Abstract: Disclosed is a surface acoustic wave device comprising a piezoelectric substrate; an electrode unit formed on the piezoelectric substrate, the electrode unit including a drive electrode unit for generating surface acoustic waves and an external connection electrode unit; an electrically conductive electrode protecting unit for covering the drive electrode unit with a hollow therebetween, the electrode covering unit being formed on the piezoelectric substrate by use of a film forming technique; an electroconductive column formed on the external connection electrode unit; and an external connection terminal formed at the extremity of the electroconductive column, wherein the piezoelectric substrate is sealed by a resin with the exception of the external connection terminal and the electrode protecting unit.

Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.

Abstract: An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.

Abstract: A method of manufacturing a piezoelectric torque transducer is provided, comprising the steps of (a) forming a prepared area on a surface of a torsion member adapted to be strained by an applied torque; (b) providing a piezoelectric element having an axis of maximum strain sensitivity and disposing first and second electrodes on opposite faces of the element, respectively, and attaching an electrical lead to each electrode; (c) connecting electrical leads to the electrodes; and (d) disposing the element on the prepared area and orienting the axis of maximum strain sensitivity on the member and securing the element to the prepared area with a material selected from a group consisting of (i) adhesive material and (ii) potting material.

Abstract: A package for a piezoelectric resonator, includes an insulating base that has a rectangular box shape and made of laminated thin ceramics sheets, and a lid that is made of a thin rectangular sheet of transparent glass material and bonded on the top surface of the base. A tuning fork type quartz crystal resonator element is hermetically sealed in the package. The corners of the lid are cut off diagonally at an angle of approximately 45 degrees or rounded so as to correspond to the cutouts of quarter circles at the corners of the base that result from via holes for wiring inside the base. A predetermined sealing width on the top surface of the base between the lid and the inner periphery of the base and a sufficient margin width between the periphery of the lid and the outer periphery of the base are ensured at the corners.

Abstract: A piezoelectric resonant component is constructed such that it is possible to reduce the thickness of an exterior case member while preventing fracture and chipping of the exterior case member. The piezoelectric resonant component preferably includes exterior substrates defining exterior case members and being stacked on an energy trap type piezoelectric resonant element via adhesive layers disposed therebetween so as to define spaces for allowing for free and unhindered vibration of the piezoelectric vibration portion, and a plurality of external electrodes disposed on the surfaces of the exterior substrates on the opposite side of the surfaces thereof fastened to the piezoelectric resonant element are arranged so as not to overlap with the spaces through the intermediary of the exterior substrates.

Abstract: A piezoelectric vibrator has a piezoelectric vibration plate having a piezoelectric vibration piece. First and second oscillation electrode films are disposed on the piezoelectric vibration plate for undergoing oscillating movement to vibrate the piezoelectric vibration plate. Each of the first and second oscillation electrode films terminates in a bonding film portion. A pair of cover members form a hermetically sealed cavity containing the piezoelectric vibration piece of the piezoelectric vibration plate. The cover members are anodically bonded together through the bonding film portions of the first and second oscillation electrode films. Each lead electrode of a pair of lead electrodes has a portion connected to a respective one of the bonding film portions of the first and second oscillation electrode films.

Abstract: A piezoelectric substrate is constituted by a piezoelectric material of an effective Poisson's ratio being less than 1/3. The substrate has a pair of opposite faces and the opposite faces are provide with a pair of vibrating electrodes in correspondence. The opposite faces of the piezoelectric substrate are rectangular respectively. The sum of the lengths Lc of the one faces in the opposite faces 1a, 1b and the length Wc of the other side of the same is limited within range 2.22 mm≦≦2.24 mm or 2.34 mm≦≦2.48 mm, said one faces being vertical each other. The areas Sc of the opposite faces are 1.22 mm2≦Sc≦1.26 mm2 or 1.35 mm2≦Sc≦1.538 mm2. Accordingly, though using the piezoelectric material of the effective Poisson's ratio being less than 1/3, vibration in the thickness extensional fundamental waves can be steadily utilized.

Abstract: A quartz crystal unit with favorable frequency variation characteristics in response to changes in temperature and changes over time. A pair of lead wires provided perpendicularly to a base and a pair of supporters supported on the pair of lead wires are used for holding and electrically connecting a quartz blank at opposite points on the periphery thereof to which leading electrodes extend. The orientation of a line connecting holding points matches an axis on which stress sensitivity of the quarts blank exhibits the least value. A line connecting both supporting points for the supporters by the lead wires is disposed in a skew position with respect to another line connecting both holding points for the quartz blank. When the quartz blank is AT cut, an angle formed between these lines in the skew relationship is preferably set to approximately 30 degrees.

Abstract: The present invention provides a piezoelectric transformer, a piezoelectric inverter, and a liquid crystal display with a high reliability, capable of preventing the occurrence of the soundings caused by the contact between gold thread wires and preventing the breaking of the gold thread wires and the deterioration of the performance of the piezoelectric transformer. The gold thread wire for wiring used in a piezoelectric transformer has a structure wherein band-like metallic foils are wound around a core consisting of numerous fine wires bundled, and the gold thread wire is constituted by impregnating it with wax.

Abstract: An electronic component includes an electronic component element having a substantially rectangular plate disposed between upper and lower case substrates in the form of substantially rectangular plates such that the upper and lower case substrates and the electronic component element are stacked and define an integral unit. Assuming that the length of the shorter sides and the length of the longer sides of the electronic component element are a0 and b0, respectively, and that the length of the shorter sides and the length of the longer sides of the lower case substrate 3 are a1 and b1, respectively, the relationships a0<a1 and b0<b1 are satisfied.

Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.

Abstract: A base (10) has a substantially cylindrical plug (12) penetrated by two leads 14. A piezoelectric oscillator (24) is secured to and supported on ends of the two leads by supports (26). The supports (26) are formed from solder having as high lead content of more than 60% by weight, preferably 85 to 98% by weight. A cap (28) open at one end is fitted on the piezoelectric oscillator (24). The plug (12) seals the open end of the cap (28) and forms a gas-tight casing, thus forming a piezoelectric oscillator unit with piezoelectric oscillator (24) held gas-tight in the inside. The high lead content solder is soft and has a low Young's Modulus, so that it can disperse stress when the piezoelectric oscillator experiences. It is thus possible to evade stress concentration on the piezoelectric oscillator (24) and improve shock resistance. A layer of a solder with a lead content of 60% by weight or less or of tin or a tin alloy, is formed on the surface of the leads (14), and ensures solder wetting property.

Abstract: A piezoelectric resonator includes two sealing substrates, a seal portion, and an energy-trap type piezoelectric resonance element which is adapted to vibrate in a third harmonic of thickness extensional vibration. The piezoelectric resonance element includes a piezoelectric substrate and a pair of excitation electrodes, which are disposed on opposite major surfaces of the piezoelectric substrate. A portion of the piezoelectric substrate sandwiched by the excitation electrodes defines a vibrating portion. The sealing substrates each have a cavity formed therein and are attached onto the corresponding major surfaces of the piezoelectric substrate such that the cavities define a space for vibration. The seal portion is formed around the vibration space so as to damp leaking vibration. The vibrating portion is arranged such that the approximate center thereof is spaced from the approximate center of the vibration space as viewed along the major surfaces of the piezoelectric resonance element.

Abstract: In a method of manufacturing an integrated optical device using a wafer of lithium niobate, an optical waveguide is formed in the wafer by diffusing from a surface thereof a metal such as titanium, nickel or zinc and which changes the refractive index of the lithium niobate. A chemical vapor deposition process is used to deposit on the wafer surface a silicon dioxide buffer layer, the process being operated with the temperature of the wafer substantially in the region of about 170.degree. C. to 225.degree. C. A metallic electrode array is deposited on the silicon dioxide buffer layer, and then the wafer is mounted in a package, with suitable optic and electric connections being made thereto. The package is hermetically sealed to protect the connected wafer from the environment.

Abstract: A liquid-filled acoustic transducer for finishing an exposed surface of a work medium, such as plastic concrete, transmits acoustic energy generated within an enclosed liquid medium, through a transducer housing member, and into the exterior work medium. Acoustic waves are generated by electrically-actuated liquid-immersed piezoelectric elements housed within the device. The efficiency with which acoustic waves are transmitted from the interior of the device to the adjacent work medium is enhanced by providing an intermediate transducer housing member, disposed between the liquid in which the piezoelectric elements are immersed and the work medium, having acoustic impedances at its two major surfaces matching the respective acoustic impedances of the respective interfacing media and a continuous acoustic impedance gradient between those two surfaces.

Abstract: The surface-acoustic-wave device has surface-acoustic-wave element 1 provided with interdigital electrodes 2, shut-off member 32 and ground patterns 35-1, 35-2. Interdigital electrodes 2 are formed on a first surface of surface-acoustic-wave element 1 and covered with protective film 33. Surface-acoustic-wave element 1 is mechanically supported above mounting substrate 36. Shut-off member 32 serves to shut off surface-acoustic-wave element 1 electrically and airtightly from an ambience. The ground patterns 35-1, 35-2, grounded electrically, serve to discharge an electric charge. Ground patterns 35-1, 35-2 contact a surface of mounting substrate 36. Shut-off member 32 covers surface-acoustic-wave element 1 and also is connected with ground patterns 35-1, 35-2 that are in contact with the surface of mounting substrate 36.

Abstract: A resonator device having an insulating substrate, a strip-shaped vibrating element which is mounted on said insulating substrate and is provided with driving electrodes formed on the main opposing surfaces of a piezoelectric substrate, and terminal electrodes which are provided on said insulating substrate so as to be electrically connected with said driving electrodes and to which driving signals are applied by an external signal source. At least the longitudinal side portions of said vibrating element are coated with a surface active agent. With such a constitution, fluctuations in resonant resistance which are due to the excitation level can be suppressed, thereby contributing to the stable operation of the device, reducing the number of producing steps, and raising the yield rate in production.

Abstract: A method to improve the high output characteristics of a ultrasonic transducer 1 by urging a cooling gas 13 to flow through the transducer, thereby passing a cooling member 18 between at least one pair of adjacent piezoelectric elements 6, 7. In a preferred embodiment sulfurhexafluoride (SF.sub.6) is used as cooling gas.

Abstract: A horizontal circular filter is provided which includes plural filter pans arranged in a circle and rotatable as a group around a fixed central vacuum box. The filter pans are connected to respective sections of the vacuum box by respective manifolds which rotate with the filter pans. Each of the filter pans comprises a pan having a flat bottom wall including plural filtrate drainage troughs therein. A removable, disposable, plastic channel-forming grid is positioned on the bottom wall between the side walls of the pan. A filter cloth is disposed over the grid, and a cloth "caulking" arrangement secures the filter cloth in place so as to also hold the grid in place in the pan. A method of retrofitting existing punched plate filter pans is also provided.

Abstract: A piezoelectric component includes a substrate on which a piezoelectric resonator is mounted with supporting members interposed therebetween. The substrate is covered by a cap which is arranged to cover the piezoelectric resonator. A rubber-like elastic material such as a silicone resin is injected through a hole of the cap to cover the periphery of the piezoelectric resonator. Preferably, the Young's modulus of the rubber-like elastic material is not larger than about 12 kgf/cm.sup.2.

Abstract: An acceleration sensor includes: a piezoelectric vibrator including a piezoelectric element having a first principal surface and a second principal surface opposed each other, a first and a second electrode formed on the first and the second principal surface, and conductive protrusions made of a metal material or a ceramic material and formed by a thermal spraying process; and a holding body for holding the piezoelectric vibrator via the conductive protrusions.

Abstract: A mounting device for use with a washing machine to mount a cantilevered piezoelectric film accelerometer to a circuit board. The invention includes a housing structure having a cavity formed therein, with the accelerometer extending inwardly into the cavity from a first wall of the housing structure. The invention also includes a means for flattening the cantilevered piezoelectric film proximate the first wall of the housing structure.

Abstract: A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.

Abstract: A liquid-filled acoustic transducer for finishing an exposed surface of a work medium, such as plastic concrete, transmits acoustic energy generated within an enclosed liquid medium, through a transducer housing member, and into the exterior work medium. Acoustic waves are generated by electrically-actuated liquid-immersed piezoelectric elements housed within the device. The efficiency with which acoustic waves are transmitted from the interior of the device to the adjacent work medium is enhanced by providing an intermediate transducer housing member, disposed between the liquid in which the piezoelectric elements are immersed and the work medium, having acoustic impedances at its two major surfaces matching the respective acoustic impedances of the respective interfacing media and a continuous acoustic impedance gradient between those two surfaces.

Abstract: A piezoelectric resonator is capable of being mounted without any directional restriction. The piezoelectric resonator includes a laminated body having two groups of internal electrodes which are alternately laminated with piezoelectric layers interposed therebetween. Strips of first insulating film are disposed on two of the four side surfaces of the laminated body, which two side surfaces are perpendicular to each other. Strips of second insulating film are disposed on the other two side surfaces of the laminated body arranged perpendicular to each other. A first external electrode is disposed on one of the two side surfaces on which the first insulating film is disposed, and a second external electrode is disposed on the other of the two side surfaces. The first and second external electrodes are connected to the second group of internal electrodes.

Abstract: A low profile integrated oscillator operable to provide an oscillator signal includes a substrate having a cavity and a via passing through the substrate. A crystal or other resonator is disposed in the cavity and stabilizes the oscillator signal. An electrical circuit means is mounted to the substrate and electrically connects to the via to condition the oscillator signal. A cover seals the resonator in the cavity. A connector electrically connects the resonator to the via. A heater is mounted to the substrate to elevate the oscillator temperature and a temperature sensor is mounted to the substrate to monitor and control the oscillator temperature. The substrate is surrounded by an insulation and mounted within a housing. The housing has a connection means for connecting to an external electrical circuit.

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Abstract: A surface acoustic wave device is manufactured by directly or indirectly bonding a lid to a substrate having a surface acoustic wave element to seal the element under the lid. The lid is made of at least one material selected from the group comprising lithium niobate, lithium tantalete, lithium borate, glass and quartz. The substrate is made of at least one material selected from the group comprising quartz, lithium niobate, lithium tantalete and lithium borate.

Abstract: The case of a piezoelectric resonator in which a piezoelectric vibrator having a piezoelectric body and an electrode is flattened and a guard is provided protruding by the amount about the same as the thickness of the case on the hermetic terminal so that the open edge is received by insertion. Then the hermetic terminal in which one end of the piezoelectric vibrator is supported by the inner lead is inserted in the open edge of the case and the case is sealed by laser welding the welding area extending to the guard and to the open edge. By so doing, a thin piezoelectric resonator is provided which is desirable for surface mounting and being capable of maintaining the inside of the case in a stable vacuum state or sealed with nitrogen and the like for a long time. Moreover, by supporting the piezoelectric vibrator by the flattened inner lead inside the air tight case, a piezoelectric resonator is provided which has excellent frequency characteristics and long term aging characteristics.

Abstract: A piezoelectric component prevents development of a short circuit between separate electrodes of a piezoelectric element and provides a high level of connection reliability. The piezoelectric component includes a piezoelectric element utilizing a longitudinal oscillation mode and being mounted on a mounting substrate. The piezoelectric element has on one main surface thereof a first electrode and a second electrode formed by dividing electrode material via longitudinally extending linear grooves and, on the other main surface, a third electrode. Conductive support members are secured to node sections of the first and second electrodes so as to be spaced apart from each other with respect to the longitudinal dimension of the piezoelectric substrate. The support members are adhered to and secured to pattern electrodes of the mounting substrate by conductive adhesive.

Abstract: In a surface acoustic wave apparatus, a surface acoustic wave element for obtaining a convolution signal is housed in a recess of a substrate. Since the surface acoustic wave element is housed in the recess of the substrate in this surface acoustic wave apparatus, the apparatus can be compactified. This effect of compactification is remarkable, because the surface acoustic wave element has an output electrode for obtaining the convolution signal and thus originally has a big element size. When a laminate substrate is used as the substrate, a configuration for effectively using surfaces of respective layers may be arranged in such a manner that output wiring of the convolution signal is separately formed in the layers. This further enhances the effect of compactification. There are further disclosed a spread spectrum signal receiver using the above surface acoustic wave apparatus for receiving a spread spectrum signal, and a spread spectrum communication system using the spread spectrum signal receiver.

Abstract: A method to improve the high output characteristics of a ultrasonic transducer 1 by urging a cooling gas 13 to flow through the transducer, thereby passing a cooling member 18 between each adjacent pair of piezoelectric elements 6, 7. In a preferred embodiment sulfurhexafluoride (SF.sub.6) is used as cooling gas.

Abstract: A resonant circuit of the present invention has a ceramic substrate, a quartz element provided on said substrate, and a capacitor for temperature compensation. Connection terminals are formed on the rear of the substrate in order to mount the resonant circuit to another substrate. A seam ring for air-tight sealing is positioned at the edges of the substrate. The quartz oscillator with this configuration can be mounted without resorting to leads.

Abstract: An energy-trapping thickness-shear resonator includes a piezoelectric substrate, a first electrode extending from a first end to a central portion of a first surface of the piezoelectric substrate and a second electrode extending from a second end to the central portion of a second surface of the substrate. Thus, the resonator utilizes thickness shear vibrations generated in a portion of the piezoelectric substrate located between the first and second electrodes at the central portion of the substrate. The width W of the la substrate is set to be equal to or less than about 0.7 mm and also to satisfy both of the following expressions (1) and (3) or to satisfy both of the expressions (2) and (3):(1) 0<W<k T/(1-a)(2) k(2n-1)T/(1-a)<W<k(2n+1)T/(1-a)(3) 0 21 .alpha.<(fa-fr)/fawhere T indicates the thickness of the piezoelectric substrate; k is 1/2; f.sub.OSC equals fa (1-.alpha.); f.sub.

Abstract: A surface acoustic wave element 11 having an inter digital electrode 12 formed on one surface of a piezo-electric substrate is arranged in a recess of a package 13 with the one surface being faced to a bottom surface of the recess of the package 13. An elastic conductive pad 35 having pads electrically connected to the electrode of the surface acoustic wave element 11 and electrodes of the package 13 is provided between the one surface of the surface acoustic wave element 11 and the package 13. The conductive pad 35 includes wiring means 35a, with which it is possible to connect the surface acoustic wave element 11 to the package 13 even when the position of the surface acoustic wave element in which the interdigital electrode is formed is deviated from the position of the electrodes of the package 13. The package 13 includes a cap 30 for pressing down the surface acoustic wave element 11.

Abstract: A piezoelectric vibrator includes a piezoelectric element having an electromechanical coupling coefficient of a thickness-extensional vibration mode greater than that of a thickness-share vibration mode, and a pair of electrodes arranged on surfaces of the piezoelectric element so that harmonic energy of the thickness-extensional vibration of the piezoelectric element is trapped.

Abstract: An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.

Abstract: A piezoelectric resonator has a base member including laminated piezoelectric layers and internal electrodes. The base member is polarized in different directions at both sides of each internal electrode. The internal electrodes are alternately covered by insulating film on opposing side surfaces of the base member. External electrodes are formed on the opposing side surfaces of the base member and the internal electrodes are connected thereto, respectively. At both ends of the base member, inactive sections are formed such that an electric field is not applied to the base member by covering consecutive plural electrodes with the insulating film. The center of the base member serves as an active section since an electric field is applied.

Abstract: The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.

Abstract: With a cylindrical case (10) and a base (18) for sealing an aperture part of the case (10), a piezo-electric transducer is enclosed in the case (10). The base (18) has a cylindrical shape and its section intersecting its axis at right angles at the part where the base (18) comes into contact with the case (10) is elliptical or nearly elliptical. The shape of an inner circumference of a section of the case (10) intersecting its axis at right angles at the part where the case (10) touches the base (18) is smaller than that of the section of the base (18), and is elliptical or nearly elliptical. The case (10) is a cylinder with one end closed and one end open. The piezo-electric transducer is enclosed by press fitting the base (18) into the open end of the case (10). In this case, a press-fitting allowance has a maximum value at parts between minor and major axes of the ellipse or near ellipse.

Abstract: A piezoelectric actuator/sensor package and corresponding method for its fabrication, and a method of embedding a ceramic actuator/sensor in a laminated structural member, such as a graphite-epoxy laminate. A ceramic actuator/sensor, with lead wires first bonded to it, is encapsulated in a non-conductive fiber composite material, such as fiberglass cloth and epoxy, to form a package that is precured at a suitable temperature, typically room temperature. Encapsulation provides electrical insulation, good strain coupling, protection from mechanical damage, and reduction in thermal stresses, since the coefficient of thermal expansion of the encapsulating material is selected to be between those of the ceramic and the graphite-epoxy laminate. Graphite fibers may be added to the package to enhance voltage-strain performance. The package is embedded in the structural laminate and the composite structure is cured in a manner that minimizes thermally-induced stresses.

Abstract: The substrate for devices 10 comprises an insulating substrate 12 of an insulating material, conducting layers 14 formed on the insulating substrate 12 and opposed to each other at a certain distance, and a dielectric film 16 formed on that portion of the insulating substrate 12 between the conducting layers 14. The substrate 10 incorporates a capacitance constituted by the opposed electric layers 14 and the dielectric film 16. A piezoelectric oscillator 20 is connected to the left and right conducting layers 14b, 14c of the substrate for devices 10. A cap 22 is connected to a boundary part of the substrate 10 through epoxy resin 24. The substrate for devices 10 with a built-in capacitance can reduce fabrication costs of a piezoelectric oscillation device and a surface acoustic wave device.

Abstract: A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

Abstract: A terminal for a piezoelectric device has a first contact portion and a second contact portion which are preferably formed as separate metallic elements. Each contact portion has a protrusion disposed thereon. A lubricant is located between the first contact portion and the second contact portion. The lubricant contains a hydrophilic group tending to form a hydrogen bond with a metal element and a lipophilic group extending in a straight chain from any such hydrogen bond and having a length at least several times that of the hydrophilic group. The lipophilic group has a molecular structure which urges away from the metallic surfaces of the contact portions.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer having holes formed therein so as to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.

Abstract: An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.