Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

Abstract: The present disclosure provides a stimulation lead for providing stimulation signals to nerve tissue and improved methods for constructing and manufacturing such a stimulation lead. The stimulation lead and/or methods includes a lead with a cable disposed within. At each end of the lead body a portion of the cable is exposed, and a metal ferrule is securely attached to the exposed cable portion. An electrode/contact is then securely attached to the metal ferrule such that the electrode covers the metal ferrule, a portion of the lead body, and a transition point where the exposed cable exits the lead body. A tine component may be swaged around a portion of the term end, configured to provide a retaining force against an force acting upon the stimulation lead, while allowing insertion of the stim end of the stimulation lead during implantation, and extraction of the stim end during explantation.

Abstract: Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 ?m by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 ?m to 5 ?m.

Abstract: A touch panel and a manufacturing method thereof, and a display device are provided. The touch panel includes a base substrate, the base substrate includes a touch area and a lead end area; the touch area is provided with a plurality of first electrodes and a plurality of second electrodes, and the second electrodes are intersected with and insulated from the first electrodes; a plurality of leads, electrically connected with the plurality of first electrodes and the plurality of second electrodes respectively, and connected to the lead end area (120), and the plurality of leads include a transparent conductive layer lead.

Abstract: In one embodiment, a method includes receiving at a thermal modeling module, data from a Power Sourcing Equipment device (PSE) for cables extending from the PSE to Powered Devices (PDs), the cables configured to transmit power and data from the PSE to the PDs, calculating at the thermal modeling module, thermal characteristics for the cables based on the data, and identifying a thermal rise above a specified threshold at one of the cables. The data comprises real-time electrical data for the cables. An apparatus and logic are also disclosed herein.

Abstract: A coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and coil conductive layers disposed inside the multilayer body. The plurality of resin insulating layers includes non-photosensitive first resin insulating layers and photosensitive second resin insulating layers. The multilayer body has a section where the first resin insulating layers and the second resin insulating layers are alternately laminated.

Abstract: Disclosed is an electrically-conductive film, comprising a support layer, an electrically-conductive area, a lead, and a bridging part. The support layer comprises a first side and a second side in an opposite arrangement. The support layer is recessively provided with a first groove and a second groove not in communication with each other. The first groove is filled with an electrically-conductive material to form an electrically-conductive area. The second groove is filled with an electrically-conductive material to form a lead. The bridging part is provided on the first side; the bridging part is electrically connected to the electrically-conductive area and to the lead. With the bridging part connected to the electrically-conductive area and to the lead, the connection is of increased reliability, and the electrical conductivity is increased. In addition, also disclosed is a preparation method for the electrically-conductive film.

Abstract: The invention relates to a method for producing stranded wires, including the steps of applying an insulation layer to lines, separating the insulated lines, individually removing the insulation layer from the separated lines along a partial length of the lines, and bringing the lines together to form a stranded wire, wherein the partial lengths are arranged at the same level at least in sections for the purpose of forming a non-insulated contact region.

Abstract: A dual axis hinge assembly couples first and second hinges to each other with a central barrel and routes cables across hinge axles with cable channels formed in the axles. The dual axis hinge assembly rotationally couples information handling system housing portions to each other and routes cables between the housing portions distal the barrel by running the cables through a channel formed in each axle of one of the hinges with the cable entering one axle distal the barrel, routing through the axle to a position proximate the barrel, crossing the hinge to enter the other hinge axle proximate the barrel and routing though the other axle to exit distal the barrel.

Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

Abstract: The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds.

Abstract: Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.

Abstract: A translating wire harness includes a first portion, a second portion configured to translate relative to the first portion, a wire spool coupled to the first portion, and an electrical wire at least partially wound onto the wire spool, wherein the electrical wire at least partially unwinds from the wire spool in response to the second portion translating away from the first portion, and the electrical wire at least partially winds into the wire spool in response to the second portion translating towards the first portion, a portion of the electrical wire extending between the first portion and the second portion remains taught during translating of the second portion both (a) away from and (b) towards the first portion.

Abstract: A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Abstract: The present invention provides a wiring structure of high frequency signal wires and a PCB board including the wiring structure of high frequency signal wires. A test part is formed by extending a high frequency signal wire from a connection end connected with a solder pad, and a test window corresponding to a position of the test part is provided on a copper foil which covers the solder pad and the test part, to expose the high frequency signal wire, such that a high frequency signal transmitted via the high frequency signal wire can be directly tested at the test window. Thus, circular test points used in the prior art can be removed, to effectively solve the problem of insufficient space on a PCB; accordingly, lengths of the high frequency signal wires become more precise, so as to ensure a synchronization of transmission of the high frequency signal wires.

Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.

Abstract: A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.

Abstract: A system and method for installing a fiber or cable on a wall or ceiling of a structure includes providing a fiber, wire or cable pre-coated with a hot melt adhesive that simply needs to be activated by the application of sufficient heat for a sufficient amount of time immediately before installation. Rolls or cartridges of wire or cable pre-coated with the hot melt adhesive are provided. The hot melt adhesive coated wire or cable is fed through a heated chamber, preferably a tip on a portable heating device such as a battery operated soldering iron, which activates the pre-coated hot melt adhesive prior to utilizing the heating tip to apply pressure to the adhesive wire directly to a wall or ceiling thereby adhering the fiber, wire or cable to the desired surface.

Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Abstract: The present invention provides a cage, for a rolling bearing, whose surface is silver-plated by using a barrel plating method capable of improving the durability thereof in a sliding test. In the cage, for the rolling bearing, made of an iron metal material and having a precious metal-plated layer formed on a surface thereof, the precious metal-plated layer is formed on a base plated layer formed on a surface of the iron metal material by using a barrel electroplating method. A surface of the base plated layer consists of a smooth surface. The precious metal-plated layer is in direct close contact with the smooth surface. The base plated layer consists of a metal having a higher ionization tendency than the precious metal formed on the surface of the base plated layer. A cavity is not present at an interface between the copper-plated layer and the silver-plated layer.

Abstract: The disclosure describes a metal-wire-based method for making an integrated ingot, which basically comprises a dielectric matrix and a patterned array of metal wires, and may further comprise other additive elements at desired locations. After sawing the integrated ingot into slices, a plurality of substrates containing through substrate metal pillars and other additive elements at desired locations are produced in a batch way. The metal-wire-based method comprises the key steps: forming a patterned array of metal wires, precisely integrating other additive elements at desired locations when needed, forming a solid dielectric material in the empty space among and around metal wires and other additive elements. Furthermore, a guidance metal wire method is described for precisely integrating other additive elements at desired locations in a patterned array of metal wires.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.

Abstract: A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.

Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

Abstract: A touch panel that includes a substrate, a first conductive layer, a second conductive layer, and FPCs including a first FPC and a second FPC, the first FPC is connected to the first conductive layer, the second FPC is connected to the second conductive layer; the first conductive layer includes n rows of first conductive patterns, one end of each row is connected to one end of a first metal wire, the other end of the first metal wire is connected to the first FPC; the second conductive layer includes m columns of second conductive patterns, one end of each column is connected to one end of a second metal wire, the other end of the second metal wire is connected to the second FPC.

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.

Abstract: A space transformer includes a carrier substrate made for a chip package, an insulated layer disposed on the carrier substrate, and a conductive block. The carrier substrate is provided with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer has a hole corresponding in position to the elongated contact. The conductive block has an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column and connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle. The method for manufacturing the space transformer is also disclosed.

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract: A flexible laminate (1) includes an electrically non-conductive substrate (2) with a substantially planar configuration, an electrically conductive element (3) on a surface of the electrically non-conductive substrate, and a layer (4) on a surface of the electrically non-conductive substrate (2). The electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) are coaxially punctured forming a punctured region (6). They are connected to each other through a mechanical connection element (5) which extends through the electrically non-conductive substrate (2), the electrically conductive element (3) and the layer (4) at the punctured region (6). The cross-sectional area of the electrically conductive element (3) at the location of the punctured region (6) is larger than the cross-sectional area of the electrically conductive element (3) outside the punctured region (6).

Abstract: A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.

Abstract: An animal deterrent device includes an elongated carrier having an internal cavity. A conductive trace can be coupled to the carrier by a first fastener that extends from the conductive trace to the cavity, which prevents water from contacting the fastener and shorting the conductive trace.

Abstract: A modular insulator for an electrical conductor is provided. The modular insulator includes a first end member configured to couple to a support rail of an electrical power distribution system and a second end member configured to couple to the support rail. The modular insulator further includes at least one intermediate member comprising a groove and configured to releasably couple to at least one of the first and second end members such that the intermediate member is positioned between the first and second end members. The groove is configured to receive a portion of the electrical conductor.

Abstract: A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in proximity to at least one of the proximal end or the distal end of the body to expose at least part of at least one of the conductors. A C-shaped contact is disposed into each of a different one of the transverse channels. Each C-shaped contact is electrically coupled to at least one of the conductors. Each C-shaped contact is closed so that opposing ends of the C-shaped contact are adjacent to one another and aligned over one of the elongated conductors. The two opposing ends of each C-shaped contact is coupled together such that each C-shaped contact forms a continuous path around the arrangement within the transverse channel in which the C-shaped contact is disposed.

Abstract: Claimed methods reduce leakage currents in transparent conductive films comprising conductive nanostructures without substantially impairing the films' optical properties or physical integrity. Imposition of electrical stimuli to separate conductive regions leads to reduced conductivity of the intervening lesser conductive regions.

Abstract: A sensing edge for providing a signal to a controller indicating that a forward edge of a door is obstructed during operation includes an elongated sheath and first and second end plugs. The elongated sheath is mounted to the forward door edge and has a first end, second end and first cavity connecting the ends. First and second spaced apart electrically conductive materials are disposed within the elongated sheath. The first end plug includes an inner end having first engaging structures positioned within the first cavity in an assembled configuration and an outer end having a first depression for housing an electronic component. The electronic component is electrically coupled to the electrically conductive materials. The second end plug includes an inner end having a sensing component and second engaging structures positioned within the first cavity in an assembled configuration. The sensing component is electrically coupled to the electrically conductive materials.

Abstract: An electronic component includes a substrate, a shielding layer formed on the substrate and a wiring substrate connected to the substrate. A pad group is formed on an overlap region on which the wiring substrate is arranged on the substrate. A first alignment pattern is formed on the substrate and extending to outside of the overlap region beyond a peripheral portion of the overlap region. A second alignment pattern is formed on the substrate and extending to outside of the overlap region beyond the peripheral portion of the overlap region. The pad group, the first and second alignment patterns are formed on the shielding layer. The first alignment pattern extends in a different direction from the direction of the second alignment pattern.

Abstract: In a sensing device, sensing circuit cells are formed on a lower structure, an upper structure is disposed on the lower structure along a vertical direction, and divergent traces are formed in the upper structure and electrically connected to the sensing circuit cells, respectively. Each divergent trace comprises at least one horizontal extending portion and at least one vertical extending portion perpendicular to each other. Sensing electrode cells are formed in the upper structure and electrically connected to the divergent traces, respectively, and sense biometrics features of an organism to generate sensing signals, which are transmitted to the sensing circuit cells through the divergent traces. The sensing circuit cells processes the sensing signals to obtain output signals, respectively. A minimum distribution area covering the sensing circuit cells is smaller than or equal to a minimum distribution area covering the sensing electrode cells.

Abstract: A device for illuminating a space comprising is discussed. In one variation, the device includes: a central body portion, with a length and a width, and including two plates running along the length of the central body portion wherein the two plates are separated by a spacer; an opening for the removal of heat during operation of the device that extends along a portion of the length of the central body portion, a light emitting diode on the central body portion; a reflector, extending from the central body portion, for reflecting light emitted by the light emitting diode towards the illuminated space. Other variations are also discussed as are methods for using suitable variations for retrofitting existing non-light emitting diode light sources.

Abstract: A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.

Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

Abstract: To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability. The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer is formed on the surface of the upper insulating layer. The upper insulating layer is formed thinner than the lower insulating layer. The silica filler occupying the upper insulating layer has a lower volume proportion than the volume proportion of the silica filler and the glass cloth that are occupying the lower insulating layer.

Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Abstract: A patterned conductive structure includes a transparent substrate having a substrate surface. A conductive polymer layer is formed on the substrate surface. The conductive polymer layer has electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas. The conductive areas and the deactivated areas form a conductive pattern in the polymer layer. One or more transparent dielectric patches that are less electrically conductive than the deactivated areas are formed over at least a portion of one or more deactivated areas and one or more conductive wires are formed over at least one of the dielectric patches.

Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: A hand-strung jewelry construction board. A plurality of holes is drilled into the board. One or more pins are inserted into the holes. Also, one or more clamps are inserted into the holes. A jewelry string is looped around the pins and clamped in position by the clamps. In a preferred embodiment, second and third strings are wrapped around the jewelry string adjacent the pins at each end of the jewelry string. The second and third wrapped strings are glued into place. When the jewelry string is removed from the jewelry construction board, permanent loops are formed into the jewelry string.

Abstract: A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.