Abstract: A low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.

Abstract: The present disclosure relates to connection arrangements for electrical devices. In the connection arrangements, an electrical device having at least one ledge that includes a plurality of contact terminals provided thereon is electrically connected to an electrical component having a plurality of contacts formed thereon.

Abstract: Electrical equipment is disclosed that comprises a front-mounting electrical component, such as an IEC connector, a switch, a circuit breaker or a lamp or indicator. The electrical component has a body with a retaining shoulder at an outside end region and electrical terminals projecting from an inside end region. Included is an equipment enclosure, such as a chassis box, having sides, a selected one of the sides being formed with a cutout for receiving the retaining shoulder of the front-mounting electrical component. Also included is an electrical component retaining plate having a front side and a back side and having a cutout into which is received, from the front side of the plate, the body of the front-mounting electrical component so as to install the electrical component in the retaining plate.

Abstract: A technique for separating the stator leads of an electric motor during the manufacturing process. The technique comprises a system having a lead gathering assembly, a lead separator, and a drive mechanism. The lead gathering assembly is adapted to gather together a plurality of stator windings extending from a stator. The lead separator having a plurality of teeth adapted to separate a stator winding from the plurality of stator windings gathered together by the lead gathering assembly. The drive mechanism is adapted to drive the lead separator into the plurality of stator windings. The lead separator has teeth to separate each of the stator windings gathered together by the lead gathering assembly.

Abstract: A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the second lead are sealed in a package by injecting a sealing resin in the die from a position on a longer side of the package, with the position being offset toward one shorter side thereof. The first lead is bent in an S shape, with a bending depth being at least as large as the thickness of the first lead. A thickness of the resin on a non-device side of the element placement pad is smaller than the bending depth.

Abstract: A method of making a flexible elongate member includes the steps of providing a core wire having a proximal region and a distal region, attaching an electrical device to the distal region of the core wire, the electrical device being electrically connected to at least one electrical conductor. A substantially cylindrical electrical connector is formed from a substrate having a first edge and a second edge, the first edge and the second edge of the substrate being bonded substantially flush to each other, the electrical connector including a plurality of conductive bands and a plurality of electrically conductive runners interconnected to the plurality of bands. An electrically conductive bond is formed between the electrical conductors and the plurality of electrically conductive runners. The substantially cylindrical electrical connector is attached to the proximal region of the core wire.

Abstract: A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.

Abstract: An electrical connector (1) having a cover (5) mounted thereon is disclosed in accordance with the present invention. The connector includes a connector body (2) defining a passageway (20) in a mounting surface (202) with a contact (3) received therein. The contact has a tail portion (304) adapted to be electrically connected to a circuit substrate (6). The cover has a pair of legs (52) extending into the passageway and forming an opening (524) adjacent to the mounting surface of the connector body. The tail portion of the contact terminates in the opening. A fusible element (4) has a portion disposed in the opening and fused to the tail portion of the contact.

Abstract: An integrated circuit design is provided capable of operating in multiple insertion orientations. In particular, the inventive circuit design includes an integrated circuit package having a plurality of contact elements extending from the integrated circuit package and arranged symmetrically thereon for enabling the integrated circuit to be inserted on a circuit board in at least two discrete orientations. A plurality of the contact elements are designated as orientation pins, the orientation pins being arranged such that, upon integrated circuit package power up, the orientation pins transmit orientation signals indicative of the integrated circuit packages insertion orientation in the circuit board. A plurality of multiplexer devices are provided for routing signals between the contact elements and integrated circuit functional circuitry in response to the orientation signals from the orientation pins.

Abstract: A method for manufacturing an ink jet head, which is provided with a discharge port member having discharge ports arranged for discharging ink, comprises the step of forming the discharge port member by a first photosensitive resin layer, and a second photosensitive resin layer having water-repellency, which is laminated on the first photosensitive resin layer, and the step of giving pattern-exposure and development to these layers for the formation of a structure having the portion where both the first photosensitive resin layer and the second photosensitive resin layers are removed, and the portion where the second photosensitive resin layer is partially removed.

Abstract: A connection technique for switchably and mutually exclusively coupling a plurality of device sets. The connection technique utilizes a low profile connector having multiple circuit sets, each of which is configured for mutually exclusive and removable insertion into a receptacle coupled to multiple devices. Each one of the multiple circuit sets, which is inserted into the receptacle, couples a desired set of the plurality of device sets.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: An apparatus that can perform checking terminal lock in a connector housing securely are provided. The apparatus for checking terminal lock (1) includes a main body (8), a housing set portion (19) so as to be disposed in the main body (8) to move freely in a direction of inserting and extracting a terminal, and push means (6) for pushing the housing set portion (19) in the direction of inserting the terminal. On condition that a connector housing (2) is secured in the housing set portion (19) pushed by push means (6) and the terminal connected with a wire is inserted into the connector housing (2), terminal lock is checked by pulling the wire in a direction of extracting the terminal.

Abstract: A method for manufacturing a sub-harness comprises the steps of:

Abstract: A throttle device in the intake section of an internal combustion engine; the throttle device including a housing part, which contains a flow cross section for an air flow. In the housing part, bearing points are provided for a throttle valve device, which can be actuated by means of an actuating drive. The actuating drive can be inserted into a receiving housing, which has first and second guide surfaces that permit the installation of the actuating drive. Fastening means are provided on the circumference surface of the receiving housing and can accommodate a closing and contacting element, which contacts electrical contacts of the actuating drive.

Abstract: A device to retrofit an existing modular connector having a flexible projecting connector tab that renders a cable to which the modular connector is connected susceptible to snagging is provided. The device is attached onto the connector and has a hollow interior, a bottom, two lateral sides, and a top. The top has a projecting tab. The projecting tab is set at an angle to allow the device tab to preclude objects from entering an opening formed by the connector tab and the connector and thus prevents the connector from snagging.

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract: A method of making an electrical connector includes the steps of: providing a connector body (2) having an insert (5) defining a recessed area (54a) at one side and a number of channels (54b) at an opposite side; assembling a ground bus (4) to the recessed area of the insert, the ground bus including a carrier strip (46) with a number of fingers (460) extending therefrom; assembling a number of signal contacts (3) to the channels of the insert, each signal contact including a board mounting portion (32); and displacing the carrier strip such that each finger extends into space (320) between the mounting portions of two adjacent signal contacts.

Abstract: A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

Abstract: An electronic device containing an electronic element such as a thermistor element is produced first by providing the element with electrodes formed on its two main surfaces facing outward away from each other, at least two terminals and a casing. Each terminal has a contact part for contacting one of the electrodes and an extended part extending from the contact part. The contact part of at least one of the terminals is elastic and bendable. The terminals and the electronic element are inserted into the casing either sequentially or simultaneously as an assembly in any of the ways such that the electrodes on the electronic element are not rubbed directly against the contact parts of the terminals. This may be done by disposing flexible guide plates over the contact parts such that the electrodes will glide over these guide plates as the electronic element is inserted after the terminals are installed inside the casing.

Abstract: A method for electrically connecting a circuit board connector to an external device. An embodiment of the method comprises providing a probe block through one end of a guide sleeve open on opposing ends, linking at least one contact on the probe block is linked to the external device, positioning the probe block so that the at least one contact is substantially aligned with a corresponding pin on the circuit board connector, and moving the probe block through the guide sleeve until the at least one contact makes a connection through one of the opposing open ends of the guide sleeve with the corresponding pin on the circuit board connector.

Abstract: A method of making a temporary medical electrical lead for pacing or defibrillating a heart of a patient.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: A method of manufacturing a multilayer piezoelectric component includes the step of providing a compact and sintered ceramic body including a piezoelectric ceramic material and having opposite first and second sides. First and second external electrodes are respectively provided on the first and second sides of the compact ceramic sintered body. A plurality of internal electrodes are stacked in the ceramic sintered body so as to overlap each other with ceramic layers disposed therebetween in the thickness direction. The internal electrodes are arranged to be electrically connected to the first or second external electrode. A dummy electrode is provided between an end of at least one of the internal electrodes opposite to the end connected to one of the external electrodes, and the other external electrode not connected to the at least one internal electrode at the height where the at least one internal electrode is located.

Abstract: A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.

Abstract: A carrier substrate, or interposer, for use in a chip-scale package. The interposer is formed from a material, such as a semiconductive material, that has a coefficient of thermal expansion that is the same or similar to that of the semiconductor device to be secured thereto. A chip-scale package including the interposer is formed by aligning a substrate including a plurality of interposers over semiconductor devices carried upon a wafer or other large-scale substrate. Bond pads of the semiconductor devices are exposed through insulator-lined apertures of the interposers. The apertures are filled with electrically conductive material and conductive structures are secured to the apertures so as to communicate with corresponding bond pads. The resulting chip-scale packages may then be severed or diced from the substrate and wafer. Apparatus and methods for simultaneously testing multiple, physically connected chip-scale packages are also disclosed.

Abstract: The present invention is generally directed towards a catalytic converter installed in the motor vehicles. More specifically to a method of measuring the pressure on the substrate as the catalytic converter is subject to the spin forming process. A pressure-measuring device such as a sensor is contact with the substrate. In order to transfer data from the rotating catalytic converter to a stationary object, a slip ring device is connected to the pressure-measuring sensor.

Abstract: An electrically conductive paste comprises 80% by weight or more of silver powder and 20% by weight or less of a thermosetting resin. The silver powder has a particle size distribution having two peaks at specific positions. Viscosities of the paste measured under a low shearing stress and under a high shearing stress are in respective specific ranges and the ratio of these viscosities is in a specific range. A cured product obtained by heating the paste has a tensile modulus in a specific range. The paste has thermal and electric conductivities approximately the same as those of solder, shows little change in properties under a high temperature and a high humidity or under cyclic cooling and heating, exhibits excellent workability in coating and can be applied to coating by using nozzles having a wide range of diameters. A reliable semiconductor device is prepared by using the paste.

Abstract: There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.

Abstract: A method of manufacturing a fabric article to include electronic circuitry in which a flex circuit is assembled to include conductive traces and pads on a flexible substrate, a fabric article is placed on a rigid surface, and the substrate of the flex circuit is secured to the fabric article. Also disclosed is a fabric article which includes electronic circuitry and an electrically active textile article.

Abstract: The invention concerns a pressure sensor (1), able to operate at high temperature and measure the pressure of a hostile medium, comprising:

Abstract: In a method of manufacturing a center electrode for a spark plug, a core member is press-fitted into a metal cup and, thereafter, a cold-forging process is performed to form a small-diameter portion at a closed end of the metal cup. The small-diameter portion is completely free from deformation which may occur during press-fitting operation. Thus, the small-diameter portion has excellent accuracy in shape. Furthermore, since the press-fitting is performed before the cold-forging of the small-diameter portion, it is possible to increase the press-fitting load or pressure to the extent that the core member and the metal cup are joined together with a sufficient degree of adhesion which will insure the a center electrode to have good thermal conductivity.

Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.

Abstract: A method of manufacturing a marker post includes the steps of preheating a tubular barrel adjacent to a lower end thereof to soften same and deforming the tubular barrel lower end to form a flange assembly. The pre-softened tubular barrel is received in a barrel holder. A mandrel assembly is reciprocated into and out of engagement with the barrel lower end. The mandrel assembly reshapes the barrel lower end to form the flange assembly.

Abstract: A technique for securing a conduit box to a housing of an electric motor is disclosed. The technique includes forming a hollow extension from a surface of the conduit box. The conduit box is placed on a motor frame so that the hollow extension is inserted into a hole in the motor frame that passes into the hollow interior of the motor frame. The hollow extension is plastically deformed inside the motor housing to a greater width than the diameter of the hole in the motor housing so that the conduit box cannot be removed from the motor housing. A stator is placed in the motor housing and wiring is routed from the stator to the interior of the wiring box through a passageway formed by the hollow extension.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract: A wiring board provided with a first terminal, a connector provided with a second terminal, and a camera module provided with a third terminal are provided. The first terminal and the second terminal are soldered to mount the connector on the wiring board. The camera module is mounted on the connector to electrically connect the second terminal with the third terminal.

Abstract: A method and apparatus is presented to allow one or more electrical components to be coupled to the land-side of an integrated circuit package coupled to a circuit board. In a first embodiment, a void is provided in the circuit board, and a peripheral area of the integrated circuit package is coupled to a peripheral area around the void. This provides space for the insertion of components in the land-side of the integrated circuit package. In a second embodiment, a spacer is provided coupled to the peripheral area of the integrated circuit package to allow the insertion of components into the land-side of the package and above the circuit board. With these embodiments of the present invention, components, such as decoupling capacitors can be coupled closer to the die (e.g., a processor die) of the package thus reducing parasitic inductance.

Abstract: To accommodate thermal stresses arising from different coefficients of thermal expansion (CTE) of a packaged or unpackaged die and a substrate, the package incorporates two or more different interconnect zones. A first interconnect zone, located in a central region of the die, employs a relatively stiff interconnect structure. A second interconnect zone, located near the periphery of the die, employs a relatively compliant interconnect structure. Additional interconnect zones, situated between the first and second interconnect zones and having interconnect structure with compliance qualities intermediate those of the first and second zones, can optionally be employed. In one embodiment, solder connections providing low electrical resistance are used in the first interconnect zone, and compliant connections, such as nanosprings, are used in the second interconnect zone.

Abstract: An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.

Abstract: In a process for mounting a plurality of parts to a cable in mounted positions and in mounted attitudes determined respectively for the parts, information for the mounting of each of parts is marked on the cable before mounting of the parts. Thus, the mounting of the parts can be carried out without selection of a worker, leading to an improved general-purpose property. Also, an exclusive jig is not required, resulting in a reduced cost and elimination of need to secure a space for storing the jig.

Abstract: A marker post includes a tubular barrel with upper and lower ends and a bore extending therebetween. An annular flange assembly is formed at the barrel lower end and includes a concave extension portion extending radially outwardly from the barrel and a return portion extending upwardly and inwardly from the extension portion. The flange assembly resists pullout of the marker post when embedded in the ground. A method of manufacturing the marker post includes steps of preheating the tubular barrel adjacent to its lower end to soften same, and deforming the tubular barrel lower end to form the flange assembly thereof. An apparatus for manufacturing the marker post includes a warming tank for immersing the barrel lower ends in heated liquid for softening same. A barrel holder receives the pre-softened tubular barrels and includes a mandrel assembly reciprocated into and out of engagement with the barrel lower ends. The mandrel assembly reshapes the barrel lower ends into the flange assemblies.

Abstract: Structure of driving unit in a drum type washing machine including a tub mounted inside of a cabinet, a drum mounted inside of the tub, a shaft connected to the drum mounted inside of the tub for transmission of a driving force from a motor to the drum, a front bearing and a rear bearing mounted on an outer circumference of the shaft at opposite end portions thereof respectively, a bearing housing built in a central portion of a rear wall of the tub for supporting the front bearing, a rotor composing the motor together with the rotor, and coupled to the rear end portion of the shaft, a stator fixed to the tub rear wall inward of the rotor to compose the motor together with the rotor, a connector serration coupled to the outer circumference of the shaft in front of the rear bearing and fixed to the rotor, for transmission of a rotating power from the rotor to the shaft, and a bearing bracket fixed to the rear wall of the tub to cover an outside of the rotor and support the rear bearing, thereby reducing noise,

Abstract: In a thin-film structure, since a flat face of a bump, which is exposed at the surface of an insulating layer and is to be in contact with an electrode layer, is an exposed surface of a nickel layer, an oxide layer on the flat face can be reliably removed by using ion-milling or sputter etching.

Abstract: A printed circuit board (7) is electrically connected to an electroluminescent display by applying the circuit board (7) to the display so that metal tracks (8) on the underside of the circuit bard (7) make electrical contact with conductive tracks (6) on the display. While the tracks (6, 8) are in electrical contact and electrically insulating adhesive (10) is applied between the lower surface of the circuit board (7) and the upper surface of the display to bond the circuit board (7) to the display. The thickness of the tracks (6, 8) spaces the circuit board (7) from the display to define a void to receive the adhesive (10). The connection method has the advantage that the operation of the assembled circuit board (7) and display can be tested before the adhesive is applied.

Abstract: A method and article of manufacture for providing a mechanical bond and an improved water vapor seal between a lens (11, 41) and a base (17, 47) in an instrument housing (10, 40), includes heating the components and a hot butyl rubber sealant (18, 58) prior to assembly, maintaining a level of heating for the assembly during assembly, dispensing the heated sealant (18, 58) into a channel (25, 65) to form a ring-shaped body of sealant (18, 58), assembling the lens (11, 41) to the base (17, 47) and pressing a lower edge (11a, 41a) of the lens (11, 41) into the ring of sealant (18, 48) and bending an upper edge (17b, 47b) of the side wall (17a, 47a) over a portion (11b, 41b) of the lens (11, 41). The method is applied in a second embodiment to an instrument having at least two signal conductors (55) entering the base (47) at two entry points. Apparatuses manufactured with the method are also disclosed.