Abstract: A high-frequency module is constituted by mounting a surface-acoustic-wave device on an insulating substrate constituting a surface-acoustic-wave-device mount substrate in which insulating substrate a plurality of insulating layers are laminated. A ring-shaped ground electrode of the insulating substrate is electrically connected to a predetermined conductor pattern formed on a back surface of the insulating substrate through a plurality of via-conductors including a via-conductor directly connected to the electrode. Among the plurality of via-conductors, via-conductors other than the via-conductor directly connected to the ring-shaped ground electrode are disposed outside a ring-shaped electrode region, as seen in plan view, where the ring-shaped ground electrode is formed.

Abstract: A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of

Abstract: A surface mount type piezoelectric vibrator comprises a piezoelectric vibrator having a piezoelectric vibrating piece bonded to an airtight terminal with a lead terminal and sealed by a cylindrical bottomed metal sealing tube. An electrode terminal is connected to the lead terminal so that a tip of the electrode terminal is disposed approximately at the same position as a tip of the lead terminal in a longitudinal direction of the surface mount type piezoelectric vibrator. The piezoelectric vibrator is coated with a mold resin.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A seal (10) for a piezo-actuator of a fuel injector with terminal posts (12) projecting out of the piezo-actuator and a head arrangement (14) mounted on the piezo-actuator with openings (16) for passage of the terminal posts (12) is particularly suitable even for comparatively thin head plates. A sealing unit (18) mounted on the head arrangement (14) and provided with openings for passage of the terminal posts (12) is provided, having a support (22), on which a sealing material (26) is arranged, which is in contact in a sealing manner with the peripheral surfaces of the terminal posts (12) and a peripheral region of the head arrangement (14) and in which an element (20) made of microporous material is integrated to create gas permeability.

Abstract: A surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips.

Abstract: A piezoelectric device, includes: a package; a piezoelectric resonator element housed in the package; a lid made of metal and bonded to the package by seam welding to seal the package air-tightly; a metal film for frequency adjustment that is provided to the piezoelectric resonator element; and a window part provided to the lid and enabling a light to transmit therethrough.

Abstract: An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.

Abstract: A lightweight, compact, and flexible organic actuator module that is stably operated in a gas such as air and safely handled has a structure in which an organic actuator and a counter electrode immersed in electrolyte solution together with the gas are stored and sealed in a container provided with a flexible portion. In the actuator module, both ends of the organic actuator are fixed to the container, and only one end of the counter electrode is fixed to the container.

Abstract: An electronic module, comprises: a circuit board; a piezoelectric device having a lid, the piezoelectric device being mounted on the circuit board; and an electronic component mounted on the circuit board. The electronic component includes an adjustment terminal for at least one of adjusting and inspecting an electrical characteristic thereof. The lid is electrically conducted to the adjustment terminal.

Abstract: A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.

Abstract: The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.

Abstract: A highly reliable surface acoustic wave device includes a low-resistance piezoelectric substrate that is difficult to reoxidize even in a high-temperature atmosphere containing oxygen. The piezoelectric substrate has a specific resistance of about 1.0×107 ?·cm to about 1.0×1013 ?·cm, an interdigital electrode on a main surface of the substrate, and a protective film covering the interdigital electrode.

Abstract: A piezoelectric resonator element is provided including a base portion and a plurality of resonating arms extending from the base portion. A notch part is formed in the base portion. Grooves are formed in the front and back surfaces of the resonating arms. A driving electrode is provided at least in the grooves of the resonating arms. The driving electrode has a lower layer and an electrode layer formed on the lower layer. The thickness t of the lower layer is in the range 0.07<t<0.3 micrometers.

Abstract: A combination transducer and water-blocking film for acoustic signaling through ambient water. The water-blocking film has an etched fluoropolymer film and adjacent bonding film interposed between the transducer and the water. Potting material extends adjacent to and is bonded to both sides of the water-blocking film. The film and potting material create an acoustic window. The etched fluoropolymer film is approximately one to two thousandths inch thick and the bonding film is approximately one thousandths inch thick, and the potting material is a polyurethane matrix.

Abstract: An electronics filter circuit includes an electromechanical resonator that is mounted directly to the surface of a silicon integrated circuit, rather than being a surface mounted or leaded filter can on a circuit board. This filter circuit allows the integrated circuit electronic package to be significantly smaller than a conventional electromechanical resonator package. The electromechanical resonator may be protected during processing and during use with a protective cover that is made of a material such as titanium. The protective cover is attached to the integrated circuit chip.

Abstract: An insert terminal containing case includes a bottom wall, four side walls, and an opening at the upper portion, wherein a terminal made of a metal plate is vertically fixed to at least one of the four side walls by insert molding. A groove is vertically arranged at the outer side surface of the side wall fixing the terminal, the groove extending downward, the outer side surface of the terminal is partially exposed at the groove, and the inner side surface opposite the outer side surface of the terminal exposed at the groove is partially exposed at the inner side surface of the side wall. Therefore, when the terminal is provided in the case by insert molding, molding can be performed only using upper and lower dies. Furthermore, the terminal can be reliably exposed at the inner surface of the side wall. The insert terminal containing case has the minimum difference between the opening dimension of the case and the dimension of a piezoelectric diaphragm and is molded without using a sliding die.

Abstract: An actuator is disclosed, which includes a piezoelectric bimorph. The actuator also includes a substantially moisture impervious and electrically insulating packaging having a cavity around the bimorph providing for a clearance around the bimorph. The packaging includes a carrier having first and second surfaces and an aperture wherein the bimorph is disposed, the packaging further includes first and second cover films selectively attached to the first and second surfaces respectively, and at least one flex circuit connected to the bimorph for supplying electrical energy thereto.

Abstract: A piezoelectric oscillator includes: a package having a package base, a bottom surface, a conductive cap that seals airtightly an interior space of the package base, and a terminal to perform at least one of inputting a signal from outside of the package and outputting a signal from the outside of the package. The piezoelectric oscillator also includes a piezoelectric oscillating piece disposed in the package and an electronic part disposed in the package. The conductive cap is coupled to the terminal to perform at least one of the inputting of the signal from the outside of the package and the outputting of the signal to the outside of the package. The terminal is provided on the electronic part and a plurality of mounting terminals are provided on the bottom surface of the package and are electrically coupled to the electronic part.

Abstract: A piezoelectric device includes an element substrate having a piezoelectric element and an electrically conductive pattern connected to the piezoelectric element, a supporting layer arranged within the periphery of the piezoelectric element, a cover extending so as to provide a groove inside the external periphery of the element substrate, the groove ranging over the entire external periphery of the element substrate by removing a portion of the cover and/or supporting layer inside the external periphery of the element substrate after the cover is arranged on the supporting layer, an insulating reinforcing material that entirely covers portions of the element substrate ranging from the cover to the periphery of a principal surface of the element substrate, and an electrically conductive member electrically connected to the electrically conductive pattern so as to pass through the cover and the reinforcing material.

Abstract: A temperature compensated crystal oscillator has a package body, a crystal blank hermetically sealed in a first recess of the package body, and an IC chip which includes an oscillation circuit electrically connected to the crystal blank, and a temperature compensating mechanism for compensating the crystal blank for the frequency-temperature characteristic. The oscillation circuit and temperature compensating mechanism are integrated into the IC chip. The IC chip is received in a second recess of the package body such that a circuit formation surface thereof faces the bottom face of the package body. External write terminals are formed on a principal surface of the IC chip, which is not the circuit formation surface, for writing temperature compensation data into the temperature compensating mechanism.

Abstract: A surface acoustic wave device that enables to reduce heating process, prevent from heat break, and make thin profile is to be provided. The surface acoustic wave device includes a substrate, a surface acoustic wave element having a comb electrode formed on a piezoelectric substrate, and being flip-mounted on the substrate using a bump in such a manner as the comb electrode is disposed opposite to the substrate, a first resin layer covering the surface acoustic wave element, and a second resin layer formed on the first resin layer, wherein the first resin layer and the second resin layer are thermosetting resins in which state transitions of being softened and thereafter cured are produced through heating process, and the first resin layer is formed of a resin material having greater fluidity caused by softening than the resin material of the second resin layer.

Abstract: Various micro-transducers incorporating piezoelectric materials for converting energy in one form to useful energy in another form are disclosed. In one embodiment, a piezoelectric micro-transducer can be operated either as a micro-heat engine, converting thermal energy into electrical energy, or as a micro-heat pump, consuming electrical energy to transfer thermal energy from a low-temperature heat source to a high-temperature heat sink. In another embodiment, a piezoelectric micro-transducer is used to convert the kinetic energy of an oscillating or vibrating body on which the micro-transducer is placed into useful electrical energy. A piezoelectric micro-transducer also is used to extract work from a pressurized stream of fluid. Also disclosed are a micro-internal combustion engine and a micro-heat engine based on the Rankine cycle in which a single fluid serves as a working fluid and a fuel.

Abstract: Method for manufacturing an electromechanical sensor element for converting mechanical forces produced by the movements and vital functions or a person into electric signals, in which method a sensor film (11) is provided with metallic electrodes (15,16) placed on either side of it, at least one of said electrodes being a signal electrode, in which method is produced by cutting off a larger amount of sensor element material, in which method in the manufacture of sensor element material the electrodes are created in a continuous roll-to-roll process, and in which method the sensor element material is produced by laminating as a continuous roll-to-roll process. At least the sensor element material consists of repeated electrode patterns and a sensor element of a desired size and/or shape is formed by cutting the material between the patterns.

Abstract: The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.

Abstract: A method is described for improving the long-term stability of a piezoelectric actuator encased in a potting compound containing or forming hydrogen atoms. Oxygen is contained in the piezoelectric actuator's piezoelectric ceramic. Appropriate means are employed so that unsaturated bonds of the hydrogen in the potting compound will release less oxygen from the piezoelectric ceramic. One means consists in reducing the concentration of hydrogen in the potting compound, with appropriate thermal processes as a result of which the concentration of hydrogen will be reduced to below a predefined threshold being applied after the piezoelectric actuator has been encased in the potting compound. Means that form bonds with the hydrogen in the potting compound or duct oxygen thereto are provided in further embodiments.

Abstract: A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, a package housing the surface acoustic wave chip, and electrode patterns provided on a bottom surface of the package. The bottom surface of the package is wider than a top surface of the package. The electrode patterns are away from edges of the bottom surface of the package.

Abstract: An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.

Abstract: A bonded substrate includes a lithium tantalate substrate and a sapphire substrate to which the lithium tantalate substrate is bonded, a bonded interface of the lithium tantalate and the sapphire substrate includes a bonded region in an amorphous state having a thickness of 0.3 nm to 2.5 nm. The bonded region in the amorphous state is formed by activating at least one of the lithium tantalate substrate and the sapphire substrate in the bonded interface with neutralized atom beams, ion beams or plasma of inert gas or oxygen. It is possible to bond the piezoelectric substrate to the supporting substrate having different lattice constants without the high-temperature thermal treatment and realize the bonded substrate having an excellent bonding strength and being less warped.

Abstract: An electronic component includes at least one piezoelectric vibrating portion, a connecting portion provided on a substrate, a structural piece including a concavity so as not to disturb the vibration of the piezoelectric vibrating portion, and a connecting wiring for electrically connecting a pad on the substrate to a mounting wiring disposed on the upper surface of the structural piece. The structural piece further includes a through hole having an electroconductive material filled therein. The structural piece seals the piezoelectric vibrating portion.

Abstract: A piezoelectric actuator 21 has: a piezoelectric actuator part 22 made up of a common electrode 27, a piezoelectric element 29, and an individual electrode 33; an electrical interconnection joint part 43 formed on the individual electrode 33; an electrical interconnection 45 formed on the electrical interconnection joint part 43; a head block 47 fixed to a nozzle plate 39 through the electrical interconnection 45; and a PI tape 49 disposed within the head block 47. A closed space 57 is defined between the head block 47 and the nozzle plate 39. The closed space 57 is divided by the PI tape 49 into two sections. Of these two sections of the closed space 57, the one on the side of the head block 47 constitutes a first closed space 57a. A moisture absorbent 52 is sealed within the first closed space 57a. Relative humidity within the closed space 57 of the ink jet head 1 is not less than 0% nor more than 20%.

Abstract: A transducer including a transducer body, a sensor associated with the transducer body, an electrical connector assembly fastened to an end of the transducer body, and a vibration damper system disposed between the end of the transducer body and the electrical connector assembly. The vibration damper system being operative for attenuating vibrational acceleration and amplification forces experienced by the electrical connector assembly when the transducer is exposed to vibration.

Abstract: An actuator, comprising a beam (2) including a laminated structure which has piezoelectric layers (30, 31, 32) and electrode layers (20, 21, 22, 23), a holding mechanism to hold the beam, a feeding terminal (10) to supply an exciting power to the electrode layers of the beam, and a contact mechanism provided in the holding mechanism, the holding mechanism comprising a case (1) including a space (5) to house the beam (2) and a holding part to hold at least one of an end and a central portion of the beam (2), the contact mechanism being configured to contact with a part of the beam (2) and prevent the beam from excessively deflecting when a great impact is added to the beam.

Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.

Abstract: A spraying device comprises a spraying plate, having a plurality of tiny holes, a vibrating element, set on a periphery of the spraying plate, and driving a vibrating movement thereof, a wrapping layer, made of soft material and tightly surrounding the vibrating element, sealing the vibrating element from the liquid, and a fastening cap, allowing for quick mounting and dismounting of the spraying device; wherein the vibrating movement of the spraying plate causes liquid adjacent to a lower side of the spraying plate to be periodically compressed and thereby to be pressed through the holes of the spraying plate, and wherein the wrapping layer prevents external interference with the vibrating movement, at the same time minimizing transmission losses of vibrational energy, enhancing effectivity of spraying.

Abstract: A piezoelectric device including an IC chip mounted on an inner bottom surface of a package, and a piezoelectric vibrating reed electrically and mechanically connected onto a TAB tape in which a lead is provided on a surface of a resin tape. The TAB tape to which the piezoelectric vibrating reed has been joined is mounted in the package, whereby the piezoelectric vibrating reed is arranged above the IC chip.

Abstract: An actuator includes a piezoelectric stack within a housing that applies a compressive load to the stack. The housing may include a cylindrical tube closed at one end and may seal the stack against fluid pressure. The housing may be shorter than the length of the piezoelectric stack and may include resilient means for inducing elastic strain in the stack. The resilient means may include one or more slots extending around the circumference of the housing and/or a corrugated region of the housing to form a tension spring at a lower end of the housing. The tension spring may then serve to draw the stack into compression. The stack may include a plurality of layers of piezoelectric or piezoceramic material interspersed with a plurality of layers of electrically conductive material and connecting means for connecting the layers to a source of electrical power.

Abstract: A quartz crystal unit includes a casing body having a cavity defined therein and having an opening, a quartz crystal blank disposed in the cavity, and a metal cover closing the opening of the cavity and hermetically sealing the crystal blank in the cavity. The metal cover has a core made of Kovar, a barrier metal layer disposed on one principal surface of the core, and a brazing layer disposed on the barrier metal layer. The barrier metal layer is made of an alloy which is composed mainly of copper and which has a thermal expansion coefficient that is smaller than a thermal expansion coefficient of cupper. The metal cover is joined to a peripheral edge portion of the opening by the brazing layer. The barrier metal layer is preferably made of a copper-nickel alloy, and the brazing layer is preferably made of silver brazing material.

Abstract: A surface acoustic wave apparatus includes a first filter and a second filter, which are integrated into one package, and, filter signal terminals of the first and second filters are connected to package signal terminals of the package through different paths which are insulated from each other. A signal line extended from filter signal terminals is connected to one common terminal outside the package. The signal line and the common terminal define a coupling section. An inductance device is connected in parallel to the coupling section as a matching circuit.

Abstract: The invention concerns an assembly comprising a piezoelectric resonator and a case, said case including a main part with a bottom and sides, in which said resonator is mounted and a cover fixed to said main part, said resonator including a tuning fork shaped part with two parallel vibrating arms connected to each other by a linking part, and a central arm protruding from said linking part and located between both vibrating arms carrying at least two electrodes to make them vibrate, these two electrodes being connected respectively to at least first and second connection pads located on a back face of said central arm oriented toward the bottom of the case, said case further comprising at least one support secured to its bottom on which said central arm of the resonator is fixed by means of at least first and second connection elements located on said support and electrically connected respectively to said first and second connection pads by a conductive adhesive, wherein guiding means are provided at least wi

Abstract: An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

Abstract: A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires outward at an angle of about 90 degrees, forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on the tip side from the bending point so as to be extended substantially parallel to a lead portion of the lead terminal, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires, forming a cup-shaped holder portion by bending the flat portion inwards, holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions, and electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.

Abstract: A piezoelectric diaphragm has principal-surface electrodes formed on upper and lower principal surfaces of a multilayer ceramic body. An internal electrode is disposed in an interface between adjacent piezoelectric ceramic layers. The upper and lower principal surfaces of the multilayer ceramic body are substantially entirely covered with a resin layer. A first cutout is formed in a side-edge portion, along the first side surface electrode, of the upper resin layer such that the upper principal-surface electrode is partially exposed in the first cutout. A second cutout is formed in a side-edge portion, along the first side surface electrode, of the lower resin layer such that the lower principal-surface electrode is partially exposed in the second cutout. The locations of the first and second cutouts formed in the upper and lower resin layers, respectively, are selected such that they do not oppose each other.

Abstract: A piezoelectric device includes a base substrate constituting the bottom of the package; a framed resonator element layered on the base substrate; and a lid for hermetically sealing a space within the package, the lid being layered on the framed resonator element. The framed resonator element includes a frame constituting a wall surrounding the space within the package; a base having a predetermined width, which is integrally formed inside the frame; a plurality of resonating arms that extend in parallel to each other from the base in one direction in the frame; first cutouts that are provided near the base ends of the resonating arms in the base; and second cutouts formed at the joint between the base and the frame.

Abstract: A quartz crystal sensor cell in which the sensor is secured to the base of a well defining a test sample space by a layer of adhesive between the respective peripheral surfaces. Also a quartz crystal sensor cell is provided in which the quartz sensor crystal is inclined relative to the opposite surface of the test sample space. These constructions respectively improve distinctness of the “Q” peak and problems from reflected waves in the space.

Abstract: To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.

Abstract: An electro-active transducer includes a ferroelectric material sandwiched by first and second electrode patterns. When the device is used as an actuator, the first and second electrode patterns are configured to introduce an electric field into the ferroelectric material when voltage is applied to the electrode patterns. When the device is used as a sensor, the first and second electrode patterns are configured to introduce an electric field into the ferroelectric material when the ferroelectric material experiences deflection in a direction substantially perpendicular thereto. In each case, the electrode patterns are designed to cause the electric field to: i) originate at a region of the ferroelectric material between the first and second electrode patterns, and ii) extend radially outward from the region of the ferroelectric material (at which the electric field originates) and substantially parallel to the ferroelectric material's plane.

Abstract: A surface acoustic wave device includes a sealing resin for sealing a gap between a surface acoustic wave element and a mounting board. The sealing resin is prevented from flowing so as to reach a vibrating portion of the surface acoustic wave element. In the surface acoustic wave device, a surface acoustic wave element is connected to a mounting board through bumps, the outer peripheral edge of the surface acoustic wave element is sealed by a sealing resin, and a vibration space is secured between the vibrating portion of the surface acoustic wave element and mounting board. In the surface acoustic wave element, an outer barrier enclosing the bumps and the vibrating portion and an inner barrier enclosing the vibrating portion are provided, the height of the outer barrier is lower than the total height of the height of the bumps and the height of electrode lands formed on the mounting board, and the height of the inner barrier is lower than the height of the bumps.

Abstract: A surface mount crystal unit comprising a crystal blank, a planar mounting substrate made of silicon and a cover having a shape with a recess and made of glass containing ions having high mobility. The mounting substrate and the cover are bonded by means of anode bonding and the crystal blank is hermetically sealed in a case made up of the mounting substrate and the cover. The mounting substrate has connection electrodes used for a connection with the crystal blank and external terminals to be used to surface-mount the crystal unit. The connection electrodes and external terminals are electrically connected.

Abstract: A surface acoustic wave device includes a surface acoustic wave filter element having a piezoelectric substrate on which comb-like electrodes are formed, and a package having a first cavity in which the surface acoustic wave filter is housed. The package includes a flexible chip mounting base having a first surface on which the surface acoustic wave filter is mounted and having a thickness equal to or less than 100 ?m.