By Using Wire As Conductive Path Patents (Class 29/850)
  • Patent number: 11051407
    Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 29, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Prabjit Singh, Daniel J. Kearney
  • Patent number: 10983615
    Abstract: The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 20, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Wilfried Lovenich, Rüdiger Sauer, Udo Guntermann
  • Patent number: 10660214
    Abstract: Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: May 19, 2020
    Assignee: Board of Regents, The University of Texas System
    Inventors: Ryan B. Wicker, Francisco Medina, Eric MacDonald, Danny W. Muse, David Espalin
  • Patent number: 10608356
    Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 31, 2020
    Assignee: L-3 Technologies, Inc.
    Inventor: Matthew J. Spitzner
  • Patent number: 10559951
    Abstract: A translating wire harness includes a first portion, a second portion configured to translate relative to the first portion, a wire spool coupled to the first portion, and an electrical wire at least partially wound onto the wire spool, wherein the electrical wire at least partially unwinds from the wire spool in response to the second portion translating away from the first portion, and the electrical wire at least partially winds into the wire spool in response to the second portion translating towards the first portion, a portion of the electrical wire extending between the first portion and the second portion remains taught during translating of the second portion both (a) away from and (b) towards the first portion.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: February 11, 2020
    Assignee: ROHR, INC.
    Inventor: Steven M. Kestler
  • Patent number: 9984994
    Abstract: A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: May 29, 2018
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Tirunelveli Sriram, Brian Smith, Bryan Mclaughlin, John Lachapelle
  • Patent number: 9801267
    Abstract: The present invention provides a wiring structure of high frequency signal wires and a PCB board including the wiring structure of high frequency signal wires. A test part is formed by extending a high frequency signal wire from a connection end connected with a solder pad, and a test window corresponding to a position of the test part is provided on a copper foil which covers the solder pad and the test part, to expose the high frequency signal wire, such that a high frequency signal transmitted via the high frequency signal wire can be directly tested at the test window. Thus, circular test points used in the prior art can be removed, to effectively solve the problem of insufficient space on a PCB; accordingly, lengths of the high frequency signal wires become more precise, so as to ensure a synchronization of transmission of the high frequency signal wires.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: October 24, 2017
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yue Wu, Fei Yang, Min He, Yu Wang
  • Patent number: 9736932
    Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 15, 2017
    Assignee: Flextronics AP, LLC.
    Inventors: Weifeng Liu, Anwar Mohammed, Murad Kurwa
  • Patent number: 9383522
    Abstract: A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: July 5, 2016
    Assignee: Compass Electro Optical Systems Ltd.
    Inventors: Amir Geron, Gideon Katz
  • Patent number: 9263870
    Abstract: A system and method for installing a fiber or cable on a wall or ceiling of a structure includes providing a fiber, wire or cable pre-coated with a hot melt adhesive that simply needs to be activated by the application of sufficient heat for a sufficient amount of time immediately before installation. Rolls or cartridges of wire or cable pre-coated with the hot melt adhesive are provided. The hot melt adhesive coated wire or cable is fed through a heated chamber, preferably a tip on a portable heating device such as a battery operated soldering iron, which activates the pre-coated hot melt adhesive prior to utilizing the heating tip to apply pressure to the adhesive wire directly to a wall or ceiling thereby adhering the fiber, wire or cable to the desired surface.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: February 16, 2016
    Assignee: CommScope Technologies LLC
    Inventor: William H. Mann
  • Patent number: 9099449
    Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: August 4, 2015
    Assignee: Cascade Microtech, Inc.
    Inventors: Kenneth R. Smith, Mike Jolley, Eric Strid, Peter Hanaway, K. Reed Gleason, Koby L. Duckworth
  • Patent number: 9086094
    Abstract: The present invention provides a cage, for a rolling bearing, whose surface is silver-plated by using a barrel plating method capable of improving the durability thereof in a sliding test. In the cage, for the rolling bearing, made of an iron metal material and having a precious metal-plated layer formed on a surface thereof, the precious metal-plated layer is formed on a base plated layer formed on a surface of the iron metal material by using a barrel electroplating method. A surface of the base plated layer consists of a smooth surface. The precious metal-plated layer is in direct close contact with the smooth surface. The base plated layer consists of a metal having a higher ionization tendency than the precious metal formed on the surface of the base plated layer. A cavity is not present at an interface between the copper-plated layer and the silver-plated layer.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: July 21, 2015
    Assignee: NTN CORPORATION
    Inventors: Masaki Egami, Kiyoshi Nakanishi, Masao Kawashima
  • Publication number: 20150140286
    Abstract: The disclosure describes a metal-wire-based method for making an integrated ingot, which basically comprises a dielectric matrix and a patterned array of metal wires, and may further comprise other additive elements at desired locations. After sawing the integrated ingot into slices, a plurality of substrates containing through substrate metal pillars and other additive elements at desired locations are produced in a batch way. The metal-wire-based method comprises the key steps: forming a patterned array of metal wires, precisely integrating other additive elements at desired locations when needed, forming a solid dielectric material in the empty space among and around metal wires and other additive elements. Furthermore, a guidance metal wire method is described for precisely integrating other additive elements at desired locations in a patterned array of metal wires.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Inventor: Yuci Shen
  • Patent number: 9027227
    Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: May 12, 2015
    Assignee: Féinics Amatech Teoranta
    Inventor: David Finn
  • Publication number: 20150117001
    Abstract: A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.
    Type: Application
    Filed: October 3, 2014
    Publication date: April 30, 2015
    Inventor: Ben FAN
  • Publication number: 20150113802
    Abstract: A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.
    Type: Application
    Filed: January 9, 2015
    Publication date: April 30, 2015
    Inventors: Takuya KOTSUBO, Shunsuke CHISAKA
  • Patent number: 9015936
    Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: April 28, 2015
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Che-Wei Hsu, Shih-Ping Hsu
  • Publication number: 20150109749
    Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.
    Type: Application
    Filed: April 2, 2014
    Publication date: April 23, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Ching-Ho Chou, Do Chen, Shang-Yu Li, Chun-Jen Chung
  • Publication number: 20150109251
    Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
    Type: Application
    Filed: December 24, 2014
    Publication date: April 23, 2015
    Inventors: KAI MENG, LIEN-HSIN LEE
  • Publication number: 20150109249
    Abstract: A touch panel that includes a substrate, a first conductive layer, a second conductive layer, and FPCs including a first FPC and a second FPC, the first FPC is connected to the first conductive layer, the second FPC is connected to the second conductive layer; the first conductive layer includes n rows of first conductive patterns, one end of each row is connected to one end of a first metal wire, the other end of the first metal wire is connected to the first FPC; the second conductive layer includes m columns of second conductive patterns, one end of each column is connected to one end of a second metal wire, the other end of the second metal wire is connected to the second FPC.
    Type: Application
    Filed: December 12, 2014
    Publication date: April 23, 2015
    Inventors: Xingfa Tian, Zengcai Sun, Zhu Liu
  • Publication number: 20150107102
    Abstract: A space transformer includes a carrier substrate made for a chip package, an insulated layer disposed on the carrier substrate, and a conductive block. The carrier substrate is provided with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer has a hole corresponding in position to the elongated contact. The conductive block has an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column and connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle. The method for manufacturing the space transformer is also disclosed.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventors: Chung-Tse LEE, Chien-Chou WU, Tsung-Yi CHEN
  • Publication number: 20150083479
    Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
    Type: Application
    Filed: December 4, 2014
    Publication date: March 26, 2015
    Inventors: KAI MENG, LIEN-HSIN LEE
  • Publication number: 20150061345
    Abstract: A flexible laminate (1) includes an electrically non-conductive substrate (2) with a substantially planar configuration, an electrically conductive element (3) on a surface of the electrically non-conductive substrate, and a layer (4) on a surface of the electrically non-conductive substrate (2). The electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) are coaxially punctured forming a punctured region (6). They are connected to each other through a mechanical connection element (5) which extends through the electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) at the punctured region (6). The cross-sectional area of the electrically conductive element (3) at the location of the punctured region (6) is larger than the cross-sectional area of the electrically conductive element (3) outside the punctured region (6).
    Type: Application
    Filed: June 27, 2014
    Publication date: March 5, 2015
    Applicant: ATL Technologies B.V.
    Inventors: Ingmar Cees Johannes VAN DER LINDEN, Jelmer Douwe SMINIA
  • Publication number: 20150053664
    Abstract: A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.
    Type: Application
    Filed: February 27, 2014
    Publication date: February 26, 2015
    Applicant: Goodrich Corporation
    Inventor: Jin Hu
  • Publication number: 20150034019
    Abstract: An animal deterrent device includes an elongated carrier having an internal cavity. A conductive trace can be coupled to the carrier by a first fastener that extends from the conductive trace to the cavity, which prevents water from contacting the fastener and shorting the conductive trace.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventor: Bruce Donoho
  • Patent number: 8921701
    Abstract: A modular insulator for an electrical conductor is provided. The modular insulator includes a first end member configured to couple to a support rail of an electrical power distribution system and a second end member configured to couple to the support rail. The modular insulator further includes at least one intermediate member comprising a groove and configured to releasably couple to at least one of the first and second end members such that the intermediate member is positioned between the first and second end members. The groove is configured to receive a portion of the electrical conductor.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: December 30, 2014
    Assignee: General Electric Copany
    Inventors: Maciej Bartosz Lejawka, Jacek Waclaw Nurzynski, Dharamveer Surya Prakash Bathla
  • Patent number: 8910376
    Abstract: A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in proximity to at least one of the proximal end or the distal end of the body to expose at least part of at least one of the conductors. A C-shaped contact is disposed into each of a different one of the transverse channels. Each C-shaped contact is electrically coupled to at least one of the conductors. Each C-shaped contact is closed so that opposing ends of the C-shaped contact are adjacent to one another and aligned over one of the elongated conductors. The two opposing ends of each C-shaped contact is coupled together such that each C-shaped contact forms a continuous path around the arrangement within the transverse channel in which the C-shaped contact is disposed.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: December 16, 2014
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventor: Matthew Lee McDonald
  • Publication number: 20140352144
    Abstract: Claimed methods reduce leakage currents in transparent conductive films comprising conductive nanostructures without substantially impairing the films' optical properties or physical integrity. Imposition of electrical stimuli to separate conductive regions leads to reduced conductivity of the intervening lesser conductive regions.
    Type: Application
    Filed: May 8, 2014
    Publication date: December 4, 2014
    Applicant: Carestream Health, Inc.
    Inventors: Robert J. Monson, Andrew T. Fried, Eric L. Granstrom
  • Patent number: 8901940
    Abstract: A sensing edge for providing a signal to a controller indicating that a forward edge of a door is obstructed during operation includes an elongated sheath and first and second end plugs. The elongated sheath is mounted to the forward door edge and has a first end, second end and first cavity connecting the ends. First and second spaced apart electrically conductive materials are disposed within the elongated sheath. The first end plug includes an inner end having first engaging structures positioned within the first cavity in an assembled configuration and an outer end having a first depression for housing an electronic component. The electronic component is electrically coupled to the electrically conductive materials. The second end plug includes an inner end having a sensing component and second engaging structures positioned within the first cavity in an assembled configuration. The sensing component is electrically coupled to the electrically conductive materials.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: December 2, 2014
    Assignee: Miller Edge, Inc.
    Inventors: Jack Provenzano, Vinay Sao, Krishnaraj Tejeswi
  • Publication number: 20140341448
    Abstract: In a sensing device, sensing circuit cells are formed on a lower structure, an upper structure is disposed on the lower structure along a vertical direction, and divergent traces are formed in the upper structure and electrically connected to the sensing circuit cells, respectively. Each divergent trace comprises at least one horizontal extending portion and at least one vertical extending portion perpendicular to each other. Sensing electrode cells are formed in the upper structure and electrically connected to the divergent traces, respectively, and sense biometrics features of an organism to generate sensing signals, which are transmitted to the sensing circuit cells through the divergent traces. The sensing circuit cells processes the sensing signals to obtain output signals, respectively. A minimum distribution area covering the sensing circuit cells is smaller than or equal to a minimum distribution area covering the sensing electrode cells.
    Type: Application
    Filed: May 14, 2014
    Publication date: November 20, 2014
    Inventor: MEI-YEN LEE
  • Publication number: 20140340593
    Abstract: An electronic component includes a substrate, a shielding layer formed on the substrate and a wiring substrate connected to the substrate. A pad group is formed on an overlap region on which the wiring substrate is arranged on the substrate. A first alignment pattern is formed on the substrate and extending to outside of the overlap region beyond a peripheral portion of the overlap region. A second alignment pattern is formed on the substrate and extending to outside of the overlap region beyond the peripheral portion of the overlap region. The pad group, the first and second alignment patterns are formed on the shielding layer. The first alignment pattern extends in a different direction from the direction of the second alignment pattern.
    Type: Application
    Filed: April 29, 2014
    Publication date: November 20, 2014
    Applicant: Japan Display Inc.
    Inventors: Yuji SATO, Yoshikazu YOMOGIHARA
  • Publication number: 20140313714
    Abstract: A device for illuminating a space comprising is discussed. In one variation, the device includes: a central body portion, with a length and a width, and including two plates running along the length of the central body portion wherein the two plates are separated by a spacer; an opening for the removal of heat during operation of the device that extends along a portion of the length of the central body portion, a light emitting diode on the central body portion; a reflector, extending from the central body portion, for reflecting light emitted by the light emitting diode towards the illuminated space. Other variations are also discussed as are methods for using suitable variations for retrofitting existing non-light emitting diode light sources.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 23, 2014
    Applicant: APPALACHIAN LIGHTING SYSTEMS, INC.
    Inventors: James J. WASSEL, R. Douglas FALK
  • Publication number: 20140309510
    Abstract: A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.
    Type: Application
    Filed: June 25, 2014
    Publication date: October 16, 2014
    Inventors: Joseph Y. Lucisano, Richard E. Calou, Mark B. Catlin, Joe T. Lin, Timothy L. Routh
  • Patent number: 8853551
    Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: October 7, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Yuu Sugimoto, Kimihide Kitamura
  • Publication number: 20140290988
    Abstract: A patterned conductive structure includes a transparent substrate having a substrate surface. A conductive polymer layer is formed on the substrate surface. The conductive polymer layer has electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas. The conductive areas and the deactivated areas form a conductive pattern in the polymer layer. One or more transparent dielectric patches that are less electrically conductive than the deactivated areas are formed over at least a portion of one or more deactivated areas and one or more conductive wires are formed over at least one of the dielectric patches.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 2, 2014
    Inventor: Todd Mathew Spath
  • Publication number: 20140290997
    Abstract: To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability. The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer is formed on the surface of the upper insulating layer. The upper insulating layer is formed thinner than the lower insulating layer. The silica filler occupying the upper insulating layer has a lower volume proportion than the volume proportion of the silica filler and the glass cloth that are occupying the lower insulating layer.
    Type: Application
    Filed: April 3, 2013
    Publication date: October 2, 2014
    Inventor: Shinnosuke Maeda
  • Publication number: 20140292937
    Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 2, 2014
    Inventors: Mitsuru Chida, Kenji Fujii, Makoto Watanabe, Toshiaki Kurosu, Masataka Nagai, Takanobu Manabe
  • Patent number: 8836509
    Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: September 16, 2014
    Assignee: Direct Payment Solutions Limited
    Inventor: Jonathan David Lowy
  • Publication number: 20140251676
    Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.
    Type: Application
    Filed: October 9, 2012
    Publication date: September 11, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuhiko Kurafuchi, Daisuke Fujimoto, Kunpei Yamada, Toshimasa Nagoshi
  • Patent number: 8827253
    Abstract: A hand-strung jewelry construction board. A plurality of holes is drilled into the board. One or more pins are inserted into the holes. Also, one or more clamps are inserted into the holes. A jewelry string is looped around the pins and clamped in position by the clamps. In a preferred embodiment, second and third strings are wrapped around the jewelry string adjacent the pins at each end of the jewelry string. The second and third wrapped strings are glued into place. When the jewelry string is removed from the jewelry construction board, permanent loops are formed into the jewelry string.
    Type: Grant
    Filed: February 19, 2011
    Date of Patent: September 9, 2014
    Inventor: Sandra Younger
  • Patent number: 8819927
    Abstract: A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 2, 2014
    Assignee: Eastman Kodak Company
    Inventor: Ronald Steven Cok
  • Patent number: 8810040
    Abstract: A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: August 19, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kentaro Kaneko, Kazuhiro Kobayashi
  • Publication number: 20140225957
    Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 14, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Tomohiro Takahashi, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Masashi Ishikawa
  • Publication number: 20140218643
    Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Applicant: INNOLUX CORPORATION
    Inventors: KAI MENG, LIEN-HSIN LEE
  • Publication number: 20140197899
    Abstract: A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via.
    Type: Application
    Filed: November 18, 2013
    Publication date: July 17, 2014
    Applicant: FUJITSU LIMITED
    Inventor: Kenichi KAWAI
  • Publication number: 20140177106
    Abstract: A thick portion having a first thickness and a thin portion having a second thickness on a base insulating layer are formed on a conductive support substrate. The second thickness is smaller than the first thickness. A boundary surface is formed between an upper surface of the thick portion and an upper surface of the thin portion. A boundary line between the upper surface of the thick portion and the boundary surface extends in a first direction. Write wiring traces and read wiring traces are formed to extend on the thick portion and the thin portion of the base insulating layer. The lateral sides of the write wiring traces and the read wiring traces extend in a second direction that intersects with the first direction, and the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 26, 2014
    Applicant: Nitto Denko Corporation
    Inventor: Youhei Shirafuji
  • Publication number: 20140173894
    Abstract: A method of coating a rear glass substrate for an electrochromic reflective element includes providing a fixture having a recess and a masking element extending from a perimeter region of the recess over a portion of the recess. The masking element includes a disc portion and an arm portion extending between the disc portion and the perimeter region of the recess of the fixture. A rear glass substrate is positioned in the recess and the masking element extends over and is spaced from the surface of the glass substrate. The glass substrate surface is coated with a mirror reflector coating. The masking element is shaped such that the mirror reflector coating is deposited at the surface behind the arm portion but is substantially not deposited behind the disc portion so as to establish a window region through the mirror reflector coating at the glass substrate surface.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Applicant: MAGNA MIRRORS OF AMERICA, INC.
    Inventors: John T. Uken, Michael J. Baur, Ian A. McCabe, Hamid Habibi
  • Publication number: 20140169399
    Abstract: The present disclosure provides a heat sensitive touch panel that comprises a substrate and a sensing layer disposed on the substrate, wherein the sensing layer comprises heat sensitive blocks and conductive wires. The heat sensitive blocks are made of a heat sensitive material and disposed on the substrate. The conductive wires are disposed on the substrate to electrically connect the heat sensitive blocks with a controller. If a finger or a dedicated stylus touches the heat sensitive touch panel, resistance of the heat sensitive blocks will change correspondingly such that the output signals generated when the touch panel is touched by a finger or a dedicated stylus are different from those when untouched, thereby being able to determine the touch location. The heat sensitive touch panel can detect a touch location of a conductive object or a non-conductive object on the touch panel.
    Type: Application
    Filed: July 28, 2013
    Publication date: June 19, 2014
    Applicant: TPK TOUCH SOLUTIONS (XIAMEN) Inc.
    Inventor: Gokalp Bayramoglu
  • Patent number: 8732944
    Abstract: In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: May 27, 2014
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventor: Homar Cisneros
  • Publication number: 20140131074
    Abstract: A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 15, 2014
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi