Abstract: A method for interconnecting nodes in each of a number of nets. This invention involves generating initial zones for all nets and determining cumulative demand for path spaces needed by these initial zones. The demand is then compared with the supply, and scores are determined for the paths of the initial zones. Redundant paths with the worst scores are then gradually deleted until there are no redundant paths. If however, demand for path spaces still exceeds supply, expanded zones are generated in areas where demand exceeds supply and redundant paths are gradually deleted until there are no redundant paths. The paths remaining after deletion from the expanded zones are then used to interconnect the nodes of the nets. The nodes are then interconnected using the remaining paths.

Abstract: This invention relates to a method of using laser energy for bonding and stripping conductors during the scribing operation. The method provides and directs discrete laser beam pulses of substantially the same energy content at a rate which continuously varies as the conductor feed rate continuously varies to provide a constant number of discrete pulses for each incremental length of conductor being scribed.

Abstract: A method of making a chip carrier array including the steps of providing a ceramic substrate and forming elongated slots in the substrate which define the edges thereof and which form one severable interconnecting bridge at each edge of each chip carrier, which bridges maintain the individual chip carriers in the array. A plurality of edge interconnect conductors are formed along each edge portion of each chip carrier on either side of the interconnecting bridges.

Abstract: A printed circuit for mounting and connecting a plurality of semiconductor devices is disclosed and includes a planar insulating substrate having multiple conductive layers disposed in overlying relationship within the planar substrate. A plurality of parallel rows of apertures for wire wrap, quick connect or stitch wire contacts are provided for mounting integrated circuit. One side of the printed circuit board includes a plurality of power and ground connections disposed between each pair of parallel rows of apertures so that filter capacitors may be mounted under each integrated circuit, thereby conserving printed circuit board space. In a preferred mode of the present invention, alternate ones of the conductive layers are coupled to a source of electrical power while all remaining conductive layers are gounded. At least two adjacent conductive layers are then utilized to minimize parasitic capacitance by completely surrounding each aperture with a portion of conductive material.

Abstract: Bonding of lead wires between electrical contact points of an integrated circuit and the conductive elements of a flexible tape-like structure on which the integrated circuit is seated is accomplished by means of a vacuum chuck having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.

Abstract: A process for making hermetic, low cost pin grid array (PGA) semiconductor die packages. The process involves die bonding a semiconductor die or integrated circuit chip to a substrate having an interconnect or metallization pattern thereon. The die is electrically connected to the pattern and then the die and the inner bonds are hermetically sealed inside a cap that is smaller than the substrate so that the ends of the metallization pattern are exposed. The leads are then electrically connected, such as by solder or other technique to the exposed ends of the pattern.

Abstract: A method and apparatus are shown for use in adding electrical connections to existing printed circuit boards. To this end, apparatus in the form of a multilayered pad is provided which has an adhesive layer over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet of pads into individual pads, placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads to bond them to the board, and stitching (welding) wire to a succession of pads to complete a series of new connections. Some pads include plated-through-holes enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

Abstract: A device which can improve the efficiency of jumper wire wiring work through automatic coiling and soldering of both conductor parts of a jumper wire to selected pins of the multiple pins protruding from a printed circuit board. The device includes a setting finger for gripping the jumper wire and holding the same within the vicinity of the printed circuit board terminal or pin, a wrapping mechanism which includes an eccentrically mounted wrapping pin for engaging the conductor portion of the jumper wire and wrapping or coiling the same about the printed cirucit board terminal or pin, and a soldering mechanism for soldering the jumper wire conductor to the printed circuit board terminal or pin.

Abstract: A method of wiring electronic parts by a printed circuit board is provided. According to the method, electronic parts having pins arranged at intervals unmatched to a predetermined grid resolution are placed on the printed circuit board and the desired pins of the electronic parts are electrically connected by the printed circuit board. The characteristic of the method resides in that wiring pins are each provided at the same relative channel position within a unit grid portion located in the vicinity of each of the pins of the electronic parts so that the pins of the electronic parts are electrically connected to one another through the wiring pins.

Abstract: A method of forming wire harnesses and a cylindrical body pin assembly for connection to a peg board of the type used to form such harnesses is disclosed. The pin assembly comprises a cylindrical pin body and a cylindrical drive nut that are rotated relative to each other to axially move a pair of wire fingers protruding from one end of the pin body. The fingers are received within a hole in the peg board and are moved axially over a spreader disposed between them to separate the fingers and cause an enlarged shoulder on the fingers to abut against the peg board. After a selected number of pin assemblies have been installed in the peg board, wires may be wound around them to form the harness. The outer cylindrical surfaces of the pin body and drive nut are substantially equal in diameter to provide relatively straight, smooth sidewalls.

Abstract: A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.

Abstract: A vacuum cleaner includes a floor cleaning unit having a rotatable brush driven by a brush motor and a receptacle for collecting particulate matter. The floor cleaning unit is mechanically and pneumatically interconnected with the receptacle through a rigid wand and a wand handle and hose assembly. The wand handle and hose assembly includes a wand handle, disposed between the rigid wand and a flexible hose. The wand handle includes a passage through which air and particulate matter pass from the floor cleaning unit to the receptable. A corona discharge element with a roughened surface is positioned in the downstream end of the wand handle passage. A stub tube is positioned in the upstream end of the wand handle passage to connect the wand handle to the wand. A conductive strap, installed in the wand handle using a heat staking process, interconnects the stub tube and the corona discharge element.

Abstract: This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

Abstract: This invention relates to an apparatus for making circuit boards in which insulated conductors are applied and bonded to a nonconductive surface to form a conductive path between contact points thereon in a predetermined precise pattern.

Abstract: A twin wire splitter system comprises an X-Y table for mounting a printed circuit board thereon; a wire bonding device for continuously bonding a twin wire to a plurality of wire connecting positions on the printed circuit board; a feeding device for feeding the twin wire; a splitting device provided on a twin wire feeding path to split the twin wire; and a splitting operation controlling device for controlling the start and end of the twin wire splitting operation carried out by the splitting means, according to the length along the twin wire feeding path between the bonding position of the wire bonding device and the splitting position of the splitting device, the length of a portion of the twin wire to be split, and the feed length of the twin wire for each sucessive bonding operation corresponding to the connecting sequence of positions to be interconnected by the twin wire on the printed circuit board.

Abstract: A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.

Abstract: An electrical connector assembly includes a bus assembly which comprises a bus insulation plate having a base which includes a plurality of terminal stations and a plurality of guide stations. The terminal stations and guide stations are separated from each other so as to provide a network of wire channels which communicate with wire passages which extend through the terminal and guide stations. The terminal stations also have terminal cavities which extends through the base to intersect the wire passages. The bus assembly further includes electrical busses comprising lengths of electrically conductive wire which pass through various terminal and guide stations via the network of wire channels.

Abstract: An interconnection board for high frequency signals is made by wire scribing coaxial conductors. The board is provided with holes. The coaxial conductors with signal conductor surrounded by a dielectric in turn surrounded by a conductive shield are wire scribed on a first surface of the board. The ends of the coaxial conductors are stripped to expose signal conductor sections, and dielectric sections. The stripped ends are inserted through the holes so that the dielectric sections reside in the holes and the exposed signal conductors protrude through the holes on the second surface of the board. The signal conductors are terminated on the second surface, and the conductive shields are connected together on the first surface.

Abstract: The invention provides a bonding wire which prevents electric short-circuiting even if it comes into contact with another bonding wire, a bonding method using the same, and a semiconductor device including the same. The bonding wire comprises a core wire made of a metal and an insulating film which surrounds it. The insulating film is eliminated from the ends of the bonding wire by thermal decomposition and scattering, while simultaneously each end of the bonding wire is connected to a bonding pad of the semiconductor device or to a lead frame. In the semiconductor device, the bonding pads are respectively connected to lead frames by means of the bonding wires.

Abstract: A thermal heating and insulating unit is manufactured by molding in situ a block of thermal insulating material about an electrical resistance element. The resistance element is first made from a continuous wire of electrical resistance material and formed into a serpentine configuration with a plurality of segments interconnected by bends at the ends of the segments. In a preferred construction, the segments are straight and the bends at the ends of the segments are in opposite directions. The resistance element is positioned in a mold on a plateau above a porous bottom, the bends overlapping the plateau, and a slurry of inorganic fibers, water and a binder is introduced into the mold to a lever above the plateau, the liquid component of the slurry passing through the porous bottom, and the fibers and a portion of the binder collecting on the porous bottom to form a block with a slot confronting the resistance element, the bends of the resistance element being embedded in the block.

Abstract: A method of making a high density dimensionally stable encapsulated circuit board. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

Abstract: An automated flexible manufacturing system for fabricating electrical cable harness assemblies. The system includes a wire preparation system in which the wires are cut to length, provided with the desired electrical terminations and marked for identification under the control of computing means to which wire harness data is fed. The prepared wires are transported to an automated cable harness assembly system which is also controlled from computing means to which the wire harness data is fed.

Abstract: A method and apparatus are shown for use in adding electrical connections to existing printed circuit boards. To this end, apparatus in the form of a multilayered pad is provided which has an adhesive layer over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet of pads into individual pads, placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads to bond them to the board, and stitching (welding) wire to a succession of pads to complete a series of new connections. Some pads include plated-through-holes enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

Abstract: Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.

Abstract: In a positioning guide for an ultrasonic stylus disposed in a scribing head, a hub surrounds the stylus and is secured to the stylus near its working tip. A surrounding retainer is secured to the housing of the moveable scribing head. Radial spokes secure the hub to the surrounding retainer, thereby providing a high degree of lateral rigidity and longitudinal compliance for the working tip of the stylus.

Abstract: An electrostatic recording head has a plurality of electrode wires arranged parallel to each other at a predetermined pitch to form recording electrodes at one ends thereof, control electrodes arranged along these recording electrodes, and a recording electrode retainer for integrally fixing these electrodes with a resin. The other ends of these electrode wires are integrally fixed by an electrode wire terminal end retainer of a resin. The electrode wires are electrically connected to a part of the conductive pattern formed on a printed circuit board interposed between both retainers, and are grouped thereby to form a plurality of recording electrode set conductors. These conductors and lead wires connected to the control electrodes are connected to connector terminals. A recording voltage is applied to the connector terminals.

Abstract: A method for producing a wired circuit board is disclosed in which a wire mat is first formed on a fixture and then mated with a circuit board having a specified conductive pad layout on the board surface. A continuous wire is routed on a fixture along a predetermined path over a thermoplastic adhesive layer and the wire is adhered to the layer to fixably position the wire in the routed configuration. The continuous wire is severed at selected locations to form a plurality of wire nets. A wire mat thus formed is mated with a circuit board having conductive pads disposed on the board surface such that selected points of selected wires confront selected conductive pads on the circuit board. Compressive pressure is applied to the wire mat and circuit board to conformally adhere the wire mat to the circuit board. The circuit board and wire mat adhered thereto are next heated at elevated temperature to cure the adhesive layer.

Abstract: Machine for interconnecting wire-in-slot type terminals in connectors mounted on a panel board utilizes a wire feed roll, rotatable insertion tooling, and an X-Y table. Wire is fed vertically through a rotation housing past wire inserters mounted above an aperture in a rotary plate. Wires are positioned for termination by wire feeding and movement of the X-Y table on which the panel board is mounted. Independently pivotable idler wheels cooperate with the feed roll to engage one or two wires. Insertion is effected by downward movement of the rotation housing which drives the inserters through the aperture in the rotary plate. The rotation housing is moved by pivoting a yoke with a variable pivot point to change limits of travel and therefore insertion depth. The plate, inserters, and rotation housing may be rotated to four orthogonal orientations to insert wires in terminals having like orientations.

Abstract: A method and apparatus for connecting wire to insulation displacement-type, circuit board-mounted electrical contacts comprises automatic positioning and orienting of individual contacts relative to a wire insertion head. A portion of wire is fed from a supply to the tip of a pusher which inserts this portion into fingers of the contact; another contact is positioned and oriented relative to the pusher to receive a second portion of the wire and provide a wire run between the contacts. The wire run can be terminated at the last contact without repositioning the contact and pusher relative to each other, with the remaining supply wire being prepared for another insertion.

Abstract: A process for extending and fixing conductors to circuit board base surfaces between pre-established spaced points in straight paths and pre-established spaced points in inflected paths, the steps comprising, fixing the end of the conductor to a pad at the first of a pair of pre-selected points and, while feeding the conductor with a guide, moving the board and the guide relative to each other along a straight path to a pad at the second of the pair of pre-established points or to a pad at an inflection point, if the conductor is to be inflected, and then to said second pad. Severing said conductor at said second pad and affixing the conductor end to said second pad. Repeating the foregoing steps until the conductor has been affixed to the pre-established pairs of pads and to the pads at the inflection points.

Abstract: A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head.

Abstract: A wire-laying tool has a central passageway terminating in a probe which can be retracted relative to a stem against the force of a spring by means of a piston movable in a chamber. A spring-loaded pawl is actuated by another piston movable in a chamber. The pawl can advance the wire in the passageway and probe forwardly of the front end of the tool. When the piston has almost completed its stroke, fluid pressure is communicated to the chamber to cause retraction of the probe. A spring-loaded dog acts as a brake for wire in the passageway. The tool is intended for use in the production of wiring harnesses with the aid of a robot manipulator.

Abstract: A method of making a plurality of multi-wire nonimpact printheads provides precise inter-wire spacing accuracy and repeatability of manufacturing steps to enable mass production.A plurality of slats are molded, one alongside another on a cylindrical support shell, parallel to the shell axis. A helical thread is engraved on the slats along the axial length of the support shell. A continuous wire is wrapped in the thread and the portions of the wire on the slats are encapsulated. The support shell and wrapped wire is cut between adjacent slats to obtain a plurality of printhead blanks. Each blank is machined to smooth the exposed print wires. The resultant printheads may be used in page- width nonimpact printers.

Abstract: A method of manufacturing an electrical interconnection assembly such as an automobile harness junction box, comprises laying a wire in a groove in a substrate; cutting the wire in the groove into a plurality of pieces; and then transferring the pieces of wire from the groove on to terminals carried by an insulating support to form the assembly.

Abstract: The surface of a substrate, particularly a multi-layer substrate, is wired y an apparatus including a tool carrier and a substrate carrier. The substrate carrier is positioned in a substantially horizontal plane so it is situated opposite the tool carrier. The substrate carrier is displaced relative to the tool carrier in the horizontal plane, i.e., relative to the vertical plane. A heating element and an electric wire dispenser are carried by the tool carrier. The dispenser includes a wire outlet orifice situated close to an end of the heating element. The heating element is longitudinally translated within a sleeve having an axis directed toward the substrate carrier. A rotary support carrying the dispenser is rotatable around the sleeve axis to enable the wire outlet orifice to be positioned with respect to the end of the heating element as a function of the relative displacement between the substrate carrier and tool carrier.

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Abstract: Several tubular wire-retaining anchor embodiments (10, 10') are disclosed, as are several methods of manufacturing and securing the same to a supporting substrate, such as a circuit board (24). In accordance with one preferred embodiment (10), the tubular anchor is either molded out of suitable plastic material, or preferably formed as a short, severed cylindrical segment of an elongated section of plastic tubing (12). As needed, the anchors (10) are positioned in a desired spaced array on the circuit board (24) and adhesively bonded thereto. This is most readily accomplished by positioning each anchor (10) on a different droplet (28b), preferably comprising the second part of a two-part adhesive or cement (28), with the first part activator (28b) being pre-coated on at least a portion of the outer surface of the anchor.

Abstract: At least one slot is formed in one or both connecting end-portions of a flexible insulating support, the slot or slots being superposed on the terminals of the corresponding electrical assembly. Connecting leads are unwound and bonded to the flexible support in the form of a continuous conductor arranged as a snaked coil, the ends of the loops which are placed beyond the slots being then cut off and removed. The method of interconnection permits the achievement of a high connection density, the connecting terminal pitch being of the order of a few tenths of a millimeter.

Abstract: A multistylus head device which comprises a vast plurality of insulated wires embedded in an insulating substrate having through-holes. The present multistylus device is characterized in that the insulated wires have their respective free terminals exposed on one edge of said insulating substrate and disposed in parallel at predetermined equal intervals in close proximity to each other to form electrodes and have their other terminals exposed respectively on the inner walls of said through-holes; and said other exposed terminals of the insulated wires are connected respectively to metal layers electrolessly deposited on the inner walls of the through-holes. The present multistylus head device is compact in size and excellent in reliability of terminal connection and is capable of recording a transmitted information with high density of printing.