Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: An object of the present invention is to manufacture, at a low cost, a piezoelectric component that has a superior level of molding pressure resistance and has its height reduced.

Abstract: A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

Abstract: The electronic component includes at least one resonator element arranged in a housing of a case. The case includes a main part with a base and at least one lateral wall of annular shape, and a cover fixed onto the main part to hermetically seal the housing of the case. One portion of the cover is transparent to a determined wavelength of a light beam to allow the resonator element to be optically adjusted once the case is sealed. The cover is fixed onto a rim of the lateral wall of the main part, which is preferably made of a ceramic material, such that one part of the rim preferably surrounds the entire lateral surface of the cover to ensure protection of the electronic component against lateral shocks.

Abstract: A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member.

Abstract: An apparatus, in particular a microsystem, includes a device for energy conversion. The device for energy conversion has a piezoelectric, mechanically vibrating diaphragm structure for converting mechanical energy into electrical energy and/or vice versa, the diaphragm structure being arranged encapsulated in an environment which has a predetermined pressure which is, in particular, lower than an isostatic pressure.

Abstract: A method of fabricating a hermetic terminal includes: joining and firing wherein a bar-shaped member to be a lead is inserted into a ring, and they are fired to form a hermetic terminal intermediate having the bar-shaped member fixed in the ring; flattening wherein an end part of the bar-shaped member to be the inner lead portion of the lead is flattened to form a stair portion; and shaping wherein an end part of the stair portion is cut to shape the stair portion into a predetermined shape, wherein in the joining and firing step, a solid round bar longer than the lead is used as the bar-shaped member, and one end side of the bar-shaped member to be the inner lead portion is inserted into the ring so that the one end side is longer than the inner lead portion in the hermetic terminal as a completed product.

Abstract: A piezoelectric vibrator manufacturing method includes a cavity forming step for forming depressions for a cavities on at least one of two wafers; a bonding electrode film forming step for forming bonding electrode films on bonded surfaces of the both wafers; a mount pattern forming step for forming a pair of mount patterns in the cavity; a through hole forming step for forming a pair of through holes in the cavity; a through electrode forming step for forming a pair of through electrodes electrically connected with the pattern in the cavity; a mount step for electrically connecting the pattern and a piezoelectric vibrating strip, a superimposing step for superimposing the both wafers and storing getter materials; a bonding step for anodically bonding the both wafers to fabricating a wafer member; a gettering step for adjusting the degree of vacuum in the interior of the cavity while measuring a series resonance resistance value; and a cutting step for cutting the wafer member into individual pieces.

Abstract: There is There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract: To obtain an inexpensive piezoelectric vibration component having vibration characteristics whose degradation resulting from deposition of moisture due to a temperature change is less likely to occur without increasing the cost of a sealing structure and the number of parts, a piezoelectric vibration component includes a piezoelectric vibrating element accommodated in a package being sealed, and when the volume of the piezoelectric vibrating element is Ve and the volume within the package obtained by subtraction of the volume Ve of the piezoelectric vibrator from the volume of the space of the package is Vp Ve/Vp>(Se×M)/{(Sp+Se)×2.72} where Se is the surface area of the piezoelectric vibrating element, Sp is the surface area of the space inside the package when the piezoelectric vibrating element inside the package is absent, and M is the maximum mass of moisture per unit volume [?g/mm3] at the use temperature and 100% relative humidity.

Abstract: In the case of a fuel injector comprising an injector housing arrangement (44, 46) which accommodates a piezo-drive, whereby the piezo-drive has a piezo-actuator which is accommodated in a piezo-housing arrangement that has a cover arrangement (12, 14) provided with openings (16) for the penetration of protruding terminal pins (10) of the piezo-actuator, the following is provided: a sealing arrangement comprising a sealing element (24) formed from a liquid-tight material, the sealing element, on the one hand, fitting tightly against the circumferential areas of the terminal pins (10) and, on the other hand, tightly against the cover arrangement (12, 14), and a ventilation arrangement (40, 42) that promotes an exchange of gas between the outside of the injector housing arrangement (44, 46) and the outside of the sealing element (24).

Abstract: The invention concerns an assembly comprising a piezoelectric resonator (14) and a case (10), the case including a base part (11), on which the resonator is mounted, a wall (12) extending from said base part so as to surround at least partially said resonator, and a cover fixed to said wall in such a way as to close said case. The base part includes a main portion (17) and at least two conductive vias (16a, 16b). The conductive vias electrically connect The piezoelectric resonator to an outside circuit through the base part, and each of the conductive vias is surrounded by a insulating lining (18) so as to insulate the vias from the main portion (17). The main portion (17) of the base part (11) is divided into two parts by an insulating partition (21) in such a way that the two conductive vias are on different sides of the partition.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).

Abstract: Embodiments of the present invention include apparatus and methods for aerosolizing liquid. One embodiment of the invention provides an apparatus for generating an aerosol. The apparatus includes an actuator having a first face and a second face and defining an opening therethrough, as well as a vibratory element in mechanical communication with the actuator, and a sealing member configured to isolate the vibratory element from a surrounding environment. In accordance with certain embodiments, the apparatus further comprises an aerosolization element mounted on the actuator and disposed substantially over the opening, wherein the aerosolization element defines at least one aperture therethrough. Hence, the vibratory element may be operated to vibrate to cause movement of the aerosolization element in such a manner that a liquid at the first face of the aerosolization element can be dispensed as an aerosol through the at least one aperture.

Abstract: A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass?frit>core.

Abstract: To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal constituting a lead penetrating inside of a stem by one piece and a piezoelectric vibrator with an excellent yield. A stem 11 filled with a filling member 13 is penetrated only with one piece of a lead 12 formed from a lead frame. As an electric terminal, a conductive lead 16 connected to the stem 11 is provided other than the lead 12. The lead 12 and the conductive lead 16 of an airtight terminal 10 constituted by the stem 11, the lead 12, the filling member 13, the conductive lead 16 are connected to a piezoelectric vibrating piece 20, further, the stem 11 is capped to a case 30 to thereby constitute a piezoelectric vibrator 1.

Abstract: A piezoelectric actuator for use in a fuel injection system of an internal combustion engine, the actuator comprising a stack of ferroelectric layers; an encapsulation for protecting the stack from the ingress of liquid; and oxygenation means for providing oxygen to the ferroelectric layers, the means positioned between the encapsulation and stack. The oxygenation means is preferably impregnated in a fabric which forms a layer between the encapsulation and the stack.

Abstract: A reception bush for a piezoelectric actuator is provided with two connection pins for electrically bonding the piezoelectric actuator, in particular for a piezoelectric actuator controlling the injector of an injection system for an internal combustion engine. The reception bush has a first (1) and a second (2) bush elements which are interconnected when the bush is mounted. The first element (1) is provided with through holes (4, 5) for the connection pins of the inventive piezoelectric actuator. The second element (2) is provided with at least one guide (12) for the connection pins.

Abstract: A quartz crystal device includes: a quartz crystal blank having an outer perimeter part and a vibration region partially separated mechanically from the outer perimeter part by a cut-out groove; a first container joined to a first principal surface of the crystal blank by being joined to an entire perimeter of the perimeter part of the crystal blank via a brazing material layer in the first principal surface; and a second container joined to a second principal surface of the crystal blank by being joined to an entire perimeter of the outer perimeter part of the crystal blank via a brazing material layer in the second principal surface. The vibration region of the crystal blank is hermetically encapsulated in a space formed by the first container, the second container and the outer perimeter part of the crystal blank.

Abstract: Piezoelectric frames are disclosed that include a tuning-fork type piezoelectric vibrating portion having a pair of vibrating arms extending from a base portion in a first direction (Y-direction). The vibrating arms have a first width W1. A respective excitation electrode is formed on each vibrating arm. Supporting arms extend from the base portion in the first direction, outboard of respective vibrating arms. The supporting arms have a second width W2. A respective connecting arm extends from each supporting arm in a second direction that crosses the first direction. An outer frame connects to the connecting arms, has a side extending in the first direction with a third width W3, and has another side extending in the second direction with a fourth width W4. The second width W2 is 1.4 times smaller than the first width W1.

Abstract: A tuning-fork type piezoelectric vibrating piece (20) is comprised of a base portion (23) comprising a piezoelectric material, a pair of vibrating arms (21) extends parallel from the base portion with a first thickness, a excitation electrode film (33, 34) formed on the vibrating arms, a pair of tuning portions (28) formed at the distal ends of the vibrating arms (21) with a second thickness which is less than the first thickness; and a metal film (18) formed on at least one surface o the tuning portion.

Abstract: The present invention is an ultrasonic device with the transmitting head located outside a housing enclosure while radial mode PZTs and tail mass are located inside the housing enclosure. The ultrasonic device and related process are useful for any process involving supplying ultrasonic energy to a liquid, including controlling algae and decontaminating liquids with multiple ultrasonic transmitters driven at variable frequencies. A broad range of algae can be successfully controlled and various liquids can be decontaminated or otherwise processed in a rapid and effective way. Each transmitter is housed in an enclosure that can float on the surface of tanks; pools, reservoirs, lakes, ponds, and water and waste-water facilities. Alternatively, the transmitters can be attached to a structure and positioned with the transmitting head immersed into the liquid. The exposed transmitting head efficiently transmits ultrasonic energy to the liquid.

Abstract: A method of fabricating a hermetic terminal having an annular ring, a lead arranged to penetrate through the ring in which one end side thereof is an inner lead portion electrically connected to a piezoelectric vibrating piece and the other end side thereof is an outer lead portion electrically connected to outside as the ring is between them, and a filler fixing the lead to the ring, wherein the hermetic terminal seals the piezoelectric vibrating piece inside a case, the method includes the steps of: applying plating to a hermetic terminal intermediate having the lead fixed in the ring with the filler to plate the ring and the lead; setting the hermetic terminal intermediate after subjected to plating on a holding member; and flattening an end part of an inner lead portion in the lead to form a stair portion in the hermetic terminal intermediate set on the holding member.

Abstract: It is an object of the present invention to provide a package-type piezoelectric resonator which can be packaged at a wafer stage and is suitable for mass production. A package-type quartz resonator of the present invention is structured such that lead electrodes are interposed between stepped surfaces and a lower surface of a frame portion of a piezoelectric substrate in a close contact state when a base is joined to a lower surface side of the piezoelectric substrate, so that a space in a recessed portion of the base is airtightly sealed. Therefore, only by joining a cover to an upper surface side of the piezoelectric substrate and joining the base to the lower surface side of the piezoelectric substrate, it is possible to easily airtightly seal the piezoelectric substrate, which can avoid the complication of manufacturing processes.

Abstract: To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented.

Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body.

Abstract: Disclosed is a piezoelectric component (1) comprising a piezoelectric transducer (10) wherein a pair of electrodes (20a, 20b) are formed on both major surfaces of a piezoelectric substrate (11), a pair of frame members (30a, 30b) fitted to both major surfaces of the piezoelectric transducer (10), a pair of sealing substrates (40a, 40b) composed of a light-transmitting resin material and so fitted as to cover the frame members (30a, 30b), opaque coating layers (50a, 50b) respectively formed on the sealing substrates (40a, 40b), and a pair of input/output terminal electrodes (61a, 61b) respectively connected to the electrodes (20a, 20b). By having such a constitution, the state of sealed space and sealing widths of the frame members (30a, 30b) can be checked by visual examination such as direct visual observation or image recognition, and thus a highly reliable piezoelectric component (1) can be obtained. In addition, a mark can be made on the coating layers (50a, 50b).

Abstract: A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.

Abstract: A piezoelectric component with a monolithic stack, has electrode layers and piezoceramic layers arranged alternately one on top of the other, the piezoceramic layers have a piezoceramic, and having at least one porous security layer arranged in the stack for the formation of a crack if mechanical overload of the stack should occur. The piezoelectric component has an infiltration barrier arranged between the security layer and a lateral surface section of the stack for suppressing the penetration of a foreign substance into the security layer. The piezoelectric component can be as a piezoactuator for controlling a valve, particularly a valve of an internal combustion engine.

Abstract: A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.

Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns (41) which are at least partially connected to each other via one or more narrow connecting strips (42), and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

Abstract: This invention relates to a system for exciting oscillations of micromechanical cantilever sensors and for measuring and evaluating the corresponding oscillations. Such sensors can e.g. be used to detect chemical substances, biomolecules, microorganisms or viruses, or to analyze surface-related phenomena and processes such as conformational changes or phase transitions in thin layers, or to measure physical properties of their surrounding, such as viscoelastic properties of liquids. In the so-called dynamic operation mode, cantilever oscillations are excited and the frequency shift of the ground frequency and/or of one or some higher harmonics, occurring because of a process taking place at the cantilever surface, are measured. In the so-called static mode, the deflection of the cantilever is determined. The setup described in this invention allows measurements in gases as well as liquids.

Abstract: An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.

Abstract: In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.

Abstract: A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle.

Abstract: An oven controlled crystal oscillator capable of uniformly transmitting heat from the heat generator to improve the frequency-temperature characteristics. The oven controlled crystal oscillator includes a high thermal conductivity plate having high thermal conductivity and provided on one side of a substrate, where the crystal resonator is provided, in such a manner to contact the resistors, the transistor, the crystal resonator, and the temperature sensor. This structure can transmit heat from the resistors and the transistor as the heat generator to the crystal resonator and the temperature sensor rapidly with less heat loss to assure a uniform temperature inside the substrate, thereby improving the frequency-temperature characteristics.

Abstract: A head plate assembly (1) for an actuator, has a cover (2), a lead-through (3), at least one connecting pin (4) led through the lead-through (3), and a seal (5) obturating the lead-through of the connecting pin. The head plate assembly (1) is pre-assembled without the actuator.

Abstract: An electronic-component container is provided in which a metal lid is bonded with an insulating package. The container comprises the insulating package having a housing portion for housing an electronic component element having an electrical function, a metallized sealing portion formed around the housing portion and hermetically bonded with the metal lid, and a castellation having a terminal electrode formed at a side end portion thereof, and the metal lid formed in a shape as viewed from the top which is substantially equal to a shape as viewed from the top of the insulating package, wherein a brazing material is formed on a lower surface of the metal lid, and the brazing material is provided with a welding portion which is bonded with the metallized sealing portion inside the castellation when the metal lid is bonded with the insulating package.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.

Abstract: A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

Abstract: A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves.

Abstract: A hermetically sealed structure in which a base substrate 31 and a lid 33 are hermetically sealed, the base substrate serving as a part of a containing body for uniformly forming or bonding an electronic part, the lid being a lid body to be hermetically bonded to the base substrate, is structured as follows: the lid is made from a material, through which light passes; as a metal layer 25 of at least a sealing portion of the lid a platable layer 22 for performing plating and a bonding layer 24 made from gold, the bonding layer being formed closer to the front side than the platable layer are formed; and the lid is structured so as to be bonded to the base substrate 31 by an Au—Ge alloy.

Abstract: A new and improved piezoelectric device package that can withstand pressures of at least 25,000 psi, high temperatures of at least 300° C., as well as acidic and caustic environments, such as often encountered in oil and gas wells. The package is comprised of a hermetically sealed piezoelectric device header with an internal cavity for mounting various types of piezoelectric devices, an impedance matching network, an antenna, and a protective radome outer cover. The internal structure of the device package is for the most part solid with the exception of an approximate 1-micron space above the surface of the piezoelectric device to allow acoustic waves a path to travel. The general shape of the piezoelectric device package is typically that of a round disk that can be installed and secured by attaching fingers or other means in a bored cavity of a tool, pipe, or other piece of equipment.

Abstract: A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Abstract: A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

Abstract: To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portio