Abstract: A method for continuously producing flat cables with electric conductors embedded in an isolating material which are arranged at a certain distance from each other, parallel to each other. According to this invention, the band shaped conductors are guided separately in a plane forming two sides of a surface. The surface sides have insulating layers based on thermoplastic synthetic materials. According to this invention, at least one of the insulating layers which covers the surface sides is produced by extrusion coating of a thermoplastic melt.

Abstract: A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending therefrom. A lead frame is disposed adjacent to the packages, positioned medially of the air space and having a plurality of connection terminals in registration with and in electric contact with the plurality of TSOP connection terminals. The TSOP's have a chip select terminal and several unused terminals. The lead frame has a strain-relieved conductor extending between the chip select terminal on a TSOP higher in the stack to the adjacent TSOP lower in the stack. Moreover, TSOP locating surfaces are included on the lead frame in the finished stack.

Abstract: A coated lead wire can be solidly connected to a terminal of a coil bobbin by placing the terminal entwined with the coated lead wire into between electrodes having heating portions, and heating the terminal entwined with the coated lead wire along with solder to melt the solder and burn off a coating layer of the coated lead wire while directing a blow of inert gas toward the terminal entwined with the coated lead wire between the electrodes. The coating layer carbonized as the result of being burned out by heating up the moving electrodes can be blown out without being mixed into the molten solder, consequently to add strength to the connection between the lead wire and the terminal, thereby to form reliable and firm connection between the lead wire and the terminal with ease.

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

Abstract: A method of connecting feeding lead wires to the winding of a rotor core which can rotate inside a stator with a clearance between the rotor core and the inner surface of the stator, using a joint conductor between the lead wire and the stator winding. Forming on the feeding lead wire, a first part to be connected to the joint conductor, a second part which is thinner than the first part, and a third part which is between the first and second parts and has a thickness changing from the thickness of the first part to the thickness of the second part, and welding the first part to the joint conductor by electron beams or brazing the first part to the joint conductor while cooling the first part.

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract: Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can include a die, an interposer substrate, a solder-ball, and a dielectric compound. The die can have an integrated circuit and at least one bond-pad coupled to the integrated circuit. The interposer substrate is coupled to the die and can have at least one ball-pad electrically coupled to the bond-pad on the die. The interposer substrate can also have a trace line adjacent to the ball-pad, and a solder-mask having an opening over the ball-pad. The solder-ball can contact the ball-pad in the opening. The dielectric compound can insulate the ball-pad and the solder-ball from an exposed portion of the adjacent trace line in the opening.

Abstract: A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.

Abstract: A method of connecting phases of a segmented stator electric machine includes providing a stator core. An end cap assembly is attached to the stator core. Winding wire is wound around the end cap assembly and the stator core to form a stator segment assembly. A plurality of the stator segment assemblies are assembled into a stator including first, second and third phases. A phase wire stitching machine is used to connect opposite ends of the winding wire of each of the stator segment assemblies to form the first, second and third phases of the stator. The phase wires can be attached to the stator segment assemblies using terminals, IDCs, hook terminals, and/or directly to the winding wire.

Abstract: A method is provided for manufacturing an electro-optical device including a flexible wiring board having a conductive terminal electrically connected to an electro-optical display apparatus, whereby the flexible wiring board is electrically connected to a conductive terminal provided on a circuit board. A structural member is disposed between a first side of the electro-optical display and a first side of the flexible wiring board. The flexible wiring board is bent toward a second side of the structural member to oppose the circuit board and a conductive member is provided between the conductive terminal of the flexible wiring board and the conductive terminal of the circuit board. A force is applied to the structural member to attach the structural member to the circuit board, the force operable to compression-bond the conductive member to the conductive terminals of the flexible wiring board and the circuit board to establish an electrical connection therebetween.

Abstract: A co-package semiconductor device including an outer clip in the form of a metal can includes also two semiconductor dies, at least one of which uses the outer clip as an electrical connector. An inner clip is used to dispose one of the dies within the outer clip. The inner clip may be insulated from the outer clip by an insulating layer.

Abstract: An electrical connector and method of making the same includes a radially resilient, cylindrical electrical contact member having a plurality of spaced strips extending between opposite ends of a sleeve. The ends of the strips are held in one or more housings in an angularly offset, end-to-end position. The contact member and the sleeve are urged from the one or more housings into a cylindrical portion of a holder or use element to mount the connector directly in the holder or use element. In one aspect, the contact strips are formed as individual strips joined to the sleeve at one end and at the other end. In another aspect, at least one contact strip is formed with a movable detent releasably engagable in a recess in a pin insertable into the connector to lock the pin in the connector. In another aspect, at least one strip has an extension which overlays a portion of the bare wire end of an electrical conductor mounted in one end of a terminal.

Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill.

Abstract: A hexagonal conductor path layout for power and ground distribution planes in a multi-layer VLSI device. The invention reduces crosstalk between switching devices in signal nets by reducing impedance in the distribution planes. Impedance is reduced by providing more direct line current paths and providing maximum path change angles of less than ninety degrees. Reduced impedance causes reduced coupling between current flows which share a common path and hence less crosstalk.

Abstract: A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract: A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.

Abstract: A method for packaging image sensors of the invention includes the steps of: providing a substrate formed with a plurality of zones, traces, and first long-holes penetrating through the substrate at a periphery of each zone, the zones being separated by the first long-holes; providing a frame layer placed on the substrate, the frame layer being formed with slots at positions corresponding to the zones of the substrate, and with second long-holes at positions corresponding to the first long-holes of the substrate; placing a plurality of photosensitive chips in each of the zones of the substrate and within the slots, respectively; electrically connecting the plurality of photosensitive chips to the substrate; placing a plurality of transparent layers above the slots of the frame layer to cover the photosensitive chips, respectively; and cutting along the first long-holes of the substrate and the second long-holes of the frame layer to form a plurality of image sensors.

Abstract: A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such as an image sensor or an ultraviolet-sensitive EPROM (Electrically-Programmable Read-Only Memory) device. The proposed method is characterized in the use of a support pillar, which is positioned beneath the lead frame when the lead frame is clamped between a top inserted mold and a bottom cavity mold, to help prevent resin flash on the lead frame during the molding of the core-hollowed portion.

Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.

Abstract: An installation device for installing a flexible sensor apparatus on a seating surface of a seat cushion includes an installation fixture having a saddle. The saddle includes a first face having a seating portion recess formed therein which generally conforms to the shape of the seating surface of the seat cushion. The first face further has at least one locating recess formed in the seating portion recess. The locating recess generally conforms to the shape of a portion of the flexible sensor apparatus. The saddle further has ports extending from the locating recess to a vacuum source, wherein a vacuum from the vacuum source retains the flexible sensor apparatus in the locating recess.

Abstract: A method of installing a driver for a plug and play device is provided, wherein the plug and play device includes a main function device and a storage device meeting a standard specification. The storage device stores a driver required by the main function device. The main function device and storage device may be connected to the host in two different ways after the plug and play device is installed to the host. The first way is to connect the two devices to the host simultaneously. The host loads a built-in standard driver for the storage device from the host to access the storage device, and then loads the driver required by the main function device from the storage device to gain freely access to the main function device. The second way is to connect the storage device to the host, and to cause the host to copy the main function device driver from the storage device to the host's storage device (e.g., a disk drive). Next, the main function device is connected to the host.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: A connector press provides for learning a specified connector pressed position, adjusting a force based threshold, and simultaneously pressing multiple connector types into a circuit board. The force based threshold may be adjusted via a slider bar on a user interface. The specified pressed position may be learned by measuring and storing a position or force value, upon the user causing the press to press the connector into a circuit board. A total force based threshold may be determined in order to simultaneously press multiple connector types. The total force based threshold may be based upon quantities and pressing forces of each of the connectors types. Further, the press may provide near capacity pressing force, even with an asymmetrical load, by including linear guides.

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract: In a method of repairing a solar panel having a defective solar cell or cells, a replacement cell (or cells) is glued onto a defective solar cell or cells of the solar panel, and is electrically integrated in the solar panel.

Abstract: The present invention comprises apparatus, methods and articles of manufacture for processing and/or stripping wire comprising a wire processing or wire termination machine with a processing or stripping sub assembly actuated by a start sensor plate, where the start sensor plate has a textured surface, so as to retain the wires being stripped.

Abstract: A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexible cable sections of a combination of rigid printed circuit boards and therewith interposed flexible cable sections which are adapted to interconnect the rigid printed circuit boards. The apparatus consists of a tool constituted of an elongated cylindrical member having a tapered leading end which narrows into an ultra-thin flat end section of a blade-like configuration, and which is adapted to be pushed between the flexible cables and so as to preform the flexible cable sections and cause them to yield in a predetermined outwardly bowed permanently relationship between the rigid printed circuit boards at the opposite ends thereof to lengthen the fatigue life of the conductors in the flexible cable sections.

Abstract: A method of increasing capacity of an air-cooled power generator 30 includes retrofitting a water evaporative cooler 48 to the generator. The water evaporative cooler 48 includes a water absorbent media 50, a controllable water inlet 52,53 for controllably delivering water from a water supply to the water absorbent media, at least one sensor 54, and a controller 56 responsive to the at least one sensor. The retrofitting includes mounting the water evaporative cooler 48 so that the water absorbent media 50 is in fluid communication a flow of cooling air, connecting the controllable water inlet 52,53 to the water supply, mounting the at least one sensor 54 for sensing at least one parameter relating to the flow of cooling air, and connecting the controller 56 to the at least one sensor to thereby operate the controllable water inlet based upon the at least one sensor.

Abstract: An electrode for the electrochemical fine-boring of workpieces includes an electrode tube for an electrolyte to pass through to reach a workpiece which is to be machined, and an electrical conductor which is connected to the electrolyte, in which electrode the tube, for the purpose of boring bores with the smallest possible diameter, consists of a metal with a substantially amorphous structure, is electrically conductive and is provided on its outer surface, at least in sections, with a nonconductive insulating layer.

Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimetre) of a paste very soluble in water and washing it off.

Abstract: A method for making an electrically shielded housing for an electrical device includes the steps of at least partially forming an insert member having a non-conductive outer surface portion and a conductive inner surface portion, insert molding the at least partially formed insert member in a cavity of a non-conductive housing body member so that the conductive inner surface portion of the insert member is disposed adjacent an outer surface portion of the body member cavity and the non-conductive outer surface portion of the insert member forms a housing cavity. An electrical device received in the housing cavity is electrically shielded by the conductive inner surface portion of the insert member and insulated from the conductive inner surface portion of the insert member by the non-conductive outer surface portion thereof.

Abstract: Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

Abstract: A method for insertion of inserting printed circuit card into socket connectors which prevents sockets from getting contaminated or damaged during the insertion of a printed circuit card comprises the steps of: inserting a cam for moving a socket connector's contacts outwardly so that they will not make contact with a card's edge when it is inserted between the contacts of the sockets connector as it is inserted, and after the printed circuit card is inserted the printed circuit card moving the printed circuit card until it makes contact with a stop in the socket connector, and after the printed circuit card has contacted the stop in the socket connector, moving the cam to a closed position allowing the printed circuit card to be seated, and seating the printed circuit card by moving it to cause and allow for an amount of wipe to clean the connector's contacts without contaminating or damaging the socket connector's contacts during the insertion of said printed circuit card.

Abstract: An apparatus and method for electronically sequencing and guiding wire path and wire connection information during the manufacturing process of wire harnesses. The user of the apparatus and method assembles a wire harness on a assembly board which has an electronic display device contained therein which has the ability to display path and text information for each specific wire contained within a specific wire harness design. The assembly board is connected to a computer that sequences and sends the information for each wire to the display. The process entails receiving assembly control data from a computer that simultaneously displays information about a specific wire on the computer screen and on the display device in the form board. The images on the display device are the life size and path of where a wire should be placed within the wire harness.

Abstract: A compressor is provided with a fluid tight electrical connector. The electrical connector is sealed against the sealed compressor housing, and a cable is attached to a connector housing. Since the cable is separately attached to the connector housing, it is not directly connected to terminal pins in the compressor. This reduces damage to those terminal pins. Further, unique sealing arrangements make the electrical connection fluid tight.

Abstract: An auxiliary machine module includes auxiliary machine a base plate equipped with the auxiliary machine; a case in which the base plate is mounted, and a connector tool for electrically connecting the base plate and the case. In this configuration, the number of components provided on the periphery of the auxiliary machine module, and the module can be reduced in size and weight in a simple structure. An inconvenience occurring in a conventional assembling operation can be also overcome.

Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g.

Abstract: The method for producing an electrical connecting element is essentially characterized in that a plastic deformable substrate is formed with an embossing tool in an embossing step in such a way that recesses are made in said substrate in the areas in which conductive strips and, for instance, through holes or contact surfaces should be formed. The substrate is then coated with a thin conductive layer. In a following step, conductive material is galvanically deposited on the substrate until the recesses are filled with conductive material. Subsequently, the conductive material is removed the corresponding areas of the substrate that should not have any conductive surface are free from any metal coating.

Abstract: The present invention relates to a center conductor insulator with a tapered entry for use with a coaxial cable transmission line connector that provides guiding and centering of a center conductor pin within the connector. The present invention further relates to a front sleeve assembly for use with a coaxial cable transmission line connector which incorporates a center conductor insulator with a tapered entry to guide and center a center conductor pin within the connector. The present invention also relates to a compression ring assembly for mounting a connector to a cable, the assembly having a collet engaging a tapered rear seal to compress the collet about the cable. The present invention further relates to a method of mounting a connector to a cable with a compression ring assembly incorporating a collet and tapered rear seal.

Abstract: An indoor/outdoor advertising device and a method for manufacturing the same. The indoor/outdoor advertising device, which is used for indoor/outdoor advertisement materials or signboards, can be easily manufactured due to its simple structure and can provide an outstanding advertisement effect not only at night but also during the daytime by emitting light from the light elements throughout surfaces thereof with less consumption of electric power.

Abstract: A method for configuring an electrical connector having a housing comprises the step of, 1) providing at least a pair of silos adapted to be formed on the housing of the connector; 2) providing at least a silo with a key thereon; 3) arranging the silos into different combinations established by events different from one another; and 4) selecting a first event from the combinations for serving configuration of the connector.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.

Abstract: Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a semiconductor chip, and an inner hole for mounting a semiconductor chip are formed, by primary- and secondary-laminating a plurality of boards. The present invention enjoys advantages in that contamination due to an outer layer surface treatment of the board laminate can be prevented, and a process for preventing a contamination of an inner hole can be omitted, and also a defective proportion can be reduced remarkably in comparison with prior arts by applying a pressure uniformly during a secondary lamination. Furthermore, a BGA board according to the invention has an ideal ball pitch and multi-fins, excellent electrical and thermal properties, also can be applied in the case of high current, and can be easily mounted on a chip.

Abstract: A method of fabricating an electrostatic chuck capable of holding a substrate in a chamber comprises forming an at least partially sintered dielectric insert, forming a dielectric preform comprising an electrode and a gas conduit, and placing the dielectric insert in the gas conduit of the dielectric preform, and sintering the dielectric preform and the dielectric insert.

Abstract: A semi-automated method for forming armature coils comprising a plurality of transposed wire pairs includes joining a plurality of pairs of wires having offset segments along their lengths, wherein each pair of wires are in contiguous, surface-to-surface engagement with each other along a length defining said each pair of wires, insulating each of the transposed pairs of wires, assembling the plurality of the insulated transposed pairs of wires with the transpositions being staggered to create a pack, and forming the pack into an armature coil in an automated coil forming machine by bending the pack in two planes. The joining of the plurality of pairs of wires having the offset segments along their lengths is effectuated at a transposition point. Each pair of wires has a transposition at a unique point relative to others of the plurality of the pairs of wires forming the coils.

Abstract: A method for assembling an arc fault circuit breaker such that electrical interconnections, i.e., electrical connections between compartments, are made without disassembling any previously assembled compartment. The arc fault circuit breaker comprises housings having compartments within. Electrically connected components having interconnecting components, i.e., components which provide electrical interconnections between compartments, are disposed within the compartments. The housings are assembled together to enclose the compartments. Interconnecting components within an enclosed compartment extend through openings in the housings to provide electrical interconnections to the next compartment to be assembled. Therefore, no disassembly of the enclosed compartment is necessary to make the interconnections.