Abstract: The present disclosure is directed to an apparatus and methods of manufacturing woven, electrical connectors that have a first and second set of strands defining their weave, thereby forming a locally compliant connector capable of accommodating asperities. Strands of the first set, that provide the electrical contact points of the connector, are deformed to define passageways there through. Loading strands of the second set are then extended from a driving mechanism and through the passageways to form the weave of the connector. The strands of the first set are connected to a termination of the connector and the strands of the second set are loaded by being connected to an elastic element, thereby providing compliance to the weave.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact and methods of making the same are provided that avoid pinching the die's contacts. Semiconductor fabrication techniques are used to construct a dense array of contacts by forming a plurality of interconnected silicon electric contacts on a substrate having a first side and a second side, each silicon electric contact having a portion connected to the first side of the substrate and a portion extending from the first side of the substrate, applying an alignment-preserving material to the second side of the substrate having the plurality of interconnected silicon electric contacts formed on the side thereof, and disconnecting the plurality of interconnected silicon electric contacts from having electrical connection therebetween.

Abstract: A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

Abstract: A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.

Abstract: A machine for terminating wire assemblies comprising: a means for holding a wire assembly; a linear movement means for moving said means for holding between a first area and a second area; an insertion head; and, a means for dislodging; wherein, after a wire assembly is loaded into the means for holding a wire assembly, the means for holding a wire assembly is moved by the linear moving means from the first area to the second area for assembly termination by the insertion head; and, following termination, the assembly is at least partially unseated from the means for holding a wire assembly by the means for dislodging.

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

Abstract: In the re-wiring formation process of a WLCSP, at least some of the re-wiring lines 3 that connect the bonding pads 1 and bump pads 2 of the semiconductor chips are formed using a photolithographic process that does not use a photomask. In this re-wiring formation process, standard portions are formed by development following photomask exposure, and portions that are to be designed corresponding to customer specifications are subjected to additional development following additional maskless exposure in the final stage.

Abstract: In a wire press-contact method, press-contact terminals 100 are set in terminal fitting groove portions 4 provided in a receiving jig 1, each of which permits the entire longitudinal length of the press-contact terminal 100 to be fitted thereinto, in a fitted state. After set therein, a wire 103 is placed correspondingly to a position located above a press-contact blade 102 of each of the press-contact terminals 100. Thereafter, the wire 103 is press-fitted into a corresponding one of the press-contact blades 102 by driving a press-contact head 7, which is enabled to be ascendably and descendably driven, in such a way as to ascend and descend.

Abstract: A method provides an improved adaptor. The method involves connecting a set of conductors to (i) a set of circuit board connector contacts of a circuit board connector and (ii) a set of switchbox connector contacts of a switchbox connector. The method further involves fastening a circuit board connector housing of the circuit board connector to a switchbox connector housing of the switchbox connector, and shrink wrapping a coating over the set of conductors to physically insulate the set of conductors using the coating and the housings of the circuit board connector and the switchbox connector.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact and methods of making the same are provided that would avoid pinching the die's contacts. Semiconductor fabrication techniques are used to construct a dense array of contacts by forming a plurality of interconnected silicon electric contacts on a substrate having a first side and a second side, each silicon electric contact having a potion connected to the first side of said substrate and a portion extending from the first side of said substrate, applying an alignment-preserving material to the second side of the substrate—having said plurality of interconnected silicon electric contacts formed on the first side thereof, and disconnecting said plurality of interconnected silicon electric contacts from having electrical connection therebetween.

Abstract: Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A mixed wire conveying step is provided to supply a plurality of terminal-connected wires having different specifications to the same production line. A wire holding step is provided to hold a terminal of the supplied terminal-connected wire such that the terminal can be inserted at least by means of a terminal chuck. An inserter selecting step is provided to select a suitable one from a plurality of terminal inserters for inserting the terminal in an inserting step in accordance with the kind of the supplied terminal-connected wire. The inserting step is performed by the cooperation of the terminal inserter selected in the inserter selecting step and a terminal chuck. A wide range of inserting operations for inserting many kinds of terminal-connected wires TW can be performed by a single unit.

Abstract: A method of forming a bump on a substrate such as a semiconductor wafer or flip chip. The method includes the act of providing a semiconductor device having a contact pad and having an upper passivation layer and an opening formed in the upper passivation layer exposing a portion of the contact pad. An under bump metallurgy is deposited over the upper passivation layer and the contact pad. An electrically conductive redistribution trace is deposited over the under bump metallurgy. A photoresist layer is deposited, patterned and developed to provide portions selectively protecting the electrically conductive redistribution trace and the under bump metallurgy. Excess portions of the electrically conductive redistribution trace and under bump metallurgy not protected by the photoresist are removed.

Abstract: A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts and allows for smaller socket holes and therefore denser arrays of contacts. In one embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts and the contacts are singulated while maintaining their alignment within the array. A metal layer may be added to the tips of the contacts for better conductivity.

Abstract: Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp members to a closed position and thereafter rotating the clamp members relative to one another in at least one complete relative revolution in a direction which is anti-helical relative to the coiled strands to form the bulge. The wire is gripped and rotated in the anti-helical direction for a relative rotational interval of greater than one-half, and preferably three-fourths, of a complete relative revolution. Thereafter, during the remaining rotational interval of each relative revolution, the clamp members are opened to permit the wire to be advanced to the next position where a bulge is to be formed.

Abstract: An anisotropically conductive sheet can retain required conductivity over a long time even when used repeatedly, or used under a high -temperature environment. The sheet contains conductive particles exhibiting magnetism in a state oriented in a thickness-wise direction in an elastic polymeric substance having a durometer hardness of 20 to 90. The particles are coated with a lubricant or parting agent. In addition, the sheet has a long service life owing to its high durability and thermal durability.

Abstract: A packaged semiconductor circuit for use in processing digital and RF signals. The packaged semiconductor circuit includes a package structure having a first side that includes a metallization layer. The metallization layer has a first part at about a center of the first side and a second part that surrounds the center. The circuit further includes a semiconductor die that is attached to the package structure at about the first part of the metallization layer. The semiconductor die has an interconnection side including an array of bumps that are configured to make electrical connection to selected ones of a first plurality of metallization traces that are defined in the first part of the metallization layer of the package structure. The circuit also includes a spiral inductor trace that is formed from the metallization layer of the package structure and is defined in the first part of the metallization layer.

Abstract: The present invention provides a process for forming a contact member cable. The cable is a longer version of a contact member and can then be cut into shorter, individual contact members, to meet the particular requirements for a specific connector application. The contact members can be used as the conductive elements for a family of land grid array connectors that provide, among other things, a low profile, uniform electrical and mechanical performance, and reworkability if a contact member is damaged. The connectors are intended to interconnect electrical circuit members such as printed circuit boards, circuit modules, or the like. Such circuit members may be used in information handling system (computer) or telecommunications environments.

Abstract: A stacked semiconductor package including a plurality of stacked semiconductor devices on a substrate, and a method of forming the same. The semiconductor devices are stacked in an active surface-to-backside configuration. The top semiconductor die is flipped over to face the active surface of the semiconductor die directly below. An electrical connector can extend from a bond pad on the top semiconductor die to a redistribution circuit on the semiconductor die below. The redistribution circuit can be electrically connected to a substrate. Alternatively, an electrical connector extends from a bond pad on the top semiconductor die to a bond pad on a substrate.

Abstract: Organic thermistor devices are produced by a first step of molding an organic thermistor material by covering a plurality of electrically conductive members to form a conductor-containing member, which is elongated in a longitudinal direction, has a pair of mutually oppositely facing side surfaces, having the conductive plates buried parallel to one another inside the organic thermistor material, each mutually adjacent pair of these conductive members being externally exposed on different ones of the side surfaces, a second step of forming a pair of electrodes elongated in the longitudinal direction on the side surfaces of the conductor-containing member, and a third step of thereafter cutting this conductor-containing member transversely at specified positions so as to divide into individual units.

Abstract: A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

Abstract: A method of producing high-frequency modules at a higher efficiency is provided comprising: an electronic components mounting step 62 of fabricating on a master substrate 21 rows of sub substrates 22, each the sub substrate 22 having an identical pattern of circuit developed thereon, and mounting electronic components on the sub substrate 22; a step 64 of, after the step 62, providing slits for electrically isolating signal terminals formed integrally; a laser trimming step 66 of, after the step 64, engaging pins 39 of an inspection tooling in direct contact with the signal terminals to conduct an inspection; and a separating step 72 of, after the step 66, separating the sub substrates 22 from the master substrate 21. Accordingly, the productivity for the high-frequency modules will be improved.

Abstract: A method for manufacturing an electrical connector for a flat cable, wherein the connector has at least one terminal (2) inserted into a receiving slot (3) of a box-shaped housing (1) from a side of the housing and having upper and lower arms (4 and 5), comprises the step of inserting the terminal into the receiving slot in a manner that the upper arm and lower arms are guided by inner surfaces of upper and lower walls of the housing, respectively, while the lower arm is deflected toward the upper arm and then deflected back to its original shape at a time of insertion to a predetermined position.

Abstract: A collar is provided that has a sleeve having a tapered axial bore that defines a tapered surface interiorly of the sleeve. The tapered axial bore is adapted to receive a receptacle such that the tapered surface bears against the receptacle. Moreover, the collar has a resilient device that engages the sleeve. The resilient device, the tapered axial bore of the sleeve, and the receptacle receive a connector. Axial displacement of the connector relative to the sleeve and the receptacle compresses the resilient device such that the resilient device exerts an increasing axial force on the sleeve. The increasing axial force displaces the sleeve axially relative to the receptacle causing the tapered surface to exert a radial force on the receptacle.

Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract: A joint connector includes a metal fittings assembly 110 and a housing 120 for fitting the assembly 110. The assembly 110 consists of two terminals 110A, 110B each having a band-shaped carrier 140 and a plurality of terminal units 130 connected to the carrier 140 through a joint portion 137. In the assembly 110, the terminals 110A, 110B are laid to overlap each other while the terminals 110A, 110B are shifted from each other in a predetermined length in the longitudinal direction of the carriers 140 and the carriers 140 are welded to each other. By bending the joint portions 137 of the upper terminal 110A by a plate thickness of the carrier 140 of the terminal 110B, it is possible to position the adjoining terminal units 130 of the terminals 110A, 110B in an identical plane.

Abstract: In a method of forming a connector press-connecting terminal 10 including a pair of opposed press-connecting blades 22R and 22L (24R and 24L) formed respectively on opposite right and left side wall plates 20R and 20L thereof formed by a metal sheet, the press-connecting blades being adapted to be electrically press-connected to a connection end portion of a cable L in a gripping manner. In this method, cuts 30 are formed respectively in press-connecting blade-forming portions of the flat metal sheet beforehand plated with an electrically-conductive material, and subsequently a plurality of drawing operations are applied to the press-connecting blade-forming portion at each of the cut portions 30 sequentially from the proximal end portion of the press-connecting blade 22R, 22L (24R, 24L) to the distal end portion thereof, thereby forming the press-connecting blade of a bent shape.

Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.

Abstract: A method for manufacturing a nonreciprocal circuit device, wherein when the nonreciprocal circuit device, such as an isolator, is manufactured having central conductors disposed adjacent to a magnetic body, to which a DC magnetic field is applied, and a case receiving the central conductors and the magnetic body therein, the central conductors are integral with a hoop and are formed by punching the hoop made of a metal film, the hoop is wound around a reel while the central conductors are transported, and when the nonreciprocal circuit devices are manufactured, the central conductors are fed into a manufacturing step after being separated from the hoop.

Abstract: A conductive damper for use in a speaker is provided, the endurance and the moldability of which are improved. A base is moved downward to allow an inner top mold to abut on a bottom mold, then the base is further moved downward to allow the inner top mold and the bottom mold to be applied pressure and the base moves down with being guided by guiding means. At this time, energizing means energizes the inner top mold to press the bottom mold, thereby corrugations for the inner part of a workpiece of the conductive damper are molded. At this time, the workpiece of the conductive damper is pulled toward the inner side thereof. Then, the base is further moved downward to press an outer top mold onto the bottom mold, thereby corrugations for the outer part of the workpiece of the conductive damper are molded.

Abstract: A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

Abstract: A method for forming a contact insert subassembly (34) for a modular jack connector (200), includes the following steps: stamping a contact strip (10) to form a group of contacts (20) which are interconnected by an end carrier (11) and a middle carrier (13), the middle carrier dividing the contacts into first and second portions (21, 22); bending the first portion into a soldering tail portion for the contacts; subjecting the contact strip to an insert molding to form an insulative block (30) around the middle carrier (13); cutting the end carrier and the middle carrier from the contacts; and bending the second portion to form a contacting portion for the contacts.

Abstract: A shifting device for manufacturing continuous terminals includes a body and a shaft. The body is formed with a hole and an inlet and an outlet both communicating with the hole. A direction into the inlet and a direction out of the outlet are the same. The inlet is shifted a predetermined distance away from the outlet. The shaft is fitted with the hole of the body and defines a spiral channel with the body after fitting with the hole of the body. The spiral channel corresponds to the inlet and the outlet of the body. According to the structure, the continuous terminals enter the body from the inlet and travel along the spiral channel. Then, the continuous terminals travel out of the body from the outlet with a predetermined distance shifted away from the inputted terminals. Thus, the processes for manufacturing terminals without waste material can be simplified.

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract: A process for fabricating coils using a Damascene process uses a curved substrate having a surface extending along and about an axis made of a first material. A groove is formed in the curved surface along and around said axis, and the groove is filled with a second material that is different from the first material to form a coil of second material in said first material. Excess second material is then removed from the surface of the first material, leaving the coil of second material in the groove.

Abstract: A load center is upgraded by removing the existing load center and replacing it with a renovation load center. As the existing incoming and branch circuit wiring may not be sufficiently long enough to reach the proper terminations in the replacement load center, renovation terminal blocks are provided in the renovation load center adjacent the penetrations of the external wiring to which the incoming lines, and if necessary, the branch circuit wiring are connected. Cabling is then provided between the terminations on the renovation terminal blocks and the appropriate load center terminations. The renovation terminal block(s) can be housed in an auxiliary enclosure mounted adjacent to a main enclosure containing the load center interior or all of the components can be housed in a single renovation enclosure.

Abstract: A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors and green sheets of a magnetic or nonmagnetic material. Terminal electrodes are formed respectively on both ends of the multilayer body along the direction of the magnetic flux generated when current is caused to flow through the coil conductors in the multilayer body. The terminal electrodes each has a conductive substrate formed within the area of the end of the multilayer body and including a lamination body as a component of the multilayer body.

Abstract: An arrangement apparatus comprises a base (10) and an elongated arranging member (12) mounted thereon, wherein the arranging member includes a plurality of channels (123) and a plurality of reference wires (1253) with predetermined colors. The reference wires are arranged in a sequence that corresponds to the arrangement of pins of a connector to be connected with the multi-core round cable. Each reference wire is disposed in alignment with a corresponding channel. The color of each reference wire is the same as the color of a core (21) of the multi-core round cable to be placed in the channel corresponding to that reference wire. An operator can freely pick up any one core and place it in the correct channel simply by matching the color of the reference wire with the color of the selected wire.

Abstract: A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.

Abstract: A circular wire with a circular cross section is wound on a coil reel. When a winding-form motor rotates a winding form, the circular wire is pulled and drawn from the coil reel. Rectangular forming rollers press the circular wire, so that a rectangular wire with a rectangular cross section is formed. The rectangular wire is directly wound on the winding form to be formed into a rectangular-wire coil. Because forming rectangular wire and winding on the winding form are carried out in a sequence of contiguous processes, a separate process for removing torsion set of the rectangular wire is unnecessary. The rectangular-wire coil can be formed from inexpensive circular material wire by a simple and low-cost apparatus. It is also possible and preferable to make dimensions and a shape of the rectangular wire variable by controlling clearance widths between the forming rollers and tension acting on the rectangular wire that has passed through the rollers.

Abstract: A method for producing contact jacks for electric plug-in connectors.

Abstract: An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.

Abstract: A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.

Abstract: A method for assigning power and ground pins in array packages in order to enhance next level routing is provided. In one embodiment, the method comprises arranging connections of a semiconductor array package, the semiconductor package having an integrated circuit with power, ground, and signal connections, in 2×3 connection grids. Each connection grid includes a power connection and a ground connection which is adjacent to the power connection. The 2×3 connection grids are arranged so that each connection at the periphery is a signal connection. A 4:1:1 signal:power:ground connection ratio is maintained in the arrangement, wherein no more than four signal connections are present for each power connection, and no more than four signal connections are present for each ground connection.