Abstract: An electric busbar for use with an electrical power distribution busway system which includes a press formed plug-in tab configured for attachment to a connector at a power tap-off section of the busway is described. The busbar has a substantially rectangular cross-section, a length, a width defined by a pair of edges, and a thickness defined by a top side and a bottom side. The plug-in tab is formed by pressing the conductive material in a direction generally perpendicular to the top and bottom sides until material is displaced outwardly from at least one of the edges. Depressions are formed in the bar of conductive material at the location of the press formed tab. In the most preferred embodiment, the volume of the depressions is substantially equal to the volume of the material in the tab.

Abstract: A continuous electrical connector or related part manufactured by injection molding axial segments in sequence. A novel in-line interlocking structure is provided for interlocking adjacent segments. The interlocking structure comprises holed end units nested together with their holes in alignment.

Abstract: Disclosed are a method of manufacturing a synthetic resin part integrally formed with metal members, including the steps of: integrally forming a plurality of metal member sets through coupling portions, each of the metal member sets including a plurality of coupled together metal members; inserting the metal member sets into the molding dies of a forming machine; injecting synthetic resin for molding into the molding die, and forming a synthetic resin part integrally formed with metal members in sequence to form a synthetic resin part continuum where a plurality of synthetic resin parts are connected; and cutting off the coupling portions to manufacture the plurality of synthetic resin parts, and a synthetic resin part manufactured according to the above-mentioned manufacturing method.

Abstract: A method of manufacturing thousands of contacts between electronic packages and their next package level by use of small wires retained within a interposer structure or soldered directly into a printed circuit board or onto the module. Each wire can be either a signal or power connection. The wires may have multiple cross-sectional shapes compared to one another and are preformed before assemble into an array retainer. The retainers contain the multiplicity of wires and are used for additional process steps and as the final housing of the connector assembly.

Abstract: Cutout portions are respectively formed at the lower edges of a pair of terminal plates, one being deeper than the other. At predetermined positions of holding grooves of a lower mold, protruding portions for positioning are formed, by which the terminal plates are positioned when the protruding portions are respectively engaged with the cutout portions. With this construction, terminal plates can be accurately fitted into a holding groove of the mold so that an O-ring can be smoothly attached to the molding.

Abstract: A conductive metal wiring pattern 1 is printed and wired on a flexible insulation film 2, and has connection terminals 1a whose surfaces are treated into a solderable state by plating or the like. An overriding flexible insulation film 3 is formed such that it covers a portion excluding the connection terminals 1a. The connection terminals 1a are easily formed by printing, bonding and cutting out portions of the insulation film 2 between the connection terminals by a press to separate the connection terminal.

Abstract: An electrical connector which provides compensation for crosstalk includes a number of conductors positioned at least partially within an internal cavity defined by a housing. The elongate conductors are generally substantially parallel and laterally spaced and include a resilient contact portion at a first end and an insulation displacement contact portion at a second end. The elongate conductors include a pair conductors, at least a portion of which are positioned in an overlapping, vertically spaced relationship. The portions of the pair of conductors which overlap are generally wider than the substantially parallel, laterally spaced portions of the conductors so as to thereby define respective compensating segments. The length of the compensating segments as well as the width of the portion of the compensating segments which overlap can be selected to establish capacitive coupling between the compensating segments so as to thereby compensate for crosstalk between the conductors.

Abstract: A wire pressing method and apparatus for a pressure terminal using a pressing punch to connect a wire to pressing blades of the pressure terminal. The pressing punch has a pressing section for press-fitting the wire and is vertically movable. A pair of walls extending in a pressing direction are arranged on both sides of the pressing section, and the pressing blades of the pressure terminal are located between the walls at the time of a pressing operation. In this manner the wire is press-fitted into the pressing blades by the pressing section while both the walls are prevented by the pressing blades from expanding outwardly. The wire pressing method and apparatus can also be used to connect a wire to pressing blades of the pressure terminal when the terminal is received in a connector housing. This is done by retaining the side walls of the terminal receiving chamber such that the side walls will not expand outwardly during the pressing operation.

Abstract: Apparatus is disclosed for interfacing a semiconductor test circuit and a semiconductor device under test, wherein the interface is a silicon structure test probe having conductor paths which extend along cantilevered parallelogram micro beams having contact bumps on the free ends of the beams arranged in a pattern which registers with a test pad pattern on the semiconductor device under test. The parallelogram beams provide test pad contact with substantially no scrubbing action. The silicon structure provides testing over wide environmental ranges because the test probe structure reacts to environmental conditions in the same way as the silicon semiconductor device under test. A method for fabricating the silicon structure test probe is disclosed which includes fabrication in the silicon structure of semiconductor circuit drivers and receivers for the conducting paths.

Abstract: A female electrical connector element for connecting a wire lead to a male contact pin has a first end which is crimped to the wire lead and a second end in the form of a socket. The socket includes a cantilevered contact floor and a separate spring contact in opposed relation to the cantilevered contact floor. The male contact pin is inserted between the spring biased contact surface and the cantilevered contact floor to establish an electrical connection. In accordance with the method of fabricating the connector, the cantilevered contact floor is supported sequentially by a series of forming surfaces at a bight portion thereof while the contact floor is being bent through 180.degree.. The side flanges of the female component are then folded over the contact for making an enclosure for defining the socket that retains the unitary spring contact.

Abstract: A known good die array is obtained by a general semiconductor assembly technique to enable mass production of known good die by performing AC and burn-in tests upon a plurality of IC chips simultaneously. The IC chip is attached to the die pad of a lead frame by interposing an adhesive and is wire-bonded. The lead frame is electrically separated from the wire-bonded lead, and the resultant lead frame is inserted into a test jig to perform the AC and burn-in tests. Bonding wires are cut by a cutting apparatus with a diamond and/or a diamond-like blade to attach the plurality of known good die as arrays. The low-cost known good die can be produced in large quantities using ordinary IC chips and can be applied to personal computers beyond the current application field of multichip modules used in super computers.

Abstract: A method of automatically assembling wiring devices of the type having mounting straps in a continuous sequence, the disclosed wiring device being a duplex wall receptacle. A strip of the mounting strap material is fed longitudinally, being alternately moved by equal increments and stopped to place each segment of the strip progressively at a plurality of operational stations. Portions of the strip are removed to form blanks for the mounting straps which remain mutually attached at positions along each side of the strip which form end portions of the blanks and, ultimately, of the mounting straps. One or more additional strips in which ground contact blanks have been formed are fed in a direction perpendicular to that of the first strip and the ground contact blanks are staked to the mounting strap blanks and severed from their respective strips.

Abstract: A method for producing groups of contact elements for 90.degree.-angle plug connectors by the press-in technique, includes forming the contact elements with a stamping device into a contact region on a plug side having a plugging direction, a terminal region on a terminal side, the terminal region having a press-in segment extending at right angles to the plugging direction, and connecting struts joining the press-in segment to the contact region. Different cutting tools are inserted into the stamping device to produce groups with a different number of contact elements. Different connections are stamped between the contact regions and the terminal regions of certain contact elements with the cutting tools.

Abstract: An electrical connector having a metallic housing about an insulative insert is hermetically sealed. Both the seal area of the housing and the seal surface of the insulative insert are roughened and cleaned. The seal area of the housing is primed with a primer which is dried prior to assembly of the insert and the electrically conductive contacts within the housing. The assembled connector is pre-heated, and a sealant is applied to the seal area of the housing and the seal surface of the insulative insert around the electrically conductive pins. The preferred sealant is an alumina-filled or aluminum nitride-filled epoxy based resin, mixed with a catalyst and a reactive diluent and degassed in a vacuum. The sealant is applied to the connector and allowed to set-up prior to curing at an elevated temperature.

Abstract: The present invention is directed to a method for making a connector 20 having co-planar contact surfaces including the steps of: providing a housing 22 having a plurality of contact-receiving slots 30, each having stop surfaces 32 that are precisely co-planar to define a referenced datum in the housing 22; selecting a plurality of contacts 40 having cooperating stop surfaces 44 and a surface mountable connecting portion 50 bent from a first connecting portion 42 and defining a contact surface facing away from the stop surface 44, the contacts 40 being bent at an angle slightly less than 90.degree.; inserting the contacts 40 into respective slots 30; and striking the surface mountable contact portions with a tool having a precisely planar surface and applying force thereto until the respective stop surfaces 32,44 engage each other and the second connecting portions 50 are at precisely right angles to the respective first connecting portions 42 such that the surface mountable contact surfaces are co-planar.

Abstract: A switch comprises a plunger, a retainer, a pair of terminals and an electrically-conducting wiper contact having a curved or bent middle portion defining two oppositely directed legs on either side of the middle portion. The retainer cooperates with the plunger to carry the wiper contact as the plunger moves between a normal and an actuated position. The terminals have facing contact surfaces for biased engagement with the portions of the legs exposed by the plunger and retainer to form an electrical path between the terminals when the plunger is in the actuated position. The plunger and the retainer are coupled together by arms which project from either the plunger or the retainer. The wiper contact is secured between the plunger and retainer without the need for forming a central loop in the wiper contact for engagement by the plunger.

Abstract: A conductive network, which can be flexible or rigid, can have self-aligning conductors which connect with corresponding conductors of other networks. The conductive network can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The contact clusters, which can be configured to substantially any shape, are the essential components of high density connector assemblies. The methods and apparatus for making the conductive network and cluster contacts are also described.

Abstract: An incontinence electrode for controlling urinary incontinence in women is made of alternating bands of conductive and non-conductive polymers molded to form a tubular body. Electrical receptacles, formed in the molding process at the interior circumferential surface of the conductive polymer bands, accept metal contacts attached to electrical leads to make a secure and durable, mechanical and electrical connection between the conductive polymer bands and the leads. The leads are coupled to a controller and carry electrical current to and from the metal contacts which then distribute the current to the conductive polymer bands to cause a contraction of the vaginal muscles responsible for controlling urinary incontinence in women.

Abstract: An outer-lead bonding apparatus according to the present invention comprises:(1) a punching die to stamp out chips from a film carrier tape,(2) a mounter to mount TAB chips on a substrate,(3) a first cover to enclose the mounter,(4) a second cover to enclose the punching die,(5) a pressure regulator to supply higher air pressure than outer air into inside space of the first cover, and(6) a exhaust to exhaust air from inside space of the second covering means. The outer-lead bonding apparatus of this invention keeps the environment around the mounter clean with air supplied from a pressure regulator and also by exhausting the air polluted by the punching operation through the exhaust. Neither products nor outer environment is thus contaminated.

Abstract: It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure condition. The method for manufacturing comprises the steps of making holes on plastic insulating sheet, which is stuck to the metallic sheet, at a certain interval in both longitudinal and lateral directions, making predetermined patterned portions on the metallic sheet by etching, and melting a solder piece in each hole.

Abstract: A method is provided for fabricating a receptacle connector for use in an IC card assembly wherein the receptacle connector is adapted for mounting generally at an edge of a circuit substrate. A housing is provided with an upper surface and a plurality of terminal-receiving passages in a dual row configuration extend parallel to the upper surface. The circuit substrate is adapted to be located a given vertical distance from the upper surface of the housing. A plurality of receptacle terminals are inserted into the passages with surface mount tail portions of the terminals projecting outside the passages. The vertical distance between the circuit substrate and the top of the housing is determined. The tail portions of the two rows of terminals initially project in a generally straight planar array from a rear face of the housing.

Abstract: An electrical connector of the zipper type comprises first and second connector members with respective rows of contact elements and insulating elements which are brought into intermeshing relation when the connector members are closed together. The contact elements are located in a mold as stamped and formed contact strips and in-molded with a carrier of resilient insulating material, which also covers one side of each contact element in insulating relation, to provide an elongate connector member which can be handled as only a single piece.

Abstract: A box contact is disclosed which is coated on the interior surface thereof proximate to the lower open end as well as on the upper ends of the mounting legs with a solder-resistant tape to prevent solder from wicking into and blocking the lower open end of the contact portion. The method of producing such anti-wicking box contacts is also described.

Abstract: A lead frame capable of easily connecting an inner lead to an electrode of a semiconductor element by way of a bump of the inner lead, and a method of manufacturing the lead frame capable of significantly easily forming the bump. A bump forming metal layer is formed on a metal base sheet on an area where each inner lead is to be formed. The inner lead is formed on the bump forming metal layer, and the bump forming metal layer is etched using the inner lead as a mask, thus forming a bump. After that, each outer lead is formed by selective etching of the metal base sheet from the rear surface side.

Abstract: An intraoperative ultrasonic transducer probe is described comprising a handle section and a transducer section which resemble a tiny leg and foot. The two sections are obtusely angled relative to each other so that the physician may continue to clearly view the surgical site while holding and manipulating the probe. The extension of the transducer section away from its point of attachment to the handle section results in the toe of the foot being insertable under unincised tissue, enabling the surgeon to ultrasonically examine organs and tissue peripheral to the surgical site and to follow a vessel even beyond the incision. The transducer section is completely encapsulated in a rubberlike material which electrically insulates the transducer from the patient, enables the probe to be easily sterilized, and further provides an inherent standoff between the transducer and the contact surface of the probe.

Abstract: A contact assembly formed from an array of insulated resilient solid wires arranged in spaced apart side-by-side relation to each other and retained in assembly by an ultrasonically assembled two-part carrier strip which extends transversely of the wire array. Notches formed in the wires by grinding define exposed conductive surfaces at selected locations. The conductive surfaces are plated with precious metal to define contact surfaces on the wires which are formed to contact configurations.

Abstract: An interconnect sheet for connecting multiple layers of a circuit board for the manufacture of high interconnect density PWBs. The interconnect sheet preferably comprises an area array grid of 0.003 inch solder columns having a 0.006 inch pitch. The interconnect sheet is preferably used to attach two or more multi-layer boards by placing one sheet at every interconnect surface. This interconnect mechanism has an advantage of redundancy of contact and therefore lower susceptibility to failure than other methods. The interconnect sheet of the present invention also offers a large tolerance for registration error without shorting adjacent pads. The preferred method of fabrication of the interconnect sheet begins with creating equally spaced holes through a 0.5 ounce double sided laminate comprising a dielectric sheet and copper plates on either side of the dielectric. These holes are filled with solder paste and the sheet undergoes a baking process to shrink the paste.

Abstract: A modular telecommunication jack adapter has a front part formed by at least one standard modular telephone jack and a rear part defined by a standard modular telephone plug. The front and rear parts are connected by a coupling member which defines a rearward extension of the modular jack. A plurality of resilient unitary spring wire conductors disposed within the adapter extend between the front part and the rear part and have forward end portions which define an in-line array of moveable contacts supported in cantilever position and parallel relation within the jack. The rear end portions of the resilient wire conductors are softened by annealing to receive an in-line array of spade contacts which terminate the conductors at the rear end of the plug. One or more of the conductors may be formed with a crossover formed within the connecting member.

Abstract: A press-in connection type contact, comprising a first press-in connection terminal, a second press-in connection terminal and a third press-in connection terminal, can be made by a process comprising the steps of splitting the first, second and third press-in connection terminals from one another by shear-cutting a plate member; bending the third press-in connection terminal in a first direction along an intermediate line between the first and second terminals; forming press contacting surfaces on corner portions of the first, second and third press-in terminals by swaging; and bending the third press-in terminals in a second opposite direction along the intermediate line between the first and second press-in terminals so that the press contacting surfaces are placed in an opposing relation.

Abstract: A sliding contact producing method is provided wherein noble metal balls are easily positioned on a metal plate; the weld strength between the noble metal ball and the metal plate can be obtained sufficiently; and a noble metal mounting jig can be prevented from damage when the metal plate is beam-welded with the noble metal ball. While being received in the recess portions of a jig, the noble metal balls are respectively contacted with bowllike recesses formed in the base surface of the metal plate. YAG laser beam is irradiated on the metal plate to weld the metal plate with the noble metal ball. Then the metal plate is sheared in a determined shape to form resilient strips. The present invention can improve welding operation efficiency and the reliability of welded portions. Since the metal plate being wider than that of the resilient strip receives beam, the metal contact mounting jig can be prevented from damage due to beam welding.

Abstract: Endocardial mapping and/or ablation system for introduction into a chamber of the heart formed by a wall by passage through a lumen leading to the chamber in the heart having blood therein comprising a catheter probe with proximal and distal extremities and having an elongate tubular member with at least one lumen extending therethrough extending the length thereof and with a distal extremity. A plurality of longitudinally and radially spaced apart electrodes are provided. An expandable device is secured to the distal extremity of the flexible elongate tubular member and is movable between a contracted position and an expanded position. The electrodes are mounted on the expandable device whereby when the expandable device is moved to the expanded position in a chamber of the heart the electrodes are moved into engagement with the wall forming the chamber of the heart in which the expandable device is disposed.

Abstract: To facilitate the registered connection between a ball grid array package and an associated multi-tiered circuit board, a spaced series of vias are formed transversely through the board substrate between its opposite first and second sides. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped leads of the BGA package, and are positioned on the same centerline pattern as the leads. After the vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs.

Abstract: Solder bumps are electrodeposited onto a substrate with carefully controlled heights by forming patterned conductors on an substrate, depositing and patterning a layer of material, such as titanium that is easily oxidized, and electrodepositing the solder bumps. The solder does not deposit on the titanium. Solder bumps of uniform height are obtained because the titanium layer acts as part of the electrical circuit during electrodeposition.

Abstract: A method of manufacturing a guide plate for use in a chip carrier socket or other electrical connector provides the precision required for close-center line spacing while minimizing the cost associated with production. A block of ceramic or the like is ground to the precise outside dimensions required. Grooves are then cut in the block of ceramic, and the ceramic is then sliced into respective guide plates. The guide plates are inserted into openings provided in the electrical connector an retained therein. The grooves are dimensioned to cooperate with contact pins of the electrical connector to precisely maintain the pins in position, whereby when a chip is positioned in the electrical connector, the pins will be in position to make an electrical connection with the pads of the chip.

Abstract: An incontinence electrode for controlling urinary incontinence in women is made of alternating bands of conductive and non-conductive polymers molded to form a tubular body. Electrical receptacles, formed in the molding process at the interior circumferential surface of the conductive polymer bands, accept metal contacts attached to electrical leads to make a secure and durable, mechanical and electrical connection between the conductive polymer bands and the leads. The leads are coupled to a controller and carry electrical current to and from the metal contacts which then distribute the current to the conductive polymer bands to cause a contraction of the vaginal muscles responsive for controlling urinary incontinence in women.

Abstract: A protector module (50) includes a housing (52) having cavities (58) into which are inserted surge protector elements (150). Each protector element upon full insertion engages a deflectable contact portion (82) of a first contact member (80) with an active electrode (156) thereof with the first contact member terminated at a second contact section (88) to a line between a central office and the customer, for providing surge protection to that circuit.

Abstract: The present invention relates to a method of making a header or housing for connection to a semi-conductor device including the step of trimming a single terminal frame molded into the header while the header or housing is in the molding cavity. To accomplish this, the present invention utilizes a single terminal frame including a plurality of substantially parallel electrical connection fingers held together at one end by a tie-bar. The terminal frame has a "V-notch" in each of the electrical connection fingers at a location adjacent the tie-bar. The terminal frame is placed in a mold having an upper and lower mold shell each having cavities formed therein which together define the header or housing to be molded. The upper and lower mold shells come together and grasp the terminal frame at a position adjacent the notch and so that the tie-bar extends outwardly from the upper and lower mold shells.

Abstract: The present invention provides a method of fabricating terminal connected leads by use of various devices such as; a terminal transmitter containing force-fitting terminals at a predetermined pitch from each other and linked by way of respective connecting sections thereof, an intermittent terminal sending mechanism to activate the terminal transmitter for transmitting the force-fitting terminals one by one, and a pressing machine provided with a force-fitting punch and a crimper for firmly connecting the leads to the terminals.

Abstract: An apparatus for separating and orienting conductors from a bundled array into a planar array includes a grooved template and several elements that cooperate together and with a laminate material to fixedly unite the conductors when disposed in the grooves.

Abstract: A method for producing a molded plastic and copper flat rotary switch or commutator with parts of the segments lying in a cylindrical surface is disclosed. A cup-shaped unfinished piece is formed by modification of a flat material, having an outside annular flange and a number of axial grooves which are radially open on the inside as well as distributed uniformly around the periphery corresponding to the number of segments in the cylindrical part of the unfinished piece, on the outside of the cylindrical wall of the unfinished piece, a layer with a thickness which corresponds to the radial thickness of the material parts occluding the grooves radially on the outside is pushed, beginning at the flat part corresponding to the subsequent brush contact surface, toward the free end of the casing with formation of the annular flange and opening of the grooves.

Abstract: A carrier, or transfer frame, includes a pair of support portions located on opposite sides of an opening defined by the frame to receive portions of individual conductors of a cable, with the conductors extending across the opening and held in desired positions relative to each other during transportation prior to installation in an electrical circuit. Each conductor is connected electrically to a respective test contact pad of electrically conductive material located on one of the support portions. The transfer frame is placed and held in a desired position adjacent a circuit while the conductors are soldered, with access to the individual conductors, including shield conductors, being gained through the opening defined by the transfer frame.

Abstract: An EMI/RFI gasket provides a barrier to EMI and RFI radiation transmission to and from electronic circuits within an electronic system chassis having receptacles that receive electrical connectors and an electrically grounded cover plate that connects the chassis to an electrical ground. The EMI/RFI gasket helps to provide a 360.degree. EMI/RFI barrier for the electronic system chassis. The EMI/RFI gasket is a flexible, electrically-conductive material with sufficient surface area to adhere and electrically connect to the cover plate. The EMI/RFI gasket has a receiving slot that is symmetrical about a longitudinal axis and a latitudinal axis of the gasket plate. A plurality of deflected teeth formed from the gasket plate are positioned around the receiving slot and deflected from the gasket plate to contact the connector at points separated by not greater than a predetermined distance. The predetermined distance is at least in part a function of the expected EMI and RFI radiation wavelengths.

Abstract: A solderable lead structure adapted for joining or soldering to a substrate carrying electrical components, comprising a double comb-like configuration made of conductive material, having two rows of contact strips or leads that are connected to opposite edges of a common carrier strip. At the free or distal ends of the leads, individual clips are formed for resiliently engaging both sides of a substrate. The leads extend from the carrier strip from opposite edges and are then folded to result in a linear, intermeshed arrangement.

Abstract: A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold the substrate against the leads, as during soldering. The retaining means may be disengaged from the substrate separately or simultaneously with the trimming of the leads from the lead arrangement after connecting to the substrate.

Abstract: A multi-terminal filtered electrical connector assembly includes a housing having a plurality of terminal-receiving passageways. A plurality of terminals are received in the passageways, with tail portions of the terminals projecting from the housing. A terminal alignment plate, independent of the housing, includes a plurality of through holes for receiving and aligning the tail portions of the terminals. First complementary interengaging latch devices are provided between the housing and the alignment plate for readily assembling the alignment plate on the housing. A ferrite block is mountable on the alignment plate and includes a plurality of through holes alignable with the holes in the alignment plate for receiving therethrough the tail portions of the terminals. Second complementary interengaging latch devices are provided between the alignment plate and the ferrite block for readily assembling the ferrite block on the alignment plate.

Abstract: The apparatus enables grasping a predetermined number of objects infed in a row and placing the grasped objects into a row arrangement containing a predetermined spacing from one another. There are provided tools containing displaceable object carriers and non-displaceable object carriers. The objects which are present in a predetermined pattern spacing are received by one of the tools and transferred to the object carriers of another one of the tools. By shifting the object carriers the objects are placed in a desired pattern having a predetermined pattern spacing, then transferred to the one tool and further processed by such one tool. The apparatus is particularly suitable, for instance, for the mounting of contact elements in insulating bodies of plug and socket connectors.

Abstract: An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material.

Abstract: A laminate comprising metal layers separated by an etchant barrier to control depth of etching of the laminate, the barrier being etchable by an etchant which is not an etchant for the layers. A cable incorporating such a laminate and having relatively flexible conductors integral with relatively rigid terminals. A method of making such a cable, using the laminate, by selectively etching the layers down to the barrier to form the conductors and terminals, stripping the barrier and laminating the conductor with an insulating material preferably extending over at least a portion of the terminals to reinforce the conductor terminal transition and a cable when made of such a method.

Abstract: An apparatus (25) and method for loading elliptically cross-sectioned canted contact springs (11) on to respective rows of U-shaped tabs (18) lanced out of a continuous strip (17) of relatively-thin flexible material.

Abstract: A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.