Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns which are at least partially connected to each other via one or more narrow connecting strips, and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: A piezoelectric resonator component includes an energy-trapped piezoelectric resonator utilizing a third order harmonic wave of thickness longitudinal vibration and including a piezoelectric substrate having first and second major surfaces and polarized in a direction of thickness between the first and second major surfaces, and first and second vibrating electrodes opposed to each other with the piezoelectric substrate interposed therebetween, and first and second casing substrates respectively laminated on the first and second major surfaces of the piezoelectric resonator so that cavities are arranged so as not to interfere with vibration of a vibration section where the first and second vibrating electrodes face each other through the piezoelectric substrate. The first and second vibrating electrodes are dimensioned so that the difference between the peak values of the phases of S0 and S1 modes of the fundamental wave of the thickness longitudinal vibration falls within a range of about ±5 degrees.

Abstract: A composite transducer array comprises a piezoelectric polymer composite panel, a continuous electrode coupled to a first surface of the composite panel, and a plurality of electrically-isolated electrode segments coupled to a second surface of the composite panel. Each electrode segment is shaped as an angular segment of a circular ring. The electrode segments are arranged to define an array of concentric circular rings of electrode segments.

Abstract: A compact and thin piezo-electric resonator is provided having a high air-tightness and available at a low cost, in which a piezo-electric resonator element is provided in a housing having a structure which permits adjustment of the frequency after sealing the housing. Further, a surface-mounting type piezo-electric resonator is provided, in which a piezo-electric resonator element is provided in a housing, having a structure which permits frequency adjustment through an opening provided in a base or a lid forming the housing.

Abstract: A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin.

Abstract: A compact and thin piezo-electric resonator is provided having a high air-tightness and available at a low cost, in which a piezo-electric resonator element is provided in a housing having a structure which permits adjustment of the frequency after sealing the housing. Further, a surface-mounting type piezo-electric resonator is provided, in which a piezo-electric resonator element is provided in a housing, having a structure which permits frequency adjustment through an opening provided in a base or a lid forming the housing.

Abstract: The invention relates to a monolithic multilayer actuator comprising a sintered stack of thin films, made from piezo-ceramic with inlaid metallic inner electrodes which extend from the stack on alternate sides and are electrically wired in parallel with external electrodes (3, 4) and are provided with connector wires (5). According to the invention, the actuator may be supplied with nominal voltage over a long period of time, without a change in the properties thereof, whereby the multilayer actuator (1) is sealed within a metallic or ceramic housing (8, 11, 16), the connector wires (5) are integral parts of the housing base (11) and the housing (8, 11, 16) is filled with a water-absorbing medium (14) and a water-transporting, electrically-insulating medium (15).

Abstract: A piezoelectric vibrator has a container having a hermetically sealed cavity and a transparent portion for transmitting therethough a laser beam into the hermetically sealed cavity. A piezoelectric vibrator piece is disposed in the hermetically sealed cavity. A gettering substance is disposed directly on a surface of the piezoelectric vibrator piece so that when a laser beam is irradiated on the metal film through the transparent portion of the container the metal film is vaporized to absorb any gases contained in the hermetically sealed cavity of the container to thereby increase a degree of vacuum within the hermetically sealed cavity.

Abstract: The invention provides a piezoelectric oscillator having a reduced horizontal size and capable of being mounted in a small area. The invention also provides a portable telephone and an electronic device using such a piezoelectric oscillator. The piezoelectric oscillator includes a first package and a second package which are firmly connected to each other such that the second package is located on the first package. An oscillator circuit element is disposed in the first package, and a piezoelectric resonator is disposed in the second package. The first package includes a first lead frame and a second lead frame. End parts of the first lead frame are bent downward such that the bent portions at the lower end are exposed to the outside and serve as the first connection terminals. The second lead frame is placed on the first lead frame. End parts of the second lead frame are bent upward so as to serve as second connection terminals. The first connection terminals described above are used as mounting terminals.

Abstract: A surface acoustic wave device includes a surface acoustic wave element, a packaging case, and a packaging electrode. The surface acoustic wave element has a piezoelectric substrate, an interdigital transducer, an electrode pad, an intermediate electrode, an upper electrode, and a bump electrode. The intermediate electrode is preferably made of NiCr including about 15 to about 30 weight percent of Cr. The electrode pad and upper electrode are made of Al. The bump electrode is press-bonded to the packaging electrode with an ultrasonic wave or heat applied to the bump electrode. The resulting surface acoustic wave device has excellent characteristics and the surface acoustic wave element is not removed or peeled from the packaging case during a drop test.

Abstract: A piezoelectric relay is disclosed in which a liquid metal droplet is moved within a switching channel formed in relay housing. A signal path passing through the switching channel is blocked or unblocked by motion of the liquid metal droplet that coalesces with one of two additional liquid metal droplets. Motion of the liquid metal droplets is controlled by piezoelectric pumps that control the flow of actuation fluid between a fluid reservoir and the switching channel. The liquid metal droplets are held in place by surface tension acting on wettable contact pads within the switching channel. The surface tension of the liquid provides a latching mechanism for the relay.

Abstract: A fluid-control electro-active device includes a piezo-diaphragm made from a ferroelectric material sandwiched by first and second electrode patterns configured to introduce an electric field into the ferroelectric material when voltage is applied thereto. The electric field originates at a region of the ferroelectric material between the first and second electrode patterns, and extends radially outward from this region of the ferroelectric material and substantially parallel to the plane of the ferroelectric material. The piezo-diaphragm deflects symmetrically about this region in a direction substantially perpendicular to the electric field. An annular region coupled to and extending radially outward from the piezo-diaphragm perimetrically borders the piezo-diaphragm. A housing is connected to the annular region and defines at least one fluid flow path therethrough with the piezo-diaphragm disposed therein.

Abstract: An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.

Abstract: A housing having lead frames which are protruded to contact and to resiliently support a piezoelectric transformer and a method of manufacturing the housing is disclosed. The housing has an upper housing part having at least two first lead frames protruded to resiliently contact input and output portions of an upper surface of the piezoelectric transformer, and a lower housing part having at least two second lead frames protruded to resiliently come into contact with the input and output portions of a lower surface of the piezoelectric transformer. The first and second lead frames are outwardly extended from the upper and lower housing parts, and the piezoelectric transformer is received in the upper and lower housing parts such that the piezoelectric transformer is resiliently supported by the first and second lead frames.

Abstract: A crystal package that contains two or more crystals that resonate at differing frequencies. The crystal package has a substrate with a top surface, a bottom surface, and side surfaces. A cavity is located in the top surface. A pair of steps are located in the cavity. A crystal is mounted to one of the steps and extends over the cavity. Another crystal is mounted to the other step and extends over the first crystal. The steps are at different heights above the bottom surface. Electronic circuitry may also be mounted within the crystal package.

Abstract: The invention relates to a monolithic multilayer actuator comprising a sintered stack of thin films, made from piezo-ceramic with inlaid metalic inner electrodes which extend from the stack on alternate sides and are electrically wired in parallel with external electrodes (3, 4) and are provided with connector wires (5). According to the invention, the actuator may be supplied with nominal voltage over a long period of time, without a change in the properties thereof, whereby the multilayer actuator (1) is sealed within a metallic or ceramic housing (8, 11, 16), the connector wires (5) are integral parts of the housing base (11) and the housing (8, 11, 16) is filled with a water-absorbing medium (14) and a water-transporting, electrically-insulating medium (15).

Abstract: A piezoelectric vibrator has a piezoelectric vibrating piece having a base portion, a free end, and an intermediate portion disposed therebetween. Each of a pair of covers has a main surface and at least two recesses formed in the main surface. The covers are connected together so that the recesses of the covers form a hermetically sealed cavity into which the piezoelectric vibrating piece of the piezoelectric vibrating plate extends in a state in which the piezoelectric vibrating piece is capable of undergoing oscillating movement. The recesses of each of the covers extend to different depths from the main surface thereof so that during oscillating movement of the piezoelectric vibrating piece, the free end of the piezoelectric vibrating piece is prevented from contacting any one of the covers by contact between the intermediate portion of the piezoelectric vibrating piece and the main surface of the one cover.

Abstract: An electronic component includes a piezoelectric element and at least a pair of lead terminals having cup-shaped holder portions attached to hold both ends of the piezoelectric element. The cup-shaped holder portions and the electrodes disposed at both end portions of the piezoelectric element are electrically and mechanically connected by a conductive joining material. The lead terminals are made of a conductive wire, and one end portion of the lead terminals is bent outwards at an angle of about 90 degrees and flat portions are defined by press extending the portions on the tip side from the bending points that extend substantially parallel to the lead portions, and the cup-shaped holder portions are formed by bending the flat portions inwards.

Abstract: A compound electro-acoustic transducer for producing acoustic signals has a plurality of elements. Each element has a piezoelectric disk with electrically conductive plates fixed on the top and bottom sides of the piezoelectric disk. A stud is joined to an outer face of each plate. Conductors can be joined to each stud. The elements can be assembled on a resilient structure to form an array. Elements can be used in the array or individually accessed.

Abstract: A piezoelectric electroacoustic transducer includes a piezoelectric diaphragm having a substantially rectangular shape which vibrates in the thickness direction when an alternating current is applied between electrodes of the piezoelectric diaphragm, a housing which stores the piezoelectric diaphragm, and a pair of terminals formed in the housing by insert molding. One end of each terminal is inserted inside the housing and includes a body portion fixed to the housing and wing portions which extend from both sides of the body portion toward the corners of the housing. The wing portions are not fixed to the housing, and stress-relieving portions are disposed between the body portion and the wing portions so that the wing portions are able to move toward the inside of the housing. Each electrode of the piezoelectric diaphragm is connected to at least one of the wing portions of the terminals by a conductive adhesive.

Abstract: A chip electronic component capable of being mounted with high density while preventing separation of bonded portions caused by solder fillets without requiring a case member having a complicated structure is provided at a low cost. The chip electronic component includes an electronic component element board including a circuit that defines an electronic component therein and having a pair of side surfaces and a lower surface, and a plurality of external electrodes extending over at least one of the side surface and the lower surface of the electronic component element and being electrically connected to the circuit provided therein. The electrode portion provided on the lower surface of the monolithic body as an electronic component element of each external electrode is provided with narrow portions and wide portions provided thereon, and the narrow portion continues to the external electrode portion provided on the side surface thereof.

Abstract: To provide a method of sealing piezoelectric devices with covers capable of rapidly and securely sealing a plurality of packages or many packages of piezoelectric devices with covers.

Abstract: A pulse detection device has a base plate having a first main surface disposable against a part of a living body during use of the pulse detection device, a second main surface disposed opposite the first main surface, and a channel formed in the second main surface. A first piezoelectric element is disposed in the channel of the base plate for transmitting an ultrasonic signal toward an artery in the living body. A second piezoelectric element is disposed in the channel of the base plate for receiving the ultrasonic signal transmitted by the first piezoelectric element and reflected by the artery.

Abstract: A piezoelectric resonator includes a piezoelectric resonating element, and a first exterior substrate and a second exterior substrate, laminated over and under, respectively, the piezoelectric resonating element. In the piezoelectric resonator, the first exterior substrate and the second exterior substrate each include a multilayer substrate having at least one layer of an internal electrode.

Abstract: The invention provides a surface acoustic wave device and a manufacturing method thereof which enhances reliability and yield.

Abstract: The present invention is for a thermally controlled package for oscillators, particularly evacuated miniature surface acoustical wave oscillators (EMSO) devices. In a preferred embodiment the surface acoustical wave device is bonded directly to a heated substrate. The package is evacuated to improve temperature characteristics. A temperature heater, sensor, and control controller are utilized to maintain the internal package temperature above ambient. In one embodiment there is an additional substrate layer that house components that are not sensitive to temperature with interconnects electrically connecting the heated substrate and the additional substrates.

Abstract: While suppressing that a vibration of a piezo-electric element propagates to a substrate by devising the composition of an electro-conductive support body, the piezoelectric resonant component which secures electroconductivity and can maintain a fall-proof shock property is provided. The piezoelectric resonant component has a substrate 20 on the top surface of which pattern electrodes 21 and 22 are formed, and on the lower surface of which it has electrodes 8 and 9. It has a piezoelectric element 1 using the length vibration on the substrate 20. Electro-conductive support bodies 10 and 11 are fixed to the length direction center section of the lower surface electrodes of the piezoelectric element 1. The connection fixation of these support bodies 10 and 11 to the pattern electrodes 21 and 22 of the substrate 20 is performed by electro-conductive adhesives 12 and 13.

Abstract: A crystal oscillator is mounted on a ceramic substrate so that the crystal oscillator is sealed air tight. The peripheral portion of the lower surface of the substrate is provided with electrodes for external connection that project downward from the lower surface of the substrate. An electronic component is mounted on the lower surface of the substrate.

Abstract: A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold—gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.

Abstract: When sapphire is epitaxially grown on a seed substrate of Si at a growth temperature of about 350° C. by an ionized cluster beam vapor deposition and epitaxy method, a &ggr; phase Al2O3 layer is formed. When the &ggr; phase Al2O3 layer is exposed to a high temperature of not lower than 1000° C., the &ggr; phase Al2O3 layer then changes to an &agr; phase Al2O3 layer by phase transition. A known or optional semiconductor light-emitting element can be formed on the &agr; phase sapphire. When the seed substrate of Si is then selectively removed by etching, a semiconductor light-emitting element having a light-extracting surface of the sapphire processed into a desired shape can be obtained. As a result, external quantum efficiency of the semiconductor light-emitting element can be improved as well as light-condensing characteristic and directivity of light output from the semiconductor light-emitting element can be improved.

Abstract: An actuator (1), in particular for operation of fuel injectors in fuel injection systems of internal combustion engines, has in this embodiment a plurality of layers (2) of a piezoelectric or magnetostrictive material arranged in a stack. The actuator (1) is prestressed by a tie rod (6) arranged in a central recess (5) by way of opposing threads (7 and 8). Securing the device and the transfer of force are accomplished by a cover plate (3) and a bottom plate (4). The prestress can also be created by a sheathing (9) surrounding the actuator (1), which transfers an axial force component onto the layers (2) via the cover plate (3) and the bottom plate (4) by flanging of projecting ends (10).

Abstract: In a crystal unit suitable for use in a thermostat oven, a first and a second excitation electrode are disposed on a first and a second surface of a crystal blank. A first and a second connection are disposed on the second surface as connections formed by applying a fillet of a mixture of a low-melting glass and a metal filler, and melting the fillet by heating. A third connection is disposed on a peripheral edge of the crystal blank to extend over both surfaces. A lead of the first excitation electrode is directly connected to the third connection, while a lead of the second excitation electrode is connected to the first connection through a vapor-deposited metal thin film. The second and third connections are connected to each other through a vapor-deposited metal thin film. The first and second connections are secured to a pair of holding members by brazing.

Abstract: A metallized electrode is provided at a fixed location of the main body of a package such that the metallized electrode is located above signal electrodes and is not in contact with the signal electrodes and an insulating joining material. Also, the metallized electrode is made conductive to the grounding electrode.

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: A piezoelectric vibrator of a high impact resistance is attained. The piezoelectric vibrator according to the present invention has a piezoelectric vibrating plate formed so that a vibrating portion thereof be integral with a frame, and covers disposed on upper and lower surfaces of the frame and sealing the piezoelectric vibrating plate air-tightly. The covers have first recesses in the sections thereof which are opposed to such a section of the vibrating member that is between a base section thereof and a free end section thereof and have spaces between inner surfaces of the same recesses and a surface of the vibrating member, and second recesses having in the vicinity of the free end a space of a width greater than a distance between the first recesses and vibrating member.

Abstract: A small piezoelectric vibrator having low equivalent series resistance is realized. In the piezoelectric vibrator of the invention, a gettering substance for gettering inner gas is provided in a sealed space formed by a hermetic container where a piezoelectric vibrator piece is arranged. The gettering substance is formed on a surface of the piezoelectric vibrator piece or an inside wall of the hermetic container. A manufacturing process for the piezoelectric vibrator includes a process in which the gettering substance is provided inside the hermetic container which contains the piezoelectric vibrator piece inside the hermetic container, a process in which the hermetic container is hermetic-sealed so that the piezoelectric vibrator piece is sealed in the hermetic container, and a process in which the gettering substance is heated by a laser beam from outside to perform gettering of the inner gas of the hermetic container.

Abstract: A method is provided for fabricating a piezoelectric vibrator without degrading vibration characteristics. The piezoelectric vibrator has a vibration plate formed with a piezoelectric vibration portion and a frame portion integrally connected with a base portion of the piezoelectric vibration portion and surrounding the piezoelectric vibration portion. Opposite surfaces of the piezoelectric vibration plate are provided with a pair of lid members bonded to hermetically seal the piezoelectric vibration portion without interfering with vibration thereof. To achieve the bonding, a metal film is coated over substantially the entire area of opposite surfaces of the piezoelectric vibration plate. The metal film is patterned to form oscillation electrode films on opposite surfaces of the piezoelectric vibration portion and to form bonding films on opposite surfaces of the frame portion for bonding the frame portion to the pair of lid members.

Abstract: In a piezoelectric resonator container having a cylindrical case, one end of which is an open end, and a stem for sealing the open end of the case, an outer peripheral face of the stem and an inner peripheral face of the case have a nearly elliptical shape or an elliptical shape, respectively. A pressure allowance when pressing the stem into the open end of the case monotonically increases from a major axis portion of the case toward a minor axis portion. Therefore, since the pressure allowance is large at minor axis portions where vertical stress tends to decrease and the pressure allowance is small at major axis portions where tensile stress tends to increase, incomplete gas-tightness due to inadequate sealing or breaking of the case does not occur. This provides a piezoelectric resonator container in which incomplete gas-tightness is not caused, even if an elliptical or a nearly elliptical case is used, and a piezoelectric resonator piece does not come into contact with the inner periphery of the case.

Abstract: There is put forward a piezolectric element for converting pressure signals into electrical signals and vice versa, with a porous homogeneous ceramic body and with at least two electrodes attached to the ceramic body. The porous ceramic body comprises open pores and is preferably hermetically sealed on the whole surface with an elastic coating. Furthermore there is suggested an oscillation transducer with the piezolement which is accommodated in a housing. The piezolectric element is with one end face rigidly connected to the base of the housing. The other end face represents a surface which is sensitive to oscillations, which preferably is not covered by the housing. The volume of the housing is filled with a casting compound, wherein the piezolectric element is mechanically decoupled from the casting compound.

Abstract: Disclosed is a surface acoustic wave device comprising a piezoelectric substrate; an electrode unit formed on the piezoelectric substrate, the electrode unit including a drive electrode unit for generating surface acoustic waves and an external connection electrode unit; an electrically conductive electrode protecting unit for covering the drive electrode unit with a hollow therebetween, the electrode covering unit being formed on the piezoelectric substrate by use of a film forming technique; an electroconductive column formed on the external connection electrode unit; and an external connection terminal formed at the extremity of the electroconductive column, wherein the piezoelectric substrate is sealed by a resin with the exception of the external connection terminal and the electrode protecting unit.

Abstract: A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element and a base member together through metal bumps having a melting point of about 450° C. or higher such that the surface acoustic wave apparatus is fixed in a face down configuration to a bottom surface of a recess of the base member; and bonding a cap member and the base member with a wax material by heating the cap member and the base member uniformly at a temperature higher than a melting point of the wax material to melt the wax material.

Abstract: A package structure for a piezoelectric resonator includes a base which has a shape of flat box and made of an insulating material, and a thin lid bonded to the upper side of the base. A tuning fork type quartz crystal resonator piece is mounted at its one end, that is its base end, on electrode pads provided on the mounting surface in a cantilever manner using conductive adhesive so that it is parallel to the mounting surface, and hermetically sealed in a package with the lid engaged therewith. Either one or both of the mounting surface of the base and the inner surface of the lid has a recess formed at the location adjacent to the free end of a tuning fork type quartz crystal resonator piece so that the free end does not touch the inside surfaces of the packages when the quartz crystal resonator piece is largely dislocated on external impact.

Abstract: A package for a piezoelectric resonator, includes an insulating base that has a rectangular box shape and made of laminated thin ceramics sheets, and a lid that is made of a thin rectangular sheet of transparent glass material and bonded on the top surface of the base. A tuning fork type quartz crystal resonator element is hermetically sealed in the package. The corners of the lid are cut off diagonally at an angle of approximately 45 degrees or rounded so as to correspond to the cutouts of quarter circles at the corners of the base that result from via holes for wiring inside the base. A predetermined sealing width on the top surface of the base between the lid and the inner periphery of the base and a sufficient margin width between the periphery of the lid and the outer periphery of the base are ensured at the corners.

Abstract: A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

Abstract: A package has a first region and a second region on one principal plane, and has a base including a ceramic board where wiring patterns to connect a quartz crystal resonator element and an IC chip for its driving are formed. In the base, a first sidewall enclosing the first region is arranged on the top side of the board, and the quartz crystal resonator element is mounted in a first void space delimited in its internal, and the IC chip is mounted in a second void space delimited by a second sidewall enclosing the second region. The first sidewall is formed to be higher than the second sidewall, a metal cover is seam welded at the upper end thereof, and the first void space is sealed in a vacuum or nitrogen atmosphere. The IC chip of the second region is resin sealed.

Abstract: A chip-type piezoelectric component has greatly increased bond strength of external electrodes while allowing the external electrodes to be easily formed. The external electrodes including a conductive paste are continuously formed on the side surface of a laminated body in which a piezoelectric element is laminated with seal substrates in addition to embedding a part of the external electrodes in recesses in which terminal electrodes of the piezoelectric element have been exposed. A metal plating layer having good solder wettability is provided on the outermost layer of the external electrode. The bonding strength between the external electrode and the laminated body is greatly improved by the wedge effect of the conductive paste penetrated in the recess, thereby preventing the electrode from peeling.

Abstract: A SAW component has a component system that is mounted on a base plate such that it makes electrical contact with the base plate. A protective coating is provided on a component side of the component system that faces away from a connecting region between the component system and the base plate. The protective coating forms a seal, which is proof against environmental influences, for the component system toward the base plate.

Abstract: An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Abstract: An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.

Abstract: A piezoelectric acoustic component having excellent efficiencies of productivity and of acoustic conversion, a greatly miniaturized size, and excellent impact resistance properties, includes a unimorph type diaphragm. The unimorph type diaphragm is defined by adhering a substantially square piezoelectric element onto a substantially square metal plate, the shorter sides of the diaphragm are supported on the supporting portion provided within the two opposing side wall portions of the case, the clearance between the remaining two sides of the diaphragm, and the case is sealed with a resilient sealing agent. The case is adhered on the substrate having external electrodes, the metal plate is connected to the external electrode with a resilient conductive paste, and the surface electrode of the piezoelectric element is connected to the external electrode with a resilient conductive paste.