Abstract: A method for manufacturing connectors comprises providing a carrier strip with a plurality of first alignment apertures and a plurality of contacts arranged in a row. The carrier strip is cut to desired lengths to form contact band pieces. The first alignment apertures are engaged with first protrusions on a carrier tape to mount each of the contact band pieces to the carrier tape. The first protrusions have a smaller outer diameter than an inner diameter of the first alignment apertures such that there is slight play there between. Resin is insert molded around the rows of the contacts to form a housing. The contacts are then cut from the carrier strip.

Abstract: A high-efficiency production method for a power module substrate with reduced line width of a conductive pattern provides an insulation substrate suitable for realizing a large current and a high voltage of a power module. According to the method, a brazing sheet is temporarily fixed on a first surface of a ceramics substrate by surface tension of a volatile organic liquid. The brazing sheet is also temporarily fixed on the first surface of a conductive pattern member punched from a base material by surface tension of same type of volatile organic liquid. The brazing sheet and the conductive pattern member are heated so as to volatilize the volatile organic liquid and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the first surface of the ceramics substrate.

Abstract: An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.

Abstract: A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.

Abstract: A device connector producing method includes a primary molding step of forming a primary molded body (20) formed with pilot holes (24), a terminal press-fitting step of press-fitting intermediate terminals (11) into the pilot holes (24) to form an intermediate product (40), and an insert molding step of setting the intermediate product (40) in a secondary molding die (50) and forming a device connector. The primary molded body (20) includes a resin inflow opening (21) that enables resin from a gate (52) to flow through the primary molded body (20) during secondary molding, and a supporting projection (23) to contact an inner surface of the secondary molding die (50). Thus, resin flow during secondary molding is good and the intermediate product (40) will not displace.

Abstract: A customer transmits their 3D CAD file for a part to be total profile machined. Computer analysis of the transmitted CAD file produces CNC machining instructions, which are transmitted back to an address defined by the customer. The customer can then use the transmitted CNC machining instructions to total profile machine their own part using their own CNC mill at the location where the part is likely needed. The transmitted instructions include not only the tool paths for CNC machining of the total profile of the part, but also for additional features formed into the encircling portion of a material block from which the part is to be total profile machined. For instance, the CNC machining instructions transmitted back to the customer can define a registration recess and/or channels or undercuts for fluid support material on an A-side of a material block. After the A-side of the block is machined, the customer adds and solidifies fluid support material into the machined recess.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may he reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate tine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: A method for making a high current low profile inductor includes forming an inductor element comprising a coil having an open center and an outside surface, the coil also having first and second coil ends, making a dry mixture comprising a dry resin and an insulated dry powdered magnetic powder, and compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: In a method of manufacturing a metal keypad panel with a micropore array, a metal laminate is prepared and etched to form micropores on the metal laminate, and a filling is coated on a surface of the metal laminate and permeated into the micropores. After the metal laminate is punched to form a metal keypad panel in a predetermined shape, the metal keypad panel is put into a mold. After a plastic material is injected into the mold, a pattern layer is formed on a side of the metal keypad panel, and then a backlight module is attached onto another side of the metal keypad panel. The backlight module has patterns, and the shape of the patterns is formed by arranging light guide microstructures. Finally, an electric signal module is attached onto a side of the backlight module to complete manufacturing the metal keypad panel.

Abstract: A method of producing a busbar structure includes a busbar arranging step for arranging a plurality of the busbars at predetermined positions in a cavity which is formed between a fixed mold and a movable mold which can be clamped and opened with respect to the fixed mold, and clamping the two molds, a resin filling step for filling molten resin into the cavity in which the busbars have been arranged, and a busbar fixing step for hardening the molten resin which has been filled thereby to fix the busbars at predetermined positions with the hardened resin, and opening the two molds. Interposed pins to be interposed between the busbars which are arranged in close proximity to each other are detachably disposed in an engaged part of the movable mold, and removed from a molded product when the two molds are opened.

Abstract: A carrier structure for electronic components includes a carrier, an interface layer, insulation paths and a metal layer. The carrier is made of a molded plastic. A reflection cup is formed on the carrier. The carrier is etched, catalyzed and activated, then deposited Ni or Cu by chemical deposition to form an interface layer on it. Afterwards insulation paths are formed on the interface layer by ablating part of the insulation layer employing laser beam radiation, in the followed step, electroplating process is carried out using Cu, Ni, Ag or Au to form a metal layer on the interface layer thereby completing the carrier structure for electronic components.

Abstract: A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.

Abstract: The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.

Abstract: Embodiments are disclosed herein that are related to input devices with curved multi-touch surfaces. For example, in one disclosed embodiment, a method of making a multi-touch input device having a curved touch-sensitive surface comprises forming on a substrate an array of sensor elements defining a plurality of pixels of the multi-touch sensor, forming the substrate into a shape that conforms to a surface of the curved geometric feature of the body of the input device, and fixing the substrate to the curved geometric feature of the body of the input device.

Abstract: There is provided a bank structure which partitions off a pattern formation region in which a functional liquid is to be disposed and flow. The pattern formation region includes a first pattern formation region, and a second pattern formation region which is continuously connected to the first pattern formation region and which has a larger width than the first pattern formation region. The second pattern formation region is provided with at least one partition bank which partitions off the second pattern formation region to regulate the flow direction of the functional liquid. A partition width substantially orthogonal to the flow direction of the functional liquid which is regulated by the partition bank is less than ±20% of the width of the first pattern formation region.

Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Abstract: The flow sensor or other type of sensor comprises a package having a cylindrical section arranged between an anchor section and a head section. The diameter of the anchor section is typically larger than the diameter of the cylindrical section, which in turn is typically larger than the diameter of the head section. A sensor chip is embedded partially into the package, with a sensitive area being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section.

Abstract: A method for preventing broken circuits of an FPC is provided, which is to attach a film to a surface of the FPC so as to enhance the strength of the FPC.

Abstract: A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Abstract: A metallic thin plate is etched to form a plurality of keypads having hollowed portions and cut to form a metallic keypad panel having a predetermined shape. Then, an electroplated layer is coated on the surface of the metallic keypad panel. A layer of protective film is adhered on the non-electroplated surface of the metallic keypad panel, which is disposed in a mold. A plastic material is then injected into the mold, so that the plastic material is formed into a pattern layer. In addition, a plastic thin plate is prepared with one side surface printed with a displaying layer, is adhered on elastic bodies having a plurality of protrusions and is cut to form an elastic layer. Finally, after the protective film is peeled off, an adhesive layer is applied thereon. The elastic layer is adhered on the surface of the adhesive layer.

Abstract: A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.

Abstract: A method for making a three-dimensional interconnect device, the device including a plurality of interconnection layers. The method includes laminating a printed circuit board comprising a plurality of interconnection layers, inserting the printed circuit board in a three-dimensional mold, injecting a molding material into the mold, so as to form a three-dimensional structure encompassing the printed circuit board, and metallizing a portion of the outer surface of the three-dimensional structure, so that it is connected with at least one interconnection layer of the printed circuit board.

Abstract: A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

Abstract: A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process.

Abstract: A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

Abstract: A method manufactures a keyboard with injecting keys and an inmold metal sheet. The bottoms of grooves of the keys are combined with an elastic material layer to form a keyboard. The metal layer is disposed at a surface of said keyboard.

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract: A manufacturing method for an actuator including a casing and a housing. The method includes setting a metallic ring in a molding die; injection molding a first flange portion of the casing using one annular hooking piece of the metallic ring as a part of a surface of the molding die so as to outsert-mold the metallic ring on a molded surface of the first flange portion, the molded surface being opposite to a first connecting end surface of the first flange portion; engaging the first flange portion with a second flange portion of the housing so as to be opposed to each other; and applying force to bend the metallic ring to form an other annular hooking piece, thereby crimping and fixing the first connecting end surface of the casing with a second connecting end surface of the housing.

Abstract: A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as differential transmission at via parts. For this wiring base board, an insulating substrate is used. The wiring base board has a first via hole part which is formed in the insulating substrate and provides a plurality of circumferential face parts, and a plurality of second via hole parts, forming concentric circles with the circumferential face parts, which are formed in the first via hole part through an insulator. By this, a differential wiring structure and coaxial structure parts are constituted.

Abstract: An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract: There are provided a magnetic element capable of enhancing magnetic permeability of a magnetic member, improving a direct current superposition characteristic, and improving production efficiency and a method of manufacturing the magnetic element. The magnetic element includes a coil (30) formed of a conductor having an insulating film, a first core member (20) constituted of insulative soft magnetic ferrite and covering the coil (30), and a second core member (50) having soft magnetic metal powder as material and surrounded by the first core member (20). Furthermore, the magnetic element includes a third core member (40) which has soft magnetic metal powder as material and a higher filling ratio of the soft magnetic metal powder than the second core member 50 and is surrounded by the first core member (20).

Abstract: A printed circuit board on which a connector is mounted includes an insulating layer through which holes are formed and a supporting layer. An upper surface of the supporting layer is attached to the connector. The supporting layer is disposed on an upper surface of the insulating layer, is extended from the upper surface of the insulating layer to a lower surface of the insulating layer, and passes through the holes in order to support the connector. The holes are arranged in a plurality of columns each being parallel to a longitudinal direction of a lateral surface of the connector.

Abstract: A method for producing a plurality of stamped shapes to serve as a mechanism for connecting and/or soldering or sealing a component, on a substrate, including the steps of depositing a layer made of a ductile material on the substrate and stamping the layer by means of an etched die having the plurality of etched portions defining one or more shapes to form the plurality of stamped shapes.

Abstract: A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so as to correspond to the piezoelectric element, the method comprising in this order a step of providing, on the substrate, a mold material corresponding to the ink flow path, a step of providing a wall material of the ink flow path so as to cover the mold material, a step of eliminating a portion of the substrate corresponding to the piezoelectric element thereby forming a space in the substrate, and a step of eliminating the mold material thereby forming the ink flow path.

Abstract: There is provided a wiring board. The wiring board includes: a plurality of laminated insulating layers including a first insulating layer, the first insulating layer being either one of an uppermost layer or a lowermost layer; wiring patterns formed in the plurality of insulating layers; external connection pads provided on the first insulating layer; external connection terminals provided on the external connection pads; and a molding resin provided on a surface of the first insulating layer on which the external connection pads are provided, the molding resin having openings from which the external connection pads are exposed. A thickness of the molding resin is set such that the molding resin does not protrude above the external connection terminals.

Abstract: A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.

Abstract: A light emitting diode mounting seat includes: a base having a conductive main part of a metallic material and a lead-mounting part of a non-conductive material containing a compound of the metallic material; and a conductive lead mounted on the lead-mounting part. The compound is an oxide of the metallic material.

Abstract: Guard electrodes 2 which are electrically connected with a conductive portion of a cooling water passage 23 through connection lines 3 are respectively provided in the middle of a water inlet pipe 1 connected with a water inlet master pipe 10 and a water outlet pipe 6 connected with a water outlet master pipe 13 in M pieces of semiconductor laser units 4. At this time, since the guard electrode 2 has a potential equal to the conductive portion of the cooling water passage 23, the electric current hardly flows between the guard electrode 2 and the conductive portion of the cooling water passage 23. As a result, rusting is inhibited in the M pieces of semiconductor laser units 4, and a clogged piping is prevented in the cooling water passage 23.

Abstract: The present invention relates to an electronic device (1) which comprises a modular housing (2) comprising a plurality of stacked housing parts (4, 6) that are mechanically interconnected by connection means (8, 10), and which comprises electronic parts (16, 26) having contact portions (30, 32) for providing electrical contact between the parts, a housing part adapted to accommodate an electronic part and having contact members for providing electrical contact between the parts, which contact members comprise conductive tracks (12) provided on a first surface (14), wherein the contact members comprise conductive tracks (18) provided on a second surface (20), the tracks on the second surface of a housing part are electrically connected to the tracks on the first surface of said housing part, and the second surface faces towards the first surface of a next housing part when connected to the housing.

Abstract: The present invention fixes a nozzle sheet on a substrate with a predetermined material (5,6), which has an excellent chemical resistance and sufficient adhesiveness, or more specifically, fixes the nozzle sheet on the substrate with cyclized rubber or with patternable, adhesive elastic material. Moreover, the present invention forms walls for liquid chambers and liquid channels with polyimide.

Abstract: The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or electromechanical device, a molded dielectric layer for forming a cavity and a seal ring. The molded dielectric is formed by aligning a dielectric preform with the base, positioning the seal ring on top of the preform, then applying a mold over the layers to shape the dielectric during a firing process that fuses the base, preform and seal ring to create a hermetic seal. The preform is of sufficient thickness that the electronic device will be fully contained within the cavity when placed into the completed package.

Abstract: The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of supplying fluid and the step of hardening the fluid to form the reinforcing material. The step of supplying the fluid includes the step of bringing the substrate connecting to the flat cable member close to a jig and then supplying the fluid to a region in which the reinforcing material is to be formed while preventing the outflow of the fluid with the jig.

Abstract: Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

Abstract: A method of producing a surface acoustic wave device includes a sacrificial-layer forming step of forming a sacrificial layer on a piezoelectric substrate so as to cover comb electrodes and reflectors, a space-forming-member forming step of forming a space-forming member while openings are formed near the reflectors along a surface of the sacrificial layer, a sacrificial-layer removing step of removing the sacrificial layer from the openings of the space-forming member, and a resin sealing step of sealing a surface acoustic wave element with sealing resin, the surface acoustic wave element having an excitation protection space formed between the reflectors and the comb electrodes by the space-forming member.

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Abstract: According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip component exposed; a peeling step of peeling the first molding die at a side of inserting the chip component; a secondary molding step of filling a second molding die with resin with a second end electrode of the chip component; and a forming step of forming a circuit wiring on one side or both sides of a molded element molded with resin, wherein the chip component is disposed according to a specified rule, and the chip component is molded with the resin.