Abstract: Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.

Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.

Abstract: A method for fabricating a semiconductor apparatus using a board frame. A wiring board region of the frame includes an island on which a semiconductor device is mounted. A marginal region of the frame surrounds the wiring board region. A frame region is located around the marginal region. A support region extends between the wiring board region and the frame region to connect the wiring board region and frame region together through the support region. The marginal region is removed from the board frame and then put back to its original position, while maintaining the wiring board region connected to the frame region through the support region. Then, the device is mounted onto the island. Next, transfer-molding is performed on the device using a die set that includes a gate through which a thermosetting resin is guided into a cavity. Then, the marginal region is removed completely from the board frame.

Abstract: Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate 10 formed by laminating a first conductive film 11 and a second conductive film 12 is covered with a photoresist layer PR having opening portions 13 with inclined surfaces 13S, a conductive wiring layer 14 is formed in the opening portions by electrolytic plating to form inverted inclined surfaces 14R, and then, when covering the same with the sealing resin layer 21, an anchoring effect is produced by making the sealing resin layer 21 bite into the inverted inclined surfaces 14R so as to strengthen bonding of the sealing resin layer 21 with the conductive wiring layer 14.

Abstract: A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material layer separated by an insulating layer. The method includes forming an IC window in the spring metal layer, forming integrated conductive leads in the conductive material layer and forming holes in the insulating layer. The IC can then be mounted to the suspension or component in the IC window, and the array of terminals electrically interconnected to the integrated conductive leads through the insulating layer.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: A method of connecting phases of a segmented stator electric machine includes providing a stator core. An end cap assembly is attached to the stator core. Winding wire is wound around the end cap assembly and the stator core to form a stator segment assembly. A plurality of the stator segment assemblies are assembled into a stator including first, second and third phases. A phase wire stitching machine is used to connect opposite ends of the winding wire of each of the stator segment assemblies to form the first, second and third phases of the stator. The phase wires can be attached to the stator segment assemblies using terminals, IDCs, hook terminals, and/or directly to the winding wire.

Abstract: The present invention is directed to a miniature hard disc drive having a metal base plate, an actuator assembly wherein the actuator assembly comprises a plurality of bearings, a shaft, and a housing; a spindle motor assembly comprising a stator with conductors, a shaft, a plurality of bearings, and a rotor; and a monolithic body of phase change material unitizing said actuator assembly housing and stator to the base plate. Methods of developing and constructing the hard disc drive are also disclosed.

Abstract: A method of producing a battery-connecting plate by providing busbars which connect batteries together, attaching terminals to one end of wires to produce terminal-attached wires for detecting voltage of desired ones of the batteries, placing the terminal-attached wires in a predetermined layout in a wire protector, setting the busbars and wire protector in a mold with the burbars positioned corresponding to an arrangement of the batteries, injecting resin into the mold to produce a molded piece with the burbars and the terminal-attached wires therein, and cutting an element mount portion of each of the terminals and connecting a respective circuit protector element to the element mount portion in a bridging manner across the cut.

Abstract: The invention relates to a method and apparatus for preventing water from penetrating into a wire harness, the wire harness containing a plurality of electrical wires and being adapted to fit into a grommet and to pass through a hole formed in a vehicle panel. The electrical wires respectively include a section which is to form part of a water-sealed portion. The electrical wires are arranged so that the sections forming part of the water-sealing portion are in parallel in a row. A first water-sealing agent is applied on the sections. A second water-sealing agent is applied over the first water-sealing agent, the second water-sealing agent having a viscosity higher than that of the first water-sealing agent. The parallel arrangement of sections are curled for fitting into the grommet, so as to form the water-sealed portion.

Abstract: A method and article of manufacture for providing a mechanical bond and an improved water vapor seal between a lens (11, 41) and a base (17, 47) in an instrument housing (10, 40), includes heating the components and a hot butyl rubber sealant (18, 58) prior to assembly, maintaining a level of heating for the assembly during assembly, dispensing the heated sealant (18, 58) into a channel (25, 65) to form a ring-shaped body of sealant (18, 58), assembling the lens (11, 41) to the base (17, 47) and pressing a lower edge (11a, 41a) of the lens (11, 41) into the ring of sealant (18, 48) and bending an upper edge (17b, 47b) of the side wall (17a, 47a) over a portion (11b, 41b) of the lens (11, 41). The method is applied in a second embodiment to an instrument having at least two signal conductors (55) entering the base (47) at two entry points. Apparatuses manufactured with the method are also disclosed.

Abstract: The fixed layers of all magnetoresistive elements that are formed on the same substrate are magnetized in the same direction. Chips including magnetoresistive elements are cut out individually from the substrate. A magnetic sensor is assembled by combining cut-out chips together with consideration given to the magnetization directions of the fixed layers of the magnetoresistive elements in the chips. In this manner, the fixed layers of the magnetoresistive elements are magnetized by a sufficiently strong magnetic field for magnetization, whereby an output signal having a large absolute value is obtained from the magnetoresistive elements.

Abstract: A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexible cable sections of a combination of rigid printed circuit boards and therewith interposed flexible cable sections which are adapted to interconnect the rigid printed circuit boards. The apparatus consists of a tool constituted of an elongated cylindrical member having a tapered leading end which narrows into an ultra-thin flat end section of a blade-like configuration, and which is adapted to be pushed between the flexible cables and so as to preform the flexible cable sections and cause them to yield in a predetermined outwardly bowed permanently relationship between the rigid printed circuit boards at the opposite ends thereof to lengthen the fatigue life of the conductors in the flexible cable sections.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric compression pad is preferably composed of an electrically insulating material, such as a silicone-based gel. The thermally conducting material is preferably either diamond, beryllium oxide, silicon nitride, or a like material.

Abstract: A plated test probe structure for testing electrical connections to integrated circuits (IC) devices with solder bumped interconnection pads that are an integral part of the fan-out wiring on the test substrate, or other printed wiring device.

Abstract: An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.

Abstract: A manufacturing method for a flat panel display module includes forming a display section having a transparent substrate with a wiring line terminal section adjacent at least one edge. A light emitting section is a center section, with a sealing cap covering the light emitting section. The sealing cap is dimensioned such that an edge of said sealing cap nearest the wiring line terminal section lies inside the wiring line terminal section. A flexible printed circuit board is provided with a semiconductor device mounted thereon. The flexible printed circuit board is connected to the wiring line terminal section of the transparent substrate, and a frame is fixed around the transparent substrate.

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract: A method for making an article having an electronic device embedded therein comprises providing a substrate having first and second opposing broad planar surfaces; mounting an electronic device on the first broad planar surface of the substrate; and applying a layer of melt-flowable adhesive of substantially uniform thickness on the first broad planar surface of the substrate to cover the electronic device. The article produced thereby has the electronic device encapsulated by the layer of melt-flowable adhesive.

Abstract: A barrier head bolt for use in power feeder applications including a main bolt portion and an extended torque head portion, the torque head portion designed and constructed to shear off the main body of the bolt at a predetermined torque, and which projects above the main body portion a sufficient distance so as to inhibit or prevent the application of a joint sleeve without first shearing off the extended torque head portion of the bolt, thus ensuring that the joint is properly tightened.

Abstract: A method for manufacturing a high frequency electrical connector including positioning a plurality of parallel contacts, a plurality of terminals, and conductors interconnecting the contacts to the terminals in a manner such that signals flowing through proximate contacts are transmitted in opposite directions to reduce near-end crosstalk.

Abstract: A three phase transformer circuit is provided that includes a supply side, wherein the supply side is selectably configurable, via the use of se of terminal boards, between a delta connection and a wye connection at a time of use and, a load side, wherein the load side is selectably configurable between a delta connection and a wye connection at the time of use. The three-phase transformer also provides for selecting an input voltage, from multiple input voltages, via the sets of terminal boards, at the time of use, and for selecting an output voltage for the supply side, from multiple output voltage, at the time of use.

Abstract: A method of making an implantable electrode array, adapted for insertion into a cochlea, includes the steps of: (a) forming electrode contact pieces made from a precious, biocompatible material into a desired shape; (b) attaching the electrode contact pieces to a foil sheet made from a non-toxic but chemically-active metal; (c) connecting a wiring system to the metal contact pieces; (d) molding a flexible polymer carrier around the electrode contact pieces and wiring system while such are held in place by the foil sheet; and (e) etching away the foil sheet, leaving the electrode contact pieces exposed at a surface of the molded polymer carrier. The exposed electrode contacts are made so as to have a shape, geometry, or makeup that aids in controlling the current flow and current density associated with the electrode contact as a function of position on the electrode contact.

Abstract: A method of producing a light-emitting-diode (LED) rope light includes the steps of preparing a plurality of light seats defining a recess therein and a plurality of metal wires having two conductive plates connected to two ends thereof; positioning two conductive plates from two different metal wires in each light seat; forming the light seats into light-emitting diodes; serially connecting the light seats to provide an LED light string; positioning the LED light string into a hollow power cord holder with two electrodes of the LED light string connected to two power cords embedded in the power cord holder; and quickly enclosing said power cord holder with a transparent outer tube by way of injection molding to form an LED rope light.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.

Abstract: A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

Abstract: Disclosed is a wire harness mounting method for mounting a wire harness to a wire harness holding portion provided on a vehicle-mounted component, such as an air conditioning duct, wherein the wire harness consists of two or more sub wire harnesses produced separately, the sub wire harnesses being arranged on the wire harness holding portion and collectively held by the wire harness holding portion to thereby complete the mounting of the wire harness.

Abstract: A strain detector where water does not reach a strain-resistance element and which supplies stable output at all times is provided. In the strain detector, a first protective layer made of glass is disposed to cover an insulating substrate and the strain-resistance element. A second protective layer made of resins or glass for covering the first protective layer, and a thermistor for compensating the resistance of the strain-resistance element are disposed.

Abstract: An electronic circuit device has an electronic module that is deformed to match an installation location. The electronic module includes electronic parts and wires interconnecting the electronic parts. The electronic module is formed by mounting the electronic parts to the wires formed on a baseboard. After the baseboard is removed from the electronic module, the electronic module is deformed, and, thereafter, the configuration of the deformed electronic module is fixed.

Abstract: Apparatus and method for electrically connecting an electric conductor to an electronic component including the steps of providing a textile material, in which at least, one flexible, wire-like and/or thread-like electric conductor is arranged, severing the electric conductor at a point to be connected, arranging a contact-making device of the component on at least one surface side of the textile material at the point on the conductor to be connected, and connecting the conductor electrically to the contact-making device.

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.

Abstract: A method of making a data cable includes coupling an electrical conductor of an end of a cable to an electrical contact that is positioned within a portion of a connector housing. A protective clamp is positioned over a section of the cable rearwardly of the electrical contact. Another portion of the connector housing is formed over the cable section and the clamp, to thereby secure the cable with the connector housing. The protective clamp is positioned between the formed portion of the connector housing and the cable section and provides mechanical protection for the cable section to reduce damage thereto.

Abstract: Manufacturing of local coils for magnetic resonance imaging systems operating to receive and transmit signals may be simply constructed by applying selected pre-manufactured, modular, multi-component circuits to antenna conductors of the coil.

Abstract: A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

Abstract: A method for metallurgically bonding a stator bar to a coupling to reduce the incidence of leak paths resulting from corrosion. The stator bar comprises strands through which a liquid coolant can flow. Adjacent ends of the strands are received in an interior cavity of the coupling through an opening in the coupling. A joining material is provided on a first portion of the stator bar within the coupling opening and adjacent the ends of the strands. The first portion is heated to melt the joining material. At essentially the same time, a second portion of the stator bar outside the coupling is also heated. Once the joining material is suitably molten, the first portion is allowed to cool while the second portion remains heated, thereby causing the joining material nearest the ends of the strands to solidify first.

Abstract: A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

Abstract: A position sensor for an electronic control pedal is carried by the pedal mounting bracket and includes a linear potentiometer having a slider operable along a substrate in only a linear direction for providing an output voltage representative of slider displacement. A drive arm is connected to the pedal shaft for rotation during pedal movement. A coupler connected to the slider is slidable within a slot in the drive arm for providing the linear displacement through a rotational movement of the shaft. The drive arm has an inner arm in a telescoping connection with an outer arm for setting the drive arm at a desired length after potentiometer calibration. The longitudinal axis of the slot is at an non-zero angle to the longitudinal axis of the drive arm for desensitizing the sensor calibration and adjustment process.

Abstract: A tool and method for using the tool is provided for engaging electrical hardware devices. The tool has a handle; a planar body; a planar engagement bar projecting normal from the body; a pair of arms, one arm formed at each of two ends of the bar; and each arm further bending and terminating in a bottom hook portion, the bottom hooks aligned in a common plane parallel to and spaced a gap distance from the bar and generally normal to the planar body. The hook spacing dimension is about equal to or slightly greater than an outer dimension of an electrical hardware device workpiece body but less than an outer dimension of a rectilinear lip element projecting from the hardware device workpiece. The gap distance is about equal to or slightly greater than a thickness dimension of the rectilinear lip element.

Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

Abstract: An improved manufacturing technique for optical fiber arrays employs optical feedback in a partially assembled unit using an inspection camera. This allows immediate reworking of a problematic part. In the present invention, a video microscope is used to check the alignment of the optical fiber array during the manufacturing process. After the optical fiber array has been glued or otherwise affixed, then an optical device may be used to measure the performance of the glued assembly.

Abstract: A printer cartridge and method of making or refurbishing a printer cartridge are disclosed. The printer cartridge may include a first cartridge subassembly attached to a second cartridge subassembly. The first cartridge subassembly may include a first conductive terminal and the second cartridge subassembly may include a second conductive terminal that is normally in electrical contact with the first conductive terminal when the first and second subassemblies are assembled. A compressible toner seal may be disposed between the first and second cartridge subassemblies. A compressible, electrically conductive extension may be attached to the first conductive terminal to compensate for variations in thickness of the compressible toner seal or relative movement of the first cartridge subassembly relative to the second cartridge subassembly when the first and second subassemblies are attached to one another to form the printer cartridge.

Abstract: A stator core extends along a longitudinal axis and includes a yoke, and a plurality of radially-inwardly projecting teeth separated by intervening slots. Each tooth includes a tooth tip at the radially innermost portion of each tooth, thereby defining a slot opening. A conductor segment including two segment ends, a pair of straight portions, and a hairpin-shaped end turn disposed therebetween is radially inserted into at least two slots through corresponding slot openings, wherein the straight portions of the conductor segment each have a width substantially equal to the width of the slot. After the conductor segment is inserted into the stator core, the tooth tips are deformed so as to reduce the size of the slot opening, thereby providing for an improved magnetic flux path and slot fill percentage without increasing the complexity or cost of manufacturing, or decreasing the reliability of the final product.

Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.

Abstract: A method of manufacturing an electronic component unit comprises the steps of forming a conductive pattern on a surface of a substrate, roughening a surface of a connecting area of said conductive pattern, printing an adhesive on the connecting area, connecting an electrode of an electronic component to the electroconductive adhesive on the connecting area, and drawing the adhesive at a temperature of 50-120° C.

Abstract: A method for depositing a nanostructure-containing material onto an object or substrate includes one or more of the following: (1) forming a solution or suspension of nanostructure-containing material, (2) selectively adding “chargers” to the solution, (3) immersing electrodes in the solution, the substrate or object upon which the nanostructure material is to be deposited acting as one of the electrodes, (4) applying a direct and/or alternating current electrical field between the two electrodes for a certain period of time thereby causing the nanostructure materials in the solution to migrate toward and attach themselves to the substrate electrode, and (5) subsequent optional processing of the coated substrate. Associated objects and devices are also provided. A method for separating nanostructures based on their properties and/or geometry is also described.

Abstract: Interconnect validation instruments and methods are provided. In one embodiment, an interconnect validation instrument has a shell with an opening at first end thereof and a second end opposite the first end. The second end has a plurality of holes. Each of the plurality of holes is adapted to receive a respective one of a plurality of pins therein. Each of the plurality of holes is further adapted to align the respective one of the plurality of pins when received therein when the respective one of the plurality of pins is not aligned.

Abstract: The invention is directed to an electrical component having a base body (1) that comprises a layer stack of mutually overlapping, electrically conductive electrode layers (3) that are separated from one another by electrically conductive ceramic layers (10), whereby the electrically conductive ceramic layers (10) are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient, whereby the electrically conductive ceramic layers (10) are produced of ceramic green films that are sintered in common with the electrode layers (3), and whereby outside electrodes (2) that are electrically conductively connected to the electrode layers (3) are arranged at two opposite outside surfaces of the base body (1). The invention is also directed to a method for the manufacture of the component and to the employment of the component.

Abstract: The invention comprises filling a conductive adhesive on a hole end of a wire connection part in tubular shape of the terminal which has an electric contact part at one side and the wire connection part at the other side, inserting an electric wire from a hole opening of the wire connection part toward the hole end, and reducing evenly a size of a tubular wall of the wire connection part, thereby causing the conductive adhesive to infiltrate into a space of the electric contact part or between wires. The invention also comprises tightening the tubular wall of the wire connection part by a rotary swaging process. Further, the conductive adhesive is a nickel paste which is a mixture of nickel powders in a liquid epoxy resin based binder. In addition, at least one of a core wire portion of the electric wire or the terminal is aluminum or aluminum alloy.