Abstract: A piezoelectric device includes: a first substrate; a second substrate disposed opposed to the first substrate; a third substrate disposed between the first substrate and the second substrate, a part of the third substrate forming a piezoelectric oscillating piece, and another part of the third substrate forming a frame which surrounds the piezoelectric oscillating piece; a first metal film which joins the first substrate and the frame; a second metal film which joins the second substrate and the frame; and a resin portion provided at least at any one of positions between the first substrate and the first metal film, between the frame and the first metal film, between the second substrate and the second metal film, and between the frame and the second metal film.

Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate.

Abstract: A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

Abstract: An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.

Abstract: A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; an external electrode that is formed on a lower surface of the base substrate; an internal electrode that is formed on an upper surface of the base substrate so as to be accommodated in the cavity; a through electrode which is formed so as to pass through the base substrate and electrically connect the external electrode with the internal electrode; a piezoelectric vibrating reed which is accommodated in the cavity in a state of being electrically connected to the internal electrode; and a getter material that is formed in the cavity, the getter material being formed of chromium or a metallic material consisting of chromium as a main ingredient.

Abstract: A piezoelectric vibrator including a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel, a pair of excitation electrodes that vibrate the pair of vibration arm portions, and a mount electrode that is electrically connected to the pair of excitation electrodes, the piezoelectric vibrating reed being mounted on the base substrate within the cavity via the mount electrode; an insulation film which is formed on the piezoelectric vibrating reed so as to cover the excitation electrodes; and a getter material formed of the metallic material that is formed on any of the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated.

Abstract: A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material.

Abstract: Provided is a method of manufacturing a piezoelectric vibrator of the invention, the piezoelectric vibrator including a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions, a package that accommodates the piezoelectric vibrating reed, and a pair of regulation films that is formed along a longitudinal direction of the vibration arm portions corresponding to each of the pair of vibration arm portions, the piezoelectric vibrator being capable of regulating a degree of vacuum in the package more than a certain level by irradiating the regulation films with a laser to evaporate a part of the regulation films. The method includes a gettering process of irradiating a laser in symmetrical positions via a center axis of the pair of vibration arm portions in the pair of regulation films.

Abstract: Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A piezoelectric assembly is described. In accordance with one embodiment, there is provided a piezoelectric assembly comprising: an electrode assembly; a signal electrical connector electrically connected to the electrode assembly; a reference electrical connector electrically connected to the electrode assembly; and a spacer positioned about a perimeter of the electrode assembly and disposed between the signal electrical connector and the reference electrical connector such that no electrical communication is provided between the signal electrical connector and the reference electrical connector through the spacer; wherein a humidity barrier space is defined between the signal electrical connector, the reference electrical connector and the spacer, and wherein the electrode assembly is disposed in the humidity barrier space.

Abstract: A method of manufacturing a piezoelectric vibrator comprises forming a gettering metal film on a surface of a piezoelectric vibrator piece and forming a frequency-adjusting weight, separate from the gettering metal film, on the piezoelectric vibrator piece. The piezoelectric vibrator piece is then placed in a hermetic container after which the hermetic container is hermetically sealed. A laser beam is irradiated on the metal film to heat the same to getter gas contained inside the hermetic container, and after completion of gettering, the laser beam is irradiated on the frequency-adjusting weight to adjust the frequency of vibration of the piezoelectric vibrator piece.

Abstract: An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess.

Abstract: A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.

Abstract: A quartz crystal unit comprises a quartz crystal tuning fork resonator capable of vibrating in a flexural mode of an inverse phase and having at least one groove having at least one stepped portion formed in at least one of opposite main surfaces of each of first and second quartz crystal tuning fork tines. An electrode is disposed on the at least one stepped portion of the at least one groove so that the electrode of the first quartz crystal tuning fork tine has an electrical polarity opposite to an electrical polarity of the electrode of the second quartz crystal tuning fork tine. The quartz crystal unit comprising the quartz crystal tuning fork resonator has a capacitance ratio r1 of a fundamental mode of vibration less than a capacitance ratio r2 of a second overtone mode of vibration.

Abstract: A crystal unit includes a unit base in which a metal flange is welded to an outer circumference of a base main body, a crystal element held by supporters on the unit base, and a metal cover that is jointed to the metal flange to cover and hermetically encapsulate the crystal element. The base main body is formed of ceramic. A first metal film, to which the metal flange is joined, is formed on a surface of the outer circumference of the base main body. At least two places of the main body, second metal films are formed on an inner bottom face of the main body, and third metal films are formed on an outer bottom face of the main body. The second metal films and the third metal films are electrically connected to one another through via holes. The supporters are joined to the second metal films.

Abstract: A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.

Abstract: Crystal devices are disclosed that include a crystal frame having a crystal vibrating piece and an outer frame. The crystal vibrating piece includes excitation electrodes, and the outer frame supports the crystal vibrating piece. Each device has a base including connection electrodes on a first surface thereof and respective external electrodes on a second surface thereof, wherein the connection electrodes are electrically connected via respective through-holes to respective excitation electrodes and to respective external electrodes. The first surface of the base is bonded to the under-surface of the outer frame, and an upper surface of the outer frame is bonded to a crystal lid. The through-holes have non-circular transverse profiles and are filled with a sealing material such as a metal.

Abstract: A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.

Abstract: An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.

Abstract: A coating film is formed on the whole surface area of a body part. Formation of the coating film may be done by immersing the body part in a solution of parfluoropolyether. Then, the parfluoropolyether constituting the coating film is joined with the side surfaces of the body part by irradiating Xenon excimer laser in a nitrogen atmosphere onto the side faces of the body part, or to the surface exposing an electrode layer. As a result, the protective film is formed only on the side surfaces of the body part. Thus, the protective film is formed as a monomolecular film. Total body part is then cleaned by 2,3-dihydrodecafluoropentane to remove non-reacted coating film, thereby completing a multi-layer piezoelectric element.

Abstract: A piezoelectric resonator device includes a base holding a piezoelectric resonator element and a lid bonded to the base in order to hermetically seal the piezoelectric resonator element held on the base. In addition, the region of bonding of the base to the lid is composed of at least a nickel-cobalt layer comprising nickel and cobalt, and a metal layer laminated on the nickel-cobalt layer, with the base and lid bonded by heat-melting using a metallic braze material.

Abstract: A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices.

Abstract: The quartz crystal device includes a container body having: a recess; a pair of holding terminals formed on an inner bottom surface of the recess; and a crystal blank, both principal surfaces of which are provided with excitation electrodes with lead-out electrodes extending from the pair of excitation electrodes toward both sides of one end of the crystal blank. Both sides of one end of the crystal blank are fixed to the holding terminals using a conductive adhesive. Pillow members are provided on the inner bottom surface of the recess at positions corresponding to corners on both sides of the other end of the crystal blank, and the two pillow members are independent of each other. Alternatively, each holding terminal includes a first region formed near the facing holding terminal and a second region having a greater thickness than the first region formed far from the facing holding terminal.

Abstract: Methods are disclosed for manufacturing piezoelectric vibrating devices. An exemplary method includes preparing a base wafer defining multiple bases each including stripes of a first bonding film extending along respective edges of the bases and first indents adjacent to and contacting respective stripes of the first bonding film. Also prepared is a lid wafer defining multiple lids each including stripes of a second bonding film extending along respective edges of the lids and second indents adjacent to and contacting respective stripes of the second bonding film. A unit of bonding material (e.g., a bonding “ball”) is applied to each of the first indents or to each of the second indents. Bonding together the base wafer and lid wafer is completed by melting the bonding material to flow the bonding material along the stripes, followed by solidifying the bonding material.

Abstract: An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material.

Abstract: Surface-mounted piezoelectric devices are disclosed that include a package having a base and a lid made of a piezoelectric material or of glass. The package defines an internal cavity containing a tuning-fork type crystal vibrating piece having a pair of vibrating arms. The volume of the cavity is at least twelve times the volume of the pair of vibrating arms. Piezoelectric devices having these characteristics exhibit reduced CI degradation.

Abstract: An actuator for actuating a fuel injection valve has a piezoactuator, enclosed in an actuator housing unit (14, 16). The housing unit has a cylindrical actuator housing (14) which is elongate in its axial direction (A) and at least partially encased by an extruded plastic coat. The actuator housing unit (14, 16), in its encased area, is provided with a ventilation aperture (20) in which a ventilation element (22) produced from a microporous material is disposed.

Abstract: A flexural vibration piece includes a base, and a vibrating arms extending therefrom, each pair of vibrating arms has a first groove formed in the extension direction of the vibrating arm in one main surface following the direction in which the pair of vibrating arms are aligned, and a second groove formed side by side to the first groove in another main surface, the sum of the depths of the first and second groove portions is greater than the interval between the one main surface and the other main surface, and a mass portion is provided on each of the pair of vibrating arms, on the one main surface which is the opening side of the first grooves formed toward the outer sides opposite the inner sides on which the vibrating arms face each other.

Abstract: The piezoelectric vibrating piece (20) comprises a base portion (29) having an adhesive area on a first surface of electrically conductive adhesive 31 for mounting, a pair of vibrating arms (21) extending in a first direction from one edge of the base portion, base electrodes (23a, 25a) arranged in the base portion, an exciting electrode (23c, 25c) extending in a first direction and connecting the base electrode to excite a pair of vibrating arms. The area where the base electrodes (23a, 25a) conduct the electrically conductive adhesive (31) is smaller than the adhesive area (33).

Abstract: Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials 20, 21 having different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Abstract: Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material 35 and a base board wafer 40 even when the bonding material 35 having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material 35, which is fixed in advance to an inner surface of a lid board wafer 50 made of an insulator, to an inner surface of a base board wafer 40 made of an insulator, the method including an anodic bonding step where an auxiliary bonding material 72 serving as an anode is disposed on an outer surface of the lid board wafer 50, a cathode 71 is disposed on an outer surface of the base board wafer 40, and a voltage is applied between the auxiliary bonding material 72 and the cathode 71, wherein the auxiliary bonding material 72 is made of a material that causes an anodic bonding reaction between the auxiliary bonding material 72 and the lid board wafer 50 in the anodic bonding step.

Abstract: Providing a method for manufacturing a package capable of improving production efficiency.

Abstract: Providing a piezoelectric vibrator and a manufacturing method thereof which is capable of achieving gettering in a state where the frequency change of the piezoelectric vibrating reed is suppressed. Providing a piezoelectric vibrator 1 including: a package 9 having a base board 2 and a lid board 3 which are bonded in a superimposed state and a cavity C formed between both boards 2, 3; and a piezoelectric vibrating reed 4 and a gettering material 27 which are accommodated in the same cavity C, wherein a shielding wall 21 is provided in the cavity C so as to shield the piezoelectric vibrating reed 4 from the gettering material 27, and the shielding wall 21 is connected to both the base board 2 and the lid board 3.

Abstract: Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly 60 along a scribe line M?, the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assembly 60 along the contour line to form the scribe line M? on a lid board wafer 50; and a breaking step of applying a breaking stress along the scribe line M? using a cutting blade to cut the wafer assembly along the scribe line M?, wherein the scribing step involves forming the scribe line M? so that the ratio of a depth dimension D of the scribe line M? to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Abstract: A capacitor-built-in type piezoelectric resonator which is thin and small in size, and has high reliability is formed by forming a pair of vibrating electrodes on both principal surfaces of a piezoelectric substrate, and joining a sealing substrate made of a ceramic material to form a capacitance via a frame onto one vibrating electrode, and joining a sealing substrate made of a resin material via a frame onto the other vibrating electrode.

Abstract: Providing a piezoelectric vibrator which is capable of securing the degree of vacuum in a cavity and can be manufactured with high efficiency and to provide a manufacturing method thereof. A piezoelectric vibrator 1 including: a base board 2 and a lid board 3 which are superimposed onto each other so as to form a cavity C therebetween; a piezoelectric vibrating reed 4 which is accommodated in the cavity and bonded to the base board; a gettering material 34 which is formed in the base board to be accommodated in the cavity; a bonding film 35 which is formed on the entire surface of the lid board facing the base board so as to bond both boards to each other at a portion thereof being in contact with the base board, wherein the bonding film is formed of a material which is capable of absorbing surrounding gas by being activated with laser irradiation.

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: A method of fabricating a case accommodating a piezoelectric vibrating piece therein in a piezoelectric oscillator including the piezoelectric vibrating piece, including the steps of: applying deep drawing to a conductive plate member to shape the plate member in a nearly cylindrical shape with a bottom; pressing an inner surface of a bottom part of the plate member by a punch for step drawing while an outer surface of the bottom part is being abutted against a surface including an opening of a hole of a die having an inner diameter smaller than the outer diameter of the bottom part, whereby a projecting portion is formed on the outer surface of the bottom part; and cutting the plate member having the projecting portion at a predetermined position on the opening side thereof, whereby a case in a nearly cylindrical shape with a bottom having the projecting portion is obtained.

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Abstract: A crystal device for surface mounting, in which a metal cover is jointed to the metal ring by seam welding, satisfies relationships A2/A1<C2/C1 and B2/B1<D2/D1, where A1 is a length of a long side of the metal ring, A2 is a length of a straight portion of a long side except for curved portions, B1 is a length of a short side of the metal ring, B2 is a length of a straight portion of the short side except for the curved portions thereof, C1 is a length of a long side of the metal cover, C2 is a length of a straight portion of the long side except for the curved portions thereof, D1 is a length of a short side of the metal cover, and D2 is a length of a straight portion of the short side except for the curved portions thereof.

Abstract: The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

Abstract: A piezoelectric oscillator part capable of suppressing oscillation that leaks from a piezoelectric oscillator to a substrate side is obtained. The piezoelectric oscillator part has a piezoelectric oscillator held on a substrate by first and second conductive holding members. The first conductive holding member is arranged proximal to a first end of the substrate. A terminal electrode connected to the first conductive holding member is arranged proximal to a second end of the substrate opposite the first end. The first conductive holding member and the terminal electrode are electrically connected by a wiring electrode.

Abstract: A tuning fork flexural crystal vibration device includes a base, two vibration arms, grooves, electrodes, and wirings. The base has a flat plate shape. The two vibration arms have flat panel shapes extending from a side surface of the base in the same direction. The grooves are provided for the two vibration arms so as to extend from base-side end portions of the vibration arms along the longitudinal direction of the vibration arms and are depressed in the thickness direction of the vibration arms. The grooves include front-side grooves which open in the front main surfaces of the vibration arms and are provided at least one by one for each vibration arm, and rear-side grooves which open in the rear main surfaces of the vibration arms and are provided at least one by one for each vibration arm. The bottom surface of the front-side groove does not face the bottom surface of the rear-side groove provided in the same vibration arm in which the front-side groove is provided.

Abstract: The piezoelectric vibrator comprises a base substrate of which the two faces are polished; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member. The through-electrode is formed by hardening of a paste containing a plurality of metal fine particles.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed.

Abstract: The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed by hardening paste P, which contains a plurality of metal fine particles and a plurality of metal beads P1, so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: A unit comprising a quartz crystal resonator vibratable in a flexural mode and having a base portion including a length less than 0.5 mm, and first and second vibrational arms connected to the base portion, at least one groove being formed in each of two of opposite main surfaces of each of the first and second vibrational arms, and an electrode being disposed on a surface of the at least one groove formed in each of the two of the opposite main surfaces of each of the first and second vibrational arms so that the electrode disposed on the surface of the at least one groove formed in each of the two of the opposite main surfaces of the first vibrational arm has an electrical polarity opposite to an electrical polarity of the electrode disposed on the surface of the at least one groove formed in each of the two of the opposite main surfaces of the second vibrational arm.