Abstract: A cable assembly comprises a plurality of electrical or fiber-optic cables, a spacer, and a collar. The cables are arranged lengthwise in a bundle, which includes a segment having a cross-sectional arrangement organized into a plurality of columnar sections of contiguous cables. Each columnar section has at least one cable. The spacer is disposed between adjacent columnar sections of cables and thus forms a dividing line between the adjacent columnar sections. The spacer spans substantially entirely across a cross section of the segment of the bundle in one direction. The collar is disposed entirely around the bundle and the spacer along at least a portion of the segment. The collar is sufficiently tight such that the collar and the spacer cooperate to hold the adjacent columnar sections in substantially fixed relative positions within the cross-section of the bundle.

Abstract: A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the package lid and at a second attachment point to the circuit board. Isolation material is provided at the attachment point of the support frame to the substrate or package lid, or at the second attachment point of the support frame to the circuit board.

Abstract: A method and device for wiring connection is provided. The method for wiring connection includes steps of applying at least a barrel pin to a printed circuit board, riveting one end of the barrel pin to the printed circuit board, soldering the barrel pin on the printed circuit board, inserting at least a wiring into the barrel pin via the other end of the barrel pin, and fixing the wiring inside the barrel pin.

Abstract: The invention comprises filling a conductive adhesive on a hole end of a wire connection part in tubular shape of the terminal which has an electric contact part at one side and the wire connection part at the other side, inserting an electric wire from a hole opening of the wire connection part toward the hole end, and reducing evenly a size of a tubular wall of the wire connection part, thereby causing the conductive adhesive to infiltrate into a space of the electric contact part or between wires. The invention also comprises tightening the tubular wall of the wire connection part by a rotary swaging process. Further, the conductive adhesive is a nickel paste which is a mixture of nickel powders in a liquid epoxy resin based binder. In addition, at least one of a core wire portion of the electric wire or the terminal is aluminum or aluminum alloy.

Abstract: When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad.

Abstract: A method of manufacturing a jaw member for use with a jaw assembly includes the step of: providing a jaw housing, an electrically conductive plate and an insulated wire for conducting a first electrical potential. The method also includes the step of: molding a first plastic onto a surface of the jaw housing such that the plastic forms a datum for receiving the electrically conductive plate and forms an elongated slot therein for receiving the insulated wire therealong. The method also includes the steps of: engaging a lead end of the wire with the electrically conductive plate such that the first electrical potential is conducted to the electrically conductive plate; aligning the electrically conductive plate atop the jaw housing and within the plastic datum such that the insulated wire aligns within the elongated slot; and molding a second plastic to secure the electrically conductive plate and the insulated wire atop the jaw housing.

Abstract: A cell such as a lithium ion cell consists of an anode and a cathode comprising respective lithium ion insertion materials, separated by an electrolyte. A practical cell may be made by stacking a plurality of anode plates (14) and cathode plates (12) alternately, and interleaving a continuous layer (10) of polymer electrolyte or separator material between successive anode and cathode plates so it forms a zigzag. If the continuous layer is a separator, the assembly is then contacted with a solution comprising lithium salt in a compatible organic solvent, which provides the cell electrolyte. This procedure enables cells to be made with thin electrolyte layers, for example less than 30 ?m thick, and hence of low internal resistance.

Abstract: A method of manufacturing a display structure includes the steps of arranging at least a display area, an extension area, and an IC mounting area on a display substrate, connecting a flexible tape substrate to the extension area of the display substrate, separating a part of the display substrate by cutting at a cutting portion which is a part under the flexible tape substrate on the extension area of the display substrate, and disposing a cutting substrate which is the separated part, on a back side which is opposite to a side where a display is mounted, of the display substrate.

Abstract: A technique for securing a conduit box to a housing of an electric motor is disclosed. The technique includes forming a hollow extension from a surface of the conduit box. The conduit box is placed on a motor frame so that the hollow extension is inserted into a hole in the motor frame that passes into the hollow interior of the motor frame. The hollow extension is plastically deformed inside the motor housing to a greater width than the diameter of the hole in the motor housing so that the conduit box cannot be removed from the motor housing. A stator is placed in the motor housing and wiring is routed from the stator to the interior of the wiring box through a passageway formed by the hollow extension.

Abstract: Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.

Abstract: Compact electronic modules, which may be used with implantable microstimulators and other medical and non-medical devices, and manufacture/assembly of such modules are described. Component and circuitry designs utilize unique redistribution techniques and attachment methods. A number of component designs and packaging configurations maximize the volume efficiency of electronic modules. Also included are improved processes and systems enabling the manufacture and assembly of such compact packages.

Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: The present invention is directed to a socket connector to couple electrical plugs to sockets mounted on circuit boards or cable ends. The socket connector includes a socket that receives an electrical plug and a socket silo. The silo may contain a beveled outer surface that receives a beveled face on the plug. The plug is held in the socket by latches disposed on the plug. The latches include pawls that fit within pawl receiving chambers in the socket and couple the plug to the socket. The latch and hinged section may rotate into a recessed section on the plug from an extended to a retracted position. A locking portion on the pawl and the receiving chamber may be angled to develop a desired pullout force.

Abstract: A siding block comprising an electrical junction box and a cover for mounting a light fixture to the exterior of a building. The electrical junction box includes a back wall, a front peripheral wall, and a recessed area within the back wall having one or more removable wall sections within the recessed area. One or more of the removable wall sections can be removed and an electrical cable connector inserted therein to provide strain relief attachment of an electrical cable therein. The electrical junction box includes two or more posts integral with and extending from the front peripheral wall and including fastener-accepting portions. The cover includes a central opening and a rear peripheral wall surrounding the central opening.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on the tip side from the bending point so as to be extended substantially parallel to a lead portion of the lead terminal, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires, forming a cup-shaped holder portion by bending the flat portion inwards, holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions, and electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.

Abstract: A method for fabricating a monolithic fluid injection device. The method includes providing a substrate with a patterned sacrificial layer thereon. Next, a patterned support layer and a patterned resistive layer, as a heating element, are formed on the substrate sequentially. A patterned insulating layer having a heating element contact via and a first opening is formed on the support layer. A patterned conductive layer is formed on the support layer and fills the heating element contact via as a signal transmitting circuit. A patterned protective layer having a signal transmitting circuit contact via and a second opening corresponding to the first opening is formed on the substrate. A manifold is formed by wet etching the back of the substrate to expose the sacrificial layer. A chamber is formed by removing the sacrificial layer in the wet etching process. Finally, an opening connecting the chamber is formed by etching the support layer along the second opening.

Abstract: A method for testing a printed circuit board includes manufacturing a dedicated testing board having protrusive metal points corresponding to the points to be tested on the printed circuit board. A pressure sensitive conductive rubber layer is inserted between the protrusive metal points and the test points. The method connects the protrusive metal points with the points to be tested on the printed circuit board by using the pressure from the press and the flexibility of the conductive rubber. The testing board having protrusive metal points is connected to the dedicated tester through flat cables so that each protrusive metal point is connected to a test node in the tester.

Abstract: A method and a connector arrangement for connecting and disconnecting an electrical generator, such as a prime mover driven alternator (10), to a circuit with an existing alternating current such as the mains electricity supply (20).

Abstract: A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.

Abstract: A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can flow. Adjacent ends of the strands are received in an interior cavity of the coupling through an opening in the coupling. A joining material is provided on a first portion of the stator bar within the coupling opening and adjacent the ends of the strands. The first portion is heated to melt the joining material. At essentially the same time, a second portion of the stator bar outside the coupling is also heated. Once the joining material is suitably molten, the first portion is allowed to cool while the second portion remains heated, thereby causing the joining material nearest the ends of the strands to solidify first.

Abstract: A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g.

Abstract: An apparatus is provided for engaging electrical hardware devices. The apparatus has a handle; a planar body; a planar engagement bar projecting normal from the body; a pair of arms, one arm formed at each of two ends of the bar; and each arm further bending and terminating in a bottom hook portion, the bottom hooks aligned in a common plane parallel to and spaced a gap distance from the bar and generally normal to the planar body. The hook spacing dimension is about equal to or slightly greater than an outer dimension of an electrical hardware device workpiece body but less than an outer dimension of a rectilinear lip element projecting from the hardware device workpiece. The gap distance is about equal to or slightly greater than a thickness dimension of the rectilinear lip element.

Abstract: A method is provided for sealing a through-fitting around a cable. The method involves: passing a cable through the through-fitting; compressing a seal in the through-fitting around the cable within the through-fitting; and extruding a sealant around the cable within the through-fitting. Both compression of the seal against the cable and extrusion of the sealant around the cable within the through-fitting are performed by causing a cap on the through-fitting to move axially. Causing the cap to move axially may comprise turning the cap to permit threads of the cap to move along mating threads of the through-fitting.

Abstract: A reliable microchip controller board and a manufacturing method thereof suitable for mass production are provided. A board wherein a programmable microchip controller is mounted includes; terminals for writing a program into the microchip controller and a circuit pattern connecting an operating terminal to shared terminals which are disconnected. A non-programmed microchip controller is mounted on the board in a state where patterns are disconnected and then programmed. The disconnected portion is connected thereafter.

Abstract: In a half-fitting prevention connector (31) of the invention, a fitting detection member (60) is moved to a proper-fitting detecting position in a female connector (40) before connection terminals are automatically inserted by an automatic terminal inserting machine. As a result of this movement, a rear end of the fitting detection member (60) substantially coincides with a rear end surface of the housing of the female connector (40), so that the connection terminals can be automatically inserted into terminal accommodating chambers (40a) by the automatic terminal inserting machine.

Abstract: A cabling method especially for installing thick electric cables (1) for connection to electric devices (8), in which method the cables (1) are brought to a cabling space (3), fitted and supported in place, cut and stripped at necessary locations, and the desired cables are equipped with cable shoes (6) or connectors for installing to the electric device (8), in which case the cabling steps are, before connection to the electric device (8), performed mainly outside the electric device (8) to be connected by using a separately arranged cabling part (3) comprising said cabling space (3). The invention also relates to this cabling part.

Abstract: The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of supplying fluid and the step of hardening the fluid to form the reinforcing material. The step of supplying the fluid includes the step of bringing the substrate connecting to the flat cable member close to a jig and then supplying the fluid to a region in which the reinforcing material is to be formed while preventing the outflow of the fluid with the jig.

Abstract: An electrical connector configured to nonrigidly apply force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attractive element and a second member that includes a support element and a second attractive element. Attractive forces, such as magnetic attraction, between the first and second attractive elements secure the first and second members of the electrical connector to the semiconductor substrate in a manner that facilitates communication between the electrically conductive element of the first member and one or more semiconductor devices carried upon the semiconductor substrate. The electrical connector may be used in stress testing of semiconductor devices or to otherwise establish an electrical connection between one or more semiconductor devices, a ground, and a power source.

Abstract: A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.

Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside.

Abstract: A method of manufacturing a surface-emitting backlight is provided with the steps of forming a lead frame and resin-made molded case by insert molding, attaching light sources, which are red, blue and green LED dies, to contacts of the lead frame provided in a hollow space of the molded case, forming a light guide section by filling the hollow space with a transparent or semitransparent resin, and thereafter attaching a reflector sheet, and lens sheets (or diffuser sheets) in accordance with the applications of the backlight.

Abstract: A process for automatically wiring at least one terminal of an electrical apparatus with a wire-laying tool of the type that includes a wiring finger movable relative to the terminal. An initial terminal connection is established between the leading end of a wire and the terminal by pressing the wire into a SBIPC connector, which is located within the housing of the terminal, while positioning the wiring finger of the electrical apparatus outside the portions of the housing surrounding the SBIPC. A final wire connection is established between the trailing end of the wire and the terminal by pressing the cut wire into the SBIPC while positioning the wiring finger outside the portions of the housing of the terminal surrounding the SBIPC.

Abstract: A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Techniques for self assembly of macro-scale objects, optionally defining electrical circuitry, are described, as well as articles formed by self assembly. Components can be joined, during self-assembly by minimization of free energy, capillary attraction, or a combination.

Abstract: A method of manufacturing a piezoelectric component in which an internal electrode and a dummy electrode are printed on a green sheet and a floating electrode is printed on a green sheet. A plurality of green sheets, each having the internal electrode and the dummy electrode printed thereon, and the green sheet on which the floating electrode is printed are stacked to obtain a layered product in which at least one floating electrode layer is arranged in at least one of the green sheets between the adjacent internal electrodes in the stacking direction and/or the green sheets outside the outermost internal electrodes in the stacking direction, a plurality of the internal electrodes are extended to opposite first and second sides alternately in the thickness direction, and the dummy electrode is arranged between an end of the internal electrode opposite to the side extended to one of the sides and the other side to which the internal electrode is not extended.

Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.

Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.

Abstract: An accelerated vehicle development process includes establishing a common, standardized interface system whereby different types of vehicle bodies may be attached to a single chassis design. Chassis and bodies are designed, manufactured and validated independently of each other in accordance with the standardized interface system, thereby accelerating the development process. As new bodies are designed to mate with the previously manufactured and validated chassis, the newly designed bodies may be developed more quickly in response to market demand and attached to the previously validated chassis.

Abstract: An electrical and mechanical connection between (a) a first shielded cable including a metal sheath and electrical conductors and (b) a second cable including a ground conductor and electrical conductors, comprises a zone of interconnection between the first and second cables. In this interconnection zone, a first connection is made between the free end of the metal sheath and the free end of the ground conductor, and second connections are made between the free ends of the electrical conductors of the first cable and the free ends of the electrical conductors of the second cable, respectively. Still in the interconnection zone, the interconnected metal sheath and ground conductor have a first length shorter than second lengths of the interconnected electrical conductors of the first cable and electrical conductors of the second cable whereby, in operation, longitudinal tension in the interconnection zone is totally supported by the interconnected metal sheath and ground conductor.

Abstract: Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements are manufactured by one or more of: (1) stacking to form a multiple-layer, multiple-dimensional array where the layers are polymericly bonded and electrically connected through asperity contact, (2) using air or gas to separate at least two elements, (3) stacking an even number of layers where each layer is electrically connected through asperity contact, (4) using multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Abstract: One joint member having a melting point different from that of the other joint member is joined to each bonding pad of a slider and further joined to each bonding pad of a suspension through the other joint member. The slider is exfoliated from the suspension in the state that the one joint member is attached to the slider by heating and melting the other joint member.

Abstract: A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct molding compound between the mold cavities and into the corners of the mold cavities. The runners prevent trapped air from accumulating in the corners of the mold cavities, and eliminate the need for air vents in the corners. The mold cavity plates also include dummy mold cavities configured to form dummy segments on the leadframe, and air vents in flow communication with the dummy segments. The dummy mold cavities are configured to collect trapped air, and to direct the trapped air through the air vents to atmosphere. Each dummy mold cavity has only a single associated air vent, such that cleaning is facilitated, and flash particles from the air vents are reduced.

Abstract: A method for equipping plug housings with fitted-out cables includes an equipping installation downstream of a fitting-out installation and introduces each fitted-out cable end into a first or second plug housing according to an installation sequence. A feeder unit takes a cable loop from a transfer unit moved from the fitting-out installation and transfers the leading cable end to a transfer station and the trailing cable end either to a rotatable store unit or, to the transfer station when it is free. An equipping unit takes over the cable ends in succession at the second transfer station and introduces the cable ends into designed cells of the corresponding plug housings.

Abstract: In a method for manufacturing a quartz crystal oscillator, at least one of a chemical etching method, a physical etching method, and a mechanical method is utilized to form a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, a fundamental mode of vibration, and a second overtone mode of vibration each comprised of a flexural mode of an inverse phase. An amplification circuit is provided having at least an amplifier. A feedback circuit is provided having the quartz crystal tuning fork resonator and capacitors. The amplifier of the amplification circuit and the quartz crystal tuning fork resonator and capacitors of the feedback circuit are electrically connected together.

Abstract: A device and method for controlling strain in a transmission line such as a power or signal transmitting wire, cable or other conduit. The device includes a body having at least one cavity formed therein for receipt of at least a portion of a transmission line. Multiple openings formed in the body allow the transmission line to extend from the at least one cavity and external to the body. The at least one cavity is defined to include a peripheral boundary formed at least partially by a first substantially linear wall and a second opposing wall which deviates from the first wall, thereby forming a deviation path for the transmission line disposed therein. A cover may be provided to cooperatively mate with the body such that it conceals the cavity or cavities formed therein.

Abstract: A fetal heart monitoring system preferably comprising a backing plate having a generally concave front surface and a generally convex back surface, and at least one sensor element attached to the concave front surface for acquiring acoustic fetal heart signals produced by a fetus within a body. The sensor element has a shape that conforms to the generally concave back surface of the backing plate. In one embodiment, the at least one sensor element comprises an inner sensor, and a plurality of outer sensors surrounding the inner sensor. The fetal heart monitoring system can further comprise a web belt, and a web belt guide movably attached to the web belt. The web belt guide being is to the convex back surface of the backing plate.

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.