Abstract: To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability. The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer is formed on the surface of the upper insulating layer. The upper insulating layer is formed thinner than the lower insulating layer. The silica filler occupying the upper insulating layer has a lower volume proportion than the volume proportion of the silica filler and the glass cloth that are occupying the lower insulating layer.

Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Abstract: A patterned conductive structure includes a transparent substrate having a substrate surface. A conductive polymer layer is formed on the substrate surface. The conductive polymer layer has electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas. The conductive areas and the deactivated areas form a conductive pattern in the polymer layer. One or more transparent dielectric patches that are less electrically conductive than the deactivated areas are formed over at least a portion of one or more deactivated areas and one or more conductive wires are formed over at least one of the dielectric patches.

Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: A hand-strung jewelry construction board. A plurality of holes is drilled into the board. One or more pins are inserted into the holes. Also, one or more clamps are inserted into the holes. A jewelry string is looped around the pins and clamped in position by the clamps. In a preferred embodiment, second and third strings are wrapped around the jewelry string adjacent the pins at each end of the jewelry string. The second and third wrapped strings are glued into place. When the jewelry string is removed from the jewelry construction board, permanent loops are formed into the jewelry string.

Abstract: A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.

Abstract: A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract: A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via.

Abstract: A method of coating a rear glass substrate for an electrochromic reflective element includes providing a fixture having a recess and a masking element extending from a perimeter region of the recess over a portion of the recess. The masking element includes a disc portion and an arm portion extending between the disc portion and the perimeter region of the recess of the fixture. A rear glass substrate is positioned in the recess and the masking element extends over and is spaced from the surface of the glass substrate. The glass substrate surface is coated with a mirror reflector coating. The masking element is shaped such that the mirror reflector coating is deposited at the surface behind the arm portion but is substantially not deposited behind the disc portion so as to establish a window region through the mirror reflector coating at the glass substrate surface.

Abstract: A thick portion having a first thickness and a thin portion having a second thickness on a base insulating layer are formed on a conductive support substrate. The second thickness is smaller than the first thickness. A boundary surface is formed between an upper surface of the thick portion and an upper surface of the thin portion. A boundary line between the upper surface of the thick portion and the boundary surface extends in a first direction. Write wiring traces and read wiring traces are formed to extend on the thick portion and the thin portion of the base insulating layer. The lateral sides of the write wiring traces and the read wiring traces extend in a second direction that intersects with the first direction, and the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.

Abstract: The present disclosure provides a heat sensitive touch panel that comprises a substrate and a sensing layer disposed on the substrate, wherein the sensing layer comprises heat sensitive blocks and conductive wires. The heat sensitive blocks are made of a heat sensitive material and disposed on the substrate. The conductive wires are disposed on the substrate to electrically connect the heat sensitive blocks with a controller. If a finger or a dedicated stylus touches the heat sensitive touch panel, resistance of the heat sensitive blocks will change correspondingly such that the output signals generated when the touch panel is touched by a finger or a dedicated stylus are different from those when untouched, thereby being able to determine the touch location. The heat sensitive touch panel can detect a touch location of a conductive object or a non-conductive object on the touch panel.

Abstract: In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

Abstract: A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame.

Abstract: A wiring board includes an electric insulating base material including an incompressible member and a thermosetting member; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region.

Abstract: A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and a second wiring layer. The first wiring layer includes a number of electrode connection wires. Second, an opening is defined in the circuit substrate. The opening passes through the base and the second wiring layer. Third, an anisotropic conductive film is adhered onto the electrode connection wires in the opening. Fourth, an electrical element including many electrodes is provided. Fifth, the electrical element is arranged in the opening, with the electrodes respectively spatially correspond to the electrode connection wires, and each electrode is electrically connected to the corresponding electrode connection wire through the anisotropic conductive film, thereby obtaining an embedded printed circuit board.

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

Abstract: The embodiments of the present invention disclose a touch panel, a touch display device and method for manufacturing the touch panel. The touch panel comprises a first electrode wire, a second electrode wire being intersected with the first electrode wire, wherein, the first electrode wire comprises first electrodes and a metal bridge for lapping adjacent first electrodes through a first through hole on the insulating layer, and the hole wall of the first through hole is provided with a first sharp corner; the second electrode wire comprises second electrodes, a connecting portion, a metal wire, and a conductive covering portion, one end of the metal wire is connected with the conductive covering portion through a second through hole on the insulating layer, and the hole wall of the second through hole is provided with a second sharp corner which is arranged to face the first sharp corner.

Abstract: A printed circuit board is manufactured by forming on a top surface of a support base, in a pattern having a predetermined width, a first metal layer for defining boundary ends between adjacent printed circuit boards in a printed circuit board assembly, forming on top of the first metal layer a wiring structure portion having an insulating layer and a conductive layer for each printed circuit board in the printed circuit board assembly, forming, in the wiring structure portion, grooves having a pattern corresponding to the pattern of the first metal layer to expose the first metal layer, forming a second metal layer on the wall surface of the grooves in the wiring structure portion, and cutting the first metal layer on the bottom surface of the grooves to separate each printed circuit board.

Abstract: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer.

Abstract: A modular insulator for an electrical conductor is provided. The modular insulator includes a first end member configured to couple to a support rail of an electrical power distribution system and a second end member configured to couple to the support rail. The modular insulator further includes at least one intermediate member comprising a groove and configured to releasably couple to at least one of the first and second end members such that the intermediate member is positioned between the first and second end members. The groove is configured to receive a portion of the electrical conductor.

Abstract: Off-plane conductive line interconnects may be formed in microelectronic devices. In one example, such as device includes a first set of metal conductive lines in a dielectric substrate at a first horizontal layer of the substrate, a second set of metal conductive lines in the substrate at the first horizontal layer of the substrate and vertically offset from the first set of metal lines, and a dielectric material insulating the metal lines from each other and the first horizontal layer from other horizontal layers. Vias in the dielectric material to connect both the first and second set of metal lines to metal lines at a second horizontal layer of the substrate.

Abstract: Disclosed herein are devices for the magnetophoretic separation of target biological materials including a separation chamber that has a plurality of channels, and one or more wires carrying a current, the wires generating a magnetic force that deflects magnetically-labeled target biological materials into a buffer stream. In addition, methods of separating target biological materials from non-target biological materials in a sample are disclosed. Finally, methods for constructing a magnetophoretic separation device are disclosed.

Abstract: A touch panel includes a film and a cover lens. Sensing units of a sensing circuit, first wires coupled to the sensing circuit, and second wires coupled between the first wires and a processor are formed on the film. The film is attached to the cover lens by an adhesive method.

Abstract: A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

Abstract: Techniques for efficient routing of wires and electrical components within a device are disclosed. The electrical tape surrounding a device may be folded, cut, or otherwise altered in order to create a trough between distinct device elements. A wire or other component may then be routed within the trough. A wire can be routed, for example, in the space between two device elements (e.g., two battery cells) with the use of a bracket inserted between the cells to provide structural support. The brackets may be placed within the cavity between device elements after cutting a section of the electrical tape. In some embodiments, multiple brackets may be inserted between the device elements, creating a structurally stable trough through which a wire or other component may be routed. After routing a wire through the trough, another electrical part or housing may be fixed above the device elements.

Abstract: Techniques for efficient routing of wires and electrical components within a device are disclosed. A wire can be routed, for example, in the space between two battery cells (or other components/structures) with the use of a bracket inserted between the cells to provide structural support. The electrical tape surrounding a battery may be cut or otherwise breached in order to expose the cavity between distinct battery cells. In some embodiments, multiple brackets may be inserted between the battery cells, creating a trough through which a wire or other component may be routed. After routing a wire through the trough, another electrical part or housing may be fixed above the battery cells.

Abstract: A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

Abstract: A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatus's include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate.

Abstract: Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack. In at least one of these embodiments, a method includes electrically coupling each of the conductive paths to at least one of a first supply node and a second supply node. One of the conductive paths includes conductive material inside a via that can extend at least partly through a die among the dice in the stack. The method also includes receiving signals from the conductive paths, and determining continuity of the conductive paths based on the signals without using a boundary scan.

Abstract: A method for fabricating a peripheral wiring unit of a touch panel includes the following steps: (a) forming a transparent conductive layer on a substrate, the substrate including a peripheral region and a window region surrounded by the peripheral region, and forming a photosensitive conductive layer on the peripheral region of the substrate, such that the photosensitive conductive layer at least partially overlies the transparent conductive layer; (b) exposing the photosensitive conductive layer by using a photomask; and (c) developing the exposed photosensitive conductive layer to form a peripheral wiring unit on the peripheral region of the substrate.

Abstract: The method of manufacturing a conductive sheet of the present invention is provided with: a creation step for creating image data that indicates a meshed pattern; and an outputting step for outputting and forming wire materials on a base body on the basis of the created image data, and manufacturing a conductive sheet having the meshed pattern. The image data has, in convolution integration of a power spectrum of the image data and standard vision responsiveness of human beings, a characteristic of having each of the integration values at a spatial frequency band that is not less than 1/4 and not more than 1/2 of a Nyquist frequency corresponding to the image data to be greater than integration values at a null-space frequency.

Abstract: An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract: A method for making an hermetic and electrically insulating feedthrough in the metal wall of a housing of a device, preferably of an active medical device, is disclosed. The method includes: a) forming electrically insulating layers (24, 26) on each of the internal and external sides of the wall (10), b) on the internal side of the wall, forming a non-through groove with a closed contour (30) defining in the wall a metal islet (28) that is physically and electrically isolated from the rest of the wall, by removing the entire thickness of the electrically insulating internal layer (26) and the wall (10), leaving intact a sufficient thickness of the electrically insulating external layer (24) so that the external layer mechanically supports the metal islet, and c) on the external and internal sides respectively, exposing pads (34, 36) for making an electrical contact to the metallic islet, by a localized removal of material of the electrically insulating external and internal layers (24, 26), respectively.

Abstract: A method of making a transparent touch-responsive capacitor apparatus includes providing a transparent substrate having a material layer formed over the transparent substrate; pattern-wise defining electrically connected first micro-wires over the transparent substrate in a plurality of first transparent conductor areas in the materials layer; pattern-wise defining electrically connected second micro-wires over the transparent substrate in a plurality of second transparent conductor areas spaced apart from the first transparent conductor areas in the material layer, the first micro-wires electrically connected to the second micro-wires; and wherein the height of at least a portion of the first micro-wires is greater than the height of at least a portion of the second micro-wires and the total area occupied by the first micro-wires is less than 15% of the first transparent conductor area and the total area occupied by the second micro-wires is less than 15% of the second transparent conductor area.

Abstract: A touch-responsive capacitive apparatus includes a transparent substrate having first and second pad and interstitial areas. Pairs of first and second pad areas define corresponding touch-responsive capacitors. Electrically connected first pad micro-wires are formed in the first pad areas and electrically connected first interstitial micro-wires are formed in the first interstitial areas. The first pad micro-wires are electrically connected to the first interstitial wires. Electrically connected second pad micro-wires are formed in the second pad areas and electrically connected second interstitial micro-wires are formed in the second interstitial areas. The second pad micro-wires are electrically connected to the second interstitial wires. The height of at least a portion of the first interstitial micro-wires is greater than the height of at least a portion of the first pad micro-wires.

Abstract: A method for manufacturing a printed circuit board having an insulative board and a plurality of electroconductive pads arranged in a grid shape on the insulative board, the method including a step for forming an electroconductive film on the insulative board; a step for forming a pattern on the electroconductive film so as to form the electroconductive pads, a lead wire connected to at least one of the electroconductive pads, and inter-pad wiring for electrically connecting each of the electroconductive pads not connected to the lead wire to any of the electroconductive pads connected to the lead wire, the inter-pad wiring being disposed between mutually adjacent electroconductive pads; a step for plating each of the electroconductive pads by immersing the insulative board in a plating bath and energizing each of the electroconductive pads through the lead wire; and a step for removing the inter-pad wiring.

Abstract: A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping.

Abstract: Printed conductive lines and a method of preparing them using polymer nanocomposites with low resistivity and high current carrying capacity. Plasma treatment selectively removes polymers/organics from nanocomposites. Subsequent selective metal is deposited on top of the exposed metal surface of the printed conductive lines in order to improve current carrying capacity of the conductive printed lines. The printed conductive lines use a conductive ink or printing process and are then cured thermally and/or by a lamination process. Next, the printed conductive lines are treated with the plasma for 5-15 minutes in order to remove organics. E-less copper (Cu) is selectively deposited only at the conducting particle surface of the printed conductive lines. If desired, e-less gold, silver, tin, or tin-lead can be deposited on top of the e-less Cu.

Abstract: An electrochromic display device including: a first substrate; first electrodes parallely extending on the first substrate; a second substrate opposite to the first substrate; second electrodes parallely extending in a direction orthogonal to the first electrodes on the second substrate; and an electrochromic composition layer between the substrates, wherein the device is passive-matrix driven to perform a display by energization between the electrodes, and to perform erasing of the display by energization in a reverse direction, a pixel is formed in a portion where the first electrodes sterically intersect with the second electrodes, and metal electrical wires extending over the regions between the second electrodes and the second substrate along the second electrodes, each of metal electrical wires being conductively connected to each of the second electrodes corresponding to any one of the regions, and insulated from each of the second electrodes corresponding to the other regions.

Abstract: A system for displaying images is provided. The system includes a touch sensor device including a transparent substrate having a sensing region and a non-sensing region adjacent to the sensing region. A sensing electrode pattern layer is on the transparent substrate in the sensing region. An inorganic dielectric material layer is on the transparent substrate. The inorganic dielectric material layer has a first portion in the non-sensing region and a second portion in the sensing region and partially covering the sensing electrode pattern layer. A method of forming a touch sensor device is also disclosed.

Abstract: The present disclosure relates to a touch panel having a shielding structure and a method of manufacturing the same. The touch panel having a shielding structure comprises a conductive ring disposed on periphery of an upper surface of a substrate, a shielding layer disposed on a lower surface of the substrate, and a plurality of conductive connection points electrically connecting the shielding layer and the conductive ring. By connecting the shielding layer and the conductive ring by the conductive connection points, impedance of the shielding layer is consistent for different distances between the shielding layer and flexible printed circuit, thereby eliminating noise interference from a liquid crystal display or an electronic device under the touch panel, while using the touch panel. Moreover, the manufacturing method of the touch panel with a shielding structure is a simple process, which reduces the manufacturing cost.

Abstract: A touch screen panel is disclosed. The touch screen panel includes a substrate; a plurality of first electrode serials arranged on the substrate; a plurality of second electrode serials arranged to cross over the first electrode serials; and an insulation layer formed at the intersections of the first and second electrode serials and to electrically insulate the first and second electrode serials, wherein each of the first electrode serials comprises a plurality of first electrode patterns and second connection patterns for connecting neighboring first electrode patterns, each of the second electrode serials comprises a plurality of second electrode patterns and first connection patterns for connecting neighboring second electrode patterns, and each of the first electrode patterns comprises a lower layer formed on the substrate and an upper layer formed on the lower layer, and the second connection pattern connects neighboring first electrode pattern upper layers.

Abstract: A method for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.