Forming Array Of Contacts Or Terminals Patents (Class 29/884)
  • Patent number: 6511463
    Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: January 28, 2003
    Assignee: JDS Uniphase Corporation
    Inventors: Robert L. Wood, Henry A. Wynands, Karen W. Markus
  • Patent number: 6505402
    Abstract: A method of making a pin header having pin contacts (12)(12A,12B) insert-molded in a parallelepiped insulating housing (13), and penetrating it to form upper and lower rows. Each contact is integrally composed of a plugging rod (14) extending horizontally and forwardly of the housing, a leg (15)(15A,15B) and a generally straight rearward extension (16). The rod (14) has a rear end exposed rearward from the housing and bent downward and rectangularly to provide the leg. Each leg has its lower end continuing to the extension (16) to be surface-mounted on a printed circuit board. Only the legs (15A) from upper row have each an intermediate step (19) between it and the extension, this step formed by rectangularly bending each leg outwardly at first and then downwardly. These legs (15A) are embedded in the housing (13), with those steps (19) being exposed together with extensions (16).
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: January 14, 2003
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Ryo Moriwake, Hideaki Horiuchi
  • Publication number: 20020184759
    Abstract: A process for producing a contact-making device is provided for making electrical contact between components, which includes the step of producing an electrical zero-insertion-force connector which further includes the step of forming an elastic dielectric with at least two elastic dielectric layers and at least one structured metal layer disposed between the two elastic dielectric layers. The elastic dielectric has an upper side and an underside being the upper side and the underside, respectively, of the zero-insertion-force connector. The process also includes the step of structuring the elastic dielectric, forming a number of contact points on the upper side and the underside of the zero-insertion-force connector; and forming a number of electrically conducting connections in and through the elastic dielectric such that the electrically conducting connections connect a number of the contact points to one another.
    Type: Application
    Filed: August 6, 2002
    Publication date: December 12, 2002
    Applicant: Siemens Aktiengesellschaft
    Inventor: Anton Wimmer
  • Patent number: 6487772
    Abstract: A process for combining micro-coaxial cables and pins by riveting, it comprises the steps of: (1) a micro-coaxial cable is cut and stripped at the desired areas thereof to form a pin riveting segment and a grounding plate connecting segment after a desired length of the cable is obtained by cutting; (2) the pin riveting segment on the cut and stripped micro-coaxial cable is sent to a riveting apparatus to proceed to combination of the cable and the pin; (3) a plurality of such cables and pins having been riveted are placed in a plastic housing to form a bus; (4) the grounding plate connecting segments on the cables and pins are welded to a grounding plate; and (5) the bus is tidied to be neat. Thereby, the micro-coaxial cables can be combined with the pins in a way of mass production, the combined structure of them is firmer.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: December 3, 2002
    Inventor: Robert Chuang
  • Publication number: 20020170175
    Abstract: A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.
    Type: Application
    Filed: June 24, 2002
    Publication date: November 21, 2002
    Inventors: Robert Aigner, Florian Plotz, Sven Michaelis, Michael Brauer
  • Patent number: 6476464
    Abstract: The invention provides a lead structure having a lead of low resistance material disposed within a surrounding sleeve or collar of low expansion material which is bonded at one end to the lead. The sleeve or collar is bonded on its outer surface to an insulating wall through which the lead structure extends. The lead is preferably copper and the sleeve or collar is preferably a nickel-alloy. The lead is hermetically sealed to the surrounding sleeve, and the sleeve is hermetically sealed to the insulating wall to provide a hermetic structure which does not detract from the use of high conductivity electrical lead materials which are often not employable in conventional hermetic sealed leads or packages. A plurality of lead structures can be employed in one or more walls of a circuit package.
    Type: Grant
    Filed: February 15, 2000
    Date of Patent: November 5, 2002
    Assignee: Ixion, LLC
    Inventor: Jay Greenspan
  • Patent number: 6467165
    Abstract: A filter electrical connector having a housing and a contact and filtering circuit subassembly. The contact and filtering circuit subassembly has a ferrite block, electrical contacts passing through the ferrite block, and a lead frame and circuit element assembly. The lead frame and circuit element assembly is mounted on the ferrite block and is electrically connected to the electrical contacts.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: October 22, 2002
    Assignee: Frametome Connectors Interlock Inc.
    Inventor: Jerrold Scott Glynn
  • Publication number: 20020144399
    Abstract: This invention generally relates to the handling of integrated circuit or electronic modules which comprise interconnecting elements. The invention relates to a holder or template and method to hold such modules during processing and to test the elements and the interconnection of a grid array of elements attached to the electronic module. There is a requirement to be able to automatically align, hold and bring the columns of a column grid array module into contact with probe devices for testing of the columns and the module. To achieve this, a self-aligning module holder or template has been developed to ensure that the columns are properly aligned. The invention includes associated methods to automatically position and align the columns of the module in the holes of the template.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 10, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yori Lacroix, Robert Langlois
  • Patent number: 6453552
    Abstract: A method of manufacturing electrical terminals and/or a terminal module is disclosed. The method includes the steps of stamping from a sheet of metal material a blank for a plurality of elongated terminals having contact portions at one end and terminal portions at the other end and joining the terminals by a tie bar intermediate the ends. The contact portions of the respective terminals are separated from each other by the stamping step. The terminal portions remain joined in the sheet of metal after the stamping step. The blank then is sheared to separate the terminal portions. The tie bar is cut to separate the terminals. In order to form a terminal module, a dielectric housing is overmolded about the terminals intermediate the ends thereof, with the tie bar being located outside the housing and removed after the overmolding process.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: September 24, 2002
    Assignee: Molex Incorporated
    Inventors: Jose H. Chavez, Jr., Gary M. Comstock, Arvind Patel, Timothy E. Purkis, Yew Teck Yap
  • Patent number: 6453553
    Abstract: A process for manufacturing an anisotropic conducting film including an insulating film in which holes are formed. Conducting inserts are located in the holes. First ends of the inserts project from one side of the insulating film, from a substrate in which compartments are formed on one surface, corresponding to the distribution of inserts on the insulating film, the shape of the compartments being complementary to the shape of the first ends of the inserts. The manufacturing process includes the steps of using a substrate with compartments with a tipped finish, producing an insulating film above the substrate with holes facing the compartments, producing conducting inserts in the holes and the compartments, and separating the insulating film in which the conducting inserts are formed.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: September 24, 2002
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Patrice Caillat, Claude Massit
  • Patent number: 6453550
    Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: September 24, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 6442834
    Abstract: In the method of manufacturing substrate-use terminals in accordance with the present invention, a rectangular wire 10 is first subjected to cylindrical shaping to form a substrate-side terminal portion 22. Next, a loss portion 14, which is a connecting portion between a tip portion 22a of the substrate-side terminal portion 22 and a tip portion 21a of a connector-side terminal portion 21 and is not used as a portion of a substrate-use terminal 20 after being cut off, is subjected to cutting so as to provide primary machining for the tip portions 21a and 22a. Subsequently, the connector-side terminal portion 21 and the substrate-side terminal portion 22 are subjected to tip crushing to provide secondary machining for the tip portions 21a and 22a. Next, a retaining section 23 for engagement in a connector housing is formed, and the loss portion 14 is finally cut off to form the single-unit substrate-use terminal 20.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: September 3, 2002
    Assignee: Yazaki Corporation
    Inventor: Toshiharu Takahashi
  • Patent number: 6438831
    Abstract: A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the electrodes of the terminal plates, including arranging positioning plates in a container and inserting conductive wires into through holes of the positioning plates. Then forming a stacked body by alternately forming stacked insulating sheet layers and synthetic resin layers, in the container and thereafter cutting the stacked body at a middle portion of each synthetic resin layer before separating the synthetic resin layers from the insulating sheet layers, thereby forming interconnectors.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: August 27, 2002
    Assignee: Tokyo Electron Limited
    Inventor: Junichi Hagihara
  • Patent number: 6438829
    Abstract: Each of a pair of composite structures includes at least one tubular member that is at least partially conductive and defines an electrical port. Each tubular member is electrically connected at a first end to a respective electrical lead and has a second end opening through an edge surface of the composite structure. A method for establishing electrical contact between the electrical leads includes electrically engaging the tubular member that defines the electrical port of each composite structure with a respective electrical contact device. The electrical contact device comprises an electrical contact pad and a conductive pin connected to and extending outwardly from the electrical contact pad such that engaging the tubular member includes inserting the conductive pin into the tubular member. Then, corresponding electrical contact pads are at least partially aligned to thereby establish electrical contact between corresponding electrical leads embedded within the pair of composite structures.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: August 27, 2002
    Assignee: McDonnell Douglas Corporation
    Inventor: John Martin Haake
  • Patent number: 6438832
    Abstract: A method of producing layered metal components is described which obviates the need for layering the terminals twice. The method includes the steps of providing a strip of base material, layering the base material with layering material, and cutting individual pieces from the strip such that the layering material is wiped across the surface of the base material which would otherwise be exposed by the separation.
    Type: Grant
    Filed: February 21, 2000
    Date of Patent: August 27, 2002
    Inventor: Larry J. Costa
  • Publication number: 20020092164
    Abstract: A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.
    Type: Application
    Filed: January 12, 2001
    Publication date: July 18, 2002
    Inventors: Luc Gilbert Guerin, Mario J. Interrante, Mark Joseph LaPlante, David Clifford Long, Gregory Blair Martin, Thomas P. Moyer, Glenn A. Pomerantz, Thomas Weiss
  • Patent number: 6412169
    Abstract: In a connector equipped with a rear holder, the rear holder in an open state is coupled with a housing of the connector by a fixing belt. A rear holder mounting device is provided with a cutter and slide bar. The cutter is moved to cut the fixing belt. The slide bar is moved to close the rear holder so that the rear holder is engaged in the housing. Thus, working before mounting the rear holder in the connector can be smoothly carried out. The rear holder, without being damaged or deformed, can be easily mounted in the connector.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: July 2, 2002
    Assignee: Yazaki Corp.
    Inventors: Takayoshi Endo, Yuji Hatagishi, Kimihiro Abe
  • Publication number: 20020080588
    Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed.
    Type: Application
    Filed: December 27, 2001
    Publication date: June 27, 2002
    Applicant: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
  • Publication number: 20020067181
    Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 6, 2002
    Applicant: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
  • Patent number: 6393698
    Abstract: A coaxial connector ensures positive, stable contact and permits sufficiently reduced size and thickness. The coaxial receptacle (1) is equipped with: a synthetic resin insulating case (2) which has a hexahedron shape; an internal terminal (30) composed of a metallic fixed terminal (4) and a movable terminal (5) made of a flexible metal material, which are provided in a cavity or internal space (3) of the insulating case (2); a rubber elastic member (51) disposed under the movable terminal (5) in the cavity (3) of the insulating case (2); and an external terminal or outer conductor (40) provided to cover an essential section of the insulating case (2). The cavity (3) of the insulating case (2) is a vertical columnar space; and the upper side thereof has an annular opening to form an inlet (7) through which the central contact of a mating coaxial connector is introduced downward.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: May 28, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshitaka Kuriyama, Takekazu Okada
  • Publication number: 20020053734
    Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed.
    Type: Application
    Filed: December 27, 2001
    Publication date: May 9, 2002
    Applicant: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
  • Patent number: 6381835
    Abstract: An implantable endocardial, multi-lumen lead wherein the distal end of the lead body is cored to provide a stopped bore co-axial with the axis of the lead body. A distal electrode is inserted into the stopped bore without an additional tubular segment and glue joint. A first lumen in the lead body has an axis which is off set from the axis of the lead body itself. A low voltage conductor passes through the first lumen. A second lumen is also offset from the axis of the lead body. The lumens may have a circular or other cross section. A plurality of non-coaxial lumens may be provided.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: May 7, 2002
    Assignee: Intermedics Inc.
    Inventors: Steven Conger, Arthur G. N. McLeon, Stephen L. Goldman, Dennis L. Brayton, Alvin Coats
  • Patent number: 6381841
    Abstract: The present invention is a method and apparatus for efficiently placing a respective fuzz button into each of a high number of button holes on a fuzz button contactor while also efficiently filtering out defectively shaped fuzz buttons. The fuzz buttons are placed into rows of a predetermined number of button holes on the fuzz button contactor. A slot plate has the predetermined number of slots aligned as a row of slots, and fuzz buttons are placed into each of the slots of the slot plate. The present invention also includes a contactor jig having at least one row of the predetermined number of jig holes. These jig holes are disposed on the contactor jig as a mirror image of the at least one row of the predetermined number of button holes on the fuzz button contactor when the contactor jig is properly aligned with the fuzz button contactor.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: May 7, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Seok Hiong Tan, Siew May Fong, Chew Hsia Fung
  • Patent number: 6379161
    Abstract: A method of making an electrical connector includes the steps of: a. stamping and forming a contact strip (10) and a number of contacts (12) on the contact strip; b. defining a recess (16) in a tail (14) of each contact; c. applying a first finish of nickel material on portions of the contact having the recesses followed by a second finish of tin-lead alloy material; d. injection molding an insulative housing (20) to the contacts; e. bending the tails outwardly; f. severing the contact strip from the contacts at the recesses.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: April 30, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hao-Yun Ma
  • Patent number: 6363607
    Abstract: A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: April 2, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chao-Hsu Chen, Ming-Wu Lee, Kun-Tsan Wu
  • Publication number: 20020004344
    Abstract: The method consists in using a strip of a plastically deformable material which is capable of acquiring elastic spring properties after treatment. The central portion of the strip is coated in a layer of electrically conductive material and then the strip is punched so as to obtain springs which are interconnected at their ends by two continuous side strips. Thereafter, the springs are displaced from the plane of the strip being twisted about their respective longitudinal axes, and one edge of each spring is folded down as a hem in the direction which ensures that the layer of conductive material remains on the outside of the fold. Thereafter, the strip is subjected to hardening treatment to confer elastic properties thereto.
    Type: Application
    Filed: June 14, 2001
    Publication date: January 10, 2002
    Applicant: ALSTOM
    Inventors: Markus Keiser, Peter Wagner
  • Patent number: 6328577
    Abstract: An electric connector is provided which can be highly accurately positioned to a location to be aligned. An electric connector set comprises a pair of insulating housings 10, 10a so formed as to have a plurality of openings 14 arranged in an array and a plurality of projections 18 each extending into the associated opening, female terminals 24 made of metal and each detachably fitted over the corresponding projection 18 of one of these housings, having a solder ball 30 and soldered to an IC package p through each solder ball, male terminals 34 each having a contact section 38 provided around the projection 18 of the other housing 10a and engageable with the corresponding female terminal 24 and a lead section 36 electrically connecting its housing bottom side 22 to the contact section 38, and solder balls 40 attached to the lead section 36 at the bottom surface on the housing.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: December 11, 2001
    Assignee: Berg Technology, Inc.
    Inventor: Eddie A. Azuma
  • Publication number: 20010040460
    Abstract: A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.
    Type: Application
    Filed: November 23, 1998
    Publication date: November 15, 2001
    Inventors: BRIAN SAMUEL BEAMAN, KEITH EDWARD FOGEL, PAUL ALFRED LAURO, MAURICE H. NORCOTT, DA-YUAN SHIH, GEORGE FREDERICK WALKER
  • Patent number: 6287502
    Abstract: A connector has a connector body. A plurality of first terminal bodies are arranged within the connector body. A plurality of second terminal bodies are arranged along the first terminal bodies within the connector body at an interval between themselves and the first terminal bodies. Each of the second terminal bodies is located between the first terminal bodies and each of the first terminal bodies is located between the second terminal bodies.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: September 11, 2001
    Assignee: Yazaki Corporation
    Inventor: Katsuhiko Onoda
  • Patent number: 6282783
    Abstract: Methods of manufacturing and assembling a composite insulator are provided. At least one metal end fitting is provided having a sleeve portion which defines a bore with a first diameter, d1. An insulator subassembly is then formed. The insulator subassembly includes a rod of electrically insulating plastic material and an insulator sheath covering at least a portion of the outer surface of the rod. An end portion of the sheath has a deformable circumferential ridge formed on the outer surface thereof. This circumferential ridge has a second diameter, d2, which is greater than the first diameter, d1. The insulator subassembly is then inserted into the bore of the metal end fitting with a spacer member interposed between the metal end fitting and at least the circumferential ridge. The spacer member serves to deform the ridge to define a temporary vent for allowing air within the bore to escape.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: September 4, 2001
    Assignee: NGK Insulators, Ltd.
    Inventor: Tetsuhiko Abe
  • Patent number: 6282782
    Abstract: A method of forming a subassembly for use in a printed circuit board is described. This method includes providing a subassembly including a circuit board layer laminated to two sheets of conductive material with two intermediate sheets of prepreg material, forming a via in the assembly, plating the via, filling the via with a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. Also described is a method of forming a partially filled via in a circuit board layer and a method of forming a thermally conductive plug in a circuit board layer for the transfer of thermal energy from one surface of the circuit board to the other.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: September 4, 2001
    Assignee: Hadco Santa Clara, Inc.
    Inventors: Nicholas Biunno, Scott Bryan, Mason Hu
  • Patent number: 6276054
    Abstract: A biomedical electrode for an electrocardiograph or similar device is provided. The biomedical electrode includes a disposable electrode having an electrically conductive gel layer and a reusable leadwire adapter having the relatively expensive metallic conductive material. The disposable electrode interfaces with the reusable leadwire adapter through the adhesive characteristics of the gel layer. The reusable leadwire includes a stud member which snaps into a standard leadwire connector.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: August 21, 2001
    Assignee: NDM, Inc.
    Inventors: James Vernon Cartmell, Wayne Robert Sturtevant, Michael Lee Wolf
  • Publication number: 20010013172
    Abstract: A process for producing an electrical component having a plurality of soldered-on plug contacts projecting at a right angle, in particular a semiconductor element arranged on a ceramic board, wherein the plug contacts initially remain joined at one side by an edge strip of the sheet metal band from which they are produced, until the solder join to a substrate is made, whereupon the edge strip is removed, wherein the position of the plug contacts is established by bending the edge of the sheet metal.
    Type: Application
    Filed: December 21, 2000
    Publication date: August 16, 2001
    Inventor: Klaus - Peter Wilczek
  • Patent number: 6263567
    Abstract: A method for making a connector includes selectively removing material from metal stock to form a monolithic body comprising a bus portion and a plurality of spaced apart stubs extending outwardly therefrom, and engaging a lower open end of each metal post and a respective stub of the monolithic body together. The starting stock need not be the full height of the posts and bus portion. Accordingly, the advantages of using extruded material versus cast material may be obtained without shortcomings in terms of excess material waste and associated expense. Each stub may be frustoconically-shaped with a desired taper angle. In one embodiment, each metal post may have a bore extending therethrough defining the lower open end and also defining an open upper end for receiving at least one electrical conductor. The metal post may also have at least one threaded passageway therein and extending transversely into the bore, such as to receive a fastener for securing the electrical conductor in the bore.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: July 24, 2001
    Assignee: Homac Manufacturing Company
    Inventor: Eugene McGrane
  • Patent number: 6260268
    Abstract: A method of forming a solid compliant connector contact which permits the compliant portion to be formed rapidly and inexpensively. Cylindrical bar stock is turned to form the outer contour of the contact, including a contact portion having a diameter larger than an opening into which it will be inserted in use. The contact is made compliant by plunging a cutter having a circular blade rotating about a center of the blade into the contact portion and removing the circular blade from the contact portion to form the slot to have a generally arcuate shape corresponding to the shape of the circular blade. The contact portion is resiliently deformable upon insertion into the opening for exerting a radially outward force within the opening to hold the contact in electrical contact with the opening.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: July 17, 2001
    Assignee: Positronic Industries, Inc.
    Inventor: John T. Gentry
  • Patent number: 6253451
    Abstract: An electrical connector which includes an insulative body which has a leg portion and a top portion which extends generally perpendicularly from the leg second portion. A conductive contact which includes a retention section and a resilient section is also included in the electrical connector. The contact is fixed to the top section and the resilient section extends along the leg section. The connector may be interposed between a electrical device and a printed circuit board.
    Type: Grant
    Filed: March 10, 1999
    Date of Patent: July 3, 2001
    Assignee: Berg Technology, Inc.
    Inventors: Ralph A. E. M. Semmeling, Andrew G. Meller
  • Patent number: 6240632
    Abstract: According a method of manufacturing a lead frame of the present invention, a plurality of leads each having an inner lead portion and an outer lead portion are formed on a metal base having on its surface a nickel layer by copper plating. An insulative holding film for holding each of the leads is formed. A projecting electrode is formed on the outer lead portion. Respective leads are separated by selectively removing the metal base by etching.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: June 5, 2001
    Assignee: Sony Corporation
    Inventors: Makoto Ito, Kenji Ohsawa
  • Patent number: 6237220
    Abstract: A method for manufacturing elastic strips, pin holders, and plug-in connectors includes the step of extruding a continuous profiled plastic member having a profile matching the desired geometry of a plug-in connector and storing the continuous profiled plastic member. The continuous profiled plastic member is then provided with cutouts in areas where cutouts cannot be produced by extrusion. Subsequently, electrical contacts are mounted on the continuous profiled plastic member. This continuous profiled plastic member is then again stored. The continuous profiled plastic member is then cut to length to form a connector blank having a desired number of electrical contacts and a guide contour is then formed at the connector blank.
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: May 29, 2001
    Assignee: Stocko Metallwarenfabriken Henkels und Sohn GmbH & Co.
    Inventors: Ulrich Apel, Manfred Koch, Dieter Klatt
  • Patent number: 6219913
    Abstract: A group of upper side male terminal fittings 2A and lower side male terminal fittings 2B are secured to the upper and lower surfaces of a mount plate 8 formed as a separate piece by pressing projections 12 into mount holes 16, thereby forming a core member 7. A housing 1 is formed by insert molding using this core member 7 as a core material. Since insert molding can be performed with the outer surfaces of the male terminal fittings 2A, 2B opposite from those secured to the mount plate 8 exposed, only the thickness of the housing 1 is added at the outer surfaces of the male terminal fittings 2A, 2B. Thus, there can be obtained a connector having a small thickness T around the male terminal fittings 2A, 2B.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: April 24, 2001
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Takahiro Uchiyama
  • Patent number: 6217393
    Abstract: A connector has multiple layers of rows of tabs provided on one side of a housing, and contact members extending from each tab aligned in a single plane on the other side. Carriers 17A and 17B of upper and lower bus bars 12 and 13 are positioned one above the other, position fixing holes 20 thereof being aligned. Rows of tabs 15A and 15B provided above and below on one side and are separated by a prescribed distance. Contact members 18A and 18B are aligned at the other side in a plane, the contact members 18A being interspersed within the contact members 18B. This insert is placed in a forming die and a moulded housing is produced by insert moulding, both carriers 17A and 17B being cut off and removed thereafter to render the contact members 18A, 18B electrically independent.
    Type: Grant
    Filed: June 16, 1999
    Date of Patent: April 17, 2001
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Junji Muta
  • Patent number: 6205660
    Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
    Type: Grant
    Filed: April 22, 1997
    Date of Patent: March 27, 2001
    Assignee: Tessera, Inc.
    Inventors: Joseph Fjelstad, John W. Smith, Thomas H. Distefano, James Zaccardi, A. Christian Walton
  • Patent number: 6205650
    Abstract: A method of producing an electrical switch wherein material is cut out of a sheet or web (1) of electrically conductive material such that a plurality of sets of terminals (5, 6, 7) are formed integral with the sheet (1). A housing (not shown) is moulded onto each set of terminals such that the inner terminals (7) are within the housing. Operative elements are mounted in the housing. The moulding of the housings and the mounting of the elements are performed on a plurality of sets of terminals simultaneously. The individual switches are separated from the sheet (1) either by severing the terminals 5 at 15 and 25 and the terminals 6 at 16, thereby forming a switch with a short distance (fx 4 mm) between the terminal ends of terminals (16), or by severing the terminals 6 at 16 and 26 and the terminals 5 at 15, thereby forming a switch with a longer distance (fx 6 mm) between the terminal ends of terminal (15).
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: March 27, 2001
    Assignee: MEC A/S
    Inventors: Claus Enoch, Flemming Jacobsen
  • Patent number: 6161283
    Abstract: A connector is provided to make terminal fittings unlikely to be struck against external matter. The connector is for use with a circuit board in which terminal fittings are bent downward after being pulled backward of a connector housing 1 so as to be connectable with a circuit board 5, protection walls including an upper protection wall 10 extend behind the connector housing 1 to surround the terminal fittings 2 lest the terminal fittings 2 should project. Thus, the protection walls prevent the terminal fittings 2 from being directly struck by an external matter. Furthermore the invention relates to an improved method for producing a connector.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: December 19, 2000
    Assignee: Sumitomo Wiring Systems, Ldt.
    Inventor: Koichiro Tokuwa
  • Patent number: 6141872
    Abstract: A method of producing products wherein semi-finished products are supported between a pair of elongate, parallel carriers. Each semi-finished product is shaped by pressing the product into a finished form. Also, each semi-finished product is connected to at least one of the carriers by a deformable element. Deformation of the deformable element allows the semi-finished product to approach or move away from that carrier. Thus, when the semi-finished product is shaped by pressing, deformation of the deformable element allows the semi-finished product to move relative to that carrier so that unwanted tensions are relieved. Accordingly, the semi-finished product does not twist undesirably.
    Type: Grant
    Filed: June 10, 1999
    Date of Patent: November 7, 2000
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hitoshi Takanashi
  • Patent number: 6125535
    Abstract: A method for manufacturing an electrical connector having at least two rows of high density contacts, comprises steps of stamping and forming, depositing, insert molding, severing, and assembling. Each contact carrier strip has a number of contacts, a first carrier and a second carrier forming positioning structures thereon. Each contact includes a soldering section, a connecting section, a securing section and a contacting section jointed together end to end. The connecting sections of the contacts of different contact carrier strips are perpendicular to both the soldering sections and the securing sections. The contact carrier strips are deposited in a mold. A contact base is insert molded around the contacts for enclosing appropriate sections of the contacts thereby forming a contact module after properly depositing the contact carrier strips in the mold. The soldering sections of the contacts of different contact carrier strips are alternately aligned and remain in the same plane.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: October 3, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Song-Rong Chiou, Nan-Tsung Huang, Hui-Tze Tsai
  • Patent number: 6115916
    Abstract: A Method of Manufacturing a Shrink-On Cap In a method for manufacturing a shrink-on cap (10'), first of all heat-shrink tubing sections (27) having an opening at each of their two ends (14, 17) are prepared. The heat-shrink tubing section (27) is then pressed together at its end (17), producing a welded seam which constitutes a rim (16) and closes off the corresponding opening. The rim (16) lies substantially in a plane of symmetry of the heat-shrink tubing section (27). The rim (16) is then deformed in such a way that its sharp edge (18) and pointed corners are removed from the plane of symmetry. A method for protecting an electrical component by means of a shrink-on cap (10') produced this way is also described.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: September 12, 2000
    Inventor: Marcel Hofsass
  • Patent number: 6107895
    Abstract: A circulator having integrally formed conductors (20, 21, and 22) which may be folded to form overlaying conductors of a circulator. The circulator includes a lens (44) for shaping a biasing magnetic field distribution to compensate for non-uniformity of magnetic field strength caused by irregularities of a magnetic circuit or the shape of a magnet (45) or ferrite (40, 41). The characteristics of ferrite discs (40, 41) are preferably correlated with the characteristics of a permanent magnet (45) so that variations of permeability of the ferrite (40, 41) are minimized over a specified temperature range.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: August 22, 2000
    Assignee: Deltec Telesystems International Limited
    Inventors: Roger John Butland, Alexander Grigorievich Schuchinsky, Gerald Leigh Therkleson
  • Patent number: 6067710
    Abstract: A memory card is comprised of a synthetic resin frame, a memory board housed in a frame, metal contacts for connecting conductor patterns of a memory board and external pins, a connector body formed from synthetic resin having a number of contact compartments in which the contacts are received, a metal cover plate which covers an opening of the frame in which the memory board and the connector body are housed, and a cut-away portion which is formed on at least one of the contact compartments of the connector body and which is opposed to the cover plate.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: May 30, 2000
    Assignee: Kyocera Elco Corporation
    Inventors: Masaki Sakaoka, Hirohisa Takano
  • Patent number: 6058604
    Abstract: A cable constructed with insulation displacement connectors produces cables which connect data storage devices to a host system. The cable allows automatic address selection of data storage devices depending on the presence or absence of a CSEL terminal pin on a corresponding connector and the location of a data storage device along the cable. Address selection by connector configuration simplifies cable construction. The end connector of an ATA cable is configured to identify an attached data storage device as the first device (drive 0), while an intermediate connector is configured to identify an attached data storage device as the second drive (drive 1), thus making installation more intuitive.
    Type: Grant
    Filed: November 15, 1997
    Date of Patent: May 9, 2000
    Inventor: Tony Goodfellow
  • Patent number: 6055725
    Abstract: An edge connector for a circuit board having a top layer and at least one layer underlying the top layer to form a composite structure. The edge connector comprises a first set of metallic tabs formed on the top layer in a row spaced from an edge of the top layer, with each of the first set of metallic tabs having a plating spoke associated therewith formed in the one layer underlying the top layer. A second set of metallic tabs is formed on the top layer in a row adjacent the edge. A metallic tab of the first set is positioned between a pair of metallic tabs in the second set, however, the surface area of the top layer between each pair of metallic tabs in the second set is substantially free of a plating spoke.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: May 2, 2000
    Assignee: International Business Machines Corporation
    Inventors: Daniel James Berto, Jimmy Melvin Coe, Lloyd Archibald Barrington Lawrence, Jr., Todd Allen Lee