Abstract: A test system for testing a multilayer 3-dimensional integrated circuit (IC), where two separate layers of IC circuits are temporarily connected in order to achieve functionality, includes a chip under test with a first portion of the 3-dimensional IC, and a test probe chip with a second portion of the 3-dimensional IC and micro-electrical-mechanical system (MEMS) switches that selectively complete functional circuits between the first portion of the 3-dimensional IC in a first IC layer to circuits within the second portion of the 3-dimensional IC in a second IC layer. The MEMS switches include tungsten (W) cone contacts, which make the selective electrical contacts between circuits of the chip under test and the test probe chip and which are formed using a template of graded borophosphosilicate glass (BPSG).

Abstract: A system for testing a device under test (DUT), in which electrical coupling among a module board, a low profile connector, and, a DIB is established by applying a pressure on the module board toward the DUT, is provided. The system includes a test head bracket secured inside a test head, the test head bracket includes the module board having a first section including a plurality of connectors to couple a test analyzer to the module board, a second section including a plurality of contacts pads to electrically couple the module board to the DUT, and, a flexible board to enable the first section to be placed at an angle with respect to the second section. The test head bracket also includes a module board stiffener mechanically securing the first section and the second section to the test head and the low profile connector electrically couples the module board to the DUT.

Abstract: A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer.

Abstract: A mounting structure for a continuity testing unit is provided in which the plurality of continuity testing units can easily be mounted to or removed from a test board without using the bolt or the intricately-shaped pin, and which improves the efficiency of restoring the mounting arrangement of the continuity testing units. The mounting structure for a continuity testing unit includes a plurality of parallely-arranged rails arranged at a frame, a joint block arranged on the respective rails and a plurality of continuity testing units each including a plate portion and a pin portion arranged at the plate portion. The joint block includes a plurality of holes into which the pin portion is fitted in a disengageable manner. The plurality of holes is arranged in two lines. The plate portion is placed on the joint blocks on the two adjacent rails.

Abstract: Circuits and methods for testing wafers are disclosed herein. An embodiment of a method includes electrically contacting a first probe and a second probe to a wafer. A gas is blown in the areas proximate the first probe and the second probe. An electric potential is then applied between the first probe and the second probe while the gas is being blown.

Abstract: A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node.

Abstract: A contactor includes a contactor base material including a first material and a conductor film including a second material. The conductor film is formed only on a contact surface with an electrode of a semiconductor apparatus at a tip of the contactor film.

Abstract: A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.

Abstract: An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.

Abstract: Nano spike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a translator having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer-side sites are carried by the translator at the wafer side of the translator. The nanospikes can be attached to nanospike sites on a wafer side of a translator. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, the nanospikes can be formed by sputtering over a metal carrier with a photoresist mask. In particular embodiments, the nanospikes have generally conical cross-section.

Abstract: The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

Abstract: Structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: A connector includes a support and an arm. The support is to support a to-be-test workpiece. The arm is rotatably connected to the support and includes a number of probes. Pinheads of the probes faces the support. When the arm is rotated to a predetermined position relative to the support, the pinheads of the probes contacts with a flexible printed circuit (FPC) of the to-be-tested workpiece.

Abstract: Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other.

Abstract: A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.

Abstract: An apparatus and a method for detecting defects within a photovoltaic module are provided. To detect defects within the photovoltaic module, light from a light source is directed towards the photovoltaic module. The light generates a voltage within each solar cell of the photovoltaic module. The generated voltages are measured and compared in order to detect defects within the solar cells of the photovoltaic module.

Abstract: An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.

Abstract: Systems and methods for testing a device under test (DUT) that includes a low power output driver. The methods include providing an input signal to the DUT. The low power output driver is configured to generate a data signal responsive to receipt of the input signal by the DUT and provide the data signal to a signal analyzer via a data signal transmission line. The methods further include determining an expected data signal to be received from the low power output driver and charging at least a portion of the data signal transmission line with a co-drive output signal that is based, at least in part, on the expected data signal. The methods further include receiving a composite data signal with the signal analyzer. The systems include probe heads with a plurality of data signal transmission lines and a plurality of co-drive conductors.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract: A DC-AC probe card for testing a DUT includes: a plurality of probe needles, each probe needle having a distal end for contacting said DUT; and a plurality of connection pathways operable to connect test instrumentation to the probe needles, wherein each connection pathway provides both a desired characteristic impedance for AC measurements and a guarded pathway for DC measurements between respective test instrument connections and probe needles.

Abstract: A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle.

Abstract: A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.

Abstract: A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.

Abstract: A test system can include a probe suitable to be coupled between a test measurement device and a device under test (DUT). The probe can include a signal input to receive an active signal from the DUT and a signal output to provide the active signal to the test measurement device. The probe can also include an input ground to connect to the DUT ground and an output ground to connect to the test measurement device ground. A probe ground connection checking device can automatically determine whether the probe ground connections to the DUT ground and test measurement device ground are solid.

Abstract: Terminals of a device under test are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact partially or completely laterally surrounds the force contact, so that it need not have its own resiliency. The sense contact has a forked end with prongs that extend to opposite sides of the force contact. Alternatively, the sense contact surrounds the force contact and slides laterally to match a lateral translation component of a lateral cross-section of the force contact during longitudinal compression of the force contact. Alternatively, the sense contact includes rods that have ends on opposite sides of the force contact, and extend parallel.

Abstract: A probe used for electrical measurement includes first and second internal electrically-conductive parts; first and second terminal contact parts configured to contact first and second external electrode terminals, respectively; first and second spring parts each having a meandering pattern; a housing part configured to surround the first and second internal electrically-conductive parts. The first internal electrically-conductive part, the first terminal contact part, the first spring part, the housing part, the second spring part, the second terminal contact part, and the second internal electrically-conductive part are successively connected in a single metal plate from a first end to a second end thereof. The first and second terminal contact parts are in first and second bent portions, respectively, of the single metal plate. The first and second internal electrically-conductive parts are configured to contact each other at the time of performing the electrical measurement.

Abstract: Provided is an electrical contact member which is capable of maintaining stable conductivity over a long period of time, while achieving low adhesion to a test subject, in particular, an electrical contact member which is capable of maintaining stable electrical contact over a long period of time by suppressing increase in the contact resistance, while achieving low adhesion to a test subject even after repeated contact at high temperatures around 85° C. or after being left in the atmosphere for a long period of time. The present invention relates to an electrical contact member, which repeatedly comes into contact with a test subject, and wherein the surface of the electrical contact member, said surface coming into contact with the test subject, is configured of a carbon coating film that contains Pd.

Abstract: A blade type micro probe and a method of manufacturing the same are disclosed. The method includes forming a plating seed layer on a substrate, a first blade structure on the plating seed layer and a second blade structure on the first blade structure, wherein the first blade structure includes a first second patterned photo resist layer and a metal layer filling up the voids in the first second patterned photo resist layer and the second blade structure includes a second patterned photo resist layer and an another metal layer filling up the voids in the second patterned photo resist layer, then removing the first and second patterned photo resist layers, and finally removing the plating seed layer and the substrate, thereby forming the blade type micro probe. The first patterned photo resist layer is different from the second patterned photo resist layer in shape.

Abstract: An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10?8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core.

Abstract: Disclosed herein is an electrical component including a substrate comprising an electroconductive filler in a first polymeric binder, and a coating layer adhered to at least a portion of the substrate surface, the coating layer comprising a nanostructured electroconductive particulate dispersed in a polymeric binder, such as an epoxy resin. A method of making the component also is disclosed, comprising obtaining a substrate containing an electroconductive filler in a polymeric binder, dispersing a nanostructured electroconductive particulate filler in a liquid that includes a solvent and/or a reactive diluent to form a dispersion, mixing the dispersion with a liquid resin to form a coating mixture, applying the coating mixture to the substrate, and crosslinking the applied coating mixture to form the coated substrate.

Abstract: A measuring device includes: a probe applying a voltage to an electrode of an element; and a supplying member supplying an insulating liquid to a contact portion between the electrode and the probe via a surface of the probe. Accordingly, the insulating liquid can be securely supplied to the contact portion between the electrode and the probe via the surface of the probe positioned relative to the electrode.

Abstract: The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other.

Abstract: An adjustable measurement device includes a case, a positive contact portion, a negative contact portion, a test probe, a first wire, and a second wire. The positive contact portion is positioned on an end of the case and electrically connected to the first wire. The negative contact portion is movably received in the case and electrically connected to the second wire. A receiving hole is defined in the negative contact portion for the test probe. The test probe includes a main body electrically connected to the negative contact portion, a tip portion electrically connected to the positive contact portion, and an insulating portion positioned between the main body and the tip portion. A distance between the positive contact portion and the negative contact portion is adjustable by moving the negative contact portion. The negative contact portion and the positive contact portion are isolated from each other.

Abstract: In accordance with an embodiment, a probe card includes a substrate, a first probe and a second probe. The substrate includes a first area and a second area adjacent to the first area. In the first area a first opening is provided. The first probe is provided in the first area. An end of the first probe extends into the first opening. The second probe is provided in the second area.

Abstract: A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board.

Abstract: A probe card is provided. The probe card includes a probe module and a first carrier board. The probe module has a plurality of probes. The probe module is disposed on the first carrier board. The first carrier board is at least partially light-transmitted and has a plurality of vias and a plurality of conductive fillers. The vias are filled with the conductive fillers, respectively. The probe module is electrically connected to the conductive fillers. With the first carrier board being partially light-transmitted, not only is it feasible to simplify the steps of registering the probe card and a device under test, but it is also feasible for an inspector to inspect the contact between the probe card and the device under test synchronously.

Abstract: Adapters for electrostatic discharge probe tips are disclosed herein. An embodiment of the adapter includes an attachment device that is attachable to the tip of the probe. A first conductor is affixed to the attachment device so that the first conductor contacts the tip when the attachment device is attached to the tip of the probe. A second conductor extends between the first electrical conductor and a point external to the attachment device.

Abstract: A corrosion sensor includes a plurality of conductive portions and at least one non-conductive portion between adjacent conductive portions, wherein the at least one non-conductive portion has a dimension less than approximately 500 microns. A method for manufacturing a corrosion sensor includes applying a non-conductive material to a substrate and applying a conductive material to discrete locations on the non-conductive material. The method further includes applying a brazing material around each discrete location of the conductive material.

Abstract: A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.

Abstract: A deflection measurement probe includes a body portion having a cavity defined by the body portion, a first positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface, and a second positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface.

Abstract: Provided is a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method including using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion, and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing the mercury into contact with the surface of the semiconductor wafer.

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.

Abstract: A suspended IO trace design for SSP cantilever Read/Write is described. Instead of having the whole I/O trace attached to surface of the cantilever, the cantilever is designed with fish-bone-like support and the I/O traces are anchored to cantilever structures 110 at some specific attachment locations with dielectric insulation in between. This design provides very compliant trace compared to cantilever's see-saw actuation around the torsional beam pivot and is also insensitive to residual stress variations from I/O trace in fabrication.

Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.

Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

Abstract: A device for testing electronic component devices mounted on a substrate, having test pins which can be placed on contact surfaces of the substrate. A frame-like support structure is provided, which supports the substrate such that the individual component devices are located in open spaces of the support structure.

Abstract: A probe for transporting a nondestructive inspection sensor through a tube, that employs wheels to reduce friction. The radial travel of the wheels are mechanically linked through a cam and axially reciprocal plunger arrangement that centers the probe at tube diameter transitions. Internal wire bending is minimized and a dynamic seal is provided to facilitate an insertion force at the probe and reduce or eliminate compressive load buckling of the flexible cable carried by the probe. Like the wheel arrangement, radial travel of the seal segments are mechanically linked to provide probe centering.

Abstract: A measurement card includes a circuit board, an edge connector on a bottom edge of the circuit board, a port arranged on the circuit board, and a single-pole double-throw switch for connecting the port to either a first or a second pin of the edge connector to tests the VDDQ and VTT outputs of a memory slot.

Abstract: An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.