Forming Array Of Contacts Or Terminals Patents (Class 29/884)
  • Patent number: 6038766
    Abstract: Disclosed is a jack assembly and a jack assembly panel system for use in telecommunications equipment, as well as a method for manufacturing both. The jack assembly is a one-piece, single-molded jack assembly and the method for making the jack assembly involves placing the switch assemblies into the mold cavity and molding the framework with the switch assemblies in it. The jack assembly panel consists of numerous molded components which can be substantially snapped together for ease of assembly and resulting in a significant reduction in the number of assembly steps.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: March 21, 2000
    Assignee: Telect, Inc.
    Inventor: William R. Werner
  • Patent number: 6035529
    Abstract: A method of deforming a pin for use in an electrical connection, and a method of making an electrical connection using a deformed pin. A normally straight pin is provided and positioned adjacent to a frame supporting a die and an operating member. The operating member is coupled to the frame and the die, whereby moving the operating member moves the die sufficiently to bend a part of the pin. The method encompasses an apparatus for accomplishing the method, as well a secure electrical connection formed by joining a female fitting with a male fitting carrying a pin modified by the method.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: March 14, 2000
    Assignee: Micron Electronics, Inc.
    Inventor: Craig L. Boe
  • Patent number: 6000126
    Abstract: A method and apparatus is provided for connecting area grid array semiconductor chips to a printed wire board. A compliant lead matrix includes a carrier and a plurality of conductive leads arranged parallel to one another and secured relative to the carrier in the form of a matrix. The method includes orienting a first side of the lead matrix to be aligned with a reciprocal matrix of conductive surface pads on the area grid array semiconductor chip. First ends of the leads are electrically connected to the conductive surface pads of the area grid array chip. The second side of the lead matrix is oriented to be aligned with a reciprocal matrix of conductive surface pads on a printed wire board. Second ends of the leads of the lead matrix are electrically connected to the conductive surface pads of the printed wire board thereby establishing an electrical connection between the area grid array chip and the printed wire board.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: December 14, 1999
    Assignee: General Dynamics Information Systems, Inc.
    Inventor: Deepak Keshay Pai
  • Patent number: 5997999
    Abstract: A sintered body, for manufacturing a ceramic substrate, on which a via can be formed with high positional accuracy and the substrate is not warped and further the productivity is high. The sintered body includes a pillar-shaped ceramic body and metallic wiring rods provided in the ceramic body in parallel with the axis. The metallic wiring rods are made of metal, the melting point of which is lower than the sintering temperature of the sintered ceramic body.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: December 7, 1999
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Michio Horiuchi, Yukiharu Takeuchi, Yoichi Harayama
  • Patent number: 5987741
    Abstract: An IC card includes a generally rectangular frame. A circuit board assembly is mounted on the frame, with the circuit board assembly including a generally planar dielectric substrate having circuit traces and at least one electrical component mounted thereon. A receptacle connector including terminals is mounted at an edge of the circuit board assembly, with the terminals being adapted to mechanically and electrically engage the circuit traces on the circuit board assembly. Complementary interengaging latches are provided between the frame and the receptable connector for securing the receptacle connector at the edge of the circuit board assembly and for ensuring a mechanical and electrical connection between the terminals and the circuit traces on the circuit board assembly. The invention also contemplates a method of fabricating the IC card according to the above.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: November 23, 1999
    Assignee: Molex Incorporated
    Inventors: Emanuel G. Banakis, Kenneth F. Janota, Harold Keith Lang
  • Patent number: 5975917
    Abstract: A method for manufacturing an electrical connector (20) comprises the steps of forming an insulative housing (24) defining a mating opening (33) in a front face thereof for mating with a second electrical connector and a central cavity (38) defined in a rear face of the housing (24), forming a contact module (26) including at least one row of conductive contacts (27) received therein, the contacts (27) each defining a contact section (52) for mating with a second contact of the second connector and a tail section (56) for engaging with a printed circuit board, and inserting the contact module (26) into the central cavity (38). An electrical connector (20) formed by such a method and the contact module (26) used with such an electrical connector (20) are also disclosed.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: November 2, 1999
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Kuo-Cheng Wang, Wayne Huang
  • Patent number: 5970607
    Abstract: A method of making an electrical subassembly and a subassembly formed by the method which includes the steps of providing a conductive member having a predetermined configuration and a housing for receiving the conductive member, connecting the conductive member to the housing, and removing a portion of the conductive member so as to separate it into a plurality of discrete contacts, each contact being connected to the housing and thereby providing a desired circuit path through the subassembly. The subassembly includes one or more electrical components mounted thereto and can be readily attached to a support and wired to a desired circuit without soldering while enabling removal and replacement of an electrical component as desired.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: October 26, 1999
    Assignee: Illinois Tool Works Inc.
    Inventor: Richard R. Herzog
  • Patent number: 5943770
    Abstract: The connector comprises a series of metal contact shafts (1) spaced and bent into elbow configurations, embedded in an electrically insulating material (2) which is itself surrounded by a metal shielding (3).Electrically insulating material (2) is molded around contact shafts (1), shielding (3) is made up of two superposed metal blocks (4a) having on their contacting surfaces elbow channels (5a, 5b, 5c) taking up contact shafts (1) surrounded by electrically insulating material (2), these channels being formed so that shielding (3) is interrupted in one rectilinear part of the elbow formed by the channels, this interruption of shielding placing in contact insulating material (2) surrounding the contact shafts, without creating any empty space in zones (7a, 7b) where the shielding is interrupted.
    Type: Grant
    Filed: September 2, 1998
    Date of Patent: August 31, 1999
    Assignee: Framatome Connectors International
    Inventors: Jacky Thenaisie, Jacques-Henri Heulot
  • Patent number: 5940963
    Abstract: The finished mass terminated end for a miniature coaxial ribbon cable is comprised of coaxial ribbon cable having an overlayer of metallic materials soldered into position, adhesive tape end portions and the insulation required by the conductor. The method of producing the mass terminated miniature coaxial ribbon cable comprises the steps necessary to produce a cable, both during the process and as a finished product that is consistently uniform in terms of the spacing of the conductors exposed and repetitive axial location without which later operations cannot be performed enmasse with a high degree of reliability and uniform appearance. The uniformity also allows termination without crossovers and shorts and improves strain relief by allowing all the conductors to become taut at the same time in order to equally share mechanical loads in a straight line motion.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: August 24, 1999
    Assignee: Tensolite Company
    Inventors: Bernard R. Tolmie, Robert H. Wittemeyer
  • Patent number: 5938039
    Abstract: A terminal strip packing arrangement including two insulative packing sheets and a terminal strip sandwiched in between the insulative packing sheets and rolled up with them into a roll for storage, wherein the terminal strip has an auxiliary strip integral with linked terminals thereof at one side, the auxiliary strip having outwardly extended protective arms adapted to stop against the insulative packing sheets to protect curved tails of the linked terminals from being compressed by the insulative packing sheets during storage.
    Type: Grant
    Filed: July 15, 1998
    Date of Patent: August 17, 1999
    Assignee: Speed Tech Corp.
    Inventor: Chao-Zen Liu
  • Patent number: 5940279
    Abstract: A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite side of the support element. The connector pins are glass-mounted into pin blocks produced independently of the support element. The pin blocks are inserted into associated cutouts of the support element and fastened therein. The arrangement and number of the connector pins in the pin blocks can thereby be flexibly adapted to particular requirements with no need for modifications to the design of the support element. The material and the geometrical properties of the pin blocks can be optimally adapted to the glass-mounting process of the connector pins, while the material of the support element can be matched to the coefficient of thermal expansion of the attached circuit support.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: August 17, 1999
    Assignee: Robert Bosch GmbH
    Inventors: Lothar Gademann, Franz Schmich, Reinhold Danner, Bernd Maihoefer
  • Patent number: 5937507
    Abstract: A motor actuator has a housing, an output gearwheel rotated by a motor, a pattern board provided on one side of the output gearwheel, and a conducting unit. The conducting unit is formed integrally with brushes contacting the pattern board and connector pins corresponding to each of the brushes and electrically connecting the brushes to other electrical components. The brushes and connector pins are fixed by an insulating resin so as to maintain the structure when link portions unneeded for electrical connection are cut.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: August 17, 1999
    Assignee: ASMO Co., Ltd.
    Inventors: Yasunori Asakura, Yukinobu Kujira
  • Patent number: 5937515
    Abstract: A method of manufacturing electronic circuitry and the resulting hardware is described in which a conduction plate is formed achieving separate electrical conducting paths for application specific signals is engaged with an electronic circuit package containing a wide range of elements including one or more integrated circuits, chip packages, multichip modules printed circuit boards and cables. One or more of these elements are assembled into the circuit package where all or a major portion of the element conductors are routed to terminals positioned for electrical connection between the circuit apparatus and the electrical conduction plate. The conduction plate completes the electrical interconnection of the circuit package by providing the application specific conduction paths, using various techniques for creating electrical conduction, such as severing segments of a generalized conductive grid to establish desired conduction paths.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: August 17, 1999
    Inventor: Morgan T. Johnson
  • Patent number: 5896655
    Abstract: A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: April 27, 1999
    Assignee: TEMIC TELEFUNKEN microelectronic GmbH
    Inventor: Dieter Knodler
  • Patent number: 5894661
    Abstract: When a stationary metallic mold and a movable metallic mold are closed, a housing is molded having a retainer insertion hole by the existence of a sliding mold. A retainer is also molded. First, when only the metallic mold is opened, the core pin is withdrawn, and the sliding mold is withdrawn in the longitudinal direction by the cam action of the angular pin, so that the molding portion is withdrawn from the retainer insertion hole. Successively, the sliding mold is relatively drawn out to the front of the advancing and withdrawing passage together with the stationary metallic mold, and the advancing and withdrawing passage becomes open. Next, an auxiliary sliding mold is advanced, and the retainer held by the auxiliary sliding mold is inserted into the retainer insertion hole and temporarily assembled to the housing. It is possible to insert the retainer straight into the retainer insertion hole. The finished product is protruded to the front of the movable metallic mold by the protruding pin.
    Type: Grant
    Filed: March 11, 1996
    Date of Patent: April 20, 1999
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Yasunori Wada, Hikaru Ito, Shinsuke Tsutsui, Hajime Kawase, Osamu Sasai
  • Patent number: 5879610
    Abstract: A method for making an electrical connector (10,170) formed by molding a plastic septum (50) transversely across an axially extending connector cavity (22) defined between the axial connector walls about the array of contacts (60) extending axially within the cavity (22) from one connector face to another. The contact sections (62) extending from the connector are initially straight prior to molding and are then subjected to a forming step to define right angles for example, with portions (66) of the contacts (60) embedded with the plastic septum (50) being of irregular cross-section to establish resistance to the stresses of such forming and maintain the sealed nature of the connector (10). The connector may comprise an integrally molded plastic housing (174) or a metal shell (20) with the plastic septum (50) molded therewithin such as about an inner flange (34) for sealing and retention.
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: March 9, 1999
    Assignee: The Whitaker Corporation
    Inventors: Ernest Lloyd Beinhaur, William Edward McClusky, Daryl Lynn Stoner
  • Patent number: 5867895
    Abstract: A method of providing an electrical component with surface-mountable metallic terminals, the component comprising two substantially parallel faces (S.sub.1, S.sub.2) with which electrical contact can be made, the perpendicular separation of these faces (S.sub.1, S.sub.2) having a value t, which method comprises the following steps:(a) Providing a substantially planar lead-frame in which an open area is framed by metallic strips, the open area containing a first peninsular protrusion and a second peninsular protrusion which emerge from oppositely located strips, the first protrusion emerging as a stub and then bifurcating into two arms, the second protrusion emerging as a stub and then continuing as a single arm which extends between the two arms of the first protrusion;(b) Bending a step into the second protrusion, so that part of its stub remains within the plane P.sub.0 of the strips but that part of its single arm is displaced into a plane P.sub.2 substantially parallel to P.sub.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: February 9, 1999
    Assignee: U.S. Philips Corporation
    Inventors: Bruno Van Beneden, Henri L. P. Lorrain
  • Patent number: 5865934
    Abstract: There is provided a method for arranging conductive bumps at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet being is in a plastic state or up to a temperature not lower than the grass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough.
    Type: Grant
    Filed: July 29, 1997
    Date of Patent: February 2, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Yamamoto, Yoshizumi Sato, Tomohisa Motomura, Hiroshi Hamano, Yasushi Arai
  • Patent number: 5857265
    Abstract: The invention concerns a process for producing a modular connection element (C.sub.0) from independent elementary connectors (4.sub.1 to 4.sub.8), having openings. The shielding elements (5d) are made from sheet metal. The surfaces of the overall connection element (C.sub.0) thus obtained are covered by shielding elements (5d) and elementary connectors (4.sub.1 to 4.sub.8) are joined together by pushing of specific zones of shielding elements (50d to 52d) into the openings. One application of the invention would be connection elements (C.sub.0) between printed circuit mother and/or daughter boards.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: January 12, 1999
    Assignee: Framatome Connectors International
    Inventors: Dominique Etiembre, Jacky Thenaisie
  • Patent number: 5855063
    Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: January 5, 1999
    Assignee: Packard Hughes Interconnect Company
    Inventors: Chris M. Schreiber, Bao Le
  • Patent number: 5850693
    Abstract: An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: December 22, 1998
    Assignee: Berg Technology, Inc.
    Inventors: Orest D. Guran, Donald E. Wood, Richard J. Middlehurst
  • Patent number: 5850694
    Abstract: A terminal insertion apparatus includes a terminal insertion head having a pair of wire catching hands and a terminal guiding piece and being movable along a Y-axis beam by servo drive, a high speed transfer belt having an electric wire clamp and being movable in the X-axis direction by servo drive, and a terminal posture correcting device having a pair of chuck pieces for chucking the terminal of a terminal end on the wire clamp and delivering it to the wire catching hands and a terminal holder and being movable by servo drive in a direction in parallel to that of the high speed transfer belt. Using the terminal insertion apparatus, the posture of the terminal is corrected two-dimensionally, and the terminal is inserted into a connector housing along the terminal guide pieces. The chuck pieces which is apart from a terminal at a certain position advances to pass the terminal therebetween, chuck the terminal, and retreat to cause the terminal to abut on a terminal stopping step.
    Type: Grant
    Filed: July 25, 1996
    Date of Patent: December 22, 1998
    Assignee: Yazaki Corporation
    Inventor: Takamichi Maejima
  • Patent number: 5822855
    Abstract: An electrical connector (40) having a two part articulated housing (42) is disclosed. The connector, intended for surface mounting on a curved surface (74, 76) of a circuit board (56), includes two housing parts (44, 48) that are intercoupled by means of a flexible member (62) that permits relative movement of the two housing parts in a direction toward and away from the mounting surface but is substantially rigid in the lateral direction. The connector (40) is manufactured by stamping and forming a series of the flexible members (62) on a carrier strip (90), passing the carrier strip through a plastic injection mold machine (98) for molding the two housing parts (44, 48) insitu onto the flexible strip (62), and then passing the carrier strip (90) through a contact insertion machine (102) for inserting the contacts (46,50) into the two housing parts (44, 48).
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: October 20, 1998
    Assignee: The Whitaker Corporation
    Inventors: David Stanley Szczesny, William V. Pauza, James Ray Fetterolf, Sr.
  • Patent number: 5822849
    Abstract: A circuit assembly is made by overmolding, with an electrically insulating material, a unitary framework of electrically conductive material forming coplanar conductors which are connected to each other by an integral structural member. The overmolded material secures the conductors relative to each other and enables portions of the structural member to be severed, electrically isolating the conductors from each other. The overmolded material also positions electrical components having leads that are electrically connected to the conductors. Ends of the conductors are formed into terminals which extend out of a hinge formed in the overmolded material. The hinge enables the terminals to be oriented in a different plane than the conductors.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: October 20, 1998
    Assignee: U.S. Philips Corporation
    Inventors: David Charles Casali, John E. Opie, Solomon Fridman
  • Patent number: 5819406
    Abstract: A method for producing an electrical circuit member includes the steps of positioning and arranging first and second electrical circuit parts having plural electrical connecting portions to be spaced and oppose each other, preparing an electrical connecting member having a plurality of electrical conductive members, each of which extends from one side of a holding member of an electrical insulating material therethrough to an opposite side of the holding member and is held in the holding member so that opposing ends of the electrical conductive member protrude from opposite sides of the holding member, and applying an adhesive to at least one side of the electrical connecting member including the electrical conductive members. The electrical connecting member with the adhesive is inserted between the first and second electrical circuit parts, and a pressing force is applied so that the first and second electrical parts contact the ends of the electrical conductive members.
    Type: Grant
    Filed: July 30, 1996
    Date of Patent: October 13, 1998
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tetsuo Yoshizawa, Toyohide Miyazaki, Hiroshi Kondo, Yoshimi Terayama, Takashi Sakaki
  • Patent number: 5807453
    Abstract: A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: September 15, 1998
    Assignee: Tessera, Inc.
    Inventors: John W. Smith, Joseph Fjelstad
  • Patent number: 5787581
    Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.
    Type: Grant
    Filed: August 17, 1995
    Date of Patent: August 4, 1998
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew
  • Patent number: 5778527
    Abstract: A method is provided for processing a number of "L"-shaped sections within a flat strip to form terminals extending from a component. In the strip, these sections are attached to a web by connecting portions. A number of such sections are simultaneously processed within various stations through which the strip is incrementally fed. These connecting portions are first twisted, so that each "L"-shaped section in the number of such sections extends in a plane perpendicular to the web. Next, these connecting portions are deflected so that outward extending legs of the sections extend in a direction needed for insertion into an electronic component structure. Then, these connecting portions are sheared, as each "L"-shaped section separated from the strip is placed in a slot within a receptacle block. Then, the receptacle block is slid to insert the "L"-shaped sections.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: July 14, 1998
    Assignee: International Business Machines Corporation
    Inventors: Michael Barenboim, Mark Edward Mino, John Lennon Sullivan, Jr., Kenneth Wayne Watts
  • Patent number: 5768777
    Abstract: A low profile connector is provided by the invention. According to the invention two sets of contacts are secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. A first end of each contact can be coupled to an I/O lead of a printed circuit board and a second end of each contact remains unsupported. A mating low profile connector according to the invention similarly provides two sets of contacts secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. The contacts are compliant and are designed to extend above the mating reference of the connector. The dimensions of the contacts are selected to provide minimum pitch and optimal compliance. A process for making the low profile connector by molding a contract strip into a housing is also disclosed.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: June 23, 1998
    Assignee: Berg Technology Inc.
    Inventor: Timothy Lemke
  • Patent number: 5761803
    Abstract: A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a vacuum table to form a first layer of the conductive plug within the vias. A second layer of the conductive plug within the via is formed by placing a stencil over the circuit board and flooding the holes of the stencil in order to form a second layer of the conductive plug within the vias of the printed circuit board.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: June 9, 1998
    Inventors: Frank St. John, Felix Rodriguez, Susan Christensen
  • Patent number: 5747101
    Abstract: A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
    Type: Grant
    Filed: April 9, 1996
    Date of Patent: May 5, 1998
    Assignee: International Business Machines Corporation
    Inventors: Richard B. Booth, Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Judith M. Roldan, Ravi Saraf, Jerzy M. Zalesinski
  • Patent number: 5740607
    Abstract: In order to reemploy the centering strips when equipping wiring backplanes with contact blades, the contact blades (2, 12) have their press-in zones introduced into a blade holder (1, 11) serving as a centering strip, being introduced thereinto in attitudinally correct allocation to one another. The contact blades (2, 12) introduced into the blade holder (1, 11) are pressed into the wiring backplane (5, 15) from the blade holder (1, 11) with a press-in die (7, 17) and the blade holder (1, 11) is pulled off from the contact blades (2, 12) when the press-in die (7, 17) is retracted.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: April 21, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Karl Zell, Peter Seidel
  • Patent number: 5737837
    Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: April 14, 1998
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5735042
    Abstract: A pin contact of a connector and a method of fabricating the pin contact which enables a substantial decrease of manufacturing cost, and smooth installation of the pin connector without a change in the pitch of arrangement at the time of press-fitting into a pin housing. A flat metal sheet undergoes blanking and pressing to form a narrow piece including a strip portion of decreased area of a fracture. Then an approximately L-shaped connecting portion is bent at right angles to raise the narrow piece sideways. Thereafter the strip portion of the narrow piece is pressed along the direction of rising, to thereby form an approximately cylindrical contact section. A raised piece at the rear of the contact section is provided with a locking section which faces approximately at right angles with the direction of arrangement.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: April 7, 1998
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yasunari Takano, Hidehiro Nakamura, Shin Yoshida, Akito Miura, Koichi Takahashi, Kazuki Satou
  • Patent number: 5729898
    Abstract: A method of making an electrical socket having an insertion part, a receptacle, and an electrically conductive terminal therebetween. The insertion part and the receptacle are at an angle to each other and the conductive terminal is bent at substantially the same angle. A tubular member is molded and one end of the conductive terminal is inserted through an insertion hole in the closed end so that the other end projects therefrom. This end is bent, preferably to a 90.degree. angle with the remainder of the conductive terminal, thereby forming the core member. The core member is inserted into a mold whereby, when molding resin is introduced into said mold, the outer tube and the receptacle are integrally formed.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: March 24, 1998
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Shinji Ogawa
  • Patent number: 5727314
    Abstract: An electrical set screw connector has an insulating cover over a metal body which includes conductor receiving passages or ports and intersecting set screws adapted to clamp down on conductor ends in the conductor receiving passages or ports. The connector insulating cover includes a vestibule or tubular chamber for each set screw. The outer end of the vestibule is restricted to capture the screw and each vestibule is internally threaded. The outer end of each vestibule includes a drive hole for the set screw. The connector insulating cover is made by dipping using the backed out set screws as core pins for each set screw vestibule with removable shanks in the set screw recesses forming the drive holes.
    Type: Grant
    Filed: February 15, 1996
    Date of Patent: March 17, 1998
    Assignee: Erico International Corporation
    Inventor: Thomas K. Ashcraft
  • Patent number: 5722861
    Abstract: An elongated electrical connector includes an elongated dielectric housing having a mating face and a longitudinal cavity defining a transverse insertion axis generally perpendicular to the mating face for receiving at least one terminal module. The terminal module includes a plurality of identically stamped terminals which are elongated in the direction of the insertion axis. The terminals having mating ends projecting from the housing beyond the mating face thereof. At least one of the identically stamped terminals has a bend therein to reduce the length thereof such that the mating end thereof projects from the housing a lesser distance beyond the mating face than the mating ends of the other terminals. A longitudinal dielectric insert is receivable in the cavity and is molded about portions of the identically stamped terminals.
    Type: Grant
    Filed: February 28, 1996
    Date of Patent: March 3, 1998
    Assignee: Molex Incorporated
    Inventor: James A. Wetter
  • Patent number: 5713126
    Abstract: A connector 1 has a connector main body 2, and a plurality of leads 3--3 protruding forward from a front surface of the connector main body 2. Each lead 3 is formed with an edge portion 3a. A plurality of terminals 6--6 are formed on an end of a printed circuit board 5. Each terminal 6 is formed with a slit 7 extending in a longitudinal direction thereof. The slit 7 is engageable with the edge portion 3a of its corresponding lead 3. A precoat solder portion 8 is formed on each terminal 6. The edge portion 3a is coupled with its corresponding slit 7. And, the leads 3--3 are soldered onto their corresponding terminals 6--6 by melting the precoat solder portion 8, thereby firmly mounting the connector 2 on the end of the printed circuit board 5 without causing the dislocation of leads in a lateral direction with respect to their corresponding terminals.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: February 3, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Shoji Sakemi
  • Patent number: 5707260
    Abstract: A terminal chain includes box-shaped terminal-connecting portions (1, 1', 1"), each being rectangular in cross-section and defined by two major side walls (1a1 and 1a2, 1a1' and 1a2', 1a1" and 1a2") and two minor side walls (1b1 and 1b2, 1b1' and 1b2', 1b1" and 1b2") wherein the major side walls (1a1 and 1a2, 1a1' and 1a2', 1a1" and 1a2") are greater in width than the minor side walls (1b1 and 1b2, 1b1' and 1b2', 1b1" and 1b2"). The terminal chain also includes a connecting strip (2) to which the terminal-connecting portions (1, 1', 1") are connected in the form of a chain. Each terminal-connecting portion (1, 1', 1") is connected to the connecting strip (2) via a connecting portion (1c, 1c', 1c") which extends from one of the two minor side walls (1b1 and 1b2, 1b1' and 1b2', 1b1" and 1b2") of the corresponding terminal connecting portion (1, 1', 1"). The terminal chain is formed by folding a development (M) punched out of an electrically-conductive metal plate.
    Type: Grant
    Filed: October 17, 1995
    Date of Patent: January 13, 1998
    Assignee: Yazaki Corporation
    Inventor: Takeshi Yanase
  • Patent number: 5704120
    Abstract: A method for making electrical connection to an electrically conductive surface, providing improved electrical performance. The electrical connection is made across an extent of the surface, rather than at just one point of the surface, and furthermore is made to be substantially nonuniform along its extent. This nonuniformity can be structured to provide preferential admittance at plural apertures, with these apertures having suitable dimensions and spacings. By this method, improved electrical performance can be provided, compared to prior art methods that connect substantially at one point, or that connect substantially uniformly along an extent.
    Type: Grant
    Filed: July 17, 1995
    Date of Patent: January 6, 1998
    Inventor: J. Peter Moncrieff
  • Patent number: 5699613
    Abstract: A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions of the underlying conductive pattern. The holes through the dielectric are plated to form via connections between the surface and the conductive pattern on the base laminate. The recess created by the via is filled with a conductive and plateable polymer which upon curing forms a conductive plug. A second dielectric layer is deposited on the board structure and in succession photolithographically processed to expose the underlying plated via and plug. The hole in the second dielectric is plated and filled with conductive polymer so as to create a second via vertically aligned with and electrically connected to the underlying first via.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: December 23, 1997
    Assignee: International Business Machines Corporation
    Inventors: Ku Ho Chong, Charles Hayden Crockett, Jr., Stephen Alan Dunn, deceased, Karl Grant Hoebener, Michael George McMaster
  • Patent number: 5687478
    Abstract: Disclosed is a modular jack having a first plurality of wires which extend in a common vertical plane from the bottom wall of the housing across the opened end and to the top wall and then extend horizontally forward and then angularly downwardly and rearwardly back toward the rear opened end. A second plurality of wires extends first in a common vertical plane from the bottom wall across only a part of the rear opened end and then extends obliquely, horizontally and upwardly toward the front opened end. A method of use is also disclosed.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: November 18, 1997
    Assignee: Berg Technology, Inc.
    Inventor: Yakov Belopolsky
  • Patent number: 5685073
    Abstract: A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to the first printed circuit board; a second printed circuit board having an electrical terminal portion for providing electrical connection to the second printed circuit board; a spacing member disposed between the first and second printed circuit boards; and electrical signal transmission contacts situated on the spacing member for providing electrical connection between the first printed circuit board and the second printed circuit board.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: November 11, 1997
    Assignee: Compaq Computer Corporation
    Inventors: H. Scott Estes, James J. Ganthier
  • Patent number: 5667615
    Abstract: An incontinence electrode for controlling urinary incontinence in women is made of alternating bands of conductive and non-conductive polymers molded to form a tubular body. Electrical receptacles, formed in the molding process at the interior circumferential surface of the conductive polymer bands, accept metal contacts attached to electrical leads to make a secure and durable, mechanical and electrical connection between the conductive polymer bands and the leads. The leads are coupled to a controller and carry electrical current to and from the metal contacts which then distribute the current to the conductive polymer bands to cause a contraction of the vaginal muscles responsible for controlling urinary incontinence in women.
    Type: Grant
    Filed: May 13, 1996
    Date of Patent: September 16, 1997
    Assignee: Empi, Inc.
    Inventors: Donald D. Maurer, Alexander Kipnis
  • Patent number: 5666723
    Abstract: The invention relates to a connector terminal and a method of producing the same. The terminal, even if small in size, has a large allowable maximum deflection, and is excellent in durability, and the terminal of a one-part type can be produced from a relatively inexpensive thin metal sheet, thereby reducing the manufacturing cost. More specifically, the terminal is formed from a single thin metal sheet, and has a receptive portion and a spring portion formed at a front portion of a base plate for engaging with a mating terminal, and a wire connecting portion formed at a rear portion of the base plate. The thickness of the spring portion is smaller than that of the remainder of the terminal. In a shaping step of a process including blanking and pressing, only the spring portion is rolled into a thickness smaller than that of the remainder.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: September 16, 1997
    Assignee: Yazaki Corporation
    Inventors: Kazuto Ohtaka, Masakuni Samejima
  • Patent number: 5639271
    Abstract: An electrical contact has a general flat sheet metal support with a pad portion that is twisted (e.g., by about 90 degrees) out of the plane of the metal support, and a contact body attached to the pad portion. The contact may be made by welding a contact body on a pad portion of the contact support while the contact support is essentially in its original flat state; and using one progressive stamping die to isolate the pad portion, form a twist, and stamp out the contact, so that the pad portion is in a plane that is generally perpendicular to the plane of the contact support.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: June 17, 1997
    Assignee: Checon Corporation
    Inventor: William H. Balme
  • Patent number: 5636431
    Abstract: An electric motor used especially for driving windshield wipers of motor vehicles which includes a gear pot and a metal cover with an outside and an inside and a plastic component which is injection-molded substantially at the outside of the cover and into which at least one conductive strip punched out from a metal blank and positioned substantially at the outside is embedded. In order to achieve an exact position of the conductive strip, the conductive strip is supported by a holding device from the inside of the cover through an aperture in the cover during the injection molding process. The plastic component includes at least one recess within the aperture in the cover which is open towards the inside of the cover and extends up to the conductive strip, unless the recess is filled with material afterwards.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: June 10, 1997
    Assignee: SWF Auto-Electric GmbH
    Inventor: Rolf Ade
  • Patent number: 5626483
    Abstract: The present invention is directed to presenting a connector which has conductor patterns in very narrow pitch. A frame 50, in which plural beams 52, which have the same cross-section as a connector 1, are aligned in parallel, is molded from a suitable resin which is good in heat resistance and accepts plating. After electroless plating over the surface of each beam 52, resist is coated uniformly thereon. The beam 52 is exposed three-dimensionally using mirrors and masks. After removing resist and unnecessary plated copper, it is gold-plated or solder plated, as needed. The beams 52, on which the conductor patterns are formed, are separated from the frame 50, and by cutting each beam into a designed number, connectors of narrow pitch are obtained.
    Type: Grant
    Filed: August 11, 1995
    Date of Patent: May 6, 1997
    Assignee: The Whitaker Corporation
    Inventor: Takaki Naitoh
  • Patent number: 5622515
    Abstract: A set of electrical terminals is provided for interconnecting and grounding electrical leads of a harness, for example an automotive engine harness. Each terminal comprises two spaced pairs of spring beams defining a pair of aligned, insulation displacement slots for receiving a common electrical lead. The spring beams of each pair are defined by a pair of juxtaposed loops. The loops of all of the terminals are connected together to provide a cage-like structure by a front wall, a rear wall and a base. One end of each loop is connected to the front wall and the other end of each loop is connected to the rear wall. Lead strain relief ferrules project rearwardly from the base and the rear wall in a single row in closely spaced relationship. The rear wall is secured to the base by means of a flange which has been struck out from the base and which engages over a neck connecting one of the ferrules to the rear wall.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: April 22, 1997
    Assignee: The Whitaker Corporation
    Inventors: Gheorghe Hotea, Harald M. Lutsch
  • Patent number: 5619794
    Abstract: A complex structure molding process for molding a complex structure including a plastic base and a plurality of terminal pins, comprising the steps of molding the plastic base to have the terminal pins partly embedded in the plastic base, storing a continuous metal material having a rim portion and a plurality of terminal pins perpendicularly extending from the rim portion, cutting the continuous metal material in a first direction parallel to the direction in which the terminal pins extend from the rim portion to form a segmented metal material, and setting the segmented metal material in the molding means in the state having the segmented metal material assume their predetermined attitudes. The continuous metal material is fed in a second direction perpendicular to the first direction to cut the continuous metal material and to set the segmented metal material for molding the plastic base to have the terminal pins partly embedded in the plastic base.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: April 15, 1997
    Assignee: Teijin Seiki Co., Ltd.
    Inventor: Keizo Hokazono