Sealed Unit Patents (Class 310/344)
  • Patent number: 7586240
    Abstract: An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: September 8, 2009
    Assignees: Fujitsu Media Devices Limited, Fujitsu Limited
    Inventors: Keiji Tsuda, Jyouji Kimura, Shunichi Aikawa, Kazunori Inoue, Takashi Matsuda
  • Patent number: 7576476
    Abstract: A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof; an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: August 18, 2009
    Assignee: Epson Toyocom Corporation
    Inventors: Yugo Koyama, Kazuhiko Shimodaira
  • Patent number: 7576470
    Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: August 18, 2009
    Assignee: Honeywell International Inc.
    Inventors: Sachin Kumar, James D. Cook, Gary O'Brien, Mohammed A J Qasimi, Richard C. Sorenson, Brian J. Marsh, Viorel V. Avramescu
  • Publication number: 20090174291
    Abstract: A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
    Type: Application
    Filed: January 5, 2009
    Publication date: July 9, 2009
    Applicant: Epson Toyocom Corporation
    Inventors: Yoji NAGANO, Hideo TANAYA, Tatsuya ANZAI
  • Publication number: 20090174290
    Abstract: A piezoelectric actuator for use in a diesel engine. The actuator comprises a piezoelectric element which is encapsulated such that a layer of gas at a pressure above atmospheric pressure surrounds the piezoelectric element. The presence of the gas within the encapsulation around the element avoids the need to passivate electrodes exposed on the surface of the element.
    Type: Application
    Filed: January 9, 2009
    Publication date: July 9, 2009
    Inventor: Michael Peter Cooke
  • Patent number: 7557493
    Abstract: A vibrator module includes a frame having an outer frame and an inner frame. A vibrator unit is formed inside the inner frame. The frame and the vibrator unit are formed of a piezoelectric ceramic or the like as one piece. On one side of the vibrator unit, an IC is mounted so that a hollow portion is provided between the vibrator unit and the IC. The periphery of the IC is filled with a resin material. On the other side of the vibrator unit, a top cover serving as a sealing material is mounted so that a hollow portion is provided between the vibrator unit and the top cover.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: July 7, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Katsumi Fujimoto
  • Patent number: 7557491
    Abstract: The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. The electronic component package 10 has a case 12 that has an opening and stores an electronic component (piezoelectric oscillator 11) in the storage inside, and a lid 16 that is joined to the rim of the opening to cover the opening, and airtightly seals a through-hole 20 provided on the bottom part 12b of the case 12 to communicate with the outside, by using a sealant 30.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: July 7, 2009
    Assignee: Citizen Holdings Co., Ltd.
    Inventors: Keisuke Kigawa, Mitsumasa Sakurai
  • Patent number: 7554247
    Abstract: An object of the present invention is to perform measuring work easily when detecting the presence or absence of an object to be measured or the concentration thereof using a plurality of quartz sensors equipped with a Langevin type quartz resonator. As a concrete means for solving the problem, a quartz sensor 3 equipped with a quartz resonator 30 forming an adsorbing layer to adsorb a target component to be measured on one surface side and coming into contact with an airtight space on the other surface side is installed in a printed circuit board 4 via a base 5. A plurality of quartz sensors 3 is detachably installed respectively in a plurality of connecting terminal units provided in a horizontal arrangement on a side surface 21 of the measuring device main unit 2 via a connecting terminal unit 41 formed on an end of the printed circuit board 4 in a state that the above-described adsorbing layer faces upward.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: June 30, 2009
    Assignee: Nihon Dempa Kogyo Co., Ltd
    Inventors: Shunichi Wakamatsu, Tsuyoshi Shiobara, Tsukasa Kobata, Naoki Onishi
  • Patent number: 7550902
    Abstract: An electronic component having thermal shock resistance and high reliability includes an element having a functional part and a first frame-shaped electrode surrounding the functional part, a substrate including a second frame-shaped electrode, and a solder sealing frame provided on the surface of at least one of the first frame-shaped electrode and the second frame-shaped electrode. In the electronic component device, the element and the substrate are bonded with the solder sealing frame, and the functional part provided on the element is hermetically sealed in a space formed between the element and the substrate.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: June 23, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Rintaro Takita
  • Publication number: 20090152992
    Abstract: To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal constituting a lead penetrating inside of a stem by one piece and a piezoelectric vibrator with an excellent yield. A stem 11 filled with a filling member 13 is penetrated only with one piece of a lead 12 formed from a lead frame. As an electric terminal, a conductive lead 16 connected to the stem 11 is provided other than the lead 12. The lead 12 and the conductive lead 16 of an airtight terminal 10 constituted by the stem 11, the lead 12, the filling member 13, the conductive lead 16 are connected to a piezoelectric vibrating piece 20, further, the stem 11 is capped to a case 30 to thereby constitute a piezoelectric vibrator 1.
    Type: Application
    Filed: January 16, 2009
    Publication date: June 18, 2009
    Applicant: Seiko Instruments Inc.
    Inventors: Hiroaki Uetake, Yuki Hoshi
  • Publication number: 20090152991
    Abstract: A piezoelectric actuator for use in a fuel injection system of an internal combustion engine, the actuator comprising a stack of ferroelectric layers; an encapsulation for protecting the stack from the ingress of liquid; and oxygenation means for providing oxygen to the ferroelectric layers, the means positioned between the encapsulation and stack. The oxygenation means is preferably impregnated in a fabric which forms a layer between the encapsulation and the stack.
    Type: Application
    Filed: November 24, 2006
    Publication date: June 18, 2009
    Inventors: Christopher Andrew Goat, Martin Paul Hardy
  • Patent number: 7545083
    Abstract: A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of
    Type: Grant
    Filed: September 18, 2007
    Date of Patent: June 9, 2009
    Assignee: Epson Toyocom Corporation
    Inventors: Seiichi Chiba, Yugo Koyama
  • Patent number: 7544248
    Abstract: In a process for manufacturing a LT substrate from a LT crystal, after growing the crystal, a LT substrate in ingot form is imbedded in carbon power, or is place in a carbon vessel, and heat treated is conducted at a maintained temperature of between 650° C. and 1650° C. for at least 4 hours, whereby in a lithium tantalate (LT) substrate, sparks are prevented from being generated by the charge up of an electric charge on the substrate surface, and thereby destruction of a comb pattern formed on the substrate surface and breaks or the like in the LT substrate are prevented.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: June 9, 2009
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Tomio Kajigaya, Takashi Kakuta
  • Patent number: 7544247
    Abstract: In a process for manufacturing a LT substrate from a LT crystal, after growing the crystal, a LT substrate in ingot form is imbedded in carbon power, or is place in a carbon vessel, and heat treated is conducted at a maintained temperature of between 650° C. and 1650° C. for at least 4 hours, whereby in a lithium tantalate (LT) substrate, sparks are prevented from being generated by the charge up of an electric charge on the substrate surface, and thereby destruction of a comb pattern formed on the substrate surface and breaks or the like in the LT substrate are prevented.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: June 9, 2009
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Tomio Kajigaya, Takashi Kakuta
  • Patent number: 7544246
    Abstract: In a process for manufacturing a LT substrate from a LT crystal, after growing the crystal, a LT substrate in ingot form is imbedded in carbon power, or is place in a carbon vessel, and heat treated is conducted at a maintained temperature of between 650° C. and 1650° C. for at least 4 hours, whereby in a lithium tantalate (LT) substrate, sparks are prevented from being generated by the charge up of an electric charge on the substrate surface, and thereby destruction of a comb pattern formed on the substrate surface and breaks or the like in the LT substrate are prevented.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: June 9, 2009
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Tomio Kajigaya, Takashi Kakuta
  • Publication number: 20090140611
    Abstract: To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portio
    Type: Application
    Filed: January 27, 2009
    Publication date: June 4, 2009
    Inventor: Kiyoshi Aratake
  • Patent number: 7531945
    Abstract: To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portio
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: May 12, 2009
    Assignee: Seiko Instruments Inc.
    Inventor: Kiyoshi Aratake
  • Patent number: 7528523
    Abstract: A surface acoustic wave device includes: an IDT electrode formed at a main surface of a piezoelectric substrate, an extraction electrode extracted from the IDT electrode; a surface acoustic wave chip having a metal junction formed along a periphery of the main surface of the piezoelectric substrate; a contact electrode made of an insulating material, connecting to the extraction electrode formed at one main surface thereof; an external electrode formed at the other main surface of the contact electrode; and a cover substrate having a through-hole electrode for connecting the contact electrode to the external electrode. The IDT electrode and the extraction electrode are hermetically sealed in an interior of the space formed by bonding the surface acoustic wave chip to the cover substrate through the metal junction.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: May 5, 2009
    Assignee: Seiko Epson Corporation
    Inventor: Shinya Aoki
  • Patent number: 7528529
    Abstract: The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: May 5, 2009
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mayumi Yamaguchi, Konami Izumi, Fuminori Tateishi
  • Patent number: 7521843
    Abstract: A piezoelectric device includes: a package including a first recessed part provided on a first surface of the package, a second recessed part provided on a second surface of the package, and a penetrating part passing partially from the first recessed part through the second recessed part; a piezoelectric element housed in the first recessed part; a lid disposed on the upper side of the first recessed part; an IC chip disposed and fixed in the second recessed part of the package so as to block a part of the penetrating part; and a sealing part provided to the second recessed part. The IC chip and the sealing part close up the penetrating part and the lid seals the first recessed part air-tightly. A piezoelectric device is provided. The piezoelectric device realizes thickness reduction thereof without undergoing warpage and breakage of an IC chip or a package thereof.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: April 21, 2009
    Assignee: Epson Toyocom Corporation
    Inventor: Hideto Naruse
  • Patent number: 7518201
    Abstract: An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: April 14, 2009
    Assignee: EPCOS AG
    Inventors: Alois Stelzl, Hans Krüger, Gregor Feiertag
  • Patent number: 7514852
    Abstract: A piezooscillator having a piezoelectric vibrator and an oscillation circuit in a space surrounded by a substrate and a cover, which has a smaller size and height, and further, which can be assembled easily and suppress power consumption, is provided.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: April 7, 2009
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Kenji Kasahara, Takeshi Uchida
  • Patent number: 7511405
    Abstract: To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having a conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having a conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulting property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: March 31, 2009
    Assignee: Seiko Instruments Inc.
    Inventors: Masashi Numata, Yasuo Kawada, Sadao Oku
  • Patent number: 7501746
    Abstract: A piezoelectric oscillator includes: a package including a first recessed portion formed on a first surface, a second recessed portion formed on a second surface with at least a part of a side surface being open, and a conductor wired from at least one of an inside surface of the first recessed portion and an inside surface of the second recessed portion to an outside surface; a piezoelectric element accommodated in the first recessed portion; a lid being in contact with the first surface and air-tightly sealing the first recessed portion; a circuit element accommodated in the second recessed portion and connected with the conductor; a resin portion formed in the second recessed portion to cover the circuit element; and an electrical check terminal connected with the conductor of the package.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: March 10, 2009
    Assignee: Epson Toyocom Corporation
    Inventor: Hideto Naruse
  • Publication number: 20090015106
    Abstract: [Object] To provide a piezoelectric device having excellent drive level characteristics in terms of downsizing, having no remaining stress at the bonding portion of the container and leaving no characteristics deteriorating factors. [Solving Means] A piezoelectric device includes: a base substrate 54, a framed resonator element 55 stacked and fixed on the base substrate, a lid 56 stacked and fixed on the framed resonator element, wherein the base substrate, the framed resonator element, and the lid are made from the same materials or the materials having highly approximate linear coefficients of expansion and the bonding surfaces thereof are bonded with each other by surface activating process so as to be vacuum-sealed.
    Type: Application
    Filed: March 22, 2007
    Publication date: January 15, 2009
    Inventor: Hideo Tanaya
  • Patent number: 7475460
    Abstract: A method for producing an airtight terminal having an annular stem, a lead passing through the stem and formed of a conductive material, and a filler for fixing the lead in the stem includes (1) a lead contour formation step of disposing a base and a lead formation portion on a plate- or strip-shaped conductive material and forming a contour of the lead on the lead formation portion with at least one end of the lead connected to the base, (2) a filler shaping and sintering step of filling the lead having a contour with the filler in a predetermined position and shaping and sintering the filler, (3) a stem mounting step of mounting the stem to a perimeter of the sintered filler, (4) a firing step of heating, melting, and cooling the sintered filler in the stem and bringing the lead into close contact with the stem to fix the lead to the stem through the filler, (5) a metal film formation step of forming a metal film on a surface of the lead, and (6) a cutting step of separating the one end of the lead from the
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: January 13, 2009
    Assignee: Seiko Instruments Inc.
    Inventors: Yoshifumi Nishino, Hiroaki Uetake, Yuki Hoshi
  • Patent number: 7474039
    Abstract: An electronic module, comprises: a circuit board; a piezoelectric device having a lid, the piezoelectric device being mounted on the circuit board; and an electronic component mounted on the circuit board. The electronic component includes an adjustment terminal for at least one of adjusting and inspecting an electrical characteristic thereof. The lid is electrically conducted to the adjustment terminal.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: January 6, 2009
    Assignee: Epson Toyocom Corporation
    Inventor: Kyo Horie
  • Patent number: 7468574
    Abstract: A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: December 23, 2008
    Assignee: Epson Toyocom Corporation
    Inventors: Kyo Horie, Makoto Komai
  • Patent number: 7439658
    Abstract: To provide a piezoelectric vibrator, an oscillator, an electronic part, an electronic apparatus, a method of fabricating a piezoelectric vibrator and a method of fabricating an electronic part capable of swiftly and easily providing a plurality of electrodes for applying a voltage to a piezoelectric vibrating piece while maintaining airtightness at inside of a hermetically sealed vessel, there is provided a piezoelectric vibrator including a hermetically sealed vessel 2 constituted by overlapping a lid member 6 and a base member 7 in a plate-like shape, a piezoelectric vibrating piece 3 provided at inside of the hermetically sealed vessel 2, a lead-out electrode 16 provided at an overlapping face 6a of the lid member 6, electrically connected to the piezoelectric vibrating piece 3 by way of a connecting portion, and extending the connecting portion 15 to an edge portion of the overlapping face 6a of the lid member 6, an external electrode 27 electrically connected to the lead-out electrode 16 from a side face
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: October 21, 2008
    Assignee: Seiko Instruments Inc.
    Inventor: Kiyoshi Aratake
  • Patent number: 7429815
    Abstract: An actuator for a fuel injector is disclosed. The actuator has a piezo element, a casing, and at least one end plate. The casing is fabricated through a deep draw process, has bellows, and is configured to house the piezo element. The at least one end plate is hermetically connected to an end portion of the casing.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: September 30, 2008
    Assignee: Caterpillar Inc.
    Inventors: Dennis H. Gibson, Jinhui Sun
  • Patent number: 7429814
    Abstract: The invention provides a piezoelectric resonator device having excellent frequency accuracy and aging characteristics. The piezoelectric resonator element can be packaged in an exclusive hollow space formed in the package in advance to packaging an IC chip. After mounting a lid on the opening of the hollow space while the hollow space is in communication with an external atmosphere, the external conduit is shut in vacuum and the hollow space for packaging the resonator element is tightly sealed, and an IC chip is packaged after an optimality discrimination treatment of the piezoelectric resonator element. The piezoelectric resonator element is formed into a tuning fork type resonator element, and the lid is made of a glass. The conduit to the external atmosphere is shielded by embedding with a gold base material to capture the materials scattered by frequency adjustment of the piezoelectric resonator element.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: September 30, 2008
    Assignee: Seiko Epson Corporation
    Inventor: Kazuhiko Shimodaira
  • Publication number: 20080231145
    Abstract: A quartz crystal device includes a crystal resonator element and a package including a plurality of components. The plurality of components are bonded using a metal paste sealing material containing a metallic particle having an average particle size from 0.1 to 1.0 ?m, an organic solvent, and a resin material in proportions of from 88 to 93 percent by weight from 5 to 15 percent by weight, and from 0.01 to 4.0 percent by weight, respectively, to hermetically seal the crystal resonator element in the package.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 25, 2008
    Applicant: EPSON TOYOCOM CORPORATION
    Inventors: Yoji NAGANO, Tatsuya ANZAI, Hideo TANAYA
  • Patent number: 7427822
    Abstract: A piezoelectric resonator element package has a base that holds a piezoelectric resonator element on which drive electrodes are formed, and a cap. Four electrode pads are formed in corners of an internal bottom surface of the base. Of the four electrode pads, the first electrode pad and second electrode pad have the different potential. The first electrode pad and third electrode pad have the same potential because of a first connecting electrode. The second electrode pad and fourth electrode pad have the same potential because of a second connecting electrode. An avoidance means is provided for avoiding electrical connection between electrode pads that have the different potential (the first electrode pad and second electrode pad) and the other electrode pads that have the same potential (the first electrode pad and third electrode pad, and the second electrode pad and fourth electrode pad).
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: September 23, 2008
    Assignee: Daishinku Corporation
    Inventor: Tsuyoshi Kusai
  • Patent number: 7427823
    Abstract: A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: September 23, 2008
    Assignee: Epson Toyocom Corporation
    Inventors: Tsuyoshi Ohshima, Shin Hasegawa, Noriyuki Watanabe
  • Patent number: 7427824
    Abstract: A piezoelectric device ensures resistance to molding without an increase in costs and includes an elemental substrate having a piezoelectric element and a conductive pattern electrically connected to the piezoelectric element; and insulating members disposed on the elemental substrate and surrounding the piezoelectric element leaving a space around the piezoelectric element. The insulating members have an internal conductor connected to the conductive pattern and extending apart from the elemental substrate. The internal conductor has expanded portions expanding in a direction intersecting the wiring direction of the internal conductor or a detour portion deviating from the wiring direction. The expanded portions or the detour portion crosses the boundary of a sealed space formed around the piezoelectric element.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: September 23, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Iwamoto, Yasunori Kishimoto
  • Patent number: 7425881
    Abstract: A surface acoustic wave device includes a piezoelectric substrate that does not restore the pyroelectric effect, and a method for manufacturing the same. A surface acoustic wave element housed in a package includes a piezoelectric substrate having a specific resistance in the range of about 1.0×107 ?·cm to about 1.0×1013 ?·cm. Pads are electrically connected to an external electrode with a solder. The space between the package and a cap of the package is sealed with a sealing material. At least one of the solder and the sealing material has a melting point of about 300° C. or less.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: September 16, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Osamu Shibata
  • Publication number: 20080218026
    Abstract: A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.
    Type: Application
    Filed: February 27, 2008
    Publication date: September 11, 2008
    Applicant: IPTRADE, INC.
    Inventors: Baruch Pletner, Grace R. Kessenich
  • Publication number: 20080211350
    Abstract: A piezoelectric resonator element includes: a base in a predetermined length, the base being made of a piezoelectric material; a plurality of resonating arms extending from a first end of the base; a joining part connected to a second end apart from the first end of the base by a predetermined distance; a connecting part connected to the joining part and extending in a width direction of the piezoelectric resonator element; a supporting arm connected to the connecting part and extending in a same direction as the resonating arm at an outer side of the plurality of resonating arms. A ratio L3/h is 40% or less where h is a length dimension from the first end of the base to the second end opposite to the resonating arms of the piezoelectric resonator element, and L3 is a width dimension of the connecting part connecting the supporting arm to the base through the joining part.
    Type: Application
    Filed: August 17, 2007
    Publication date: September 4, 2008
    Applicant: EPSON TOYOCOM CORPORATION
    Inventors: Hideo TANAYA, Yoshiyuki YAMADA, Yukihiro TONEGAWA, Katsumi KURODA
  • Patent number: 7417357
    Abstract: An ultrasonic motor includes a rotor (70) and a piezoelectric driving unit (50) for driving the rotor to rotate. The driving unit includes a piezoelectric film (52) and a vibration film (54) contacting with the rotor at an outer-periphery thereof. The ultrasonic motor further includes covers (56, 58) having a plurality of poles (560, 580) extending therefrom. Free ends of the poles fixedly connect with top and bottom sides of the vibration film, respectively.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: August 26, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ching-Hsing Huang, Chien-Long Hong, Huan-Chao Lin, Wun-Chang Shih, Hsien-Sheng Pei
  • Patent number: 7404247
    Abstract: A method for making a pressure sensor including the steps of providing a substrate and forming or locating a pressure sensing component on the substrate. The method further includes the step of, after the forming or locating step, etching a cavity in the substrate below the pressure sensing component to define a diaphragm above the cavity with the pressure sensing component located on the diaphragm. The pressure sensing component includes an electrically conductive electron gas which changes its electrical resistance thereacross upon movement of the diaphragm.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: July 29, 2008
    Assignee: Rosemount Aerospace Inc.
    Inventors: Odd Harald Steen Eriksen, Shuwen Guo
  • Patent number: 7397165
    Abstract: A restrained surface wave resonator with reduced or abated acceleration sensitivity is provided with a stiffening layer, adhesive layers and subsurface horizontal indentations on the substrate to achieve reduced acceleration sensitivity, increased structural rigidity, decreased sensitivity to in-plane deformations, a lightweight device and reduced deleterious effects from environmental shocks and vibration. The substrate of the restrained surface wave resonators features multiple subsurface horizontal indentations in one major substrate surface deposited on a stiffening layer to provide improved structural rigidity against flexure caused by normal acceleration based upon the diminished mass and reduced weight resulting from removal of portions of the substrate subsurface through micro-machining, and it also tends to improve excessive sensitivity to other flexural deformations. The present invention encompasses a restrained surface wave resonator device and a restrained surface wave resonator system.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: July 8, 2008
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: John A. Kosinski
  • Patent number: 7397171
    Abstract: To propose a structure of a small-sized airtight terminal capable of restraining a reduction in yield of steps of fabricating an airtight terminal and steps of integrating a piezoelectric vibrator and a mold structure of a surface mount type piezoelectric vibrator in correspondence with the airtight terminal, there is provided a surface mount type piezoelectric vibrator including a piezoelectric vibrating piece having a pair of exciting electrodes, a first electrode of the pair of exciting electrodes being electrically connected to the lead, and a second electrode thereof being electrically connected to a stem of an airtight terminal, a case of a bottomed cylinder type fixed to the stem to cover the piezoelectric vibrating piece to form an airtight space, a first external electrode terminal electrically conductive to the first electrode by way of the lead, a second external electrode terminal electrically conductive to the second electrode, and a mold resin molded to be formed on surfaces of the case and the
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: July 8, 2008
    Assignee: Seiko Instruments, Inc.
    Inventors: Hiroaki Uetake, Yuki Hoshi
  • Publication number: 20080157630
    Abstract: A piezoelectric vibrating piece having a first and a second surface at an opposing side of the first surface is comprised of an piezoelectric piece having designated coefficient of thermal expansion; a first electrode film having bigger coefficient of thermal expansion than the designated coefficient of thermal expansion and formed on the first surface; and a second electrode film having smaller coefficient of thermal expansion than the designated coefficient of thermal expansion and formed on the second surface.
    Type: Application
    Filed: December 13, 2007
    Publication date: July 3, 2008
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventor: Takehiro Takahashi
  • Publication number: 20080136291
    Abstract: This invention relates to a system for exciting oscillations of micromechanical cantilever sensors and for measuring and evaluating the corresponding oscillations. Such sensors can e.g. be used to detect chemical substances, biomolecules, microorganisms or viruses, or to analyze surface-related phenomena and processes such as conformational changes or phase transitions in thin layers, or to measure physical properties of their surrounding, such as viscoelastic properties of liquids. In the so-called dynamic operation mode, cantilever oscillations are excited and the frequency shift of the ground frequency and/or of one or some higher harmonics, occurring because of a process taking place at the cantilever surface, are measured. In the so-called static mode, the deflection of the cantilever is determined. The setup described in this invention allows measurements in gases as well as liquids.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 12, 2008
    Applicant: CONCENTRIS GMBH
    Inventor: Felice Mauro Battiston
  • Publication number: 20080129149
    Abstract: To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having a conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having a conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulting property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by
    Type: Application
    Filed: November 29, 2007
    Publication date: June 5, 2008
    Inventors: Masashi Numata, Yasuo Kawada, Sadao Oku
  • Patent number: 7378780
    Abstract: A surface mount type crystal oscillator includes: a container body composed of a laminated ceramic including a plate-shaped center layer, and first and second frame layers stacked on opposite surfaces of the center layer respectively; a crystal blank hermetically sealed in a first recess formed by the first frame layer and the center layer; an IC chip accommodated in a second recess formed by the second frame layer and the center layer; and a test terminal provided on the outer side surface of the container body and used to test the crystal blank. The center layer has at least a first layer and a second layers, and the test terminal is electrically connected to a crystal retaining terminal provided on the bottom surface of the first recess in order to retain the crystal blank through a conductive path provided on an interface between the first and second layers.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: May 27, 2008
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Hiroaki Mizumura, Kouichi Moriya
  • Publication number: 20080116766
    Abstract: The invention relates to a piezoelectric pressure sensor comprising an outer housing separated by an annular gap from an inner housing, which inner housing is attached to the outer housing on the pressure side. At least one piezoelectric measuring element being positioned between a diaphragm placed on the pressure side of the inner housing and a base part of said inner housing. The inner housing is provided with a massive cylindrical wall throughout, whose wall thickness essentially corresponds to the thickness of the adjacent outer housing, and in the annular gap between outer housing and inner housing or in the space between the base part of the inner housing and an interior shoulder of the pressure sensor there are provided means for transferring heat to the outer housing.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 22, 2008
    Inventor: Alexander Friedl
  • Publication number: 20080106172
    Abstract: A piezoelectric device comprises: a piezoelectric resonator element having a base, a plurality of oscillating arms paralleled each other and extended from the base, a plurality of supporting arms extended from the base and in parallel with the side surface of each of the plurality of oscillating arms so as to sandwich the plurality of oscillating arms, a groove formed in at least one of a front surface and a back surface of each of the plurality of oscillating arms and an end weight layer formed in at least one of the front surface and the back surface near to an end portion of each of the plurality of oscillating arms; a package storing the piezoelectric resonator element within a containable recess and being air-tightly sealed by a lid; a bottom surface recess rimmed in the bottom surface of the containable recess; and a connecting pad formed as a protrusion in an region that is connected with the plurality of supporting arms in the bottom surface of the containable recess.
    Type: Application
    Filed: November 6, 2007
    Publication date: May 8, 2008
    Applicant: EPSON TOYOCOM CORPORATION
    Inventors: Hideo TANAYA, Katsumi KURODA, Kazuya HIRASAWA
  • Patent number: 7362038
    Abstract: A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and streamlined manufacturing process. A substrate including a SAW active area on a first side is interconnected to external circuits and mechanically mounted via a plurality of metal pillars and an outer metal sealing wall. The sealing wall additionally provides protection from external environmental contamination and interference. The sealing wall may include a number of gaps to reduce stress due to differences in thermal expansion coefficients between the SAW substrate and the metal sealing wall and the gaps may be filled with a flexible sealant. The metal pillars may be round, square or other suitable shape and solder bump terminals may be added to the ends of the pillars and the bottom edge of the sealing wall.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: April 22, 2008
    Assignee: Amkor Technology, Inc.
    Inventors: Ho Cheol Jang, Choon Heung Lee, Seong Min Seo
  • Patent number: 7358646
    Abstract: The present invention provides a piezoelectric actuator with excellent durability. In the present invention, a piezoelectric element 2 in which a plurality of piezoelectric layers that expand in accordance with an applied voltage, and internal electrode layers for supplying an applied voltage, are alternately laminated, and at least a part of the side surfaces 201 and 202 thereof is covered by an external packaging resin 25, the piezoelectric element 2 being housed in a sealed container 11 that substantially isolates it from the external atmosphere, and in which the internal atmosphere 19 is replaced by an inert gas. Alternatively, the piezoelectric element 2 is housed in a sealed container 11 that substantially isolates it from the external atmosphere, and the external packaging resin 25 includes an antioxidant.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: April 15, 2008
    Assignee: Denso Corporation
    Inventors: Hiroaki Asano, Shinichi Okamoto