electrical unit is mounted to a circuit board, by providing a mounting body to support the unit on the board; providing conductive means including contact structure with spring fingers to receive a nit terminal, the conductive means including auxiliary terminal means to project outwardly of the body via a body slot, the contact structure and auxiliary terminal means defining a bridge portion with tab means in the body slot to anchor the body. The light unit may extend at either end of the body.

Abstract: A printed circuit board assembly is disclosed which includes a printed circuit board having in situ molded members for mechanically securing electrical and mechanical components and the like to the printed circuit board. The printed circuit board is manufactured using a method wherein a printed circuit board is initially prepared with the required printed circuit patterns and with apertures for in situ molded members and for the leads of the electrical components. The required molded members are then molded in situ in specified apertures of the printed circuit board. The electrical components are thereafter mechanically secured in place with the in situ molded members and the leads of the components are connected to the contact pads of the printed circuit pattern.

Abstract: A conductive insert assembly is mounted in a metal shell to retain and ground out unwanted electrical signals between two or more coaxial terminals, the grounding arrangement including a cylindrical metal retention clip being carried in each passage of an array of through passages, the clip including a spring finger that establishes a first electrical circuit contact with an axial end face of the terminal, and a stiff protuberance and a resilient wing that extend radially inward to captivate and establish a second electrical path with the outer periphery of the terminal, the retention clip being captivated within a pair of conductive planar members.

Abstract: An electrical component for mechanical mouting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elongate contacts extending from the body for insertion into such plated through holes, and the component having a reservoir for retaining solder type material for melting, for flow into respective plated through holes, and for re-solidifying to mechanically and electrically couple the component to such printed circuit board. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide an interface connection between the printed circuit board and a separate or portable connector.

Abstract: An electrical component for mechanical mounting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elongate contacts extending from the body for insertion into such plated through holes, and the component having a reservoir for retaining solder type material for melting, for flow into respective plated through holes, and for re-solidifying mechanically and electrically to couple the component to such printed circuit board. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide interface connection between the printed circuit board and a separate or portable connector.A method for attaching such an electrical component to a printed circuit board compatibly with surface mount attaching processes and an apparatus to carry out such method also are part of the invention.

Abstract: Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process permits thorough electrical testing of a power semiconductor chip prior to incorporation into a relatively expensive power device package. In particular, the power chip can be tested at full-rated current, at least where the current is pulsed at a low duty cycle.

Abstract: A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP.

Abstract: An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.

Abstract: Method for replacing a single contact in an elongate connector having rows of right angle contacts with tails soldered in holes of a printed circuit board comprises steps of desoldering tail of contact, extracting the contact from the mating face, inserting a loop into the vacated contact passage from mounting face, inserting a replacement contact with a hooked tail into the vacated passage from mating face, and seating the replacement contact by using the loop to pull the hooked tail through the mounting face.

Abstract: Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces on the substrate during lead bonding.

Abstract: Printed circuit board, provided with conductive pattern on one side or both sides of the board and through-holes, has conductive materials being inserted in its through-holes, the conductive material being metallically connected with the conductive pattern.The printed circuit board is manufactured in such a manner that by inserting conductive material to the through-hole, bending end portion of the conductive material laterally toward conductive pattern, applying ultrasonic welding to the bent end portion of the conductive pattern so as to make the end portion metallically connected to the conductive pattern.

Abstract: A tool for and a method of inserting a printed circuit board on to a contact assembly is described in which the board is positioned between opposing contact fingers by rotating the circuit board on an alignment pin so that solder pads on the circuit board are aligned with and positioned between the contact fingers one at a time.

Abstract: A hybrid integrated circuit component for insertion in a slit of a mother printed circuit board, and a method of mounting the hybrid integrated circuit component. The circuit component includes a flexible circuit board composed of a flexible insulated substrate, a circuit conductor formed on one side of the substrate, and a pair of conductor layers formed along opposite sides of the substrate to serve as external connection terminals. Circuit elements are mounted on the substrate and electrically connected to the circuit conductor.

Abstract: A plurality of solenoid bobbins or bobbin wound coils are collectively attached to and supported from one surface of a printed circuit board and the coil wires are securely connected to the conductors on the board.

Abstract: An improved electronics containing cartridge and cartridge holder are disclosed. The cartridge is utilized to encase electronic circuitry, such as a bubble memory, which can be selectively added to main equipment via the cartridge holder. The cartridge itself is made by an improved system which eliminates the environmental concerns of printed circuit board manufacture. The circuit board of the cartridge is formed by molding a substantially planar member with a plurality of circuit trace forming grooves therein. The circuitry is stamped from a metal web and inserted into the respective grooves. The contacts of the holder and cartridge are arranged for low wear operation. Both of the cartridge and the holder are provided with means which are readily exchangeable and provide a plurality of keyed configurations to assure that only the proper cartridge will be inserted into the respective holder.

Abstract: An anchoring device for securing a capacitor body to a printed circuit board provides a circumferential band for encircling the capacitor body, the band including a crimpable section for reducing the circumference of the band and for applying compression to the band to engage the capacitor body, and a plurality of connectors affixed to the band and extending perpendicular to the circumference thereof for penetrating the printed circuit board to allow mounting of the clamp and thereby the capacitor body to the printed circuit board.

Abstract: An apparatus and method of forming aluminum balls utilized for ball bonding. The aluminum balls are formed in a moist argon atmosphere by applying an electrical potential across a spark gap causing a spark to occur which causes the end of the aluminum wire to melt, forming an aluminum ball.

Abstract: A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers which are often bent and displaced laterally or vertically before they can be connected to the terminal pads of a semiconductor chip. The present invention provides a removable stabilizing connecting frame which is made from the same conductive foil as the lead fingers and is provided with tear links which innerconnect the removable frame and each of the lead fingers so that the stabilizing frame may be removed after the lead fingers are bonded to the terminal pads of the semiconductor chip.

Abstract: A method for making a light emitting diode display socket. A standard receiving socket with contact terminals extending in a dual-in-line configuration from one side thereof is coupled to one edge of each of two printed circuit cards having individual terminals extending from another edge. The contact terminals of the socket enter appropriate holes along the one edge of the printed circuit cards. The assembly is then wave soldered to permanently connect the individual terminals and the socket contact terminals to the printed circuit cards. The cards are then folded toward each other to a parallel, spaced confronting position and they are secured in that position for final permanent assembly.

Abstract: This is directed to an electronic circuit apparatus using a flexible printed wiring board having a conductive leaf formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is formed on the periphery of the flexible base material. An electronic parts is mounted and connected to the circuit conductive leaf. Since the flexible base material is extremely thin and flexible, the electronic circuit apparatus can be constructed smaller and thinner.

Abstract: A method and apparatus for trimming soldered printed circuit board component leads to a uniform finished height. The leads are pre-trimmed prior to soldering to an intermediate length long enough such that when inserted into the board the leads will possess a desired degree of mechanical security, while short enough to permit even abrasive trimming. A driven abrasive surface is passed across the soldered leads and the leads are then trimmed to a uniform finished height.